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W25Q64FVSFIG 参数 Datasheet PDF下载

W25Q64FVSFIG图片预览
型号: W25Q64FVSFIG
PDF下载: 下载PDF文件 查看货源
内容描述: 与双核/四SPI和QPI 3V 64M位串行闪存 [3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI]
分类和应用: 闪存
文件页数/大小: 88 页 / 1207 K
品牌: WINBOND [ WINBOND ]
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W25Q64FV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q64FV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pad WSON 6x5-mm or 8x6-mm
(package code ZP & ZE), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package
code SF) and a 24-ball 8x6-mm TFBGA (package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1
Pin Configuration SOIC 208-mil
Top View
/CS
DO (IO
1
)
/WP (IO
2
)
GND
1
2
3
4
8
7
6
5
VCC
/HOLD (IO
3
)
CLK
DI (IO
0
)
Figure 1a. W25Q64FV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
3.2
Pad Configuration WSON 6x5-mm / 8X6-mm
Top View
/CS
DO (IO
1
)
/WP (IO
2
)
GND
1
2
3
4
8
7
6
5
VCC
/HOLD (IO
3
)
CLK
DI (IO
0
)
Figure 1b. W25Q64FV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP & ZE)
-6-