W25Q64FV
1. GENERAL DESCRIPTION
The W25Q64FV (64M-bit) Serial Flash memory provides a storage solution for systems with limited
space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash
devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP)
and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current
consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving
packages.
The W25Q64FV array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes
can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128
(32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64FV has
2,048 erasable sectors and 128 erasable blocks respectively. The small 4KB sectors allow for greater
flexibility in applications that require data and parameter storage. (See figure 2.)
The W25Q64FV support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2-
clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI),
I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing
equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when
using the Fast Read Dual/Quad I/O and QPI instructions. These transfer rates can outperform standard
Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient
memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP
(execute in place) operation.
A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control,
provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and
device identification, a 64-bit Unique Serial Number and four 256-bytes Security Registers.
2. FEATURES
•
Family of SpiFlash Memories
– W25Q64FV: 64M-bit / 8M-byte (8,388,608)
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO
0
, IO
1
, /WP, /Hold
– Quad SPI: CLK, /CS, IO
0
, IO
1
, IO
2
, IO
3
– QPI: CLK, /CS, IO
0
, IO
1
, IO
2
, IO
3
•
Highest Performance Serial Flash
– 104MHz Standard/Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention
•
Efficient “Continuous Read” and QPI Mode
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces
instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
•
Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
•
Flexible Architecture with 4KB sectors
– Uniform Sector Erase (4K-bytes)
– Uniform Block Erase (32K and 64K-bytes)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
•
Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Power Supply Lock-Down and OTP protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
•
Space Efficient Packaging
– 8-pin SOIC 208-mil
– 8-pad WSON 6x5-mm/8x6-mm
– 16-pin SOIC 300-mil
– 8-pin PDIP 300-mil
– 24-ball TFBGA 8x6-mm
– Contact Winbond for KGD and other options
-5-
Publication Release Date: December 19, 2011
Revision D
WINBOND [ WINBOND ]
