CD4013BM96原理图各脚功能电路原理芯片引脚定义引脚图及功能-中国IC网-芯三七

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产品型号CD4013BM96的概述

CD4013BM96 芯片概述及其应用解析一、概述 CD4013BM96 是一款双 D 型触发器芯片，广泛应用于数字电路中，尤其是在时序逻辑电路设计中。它是基于 CMOS 技术制造的，具有低功耗、高噪声容忍度等优势。由于其独特的功能，CD4013BM96 可以实现多种数据处理和存储方案，使其成为设计师在构建复杂时序电路时的重要选择。该芯片的引脚配置和逻辑功能使其能够接收数据输入并在特定时钟边缘时对其进行采样。它主要由两个单元组成，每个触发器的输出可以被用于其他电路中，并且其输入状态可以通过外部信号进行控制。CD4013BM96 的广泛应用包括计数器、寄存器、状态机等多种功能模块。二、详细参数 CD4013BM96 的主要参数如下： - 逻辑类型: D 型触发器 - 电源电压范围: 3V 至 15V - 典型工作电源电压: 5V、9V 和 15V - 输入电平范围: VSS ≤ ...

产品型号CD4013BM96的Datasheet PDF文件预览

Data sheet acquired from Harris Semiconductor

SCHS023D − Revised April 2005

The CD4013B types are supplied in 14-lead

hermetic dual-in-line ceramic packages

(F3A suffix), 14-lead dual-in-line plastic

packages (E suffix), 14-lead small-outline

packages (M, MT, M96, and NSR suffixes),

and 14-lead thin shrink small-outline

packages (PW and PWR suffixes).

PACKAGE OPTION ADDENDUM

www.ti.com

26-Sep-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

89267AKB3T

CD4013BE

OBSOLETE

ACTIVE

CFP

TBD

Call TI

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4013BEE4

ACTIVE

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD4013BF

CD4013BF3A

CD4013BK3

CD4013BM

ACTIVE

CDIP

CFP

TBD

Call TI

Level-NC-NC-NC

Call TI

OBSOLETE

ACTIVE

SOIC

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4013BM96

CD4013BM96E4

CD4013BME4

ACTIVE

SOIC

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4013BMT

SOIC

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4013BMTE4

CD4013BNSR

SOIC

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4013BNSRE4

CD4013BPW

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

CDIP

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4013BPWE4

CD4013BPWG4

CD4013BPWR

CD4013BPWRE4

CD4013BPWRG4

JM38510/05151BCA

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TBD

Call TI

Level-NC-NC-NC

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

no Sb/Br)

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

26-Sep-2005

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

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enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

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CD4013BM96相关文章

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CD4013BM96产品参数

型号:	CD4013BM96
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	TEXAS INSTRUMENTS INC
零件包装代码：	SOIC
包装说明：	SOIC-14
针数：	14
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	1 week
风险等级：	0.68
Samacsys Confidence：	3
Samacsys Status：	Released
Samacsys PartID：	11142
Samacsys Pin Count：	14
Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	Small Outline Packages
Samacsys Footprint Name：	D(R-DPSO-G14)
Samacsys Released Date：	2017-10-11 14:23:31
Is Samacsys：	N
系列：	4000/14000/40000
JESD-30 代码：	R-PDSO-G14
JESD-609代码：	e4
长度：	8.65 mm
负载电容（CL）：	50 pF
逻辑集成电路类型：	D FLIP-FLOP
最大频率@ Nom-Sup：	3500000 Hz
最大I（ol）：	0.0068 A
湿度敏感等级：	1
位数：	1
功能数量：	2
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-55 °C
输出极性：	COMPLEMENTARY
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP14,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
包装方法：	TR
峰值回流温度（摄氏度）：	260
电源：	5/15 V
最大电源电流（ICC）：	0.06 mA
Prop。Delay @ Nom-Sup：	300 ns
传播延迟（tpd）：	300 ns
认证状态：	Not Qualified
座面最大高度：	1.75 mm
子类别：	FF/Latch
最大供电电压 (Vsup)：	18 V
最小供电电压 (Vsup)：	3 V
标称供电电压 (Vsup)：	5 V
表面贴装：	YES
技术：	CMOS
温度等级：	MILITARY
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
触发器类型：	POSITIVE EDGE
宽度：	3.91 mm
最小 fmax：	12 MHz
Base Number Matches：	1

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