STPS160A/U
Fig. 7:
Forward voltage drop versus forward cur-
rent (maximum values).
Fig. 8-1:
Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board, copper thickness: 35µm)(SMB).
Rth(j-a) (°C/W)
100
Tj=125°C
IFM(A)
1E+1
80
Tj=25°C
1E+0
60
40
20
1E-1
VFM(V)
1E-2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
S(Cu) (cm²)
0
0
1
2
3
4
5
Fig. 8-2:
Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board, copper thickness: 35µm)(SMA).
Rth(j-a) (°C/W)
140
120
100
80
60
40
20
0
0
1
S(Cu) (cm²)
2
3
4
5
4/6