W25Q64FV
3.7
Ball Configuration TFBGA 8x6-mm
Top View
A1
NC
A2
NC
A3
NC
A4
NC
B1
NC
B2
CLK
B3
GND
B4
VCC
C1
NC
C2
/CS
C3
NC
C4
/WP (IO
2
)
D1
NC
D2
DO(IO
1
)
D3
D4
DI(IO
0
) /HOLD(IO
3
)
E1
NC
E2
NC
E3
NC
E4
NC
F1
NC
F2
NC
F3
NC
F4
NC
Figure 1e. W25Q64FV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TC)
3.8
Ball Description TFBGA 8x6-mm
PIN NAME
CLK
GND
VCC
/CS
/WP (IO2)
DO (IO1)
DI (IO0)
/HOLD (IO3)
NC
I
I/O
I/O
I/O
I/O
BALL NO.
B2
B3
B4
C2
C4
D2
D3
D4
Multiple
I/O
I
Serial Clock Input
Ground
Power Supply
Chip Select Input
FUNCTION
Write Protect Input (Data Input Output 2)*
Data Output (Data Input Output 1)*
Data Input (Data Input Output 0)*
Hold Input (Data Input Output 3)*
No Connect
1
2
1
2
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
-9-
Publication Release Date: December 19, 2011
Revision D
WINBOND [ WINBOND ]
