STPS160A/U
THERMAL RESISTANCES
Symbol
R
th (j-l)
Junction to lead
Parameter
SMA
SMB
STATIC ELECTRICAL CHARACTERISTICS
Symbol
I
R
*
Tests Conditions
Reverse leakage current
Tests Conditions
Tj = 25°C
Tj = 125°C
V
F
*
Forward voltage drop
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Pulse test :
* tp = 380
µs, δ
< 2%
Value
30
23
Unit
°C/W
Min.
Typ.
Max.
4
Unit
µA
mA
V
V
R
= 60V
1.1
I
F
= 1 A
I
F
= 1 A
I
F
= 2 A
I
F
= 2 A
0.58
0.49
4
0.67
0.57
0.8
0.65
To evaluate the maximum conduction losses use the following equation :
P = 0.49 x I
F(AV)
+ 0.08 x I
F2(RMS)
Fig. 1:
Average forward power dissipation versus
average forward current.
PF(av)(W)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0
0.2
0.4
IF(av) (A)
0.6
0.8
δ
=tp/T
T
Fig. 2:
Average forward current versus ambient
temperature (δ=0.5).
IF(av)(A)
δ
= 0.1
δ
= 0.05
δ
= 0.2
δ
= 0.5
1.2
Rth(j-a)=Rth(j-l)
1.0
δ
=1
0.8
0.6
0.4
0.2
tp
T
SMA
Rth(j-a)=100°C/W
S(Cu)=1.5cm²
SMB
Rth(j-a)=80°C/W
S(Cu)=1.5cm²
1.0
1.2
0.0
δ
=tp/T
tp
Tamb(°C)
50
75
100
125
150
0
25
2/6
STMICROELECTRONICS [ STMICROELECTRONICS ]
