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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • BD6735FV-E2
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  • BD6735FV-E2图
  • 上海意淼电子科技有限公司

     该会员已使用本站14年以上
  • BD6735FV-E2 现货库存
  • 数量20000 
  • 厂家ROHM 
  • 封装SSOP 
  • 批号23+ 
  • 原装现货热卖!请联系吴先生 13681678667
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  • 15618836863 QQ:617677003
  • BD6735FV-E2图
  • 深圳市芯鹏泰科技有限公司

     该会员已使用本站8年以上
  • BD6735FV-E2
  • 数量7536 
  • 厂家Rohm Semiconductor 
  • 封装20-SSOP-B 
  • 批号23+ 
  • 电机驱动器控制器原装现货
  • QQ:3004306594QQ:3004306594 复制
  • 0755-82777852 QQ:3004306594
  • BD6735FV-E2图
  • 深圳市隆亿诚科技有限公司

     该会员已使用本站3年以上
  • BD6735FV-E2
  • 数量3253 
  • 厂家ROHM/罗姆 
  • 封装TSSOP20 
  • 批号22+ 
  • 支持检测.现货价优!
  • QQ:778039761QQ:778039761 复制
  • -0755-82710221 QQ:778039761
  • BD6735FV-E2图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • BD6735FV-E2
  • 数量42 
  • 厂家ROHM/罗姆 
  • 封装SSOP20 
  • 批号21+ 
  • 羿芯诚只做原装 原厂渠道 价格优势
  • QQ:2881498351QQ:2881498351 复制
  • 0755-22968581 QQ:2881498351
  • BD6735FV-E2图
  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
  • BD6735FV-E2
  • 数量3800 
  • 厂家ROHM 
  • 封装20-LSSOP 
  • 批号24+ 
  • 授权分销 现货热卖
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  • 0755-83222787 QQ:1950791264QQ:2216987084
  • BD6735FV-E2图
  • 深圳市中杰盛科技有限公司

     该会员已使用本站14年以上
  • BD6735FV-E2
  • 数量12000 
  • 厂家ROHM Semiconductor 
  • 封装SSOP-B20 
  • 批号24+ 
  • 【原装优势★★★绝对有货】
  • QQ:409801605QQ:409801605 复制
  • 0755-22968359 QQ:409801605
  • BD6735FV-E2图
  • 北京耐芯威科技有限公司

     该会员已使用本站13年以上
  • BD6735FV-E2
  • 数量5000 
  • 厂家Rohm Semiconductor 
  • 封装
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
  • QQ:2880824479QQ:2880824479 复制
    QQ:1344056792QQ:1344056792 复制
  • 86-010-010-62104931 QQ:2880824479QQ:1344056792
  • BD6735FV-E2图
  • 北京耐芯威科技有限公司

     该会员已使用本站12年以上
  • BD6735FV-E2
  • 数量5000 
  • 厂家Rohm Semiconductor 
  • 封装
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
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    QQ:1344056792QQ:1344056792 复制
  • 96-010-62104931 QQ:2880824479QQ:1344056792
  • BD6735FV-E2图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • BD6735FV-E2
  • 数量13900 
  • 厂家ROHM/罗姆 
  • 封装NA/ 
  • 批号23+ 
  • 优势代理渠道,原装正品,可全系列订货开增值税票
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  • 0755-82546830 QQ:3007977934QQ:3007947087
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  • 深圳市晶美隆科技有限公司

     该会员已使用本站15年以上
  • BD6735FV-E2
  • 数量69800 
  • 厂家ROHM/罗姆 
  • 封装SSOP20 
  • 批号24+ 
  • 假一罚十,原装进口正品现货供应,价格优势。
  • QQ:198857245QQ:198857245 复制
  • 0755-82865294 QQ:198857245
  • BD6735FV-E2图
  • 集好芯城

     该会员已使用本站13年以上
  • BD6735FV-E2
  • 数量19393 
  • 厂家ROHM/罗姆 
  • 封装SSOP20 
  • 批号最新批次 
  • 原装原厂 现货现卖
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    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • BD6735FV-E2图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • BD6735FV-E2
  • 数量8800 
  • 厂家ROHM/罗姆 
  • 封装SSOP-20 
  • 批号新年份 
  • 羿芯诚只做原装,原厂渠道,价格优势可谈!
  • QQ:2853992132QQ:2853992132 复制
  • 0755-82570683 QQ:2853992132
  • BD6735FV-E2图
  • 深圳市恒佳微电子有限公司

     该会员已使用本站12年以上
  • BD6735FV-E2
  • 数量
  • 厂家4000 
  • 封装SSOP20 
  • 批号 
  • 正品原装 支持最低价
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    QQ:1807086236QQ:1807086236 复制
  • 755-82533156 QQ:864187665QQ:1807086236
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  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • BD6735FV-E2
  • 数量58441 
  • 厂家ROHM 
  • 封装SSOP-20 
  • 批号2023+ 
  • 绝对原装全新正品现货/优势渠道商、原盘原包原盒
  • QQ:364510898QQ:364510898 复制
    QQ:515102657QQ:515102657 复制
  • 0755-83777708“进口原装正品专供” QQ:364510898QQ:515102657
  • BD6735FV-E2图
  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • BD6735FV-E2
  • 数量5000 
  • 厂家Rohm Semiconductor 
  • 封装
  • 批号2024+ 
  • 全新原装、现货库存,欢迎询价
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  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • BD6735FV-E2
  • 数量5000 
  • 厂家ROHM Semiconductor 
  • 封装贴/插片 
  • 批号2024+ 
  • 百分百原装正品,现货库存
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  • 010-62104791 QQ:857273081QQ:1594462451
  • BD6735FV-E2图
  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • BD6735FV-E2
  • 数量5000 
  • 厂家Rohm Semiconductor 
  • 封装
  • 批号2024+ 
  • 原装正品 优势现货
  • QQ:2880824479QQ:2880824479 复制
    QQ:1344056792QQ:1344056792 复制
  • 010-62104931 QQ:2880824479QQ:1344056792
  • BD6735FV-E2图
  • 深圳市惠诺德电子有限公司

     该会员已使用本站7年以上
  • BD6735FV-E2
  • 数量29500 
  • 厂家Rohm Semiconductor 
  • 封装IC MOTOR DRIVER 2V-8V 20SSOP 
  • 批号21+ 
  • 只做原装现货代理
  • QQ:1211267741QQ:1211267741 复制
    QQ:1034782288QQ:1034782288 复制
  • 159-7688-9073 QQ:1211267741QQ:1034782288
  • BD6735FV-E2图
  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • BD6735FV-E2
  • 数量5000 
  • 厂家ROHM Semiconductor 
  • 封装贴/插片 
  • 批号2024+ 
  • 百分百原装正品,现货库存
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    QQ:1594462451QQ:1594462451 复制
  • 010-62104891 QQ:857273081QQ:1594462451
  • BD6735FV-E2图
  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • BD6735FV-E2
  • 数量5000 
  • 厂家ROHM 
  • 封装SSOPB20 
  • 批号16+ 
  • 百分百原装正品,现货库存
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62106431 QQ:857273081QQ:1594462451
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  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • BD6735FV-E2
  • 数量5000 
  • 厂家ROHM Semiconductor 
  • 封装贴/插片 
  • 批号2024+ 
  • 百分百原装正品,现货库存
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  • 深圳市积美福电子科技有限公司

     该会员已使用本站4年以上
  • BD6735FV-E2
  • 数量1560 
  • 厂家ROHM/罗姆 
  • 封装LSSOP-20 
  • 批号21+ 
  • 只做原装正品,深圳现货库存
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    QQ:499959596QQ:499959596 复制
  • 0755-83228296 QQ:647176908QQ:499959596
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  • 深圳市美思瑞电子科技有限公司

     该会员已使用本站12年以上
  • BD6735FV-E2
  • 数量12245 
  • 厂家ROHM/罗姆 
  • 封装SSOP-20 
  • 批号22+ 
  • 现货,原厂原装假一罚十!
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    QQ:2885657384QQ:2885657384 复制
  • 0755-83952260 QQ:2885659458QQ:2885657384
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  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • BD6735FV-E2
  • 数量6328 
  • 厂家ROHM-罗姆 
  • 封装TSSOP-20 
  • 批号▉▉:2年内 
  • ▉▉¥27.7元一有问必回一有长期订货一备货HK仓库
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  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • BD6735FV-E2图
  • 深圳市能元时代电子有限公司

     该会员已使用本站10年以上
  • BD6735FV-E2
  • 数量92000 
  • 厂家ROHM/罗姆 
  • 封装TSSOP20 
  • 批号24+ 
  • 原装现货假一罚十!可含税长期供货
  • QQ:2885637848QQ:2885637848 复制
    QQ:2885658492QQ:2885658492 复制
  • 0755-84502810 QQ:2885637848QQ:2885658492
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  • 深圳市毅创腾电子科技有限公司

     该会员已使用本站16年以上
  • BD6735FV-E2
  • 数量4195 
  • 厂家ROHM罗姆 
  • 封装LSSOP-20 
  • 批号22+ 
  • ★只做原装★正品现货★原盒原标★
  • QQ:2355507168QQ:2355507168 复制
    QQ:2355507169QQ:2355507169 复制
  • 86-755-83219286 QQ:2355507168QQ:2355507169
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  • 深圳市硅诺电子科技有限公司

     该会员已使用本站8年以上
  • BD6735FV-E2
  • 数量40196 
  • 厂家ROHM 
  • 封装SSOP20 
  • 批号17+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
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  • 深圳市凯信扬科技有限公司

     该会员已使用本站7年以上
  • BD6735FV-E2
  • 数量18860 
  • 厂家ROHM/罗姆 
  • 封装LSSOP-20 
  • 批号21+ 
  • ▲▲▲诚信经营,服务至上,十年专注▲▲▲
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  • 深圳市赛矽电子有限公司

     该会员已使用本站13年以上
  • BD6735FV-E2
  • 数量
  • 厂家ROHM 
  • 封装原包 
  • 批号最新 
  • ROHM专卖,进口原装现货
  • QQ:3397630681QQ:3397630681 复制
  • 0755-83040896 QQ:3397630681
  • BD6735FV-E2图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • BD6735FV-E2
  • 数量8500 
  • 厂家原厂品牌 
  • 封装原厂封装 
  • 批号新年份 
  • 羿芯诚只做原装长期供,支持实单
  • QQ:2880123150QQ:2880123150 复制
  • 0755-82570600 QQ:2880123150
  • BD6735FV-E2图
  • 万三科技(深圳)有限公司

     该会员已使用本站2年以上
  • BD6735FV-E2
  • 数量660000 
  • 厂家ROHM(罗姆) 
  • 封装原厂原装 
  • 批号23+ 
  • 支持实单/只做原装
  • QQ:3008961398QQ:3008961398 复制
  • 0755-21006672 QQ:3008961398
  • BD6735FV-E2图
  • 昂富(深圳)电子科技有限公司

     该会员已使用本站4年以上
  • BD6735FV-E2
  • 数量4195 
  • 厂家ROHM(罗姆) 
  • 封装LSSOP-20 
  • 批号24+ 
  • 一站式BOM配单,短缺料找现货,怕受骗,就找昂富电子.
  • QQ:GTY82dX7
  • 0755-23611557【陈妙华 QQ:GTY82dX7
  • BD6735FV-E2图
  • 深圳市恒嘉威智能科技有限公司

     该会员已使用本站7年以上
  • BD6735FV-E2
  • 数量15000 
  • 厂家ROHM(罗姆) 
  • 封装LSSOP-20 
  • 批号21+ 
  • 原装正品价格绝对优势
  • QQ:1036846627QQ:1036846627 复制
    QQ:2274045202QQ:2274045202 复制
  • -0755-23942980 QQ:1036846627QQ:2274045202
  • BD6735FV-E2图
  • 深圳市凯睿晟科技有限公司

     该会员已使用本站10年以上
  • BD6735FV-E2
  • 数量5000 
  • 厂家ROHM/罗姆 
  • 封装LSSOP-20 
  • 批号24+ 
  • 百域芯优势 实单必成 可开13点增值税
  • QQ:2885648621QQ:2885648621 复制
  • 0755-23616725 QQ:2885648621
  • BD6735FV-E2图
  • 北京天阳诚业科贸有限公司

     该会员已使用本站9年以上
  • BD6735FV-E2
  • 数量88 
  • 厂家ROHM 
  • 封装NA 
  • 批号22+ 
  • 京北通宇商城可查价
  • QQ:2850389426QQ:2850389426 复制
    QQ:2850707139QQ:2850707139 复制
  • 0534-7058298 QQ:2850389426QQ:2850707139
  • BD6735FV-E2图
  • 深圳市亿智腾科技有限公司

     该会员已使用本站8年以上
  • BD6735FV-E2
  • 数量16680 
  • 厂家ROHM订货 
  • 封装SSOP20 
  • 批号16+ 
  • 假一赔十★全新原装现货★★特价供应★工厂客户可放款
  • QQ:799387964QQ:799387964 复制
    QQ:2777237833QQ:2777237833 复制
  • 0755-82566711 QQ:799387964QQ:2777237833
  • BD6735FV-E2图
  • 深圳市中利达电子科技有限公司

     该会员已使用本站11年以上
  • BD6735FV-E2
  • 数量10000 
  • 厂家ROHM(罗姆) 
  • 封装LSSOP-20 
  • 批号24+ 
  • 原装进口现货 假一罚十
  • QQ:1902134819QQ:1902134819 复制
    QQ:2881689472QQ:2881689472 复制
  • 0755-13686833545 QQ:1902134819QQ:2881689472
  • BD6735FV-E2图
  • 深圳市特拉特科技有限公司

     该会员已使用本站2年以上
  • BD6735FV-E2
  • 数量10000 
  • 厂家ROHM 
  • 封装SSOP20 
  • 批号22+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
  • QQ:709809857QQ:709809857 复制
  • 0755-82531732 QQ:709809857

产品型号BD6735FV-E2的概述

芯片BD6735FV-E2的概述 BD6735FV-E2是一款专为音频应用设计的高性能电源管理芯片,主要用于供电和音频信号处理。这款芯片的低功耗特性使其尤其适用于便携设备和移动音频设备。BD6735FV-E2具有高效能和多种保护功能,能够稳定地支持各种音频应用的需求,包括家庭影音设备、电视、音响系统等。 芯片BD6735FV-E2的详细参数 BD6735FV-E2的主要参数为: - 输入电压范围:适合的输入电压范围一般在2.5V到5.5V之间,使得它能广泛应用于不同电压供电的设备。 - 输出电流:最大输出电流可达到1A,确保在高负载情况下仍能保持稳定的性能。 - 工作温度范围:工作温度范围通常为-40°C到85°C,能够适应多种环境条件。 - 开关频率:开关频率可以在200kHz到1MHz之间调节,以满足不同应用场景下对效率和纹波的要求。 - 效率:在典型负载条件下,工作效率可高达95...

产品型号BD6735FV-E2的Datasheet PDF文件预览

H-Bridge Drivers for DC Brush Motors  
Dual H-Bridge Driver  
BD6735FV  
General Description  
Key Specifications  
The BD6735FV provides a dual H-bridge motor driver  
which features wide range of motor power supply  
voltage from 2.0V to 8.0V and low power consumption to  
switch low ON-Resistance DMOS transistors. This small  
surface mounting package is most suitable for mobile  
system, home appliance and various applications.  
Power Supply Voltage Range:  
Motor Power Supply Voltage Range: 2.0V to 8.0V  
Circuit Current:  
Stand-By Current:  
Control Input Voltage Range:  
Logic Input Frequency:  
Minimum Logic Input Pulse Width:  
H-Bridge Output Current (DC):  
Output ON-Resistance (Total):  
Operating Temperature Range:  
2.0V to 8.0V  
2.0mA(Typ)  
1μA (Max)  
0V to VCCV  
100kHz(Max)  
0.5μs(Min)  
-1.0A to +1.0A  
1.0Ω(Typ)  
-30°C to +75°C  
Features  
Low ON-Resistance Power DMOS Output  
Charge Pump for the High-Side DMOS Gates  
Drive Mode Switch Function  
Under Voltage Locked Out Protection  
& Thermal Shut Down Circuit  
Package  
SSOP-B20  
W(Typ) x D(Typ) x H(Max)  
6.50mm x 6.40mm x 1.45mm  
Applications  
Mobile system  
Home appliance  
Amusement system, etc  
SSOP-B20  
Typical Application Circuit  
Bypass Filter Capacitor for  
Power Supply  
Power-Saving  
H: Active  
L: Stand-by  
Bypass Filter Capacitor for  
Power Supply  
1µF to 100µF  
VCC  
1
PS 20  
Power Save  
TSD & UVLO  
BST  
BandGap  
1µF to 100µF  
5
6
VM  
Motor Control Input  
OUT1  
H bridge  
Full ON  
IN1A 19  
IN1B 18  
M
OUT2  
Level Shift  
&
7
4
Logic  
IN2A 17  
OUT3  
OUT4  
Pre Driver  
H bridge  
Full ON  
IN2B 16  
3
2
8
PWMEN 15  
MGND2  
MGND1  
Power Save  
OSC  
Selectable Drive Mode  
H : EN/IN  
L : IN/IN  
Charge Pump  
Charge Pump  
10  
14  
13  
12  
11  
9
GND  
CPL1  
CPL2  
CPH1  
CPH2  
BST  
0.1μF  
0.1μF  
1.0μF  
Connecting capacitors between the CPL1 and CPL2, CPH1 and CPH2, and BST and GND  
pins generate a BST voltage. Use caution to ensure that the voltage difference between  
BST and VM is 3.0V or higher, and that the BST voltage does not exceed the absolute  
maximum rating of 15V, especially set the BST voltage direct input.  
Product structureSilicon monolithic integrated circuit This product has no designed protection against radioactive rays  
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Pin Configuration  
(TOP VIEW)  
PS  
IN1A  
IN1B  
IN2A  
IN2B  
1
2
20  
19  
18  
17  
16  
VCC  
MGND2  
OUT4  
OUT3  
VM  
3
4
5
PWMEN 15  
6
OUT1  
OUT2  
MGND1  
BST  
CPL1  
CPL2  
CPH1  
CPH2  
14  
13  
12  
11  
7
8
9
GND  
10  
Pin Description  
Pin No.  
Pin Name  
VCC  
MGND2 Motor ground 2  
Function  
Pin No.  
Pin Name  
CPH2  
Function  
1
2
Power supply  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
2nd Bucket stage with capacitor 2  
2nd Bucket stage with capacitor 1  
1st Bucket stage with capacitor 2  
1st Bucket stage with capacitor 1  
CPH1  
3
OUT4  
OUT3  
VM  
H-bridge output 4  
H-bridge output 3  
Motor power supply  
H-bridge output 1  
H-bridge output 2  
CPL2  
4
CPL1  
5
PWMEN Drive mode logic input  
6
OUT1  
OUT2  
IN2B  
IN2A  
IN1B  
IN1A  
PS  
Control logic input 2B  
Control logic input 2A  
Control logic input 1B  
Control logic input 1A  
Power-saving function  
7
8
MGND1 Motor ground 1  
9
BST  
Charge pump output with capacitor  
Ground  
10  
GND  
Block Diagram  
VCC  
1
PS 20  
Power Save  
TSD & UVLO  
BST  
BandGap  
5
6
VM  
OUT1  
H bridge  
Full ON  
IN1A 19  
IN1B 18  
Level Shift  
7
4
OUT2  
OUT3  
Logic  
&
IN2A 17  
Pre Driver  
H bridge  
Full ON  
IN2B 16  
3
2
8
OUT4  
PWMEN 15  
MGND2  
MGND1  
Power Save  
OSC  
Charge Pump  
Charge Pump  
10  
14  
13  
12  
11  
9
CPH2  
GND  
CPL1  
CPL2  
CPH1  
BST  
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Description of Blocks  
1. Power-Saving Function  
A power-saving function is included, which allows the system to save power when not driving the motor. The voltage  
level on this pin should be set high so as to keep the operation mode. (See the Electrical Characteristics; p.4/12)  
2. Motor Control Input  
(a) IN1A, IN1B, IN2A and IN2B Pins  
Logic level controls the output logic of H-Bridge.  
(See the Electrical Characteristics; p.4/12, and I/O Truth Table; p.6/12)  
(b) PWMEN Pin  
Logic level sets the IN/IN or EN/IN drive mode.  
(See the Electrical Characteristics; p.4/12, and I/O Truth Table; p.6/12)  
3. H-Bridge  
Each H-bridge can be controlled independently. It is therefore possible to drive the H-bridges simultaneously, as long  
as the package thermal tolerances are not exceeded. Because the output transistors consist of power DMOS that  
can be controlled the charge pump output VBST, the total ON-Resistance of high and low-side transistor is dependent  
on BST voltage VBST  
.
4. Charge Pump  
The BD6735FV includes charge pump circuit which is used to generate a supply above VM to drive the high-side  
DMOS gates. Three external capacitors should be connected between CPL1 and CPL2, CPH1 and CPH2, BST and  
GND pin. The voltage difference between BST and VM must be 3.0V or higher where the BST voltage VBST must not  
exceed the absolute maximum rating of 15.0V in order to ensure better performance.  
Absolute Maximum Ratings  
Parameter  
Symbol  
Rating  
Unit  
Power Supply Voltage  
VCC  
VM  
-0.5 to +10.0  
-0.5 to +10.0  
-0.5 to +15.0  
-0.5 to +VCC+0.5  
0.81(Note 1)  
-1.0 to +1.0 (Note 2)  
-55 to +150  
150  
V
V
Motor Power Supply Voltage  
Charge Pump Step-up Supply Voltage  
Control Input Voltage  
VBST  
VIN  
V
V
Power Dissipation  
Pd  
W
A
H-bridge Output Current (DC)  
Storage Temperature Range  
Junction Temperature  
IOUT  
Tstg  
Tjmax  
°C  
°C  
(Note 1) Reduced by 6.48mW/°C over 25°C, when mounted on a glass epoxy board (70mm x 70mm x 1.6mm).  
(Note 2) Must not exceed Pd, ASO, or Tjmax of 150°C  
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over  
the absolute maximum ratings.  
Recommended Operating Conditions  
Parameter  
Power Supply Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
2.0  
2.0  
0
-
-
-
-
-
-
8.0  
8.0  
VCC  
100  
-
V
V
VCC  
VM  
Motor Power Supply Voltage  
Control Input Voltage  
V
VIN  
Logic Input Frequency  
0
kHz  
μs  
°C  
FIN  
Minimum Logic Input Pulse Width  
Operating Temperature Range  
0.5  
-30  
TIN  
Topr  
+75  
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Electrical Characteristics (Unless otherwise specified VCC=5.0V, VM=5.0V, Ta=25°C)  
Parameter  
All Circuits  
Symbol  
Min  
Typ  
Max  
Unit  
Conditions  
Stand-by Current  
ICCST  
ICC  
-
0
1
μA  
VPS=0V  
Circuit Current  
0.5  
2.0  
4.0  
mA  
VPS=5V, fIN =100kHz  
PS Input (PS)  
High-Level Input Voltage  
Low-Level Input Voltage  
High-Level Input Current  
Low-Level Input Current  
VPSH  
VPSL  
IPSH  
IPSL  
2.0  
-0.3  
25  
-
-
VCC  
+0.5  
100  
+1  
V
V
50  
0
μA  
μA  
VPS=5V  
VPS=0V  
-1  
Control Input (IN=IN1A, IN1B, IN2A, IN2B, PWMEN)  
High-Level Input Voltage  
Low-Level Input Voltage  
High-Level Input Current  
Low-Level Input Current  
UVLO  
VINH  
VINL  
IINH  
IINL  
2.0  
-0.3  
25  
-
-
VCC  
+0.7  
100  
+1  
V
V
50  
0
μA  
μA  
VIN=5V  
VIN=0V  
-1  
UVLO Voltage  
VUVLO  
1.5  
-
-
1.9  
V
Full ON Type H-Bridge Driver  
Output On-Resistance  
RON  
1.0  
1.35  
Ω
IOUT=700mA, High & Low-side total  
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Typical Performance Curves (Reference data)  
5.0  
800  
600  
400  
200  
0
Top 75°C  
Mid 25°C  
Low -30°C  
4.0  
Operating range  
(2.0V to 8.0V)  
3.0  
2.0  
1.0  
0.0  
Top 75°C  
Mid 25°C  
Low -30°C  
0
2
4
6
8
10  
0
200  
400  
600  
800  
1000  
Power Supply Voltage : VCC [V]  
Output Current : IOUT [mA]  
Figure 1.  
Figure 2.  
Circuit Current vs Power Supply Voltage  
(Operation Mode)  
Output VDS vs Power Output Current  
(Output On-Resistance on high-side, VM=5V, VCC=5V)  
800  
600  
400  
200  
0
Top 75°C  
Mid 25°C  
Low -30°C  
0
200  
400  
600  
800  
1000  
Output Current : IOUT [mA]  
Figure 3.  
Output VDS vs Power Output Current  
(Output On-Resistance on low-side, VM=5V, VCC=5V)  
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Timing Chart  
Table 1. I/O Truth Table  
INPUT  
PWM IN1A/2A IN1B/2B  
OUTPUT  
Input Mode  
PS(Note 3)  
OUT1/3  
Output Mode(Note 4)  
Short Brake  
CW  
OUT2/4  
L
H
H
L
X
L
L
H
L
L
L
EN/IN  
H
H
L
H
Z
L
CCW  
H
L
Z
H
L
Open  
H
L
L
CW  
IN/IN  
-
L
H
H
X
H
L
CCW  
H
X
L
Short Brake  
Open  
X
Z
Z
L: Low, H: High, X: Dont care, Z: Hi impedance  
(Note 3)PS=High: Operation Mode, PS=Low: Stand-by Mode  
(Note 4)CW: Current flows from OUT1 to OUT2 and OUT3 to OUT4, CCW: Current flows from OUT2 to OUT1 and OUT4 to OUT3  
Application Example  
Bypass Filter Capacitor for  
Power Supply  
Power-Saving  
H: Active  
L: Stand-by  
Bypass Filter Capacitor for  
Power Supply  
1µF to 100µF  
VCC  
1
PS 20  
Power Save  
TSD & UVLO  
BST  
BandGap  
1µF to 100µF  
5
6
VM  
Motor Control Input  
OUT1  
OUT2  
IN1A 19  
IN1B 18  
H bridge  
Full ON  
M
Level Shift  
7
4
Logic  
&
IN2A 17  
OUT3  
OUT4  
Pre Driver  
H bridge  
Full ON  
IN2B 16  
3
2
8
PWMEN 15  
MGND2  
MGND1  
Power Save  
OSC  
Selectable Drive Mode  
H : EN/IN  
L : IN/IN  
Charge Pump  
Charge Pump  
10  
14  
13  
12  
11  
9
GND  
CPL1  
CPL2  
CPH1  
CPH2  
BST  
0.1μF  
0.1μF  
1.0μF  
Connecting capacitors between the CPL1 and CPL2, CPH1 and CPH2, and BST and GND  
pins generate a BST voltage. Use caution to ensure that the voltage difference between  
BST and VM is 3.0V or higher, and that the BST voltage does not exceed the absolute  
maximum rating of 15V, especially set the BST voltage direct input.  
Selection of Components Externally Connected  
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external  
components including static and transitional characteristics as well as dispersion of the IC.  
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Power Dissipation  
1.0  
0.81W  
0.8  
0.6  
0.4  
0.2  
0.0  
0.49W  
75°C  
75 100  
0
25  
50  
125  
150  
Ambient Temperature : Ta [°C]  
Figure 4.  
Power Dissipation vs Ambient Temperature  
I/O Equivalent Circuits  
PS  
IN1A, IN1B, IN2A, IN2B, PWMEN  
VM, MGND1, MGND2, OUT1 to OUT4  
VM  
VCC  
VCC  
70kΩ  
VCC  
10kΩ  
100kΩ  
100kΩ  
OUT1, 3  
OUT2, 4  
VCC  
3.33kΩ  
275kΩ  
MGND1, 2  
CPH1, CPL1  
BST, CPH2, CPL2  
Inside REG  
VM  
BST  
CPH2  
CPL2  
VM  
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Operational Notes  
1.  
2.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the ICs power  
supply pins.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3.  
4.  
Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
Ground Wiring Pattern  
When using both small-signal(GND) and large-current ground(MGND) traces, the two ground traces should be routed  
separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the  
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not  
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line  
impedance.  
5.  
Thermal Consideration  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size  
and copper area to prevent exceeding the Pd rating.  
6.  
7.  
Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately  
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.  
Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may  
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,  
and routing of connections.  
8.  
9.  
Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)  
and unintentional solder bridge deposited in between pins during assembly to name a few.  
11. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
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Operational Notes continued  
12. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should  
be avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 5.  
Example of monolithic IC structure  
13. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
14. Area of Safe Operation (ASO)  
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe  
Operation (ASO).  
15. Thermal Shutdown Circuit(TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction  
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below  
the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from  
heat damage.  
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BD6735FV  
Ordering Information  
B D  
6
7
3
5
F
V
-
E 2  
Packaging and forming specification  
E2: Embossed tape and reel  
Package  
FV : SSOP-B20  
Part Number  
Marking Diagram  
SSOP-B20 (TOP VIEW)  
Part Number Marking  
LOT Number  
B D 6 7 3 5  
1PIN MARK  
Part Number Marking  
Package  
SSOP-B20  
Orderable Part Number  
BD6735  
BD6735FV-E2  
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BD6735FV  
Physical Dimension, Tape and Reel Information  
Package Name  
SSOP-B20  
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Revision History  
Date  
Revision  
001  
Changes  
09.Dec.2015  
New Release  
www.rohm.com  
TSZ02201-0H3H0B601300-1-2  
09.Dec.2015 Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
12/12  
TSZ2211115001  
Daattaasshheeeett  
Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.002  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PGA-E  
Rev.002  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Datasheet  
Buy  
BD6735FV - Web Page  
Distribution Inventory  
Part Number  
Package  
Unit Quantity  
BD6735FV  
SSOP-B20  
2500  
Minimum Package Quantity  
Packing Type  
Constitution Materials List  
RoHS  
2500  
Taping  
inquiry  
Yes  
配单直通车
BD6735FV-E2产品参数
型号:BD6735FV-E2
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
零件包装代码:SSOP
包装说明:LSSOP, TSSOP20,.25
针数:20
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:10 weeks
风险等级:1.62
模拟集成电路 - 其他类型:STEPPER MOTOR CONTROLLER
JESD-30 代码:R-PDSO-G20
长度:6.5 mm
功能数量:1
端子数量:20
最高工作温度:75 °C
最低工作温度:-30 °C
最大输出电流:1 A
封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP
封装等效代码:TSSOP20,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V
认证状态:Not Qualified
座面最大高度:1.35 mm
子类别:Motion Control Electronics
最大供电电流 (Isup):4 mA
最大供电电压 (Vsup):8 V
最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):5 V
表面贴装:YES
温度等级:COMMERCIAL EXTENDED
端子形式:GULL WING
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4.4 mm
Base Number Matches:1
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