CD4012BE各脚功能电路原理芯片引脚定义引脚图及功能IC贸易商-中国IC网-芯三七

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产品型号CD4012BE的概述

芯片CD4012BE的概述 CD4012BE是一款广泛应用的集成电路，属于74系列数字逻辑器件中的一种。该芯片主要用于数字电路中实现双输入与非门的功能。随着电子技术的不断发展，CD4012BE在各类电子产品中扮演了至关重要的角色，尤其是在逻辑运算、信号处理及其他相关应用中。同时，该芯片也具有抗干扰能力强、功耗低及灵活性高等优点，是设计数字电路时的一个理想选择。芯片CD4012BE的详细参数 CD4012BE的主要参数包括： 1. 工作电源电压：芯片的电源电压范围为3V至15V，适应各种应用场合。 2. 逻辑电平： - 高电平：大于或等于0.7VDD - 低电平：小于或等于0.3VDD 3. 输入电流：每个输入端的流入电流为最大1 µA。 4. 输出电流：最大输出电流为25 mA，适合驱动其他器件。 5. 工作温度范围：通常情况下，芯片的工作温度为-55°C至125°C...

产品型号CD4012BE的Datasheet PDF文件预览

Data sheet acquired from Harris Semiconductor

SCHS021D – Revised September 2003

The CD4011B, CD4012B, and CD4023B types

are supplied in 14-lead hermetic dual-in-line

ceramic packages (F3A suffix), 14-lead

dual-in-line plastic packages (E suffix), 14-lead

small-outline packages (M, MT, M96, and NSR

suffixes), and 14-lead thin shrink small-outline

packages (PWR suffix). The CD4011B and

CD4023Btypes also are supplied in 14-lead thin

shrink small-outline packages (PW suffix).

PACKAGE OPTION ADDENDUM

www.ti.com

10-Mar-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CFP

PDIP

Drawing

89265AKB3T

89266AKB3T

89273AKB3T

CD4011BE

OBSOLETE

ACTIVE

None

Call TI

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4011BF

CD4011BF3A

CD4011BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4011BM96

CD4011BMT

CD4011BNSR

CD4011BPW

CD4011BPWR

CD4012BE

ACTIVE

SOIC

2500

250

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

CU NIPDAU Level-NC-NC-NC

2000

Pb-Free

(RoHS)

Pb-Free

(RoHS)

CD4012BF3A

CD4012BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4012BM96

CD4012BMT

CD4012BNSR

CD4012BPWR

CD4023BE

ACTIVE

SOIC

2500

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4023BF

CD4023BF3A

CD4023BM

ACTIVE

CDIP

SOIC

None

Call TI

Level-NC-NC-NC

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4023BM96

CD4023BMT

CD4023BNSR

CD4023BPW

CD4023BPWR

ACTIVE

SOIC

2500

250

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

2000

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Mar-2005

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

Drawing

JM38510/05051BCA

JM38510/05052BCA

JM38510/05053BCA

ACTIVE

None

Call TI

Level-NC-NC-NC

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

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Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

Audio

Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

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www.ti.com/automotive

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dsp.ti.com

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Military

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

Logic

interface.ti.com

logic.ti.com

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power.ti.com

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Security

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www.ti.com/security

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microcontroller.ti.com

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Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

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CD4012BE产品参数

型号:	CD4012BE
生命周期：	Transferred
包装说明：	,
Reach Compliance Code：	unknown
风险等级：	5.76
Base Number Matches：	1

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