ADG408BR各脚功能电路原理芯片引脚定义引脚图及功能IC贸易商-中国IC网-芯三七

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产品型号ADG408BR的概述

芯片ADG408BR概述 ADG408BR是一款由Analog Devices公司生产的高性能多路复用器/开关芯片，属于其ADG系列的产品。该芯片具有低功耗、高线性度、快速开关速度和广泛的工作电压范围，适用于各种模拟信号处理应用。ADG408BR主要用于音频、视频和多种工业信号的切换。其核心功能是提供多路输入信号的选择和传送，广泛应用于数据采集系统、自动化测试设备、医疗设备以及其他需要精确切换信号的电子装置中。芯片ADG408BR的详细参数 ADG408BR具有以下关键参数： 1. 工作电压范围: 适用于±1.5V至±15V之间的工作电压。这种宽范围使其可以灵活地适用于多种供电设计。 2. 开关电阻: 在50Ω至160Ω的范围内，具体取决于工作电压和频率，这对信号传输质量至关重要。 3. 总谐波失真（THD）: 小于0.05%，保证信号在开关过程中的高保真度。 4....

产品型号ADG408BR的Datasheet PDF文件预览

LC²MOS 4-/8-Channel

High Performance Analog Multiplexers

ADG408/ADG409

FEATURES

FUNCTIONAL BLOCK DIAGRAMS

44 V Supply Maximum Ratings

V_SSto V_DDAnalog Signal Range

Low On Resistance (100 ⍀ max)

Low Power (I_SUPPLY< 75 ␮A)

Fast Switching

ADG408

ADG409

S1A

S4A

Break-Before-Make Switching Action

Plug-in Replacement for DG408/DG409

APPLICATIONS

S1B

S4B

Audio and Video Routing

Automatic Test Equipment

Data Acquisition Systems

Battery Powered Systems

Sample and Hold Systems

Communication Systems

1 OF 8

DECODER

1 OF 4

DECODER

A0 A1 A2 EN

A0 A1 EN

GENERAL DESCRIPTION

PRODUCT HIGHLIGHTS

The ADG408 and ADG409 are monolithic CMOS analog

multiplexers comprising eight single channels and four differen-

tial channels respectively. The ADG408 switches one of eight

inputs to a common output as determined by the 3-bit binary

address lines A0, A1 and A2. The ADG409 switches one of four

differential inputs to a common differential output as deter-

mined by the 2-bit binary address lines A0 and A1. An EN

input on both devices is used to enable or disable the device.

When disabled, all channels are switched OFF.

The ADG408/ADG409 are designed on an enhanced LC²MOS

process which provides low power dissipation yet gives high

switching speed and low on resistance. Each channel conducts

equally well in both directions when ON and has an input signal

range that extends to the supplies. In the OFF condition, signal

levels up to the supplies are blocked. All channels exhibit break-

before-make switching action, preventing momentary shorting

when switching channels. Inherent in the design is low charge

injection for minimum transients when switching the digital

inputs.

1. Extended Signal Range

The ADG408/ADG409 are fabricated on an enhanced

LC²MOS process giving an increased signal range that

extends to the supply rails.

2. Low Power Dissipation

3 Low R_ON

4. Single Supply Operation

For applications where the analog signal is unipolar, the

ADG408/ADG409 can be operated from a single rail power

supply. The parts are fully specified with a single +12 V

power supply and will remain functional with single supplies

as low as +5 V.

The ADG408/ADG409 are improved replacements for the

DG408/DG409 Analog Multiplexers.

REV. A

Information furnished by Analog Devices is believed to be accurate and

reliable. However, no responsibility is assumed by Analog Devices for its

use, nor for any infringements of patents or other rights of third parties

which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781/329-4700

Fax: 781/326-8703

World Wide Web Site: http://www.analog.com

ADG408/ADG409–SPECIFICATIONS

DUAL SUPPLY¹

(V_DD= +15 V, V_SS= –15 V, GND = 0 V, unless otherwise noted)

B Version

–40؇C to

+85؇C

T Version

–55؇C to

+25؇C +125؇C

Parameter

+25؇C

Units

Test Conditions/Comments

ANALOG SWITCH

Analog Signal Range

R_ON

_SSto V_DD

V_SSto V_DD

100

Ω typ

Ω max

V_D= ±10 V, I_S= –10 mA

125

∆R_ON

V_D= +10 V, –10 V

LEAKAGE CURRENTS

Source OFF Leakage I_S(OFF)

±0.5

±50

±0.5

±50

nA max

V_D= ±10 V, V_S= ϯ10 V;

Test Circuit 2

Drain OFF Leakage I_D(OFF)

ADG408

V_D= ±10 V; V_S= ϯ10 V;

Test Circuit 3

±1

±100

±50

±1

±100

±50

nA max

ADG409

Channel ON Leakage I_D, I_S(ON)

ADG408

V_S= V_D= ±10 V;

Test Circuit 4

±1

±100

±50

±1

±100

±50

nA max

ADG409

DIGITAL INPUTS

Input High Voltage, V_INH

Input Low Voltage, V_INL

Input Current

2.4

0.8

2.4

0.8

V min

V max

_INLor I_INH

±10

µA max

pF typ

V_IN= 0 or V_DD

f = 1 MHz

C_IN, Digital Input Capacitance

DYNAMIC CHARACTERISTICS²

t_TRANSITION

120

250

120

250

ns typ

R_L= 300 Ω, C_L= 35 pF;

V_S1= ±10 V, V_SS= ϯ10 V;

Test Circuit 5

ns max

t_OPEN

ns min

R_L= 300 Ω, C_L= 35 pF;

V_S= +5 V; Test Circuit 6

R_L= 300 Ω, C_L= 35 pF;

V_S= +5 V; Test Circuit 7

R_L= 300 Ω, C_L= 35 pF;

V_S= +5 V; Test Circuit 7

V_S= 0 V, R_S= 0 Ω, C_L= 10 nF;

Test Circuit 8

t_ON(EN)

150

125

225

150

125

225

ns typ

ns max

ns typ

ns max

pC typ

t_OFF(EN)

150

Charge Injection

OFF Isolation

Channel-to-Channel Crosstalk

–75

dB typ

pF typ

R_L= 1 kΩ, f = 100 kHz;

V_EN= 0 V; Test Circuit 9

R_L= 1 kΩ, f = 100 kHz;

Test Circuit 10

f = 1 MHz

C_S(OFF)

C_D(OFF)

ADG408

ADG409

C_D, C_S(ON)

ADG408

ADG409

f = 1 MHz

pF typ

f = 1 MHz

pF typ

POWER REQUIREMENTS

I_DD

µA typ

µA max

µA typ

µA max

µA typ

µA max

V_IN= 0 V, V_EN= 0 V

V_IN= 0 V, V_EN= 2.4 V

I_SS

I_DD

100

200

100

200

500

NOTES

¹Temperature ranges are as follows: B Version: –40°C to +85°C; T Version: –55°C to +125°C.

²Guaranteed by design, not subject to production test.

Specifications subject to change without notice.

–2–

REV. A

ADG408/ADG409

SINGLE SUPPLY¹

(V_DD= +12 V, V_SS= 0 V, GND = 0 V, unless otherwise noted)

B Version

T Version

–40؇C to

–55؇C to

Parameter

+25؇C

+85؇C

+25؇C +125؇C

Units

Test Conditions/Comments

ANALOG SWITCH

Analog Signal Range

R_ON

0 to V_DD

Ω typ

V_D= +3 V, +10 V, I_S= –1 mA

LEAKAGE CURRENTS

Source OFF Leakage I_S(OFF)

±0.5

±50

±0.5

±50

nA max

V_D=8 V/0 V, V_S= 0 V/8 V;

Test Circuit 2

Drain OFF Leakage I_D(OFF)

ADG408

V_D=8 V/0 V, V_S= 0 V/8 V;

Test Circuit 3

±1

±100

±50

±1

±100

±50

nA max

ADG409

Channel ON Leakage I_D, I_S(ON)

ADG408

V_S= V_D= 8 V/0 V;

Test Circuit 4

±1

±100

±50

±1

±100

±50

nA max

ADG409

DIGITAL INPUTS

Input High Voltage, V_INH

Input Low Voltage, V_INL

Input Current

2.4

0.8

2.4

0.8

V min

V max

_INLor I_INH

±10

µA max

pF typ

V_IN= 0 or V_DD

f = 1 MHz

C_IN, Digital Input Capacitance

DYNAMIC CHARACTERISTICS²

t_TRANSITION

130

ns typ

R_L= 300 Ω, C_L= 35 pF;

V_S1= 8 V/0 V, V_S8= 0 V/8 V;

Test Circuit 5

t_OPEN

140

ns typ

pC typ

dB typ

pF typ

R_L= 300 Ω, C_L= 35 pF;

V_S= +5 V; Test Circuit 6

R_L= 300 Ω, C_L= 35 pF;

V_S= +5 V; Test Circuit 7

R_L= 300 Ω, C_L= 35 pF;

V_S= +5 V; Test Circuit 7

V_S= 0 V, R_S= 0 Ω, C_L= 10 nF;

Test Circuit 8

t_ON(EN)

t_OFF(EN)

Charge Injection

OFF Isolation

Channel-to-Channel Crosstalk

–75

R_L= 1 kΩ, f = 100 kHz;

V_EN= 0 V; Test Circuit 9

R_L= 1 kΩ, f = 100 kHz;

Test Circuit 10

f = 1 MHz

C_S(OFF)

C_D(OFF)

ADG408

ADG409

C_D, C_S(ON)

ADG408

ADG409

f = 1 MHz

pF typ

f = 1 MHz

pF typ

POWER REQUIREMENTS

I_DD

µA typ

µA max

µA typ

µA max

V_IN= 0 V, V_EN= 0 V

V_IN= 0 V, V_EN= 2.4 V

I_DD

100

200

100

200

500

NOTES

¹Temperature ranges are as follows: B Version: –40°C to +85°C; T Version: –55°C to +125°C.

²Guaranteed by design, not subject to production test.

Specifications subject to change without notice.

REV. A

–3–

ADG408/ADG409

ABSOLUTE MAXIMUM RATINGS¹

ORDERING INFORMATION

(T_A= +25°C unless otherwise noted)

Model¹

Temperature Range

Package Option²

V_DDto V_SS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V

ADG408BN

ADG408BR

ADG408BRU

ADG408TQ

–40°C to +85°C

–55°C to +125°C

N-16

_DDto GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V

_SSto GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V

R-16A

RU-16

Q-16

Analog, Digital Inputs². . . . . V_SS–2 V to V_DD+2 V or 20 mA,

Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA

Peak Current, S or D

(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA

ADG409BN

ADG409BR

ADG409TQ

–40°C to +85°C

–55°C to +125°C

N-16

R-16A

Q-16

Operating Temperature Range

NOTES

Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C

Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C

Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW

θ_JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C

Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW

θ_JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C

TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW

θ_JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155°C/W

θ_JC, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50°C/W

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW

θ_JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77°C/W

Lead Temperature, Soldering

¹To order MIL-STD-883, Class B processed parts, add /883B to T grade part

numbers.

²N = Plastic DIP; Q = Cerdip; R = 0.15" Small Outline IC (SOIC);

RU = Think Shrink Small Outline Package (TSSOP).

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C

NOTES

¹Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

²Overvoltages at A, EN, S or D will be clamped by internal diodes. Current should

be limited to the maximum ratings given.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent

damage may occur on devices subjected to high energy electrostatic discharges. Therefore,

proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

–4–

REV. A

ADG408/ADG409

PIN CONFIGURATIONS (DIP/SOIC/TSSOP)

TERMINOLOGY

V_DD

V_SS

Most positive power supply potential.

Most negative power supply potential in dual

supplies. In single supply applications, it may

be connected to ground.

15 GND

GND

ADG408

TOP VIEW

(Not to Scale)

S1A

S1B

S2B

S3B

S4B

ADG409

TOP VIEW

(Not to Scale)

GND

R_ON

Ground (0 V) reference.

S2A

S3A

S4A

Ohmic resistance between D and S.

∆R_ON

Difference between the R_ONof any two

channels.

I_S(OFF)

I_D(OFF)

I_D, I_S(ON)

V_D(V_S)

Source leakage current when the switch is off.

Drain leakage current when the switch is off.

Channel leakage current when the switch is on.

Analog voltage on terminals D, S.

ADG408 Truth Table

SWITCH

C_S(OFF)

Channel input capacitance for “OFF”

condition.

NONE

_D(OFF)

Channel output capacitance for “OFF”

condition.

C_D, C_S(ON) “ON” switch capacitance.

C_IN

Digital input capacitance.

t_ON(EN)

Delay time between the 50% and 90% points of

the digital input and switch “ON” condition.

_OFF(EN)

Delay time between the 50% and 90% points of

the digital input and switch “OFF” condition.

ADG409 Truth Table

t_TRANSITION

Delay time between the 50% and 90% points of

the digital inputs and the switch “ON” condition

when switching from one address state to another.

ON SWITCH

PAIR

NONE

t_OPEN

“OFF” time measured between the 80% point

of both switches when switching from one

address state to another.

V_INL

V_INH

Maximum input voltage for Logic “0.”

Minimum input voltage for Logic “1.”

Input current of the digital input.

I_INL(I_INH

Crosstalk

)

A measure of unwanted signal which is coupled

through from one channel to another as a result

of parasitic capacitance.

Off Isolation A measure of unwanted signal coupling through

an “OFF” channel.

Charge

Injection

A measure of the glitch impulse transferred

from the digital input to the analog output

during switching.

I_DD

I_SS

Positive supply current.

Negative supply current.

REV. A

–5–

ADG408/ADG409

Typical Performance Characteristics

120

180

160

140

120

100

= +25؇C

= +5V

= 0V

= +5V

= –5V

100

= +12V

= –12V

= +10V

= –10V

= +12V

= 0V

= +10V

= 0V

= +15V

= 0V

= +15V

= –15V

–15

–10

–5

(V ) – Volts

Figure 4. R_ONas a Function of V_D(V_S): Single Supply

Voltage

Figure 1. R_ONas a Function of V_D(V_S): Dual Supply Voltage

100

130

= +15V

= –15V

= +12V

= 0V

120

110

100

+125؇C

+85؇C

+25؇C

–15

–10

–5

(V ) – Volts

V (V ) – Volts

D S

Figure 2. R_ONas a Function of V_D(V_S) for Different

Temperatures

Figure 5. R_ONas a Function of V_D(V_S) for Different

Temperatures

0.2

0.04

= +25؇C

= +15V

= +12V

= –15V

= 0V

0.02

0.1

(OFF)

(ON)

(OFF)

–0.02

–0.04

–0.06

(ON)

–0.1

–0.2

–15

–10

–5

(V ) – Volts

Figure 3. Leakage Currents as a Function of V_D(V_S)

Figure 6. Leakage Currents as a Function of V_D(V_S)

–6–

REV. A

ADG408/ADG409

120

100

140

120

100

= +12V

= 0V

= +15V

= –15V

TRANSITION

(EN)

OFF

(EN)

OFF

– Volts

Figure 7. Switching Time vs. V_IN(Bipolar Supply)

Figure 10. Switching Time vs. V_IN(Single Supply)

300

400

= +5V

300

200

100

200

100

TRANSITION

(EN)

OFF

(EN)

OFF

؎5

؎7

؎9

؎11

؎13

؎15

– Volts

SUPPLY

Figure 8. Switching Time vs. Single Supply

Figure 11. Switching Time vs. Bipolar Supply

= +15V

= –15V

= +15V

= –15V

EN = 2.4V

EN = 0V

EN = 2.4V

EN = 0V

–1

100

10k

100k

10M

100

10k

100k

10M

FREQUENCY – Hz

Figure 9. Positive Supply Current vs. Switching Frequency

Figure 12. Negative Supply Current vs. Switching

Frequency

REV. A

–7–

ADG408/ADG409

110

100

= +15V

= –15V

= +15V

= –15V

100

10k

100k

10k

100k

FREQUENCY – Hz

Figure 13. Off Isolation vs. Frequency

Figure 14. Crosstalk vs. Frequency

Test Circuits

(OFF)

+0.8V

GND

= V1/I

Test Circuit 1. On Resistance

Test Circuit 3. I_D(OFF)

(OFF)

(ON)

2.4V

+0.8V

GND

Test Circuit 4. I_D(ON)

Test Circuit 2. I_S(OFF)

–8–

REV. A

ADG408/ADG409

< 20ns

t < 20ns

ENABLE

DRIVE (V

50%

)

50⍀

S2 THRU S7

TRANSITION

90%

ADG408*

OUTPUT

2.4V

300⍀

GND

35pF

90%

*SIMILAR CONNECTION FOR ADG409

Test Circuit 5. Switching Time of Multiplexer, t_TRANSlTlON

ADDRESS

DRIVE (V

)

50⍀

S2 THRU S7

ADG408*

80%

OUTPUT

2.4V

300⍀

GND

OPEN

*SIMILAR CONNECTION FOR ADG409

Test Circuit 6. Break-Before-Make Delay, t_OPEN

ENABLE

DRIVE (V

50%

)

S2 THRU S8

(EN)

OFF

ADG408*

OUTPUT

0.9V

OUTPUT

300⍀

GND

50⍀

*SIMILAR CONNECTION FOR ADG409

Test Circuit 7. Enable Delay, t_ON(EN), t_OFF(EN)

REV. A

–9–

ADG408/ADG409

ADG408*

OUT

⌬ V

OUT

= C

⌬ V

10nF

INJ

OUT

GND

*SIMILAR CONNECTION FOR ADG409

Test Circuit 8. Charge Injection

2.4V

ADG408

OUT

1k⍀

GND

OFF ISOLATION = 20 LOG V

CROSSTALK = 20 LOG V

OUT IN

Test Circuit 9. OFF Isolation

Test Circuit 10. Channel-to-Channel Crosstalk

–10–

REV. A

ADG408/ADG409

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

Plastic DIP (N-16)

SO (Narrow Body) (R-16A)

0.3937 (10.00)

0.3859 (9.80)

0.87 (22.1) MAX

0.25

(6.35)

0.31

(7.87)

0.1574 (4.00)

0.1497 (3.80)

0.2440 (6.20)

0.2284 (5.80)

PIN 1

0.035

(0.89)

0.18

(4.57)

MAX

0.0688 (1.75)

0.0532 (1.35)

PIN 1

0.0196 (0.50)

0.0099 (0.25)

x 45°

0.0098 (0.25)

0.125

(3.18)

MIN

0.18

0.0040 (0.10)

0.011

(0.28)

(4.57)

0.3 (7.62)

8°

0°

SEATING

PLANE

0.100

(2.54)

BSC

0.033

(0.84)

0.018

(0.46)

0.0500

(1.27)

BSC

0.0192 (0.49)

0.0138 (0.35)

SEATING

PLANE

0.0500 (1.27)

0.0160 (0.41)

0.0099 (0.25)

0.0075 (0.19)

Thin Shrink Small Outline Package (TSSOP)

(RU-16)

Cerdip (Q-16)

0.005 (0.13) MIN

0.080 (2.03) MAX

0.201 (5.10)

0.193 (4.90)

0.310 (7.87)

0.220 (5.59)

0.320 (8.13)

0.290 (7.37)

PIN 1

0.840 (21.34) MAX

0.060 (1.52)

0.015 (0.38)

0.200 (5.08)

MAX

0.150

(3.81)

MIN

0.200 (5.08)

0.125 (3.18)

0.015 (0.38)

0.008 (0.20)

SEATING

PLANE

PIN 1

0.022 (0.558)

0.014 (0.356)

0.100

(2.54)

BSC

0.070 (1.78)

0.030 (0.76)

15°

0°

0.006 (0.15)

0.002 (0.05)

0.0433

(1.10)

MAX

0.028 (0.70)

0.020 (0.50)

8°

0°

0.0118 (0.30)

0.0075 (0.19)

0.0256

(0.65)

BSC

SEATING

PLANE

0.0079 (0.20)

0.0035 (0.090)

REV. A

–11–

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深圳市中利达电子科技有限公司服务专线: 0755-13686833545 在线联系:

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ADG408BR产品参数

型号:	ADG408BR
Source Url Status Check Date：	2013-05-01 14:56:37.181
Brand Name：	Analog Devices Inc
是否无铅：	含铅
是否Rohs认证：	不符合
生命周期：	Obsolete
零件包装代码：	SOIC
包装说明：	MS-012AC, SOIC-16
针数：	16
制造商包装代码：	R-16
Reach Compliance Code：	not_compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	8.3
其他特性：	CAN ALSO OPERATE WITH 12V SUPPLY
模拟集成电路 - 其他类型：	SINGLE-ENDED MULTIPLEXER
JESD-30 代码：	R-PDSO-G16
JESD-609代码：	e0
长度：	9.9 mm
湿度敏感等级：	1
标称负供电电压 (Vsup)：	-15 V
信道数量：	8
功能数量：	1
端子数量：	16
标称断态隔离度：	75 dB
通态电阻匹配规范：	15 Ω
最大通态电阻 (Ron)：	100 Ω
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP16,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	235
电源：	12/+-15 V
认证状态：	Not Qualified
座面最大高度：	1.75 mm
最大信号电流：	0.02 A
子类别：	Multiplexer or Switches
最大供电电流 (Isup)：	2 mA
标称供电电压 (Vsup)：	15 V
表面贴装：	YES
最长断开时间：	150 ns
最长接通时间：	150 ns
切换：	BREAK-BEFORE-MAKE
技术：	CMOS
温度等级：	INDUSTRIAL
端子面层：	Tin/Lead (Sn85Pb15)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	20
宽度：	3.9 mm
Base Number Matches：	1

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