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产品型号FPF2700MX的概述

芯片FPF2700MX的概述 FPF2700MX是一种高性能的电源管理芯片，属于功率管理集成电路（PMIC）类别，广泛应用于现代电子设备中。这款芯片主要用于高效输出和电源分配，特别是在智能手机、平板电脑、便携式设备及消费类电子产品中，能够有效地优化电源管理，提升整体系统效率。FPF2700MX以其优越的性能、低静态功耗和丰富的功能而受到市场的广泛青睐，适用于多种电源方案。 FPF2700MX设计目标是满足当今快速发展的电子应用需求，其主要功能包括输出电压调节、电池充电、过压保护、短路保护等。其内部集成了多种电源管理功能，使得系统设计更加简洁，也能有效节省PCB空间。此外，FPF2700MX支持多种输入电压范围，具备较强的适应性，能够在不同环境下稳定工作。芯片FPF2700MX的详细参数 FPF2700MX的详细参数包括但不限于以下内容： - 输入电压范围：2.5V至5.5V - 输出...

产品型号FPF2700MX的Datasheet PDF文件预览

January 2011

FPF2700 / FPF2701 / FPF2702 — AccuPower™ 0.4~2A

Adjustable Over-Current Protection Load Switches

Features

Description

2.8V to 36V Input Voltage Range

The AccuPower™ FPF270X series is a family of

current-limit load switches that provide full protection to

systems and loads from excess current conditions.

Minimum current limit is adjustable from 0.4A to 2.0A.

The FPF270X contains a slew-rate-controlled N-channel

MOSFET and slew-rated turn-on to prevent power bus

disturbances from being caused by “hot plugging” loads

or momentary excess load demands. The input voltage

range is 2.8V to 36V. Loads can be activated or

deactivated with a low-voltage logic-compatible ON pin.

Fault conditions can be monitored using the error flag

pin and/or the power-good pin.

Typical R_DS(ON)=88m

0.4A to 2A Adjustable Current Limit (Min.)

Slew Rate Controlled

ESD Protected, above 2000V HBM

Thermal Shutdown

Active LOW Enable

UVLO Protection

Power-Good Output

Applications

Each member of the FPF270X family serves a category

of load-fault response. All devices clamp the load

current so that it cannot exceed an externally

programmed current level. An over temperature feature

provides further device protection in case of excessive

levels of power dissipation.

Motor Drives

Digital Cameras

Consumer Electronics

Industrial

FPF2700 responds to an overload condition that lasts

longer than a fixed blanking period by turning off the

load, followed by a retry after the auto-restart time.

Computing

Hard Disk Drives

Telecom Equipment

FPF2701 responds to an overload condition that lasts

longer than a fixed blanking period by latching off the

load. The load remains off unless either the ON pin is

toggled or the input voltage cycles through UVLO.

FPF2702 is intended to be used with external fault

management. Like the FPF2700 and FPF2701, it sets

the fault signal pin LOW when it activates current

clamping. This device is intended for applications where

external fault management coordinates the overload

response with the FPF2702.

Figure 1. MLP (Top View) Figure 2. MLP (Bottom View)

The FPF270X is available in a space-saving Pb and

Halogen free, 8-lead MLP 3x3mm and SO8 packages.

Figure 3. SO8 (Top View)

Ordering Information

Part

Number

Current Limit

Blanking Time [ms]

Auto-Restart

Time [ms]

ON Pin

Activity

Current Limit [A]

Package

FPF2700MPX

FPF2701MPX

FPF2702MPX

FPF2700MX

FPF2701MX

FPF2702MX

0.4 – 2.0

0.5

127.5

Active LOW

MLP3X3

SO8

127.5

SO8

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Application Diagram

36V MAX.

TO LOAD

VIN

VOUT

FLAGB

PGOOD

OFF

C_OUT

V_IN

2.8V – 36V

C_IN

ISET

R_SET

GND

Figure 4. Typical Application

Block Diagram

Figure 5. Block Diagram

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Pin Configurations

VIN

VOUT

VIN

PGOOD

FLAGB

PGOOD

GND

ISET

GND

Figure 6. MLP (Bottom View)

Figure 7. SO8 (Top View)

Pin Definitions

Pin #

Name

Description

VIN

Supply Input. Input to the power switch and the supply voltage for the IC.

Power-Good Output. Open-drain output to indicate that output voltage has reached 90% of

input voltage.

PGOOD

ISET

Current Limit Set Input. A resistor from ISET to ground sets the current limit for the switch.

ON Control Input. Active LOW.

Ground

GND

No connection. Leave open or connect to ground.

Fault Output. Active LOW, open-drain output that indicates current limit, under-voltage, or

over -temperature state.

FLAGB

VOUT

Switch Output. Output of the power switch.

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device

reliability. The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Min.

-0.3

Max.

Unit

PGOOD, FLAGB, VIN to GND

VOUT to GND

ON to GND

V_IN+ 0.3

MLP 3x3⁽¹⁾, See Figure 8

SO8⁽¹⁾, See Figure 10

1.25

1.00

3.5

P_D

Power Dissipation (T_A=25°C)

I_SW

T_J

Maximum Continuous Switch Current

Operating Junction Temperature

Storage Temperature

-40

-65

+125

+150

°C

T_STG

Human Body Model, JESD22-A114

2000

Electrostatic Discharge

Protection Level

ESD

Charged Device Model, JESD22-C101

MLP 3x3⁽¹⁾, See Figure 8

SO8⁽¹⁾, See Figure 10

Thermal Resistance,

Junction to Ambient

°C/W

_JA

102

Note:

1. Thermal resistance, θ_JA, is determined with the device mounted on a one inch square pad, 2oz copper pad, and

a 1.5 x 1.5in. board of FR-4 material.

Figure 8. 80°C/W Mounted on a 1in²Pad of

2oz. Copper

Figure 9. 226°C/W Mounted on a Minimum Pad of

2oz. Copper

Figure 10. 102°C/W mounted on a 1in²Pad of

2oz. Copper

Figure 11. 181°C/W Mounted on a Minimum Pad of

2oz. Copper

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol

V_IN

Parameter

Min.

2.8

Max.

36.0

Unit

Input Supply Voltage

Ambient Operating Temperature

T_A

-40

°C

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Electrical Characteristics

V_IN=2.8 to 36V and T_A=-40 to +85°C unless otherwise noted. Typical values are at V_IN=12V and T_A=25°C.

Symbol

Parameter

Conditions

Min. Typ. Max. Unit

Basic Operation

V_IN

I_Q

Operating Voltage

Quiescent Current

2.8

36.0

140

V_IN=12V, V_ON=0V, I_OUT=0A

V_IN=36V, V_ON=3.3V, I_OUT=0A

T_A=25°C, V_IN=12V

μA

I_SHDN

Shutdown Current

114

140

114

140

T_A=-40 to +85°C, V_IN=12V

T_A=25°C, V_IN=5V

R_ON

On-Resistance

mΩ

T_A=-40 to +85°C, V_IN=5V

V_IN=2.8 to 36V

V_IH

V_IL

ON Input Logic HIGH Voltage

ON Input Logic LOW Voltage

ON Input Leakage

2.0

-1

V_IN=2.8 to 36V

0.8

I_LK

V_ON=5.5V or GND

μA

I_SWOFF

Off Switch Leakage

V_IN=36V, V_ON=3.3V, V_OUT=0V

V_IN=5V, I_SINK=1mA

0.01

0.1

V_FLAGB(LO)FLAGB Output Logic LOW Voltage

0.2

FLAGB Output Logic HIGH Leakage

I_FLAGB(HI)

Current

V_IN=36V, Switch On, V_FLAGB=36V

μA

V_IN=5V, V_OUTas Percent of V_IN,

V_PGOOD

PGOOD Trip Voltage

V_OUTRising

V_IN=5V, V_OUTas Percent of V_IN,

V_PGOOD(HYS)PGOOD Hysteresis

V_PGOOD(LO)PGOOD Output Logic LOW Voltage

I_PGOOD(HI)PGOOD Output High Leakage Current

Protections

V_OUTFalling

V_IN=5V, I_SINK=1mA

0.1

0.2

V_IN=36V, Switch ON,

μA

V_PGOOD=36V

0.8 x 1.0 x 1.2 x

I_LIM

I_SC

Current Limit

T_A=25°C

I_NOM

V_OUT< 2V, Switch in Over-

Current Condition

0.75 x

I_NOM

Short Circuit Current Limit

Shutdown Threshold

Return from Shutdown

Hysteresis

140

110

TSD

Thermal Shutdown

°C

UVLO

Under-Voltage Shutdown

V_INIncreasing

2.3

2.5

100

2.7

UVLO__HYSTUnder-Voltage Shutdown Hysteresis

Dynamic

t_don

t_doff

Turn On Delay

2.7

0.1

Turn Off Delay

R_L=500Ω, C_L=2uF

t_R

V_OUTRise Time

7.5

t_F

V_OUTFall Time

1.5

t_BLANK

t_RESTART

t_CLR

Over-Current Blanking Time

Auto-Restart Time

Current-Limit Response Time

FPF2700/1, T_A=25°C

FPF2700, T_A=25°C

V_IN=12V, V_ON=0V

0.25

0.50

0.75

μs

63.8 127.5 191.2

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Timing Diagram

V_OUT

V_ON

t_R

t_F

3.3

V_OUT

t_don

t_doff

t_ON= t_R+ t_dont_OFF= t_F+ t_doff

Figure 12. Timing Diagram

Typical Performance Characteristics

V_IN= 12V and T_A= 25°C.

1.40

1.80

1.70

1.60

1.50

1.40

1.30

1.20

1.10

1.00

0.90

0.80

T_A= 25°C

V_IN= 12V

1.38

1.35

V_IH

1.33

V_IH

1.30

V_IL

1.28

1.25

1.23

1.20

‐50

‐25

100

125

150

Supply Voltage (V)

T_J, Junction Temperature (^oC)

Figure 13. ON Threshold vs. Supply

Figure 14. ON Threshold vs. Temperature

130

120

110

100

V_ON= 0V

T_A= 125°C

V_ON= 5V

T_A= 125°C

T_A= 85°C

T_A= 25°C

T_A= 85°C

T_A= 25°C

T_A= ‐40°C

Supply Voltage (V)

Figure 15. Quiescent Current vs. Supply Voltage (ON) Figure 16. Quiescent Current vs. Supply Voltage (OFF)

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Typical Performance Characteristics

V_IN= 12V and T_A= 25°C.

Figure 17. On Resistance vs. Supply Voltage

Figure 18. On Resistance vs. Junction Temperature

4.0

V_IN= 12V

R_L= 500

C_L= 2µF

3.5

3.0

2.5

2.0

1.5

1.0

‐50

‐25

100 125 150

T_J, Junction Temperature (^oC)

Figure 19. Turn-On Delay vs. Junction Temperature Figure 20. Output Rise Time vs. Junction Temperature

Figure 21. Turn-Off Delay vs. Junction Temperature Figure 22. Output Fall Time vs. Junction Temperature

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Typical Operation Characteristics of FPF2700 and FPF2701

When V_OUT<2V, the current limit is set to 75% of I_LIM

Figure 23. Normal Startup to 0.5X I_LIM

Figure 24. OUT Shorted to GND, Short Condition

Persists (SOA Protection Followed by Current-Limited

Operation)

Figure 25. OUT Overloaded with 1.5X I_LIM

(Long-Duration Overload)

Figure 26. OUT Shorted to GND, Short Condition

Removed (SOA Protection Followed by

Normal Operation)

Figure 27. OUT Overloaded with 1.5X I_LIM

(Transient Overload)

www.fairchildsemi.com

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

Typical Operation Characteristics of FPF2702

Figure 28. OUT Shorted to GND, Short Condition Persists

(SOA Protection Current Limit Followed by Current Limit)

Figure 29. OUT Overloaded with 1.5X I_LIM(Long-Duration Overload)

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Typical Performance Characteristics FPF270X

V_IN= 12V and T_A= 25°C.

Figure 30. 12V Turn-On Delay (R_L=500, C_OUT=2µF)

Figure 31. 12V Turn-Off Delay (R_L=500, C_OUT=2µF)

Figure 32. 12V Blanking Time

(Output Overloaded and t_blankExpired, FPF2700/01,

Figure 33. 12V Restart Time

(Switch Turned ON into Persistent Over-Current

Condition,t_RESTART~127.5ms)

(2)

_LIM=1A, I_LOAD=3.3A, C_OUT=µF, R_LOAD=500) V_OC

Figure 34. Soft Overload and Constant Current

(I_LOAD> I_LIM, FPF2702 Enters Constant Current Mode,

Figure 35. OUT Shorted to GND, Short Condition

Removed (SOA Protection Followed by a Normal

Operation, FPF2700 / FPF2701)

Running at I_LIM

)

Note:

2. V_OCsignal forces the device into an over-current condition by loading a 500m resistor to the output through an

NMOS. V_OCis the gate drive of the NMOS.

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Application Information

Description of Operation

Current Limiting

The FPF270X family of current limit load switches is

designed to meet the power requirements of a variety of

applications with wide input voltage range of 2.8V to 36V

and adjustable current-limit value. The FPF270X family

offers control and protection while providing optimum

operation current for safe design practices. The core of

each switch is a typical 88mΩ (V_IN= 12V) N-channel

MOSFET and a controller capable of functioning over an

input voltage range of 2.8V to 36V.

The current limit ensures that the current through the

switch doesn't exceed a maximum value while not

limiting at less than a minimum value. The current-limit

level is adjustable through an external resistor

connected between the ISET pin and GND.

The typical current limit level is adjustable from 500mA

to 2.5A. The minimum current limit (I_LIM(MIN)) range is

from 0.4A to 2.0A, including 20% current-limit tolerance.

The FPF2700 and FPF2701 have a blanking time during

which the switch acts as a constant-current source

(Figure 27). If the over-current condition persists beyond

the blanking time, the FPF2700 latches off and shuts the

switch off (Figure 32). If the ON pin is kept active, an

auto-restart feature releases the switch and turns the

switch on again after the auto-restart time (Figure 33). If

the over-current condition persists beyond the blanking

time, the FPF2701 latch-off feature shuts the switch off.

The switch is kept off until the ON pin is toggled or input

power is cycled. The FPF2702 has no current-limit

blanking period, so it remains in a constant-current state

until the ON pin is deactivated or the thermal shutdown

turns off the switch.

FPF270X offers adjustable current limiting, under-

voltage lockout (UVLO), power-good indicator

(PGOOD), fault flag output (FLAGB), and thermal

shutdown protection. In the event of an over-current

condition, the load switch limits the load to the current

limit value. The current limit value for each switch can

be adjusted from 400mA to 2A through the ISET pin.

On/Off Control

The ON pin is active LOW for and controls the state of

the switch. Pulling the ON pin continuously to LOW

holds the switch in ON state. The switch moves into

OFF state when the ON pin is pulled HIGH. The ON pin

can be pulled HIGH to a maximum voltage of 5.5V.

Besides the current-limiting functionality, the switch is

protected by the thermal shutdown protection and an

independent SOA protection circuit is available.

An under-voltage condition on the input voltage or a

junction temperature in excess of 140°C overrides the

ON control and turns off the switch. In addition, an over-

current condition causes the switch to turn off in the

FPF2700 and FPF2701 after the expiration of the

blanking time. The FPF2700 has an auto-restart feature

that automatically turns the switch ON again after the

auto-restart time. For the FPF2701, the ON pin must be

toggled to turn the switch on again. The FPF2702 does

not turn off in response to an over-current condition; it

remains operating in Constant-Current Mode as long as

ON is enabled and the thermal shutdown or UVLO have

not activated. The ON pin does not have internal pull-

down or pull-up resistors and should not be left floating.

SOA Protection Current Limit (I_OUT> 12A)

FPF270X has an SOA protection feature to protect the

load switch in response to current surges exceeding 12A

in normal operation. If a short-circuit event occurs

(I_OUT>12A), the switch is turned off in about 1µs by an

independent Safe Operating Area (SOA) protection

circuit (Figure 26, Figure 28). This feature protects the

switch in case of sudden, high-current events at the

output, such as a short to GND. The switch turns on

automatically after a turn-on delay of about 2.7ms.

Short-Circuit Current Limit (V_OUT< V_SCTH= 2V)

Fault Reporting

When the output voltage drops below the short-circuit

threshold voltage, V_SCTH, the current-limit value re-

conditions itself to the short-circuit current limit value,

Upon detection of an over-current condition, an input

UVLO, or an over-temperature condition, the FLAGB

signals the Fault Mode by activating LOW. In the event

of an over-current condition for the FPF2700 or

FPF2701, the FLAGB goes LOW at the end of the

blanking time (Figure 24 and Figure 25). FLAGB goes

LOW immediately for the FPF2702 (Figure 29). If the

over-current condition lasts longer than blanking time,

FLAGB remains LOW through the auto-restart time for

the FPF2700. For the FPF2701, FLAGB is latched LOW

and ON must be toggled to release it.

which is 75% of the nominal current limit (0.75 x I_LIM,

)

(Figure 24). This prevents early thermal shutdown by

reducing the power dissipation of the device. The V_SCTH

value is set at 2V. At about V_OUT= 2.1V, the switch is

removed from short-circuit current-limiting mode and the

current limit is set to the nominal current limit value.

Setting the Current Limit Value

For FPF2702, FLAGB is LOW during a fault and

immediately returns HIGH at the end of the fault

condition. FLAGB is an open-drain MOSFET that

requires a pull-up resistor. The maximum pull-up voltage

is 36V (Figure 29).

The FPF270X has an adjustable 0.4A to 2.0A minimum

current limit set through an external resistor, R_SET

connected between ISET and GND. A precision R_SET

value must be used, such as 1% tolerance or lower, to

minimize the total current limit tolerance of the system.

During shutdown, the pull-down on FLAGB is disabled to

reduce current draw from the supply. A 100KΩ pull-up

resistor is recommended in the application.

Use the following equation to calculate the value of the

resistor for intended typical current limit value:

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

277.5

R_SET(K) 

Power Good

(1)

I_LIM(TYP)(A)

FPF270X has a power good feature. The PGOOD pin is

an open-drain MOSFET that asserts HIGH when the

output voltage reaches 90% of the input voltage (Figure

26). A typical 3% PGOOD hysteresis is added to

PGOOD to prevent PGOOD from chattering as V_OUT

falls near the PGOOD threshold voltage.

I_LIM(TYP)is the typical current limit value based on a given

R_SET

Table 1. R_SETSelection Guide

Current Limit [A]

R_SET

(k)

Tol. (%)

The PGOOD pin requires an external pull-up resistor

connected to an external voltage source compatible with

input levels of other chips connected to this pin. PGOOD

is kept LOW when the device is inactive. To save

current in the OFF state, the pull-up resistor of the

PGOOD pin can be connected to the output voltage

when there is no battery, provided that compatibility with

the input levels of other devices connected to PGOOD is

observed. A typical value of 100kΩ is recommended for

the pull up resistor. When the power-good feature is not

used in the application, the PGOOD pin can be

connected to GND.

Min.

Typ.

2.50

2.24

1.89

1.52

1.26

1.01

0.74

0.51

Max.

111

124

147

182

220

274

374

549

2.00

1.79

1.51

1.22

1.01

0.81

0.59

0.40

3.00

2.69

2.27

1.83

1.51

1.22

0.89

0.61

Thermal Shutdown

2.8

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

100

Thermal shutdown protects the die from internally or

externally generated excessive temperatures. During an

over-temperature condition; as the temperature

increases above 140°C, FLAGB is activated and the

switch is turned off.

When the die cools down sufficiently (die temperature

drops below the threshold level), the switch

automatically turns on again. To avoid unwanted thermal

oscillations, a 30°C (typical) thermal hysteresis is

implemented between thermal shutdown entry and exit

temperatures. Proper board layout is required to prevent

premature thermal shutdown (see Figure 38 for thermal

shutdown behavior on FPF2702).

200

300

400

500

600

_SET(k)

Figure 36. I_LIMvs. R_SET

Under-Voltage Lockout (UVLO)

The under-voltage lockout feature turns off the switch if

the input voltage drops below the under-voltage lockout

threshold. With the ON pin active (ON pin pulled LOW),

the input voltage rising above the under-voltage lockout

threshold causes a controlled turn-on of the switch

(Figure 37). The UVLO threshold voltage is set internally

at 2.5V for V_INrising. The under-voltage lockout

threshold has a 0.1V hysteresis.

Figure 38. FPF2702 Thermal Shutdown Behavior

Figure 37. Under-Voltage Lockout Performance

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

SOA (FPF2702)

During extended output-short conditions, excessive

power dissipation occurs in the load switch. FPF2700

and PFP2701 are protected by turning off the load

switch after blanking time. FPF2702 has no blanking

time feature; please refer to Note 3.

It is possible to estimate the SOA for the two FPF2702

packages, MPX and MX, through their respective SOA

curves shown in Figure 39 and Figure 40. These curves

provide a reference on how long the load switch

survives under the worst-case scenario with minimum

pad size of one square inch.⁽¹⁾

Figure 39. FPF2702 MPX SOA

Figure 40. FPF2702 MX SOA

Note:

3. To protect FPF2702 from an extended short condition, additional protection must be implemented in the system

to protect the device. For example, the FLAGB and PGOOD signal can be used to monitor the short-circuit fault

condition. In applications where FPF2702 can be exposed to persistent short-circuit conditions, it should be used

only with external fault management control to protect the switch.

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Input Capacitor

Power Dissipation

To limit the voltage drop on the input supply caused by

transient inrush currents when the switch is turned on

into a discharged load capacitor or short-circuit; an input

capacitor, C_IN, is recommended between the IN and

GND pins. The FPF270X features a fast current limit

response time (50μs). During this period, the device

relies on the input capacitor to supply the load current. A

10μF to 100μF ceramic capacitor is adequate for C_INin

most cases. Larger C_INvalues may be required in high-

voltage or high-current applications. An electrolytic

capacitor can be used in parallel to further reduce the

voltage drop.

During normal operation as a switch, the power

dissipation of the device is small and has little effect on

the operating temperature of the part. The maximum

power dissipation for the switch in normal operation

occurs just before the switch enters into current limit.

This may be calculated using the equation:

P_{D _ MAX ( NormalOper ation )} (I_{LIM ( Max )}

)

 R_{ON ( MAX )}

(3)

The maximum junction temperature should be limited to

125°C under normal operation. Junction temperature

can be calculated using the equation:

T_J P_D_JAT_A

(4)

Output Capacitor

where:

A 0.1μF to 1μF capacitor, C_OUT, should be placed

between the OUT and GND pins. This capacitor helps

prevent parasitic board inductances from forcing the

output voltage below ground when the switch turns

off. This capacitor should have a low dissipation

factor. An X7R Multilayer Ceramic Chip (MLCC)

capacitor is recommended.

T_Jis junction temperature;

P_Dis power dissipation on the switch;

_JAis the thermal resistance, junction-to-ambient of

the package; and

T_Ais ambient temperature.

During startup, the total output current consists of both

the load current and the charge current of the output

capacitor. For the FPF2700 and FPF2701; if the total

output current exceeds the set current limit threshold

(determined via R_SET) for longer than the blanking time,

the device may not be able to start properly. This

imposes an upper limit to the value of the output

capacitor, given the load current and the selected

current limit value. C_OUTshould not exceed the C_OUTmax

calculated in Equation 2 or the switch does not start

properly due to the set current limit:

Design Example

For a 12V application and I_LIM

power dissipation in a normal operation is calculated as:

= 1A, maximum

(Max)

P_{D _MAX(NormalOperation)(VIN12V )} (1)²0.140  140mW

(5)

FPF2702 P_D(Max)during OC:

If device is in over-current condition and V_OUT>2V,

power dissipation can be calculated as:

P_D= (V_IN- V_OUT) x I_{LIM (Max)}

(6)

C_{OUT max} I_{LIM _MIN}500s /_V

(2)

If device is in short-circuit current limit and V_OUT< 2V,

power dissipation can be calculated as:

High-Voltage Operation (Output Capacitor)

During a hard short condition on the output while

operating at greater than 24V V_IN, a large instantaneous

inrush current is delivered to the shorted output. A

capacitor must be placed at the OUTPUT pin, acting as

a current source to support the instantaneous current

draw (Table 2). A low-ESR capacitor is recommended.

Once the value of the output capacitor is determined

from Table 2, Equation 2 must be reevaluated.

P_D= (V_IN- V_OUT) x (0.75 x I_{LIM (Max)}

)

(7)

Design Example:

Using FPF2702 in a V_IN= 5V application where I_{LIM (Max)}

= 2A, assuming V_OUT= 2.5V; power dissipation across

the switch is calculated as:

P_D= (5 - 2.5) x 2 = 5W

(8)

Table 2. C_OUTSelection Guide

Whereas in a short-circuit current-limit condition (V_OUT

0V), power dissipation is calculated as:

≈

V_IN(V)

Capacitance (μF)

24< V_IN≤ 27

27< V_IN≤ 32

32< V_IN≤ 36

P_D= ((V_IN- V_OUT) x (0.75 x I_{LIM (Max)}) = (5 - 0) x

(0.75 x 2) = 7.5W

(9)

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

PCB Layout Recommendations

For the best performance, all traces should be as short

as possible. To be most effective, the input and output

capacitors should be placed close to the device to

minimize the effects that parasitic trace inductances

may have on normal and short-circuit operation (Figure

42). Using wide traces for IN, OUT, and GND pins helps

minimize parasitic electrical effects as well as the case-

to-ambient thermal impedance.

3. The IN, OUT, and GND pins dissipate most of the

heat generated during high-load current condition.

The layout suggested in Figure 42 and Figure 43 is

strongly recommended illustrating a proper layout

for devices in MLP 3x3 packages. IN, OUT, and

GND pins are connected to adequate copper so

that heat may be transferred as efficiently as

possible out of the device. The low-power FLAGB

and ON pins traces may be laid-out diagonally from

the device to maximize the area available to the

ground pad. Place the input and output capacitors

as close as possible to the device.

To minimize the interference between analog ground

(chip ground, pin 5) and power ground during load

current excursion, the ground terminal of the input and

output capacitors and the R_SETresistor should be routed

directly to chip ground and away from power ground.

Improving Thermal Performance

Improper layout could result in higher junction

temperature and trigger thermal shutdown protection.

This is particularly significant for the FPF2702, where

the device operates in Constant Current Mode under

overload conditions. During fault conditions, the power

dissipation of the switch could exceed the maximum

absolute power dissipation.

The following techniques improve the thermal

performance of this family of devices. These techniques

are listed in order of the significance of their impact.

Figure 42. Proper Layout of Output and Ground

Copper Area (Top, SST, and AST Layers)

1. Thermal performance of the load switch can be

improved by connecting the Die Attach Pad (DAP) of

the MLP 3x3 package to the GND plane of the PCB.

2. Embedding two exposed through-hole vias into the

DAP provides a path for heat to transfer to the back

GND plane of the PCB. A drill size of round, 15 mils

(0.4mm)

with

1-ounce

copper

plating

recommended for appropriate solder reflow.

smaller-size hole prevents the solder from

penetrating into the via, resulting in device lift-up.

Similarly, a larger hole consumes excessive solder

and may result in voiding the DAP.

Figure 43. Proper Layout (Bottom and ASB Layers)

Figure 41. Two Through-Hole Open Vias Embedded

in the DAP

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

FPF270x Demonstration Board

The FPF270X demonstration board has components

and circuitry to demonstrate the load switch’s functions

and features. Thermal performance of the board is

improved using the techniques recommended in the

layout recommendations section. Additional information

about demonstration board can be found in the

FPF270X board users guide.

Figure 44. Top, SST, and AST Layers

Figure 45. Bottom and ASB Layers

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Physical Dimensions

5.00

4.80

0.65

3.81

1.75

6.20

5.80

4.00

3.80

5.60

PIN ONE

INDICATOR

1.27

(0.33)

0.25

C B A

LAND PATTERN RECOMMENDATION

SEE DETAIL A

0.25

0.10

0.25

0.19

1.75 MAX

0.10

0.51

0.33

OPTION A - BEVEL EDGE

0.50

0.25

x 45°

R0.10

GAGE PLANE

OPTION B - NO BEVEL EDGE

0.36

NOTES: UNLESS OTHERWISE SPECIFIED

8°

0°

0.90

A) THIS PACKAGE CONFORMS TO JEDEC

MS-012, VARIATION AA, ISSUE C,

B) ALL DIMENSIONS ARE IN MILLIMETERS.

C) DIMENSIONS DO NOT INCLUDE MOLD

FLASH OR BURRS.

SEATING PLANE

(1.04)

0.406

D) LANDPATTERN STANDARD: SOIC127P600X175-8M.

E) DRAWING FILENAME: M08AREV13

DETAIL A

SCALE: 2:1

Figure 46. 8-Lead, Small Outline Package (SOP)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

Physical Dimensions

0.15 C

3.00

2.52

1.94

3.00

1.70

3.30

PIN1

IDENT

0.56 8X

0.15 C

TOP VIEW

0.47 8X

0.65

RECOMMENDED LAND PATTERN

0.80 MAX

0.10 C

(0.20)

0.08 C

0.05

0.00

NOTES:

SIDE VIEW

A. PACKAGE CONFORMS TO JEDEC MO-229

EXCEPT WHERE NOTED.

SEATING

PLANE

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. LAND PATTERN RECOMMENDATION IS

BASED ON FSC DESIGN ONLY.

2.45

2.35

(0.35) 4X

PIN 1

IDENT

E. DRAWING FILENAME: MKT-MLP08Vrev1.

1.75

1.65

0.40

0.30

0.10

0.05

C A B

0.40

0.30

0.65

BOTTOM VIEW

Figure 1.

8-Lead, 3x3mm Molded Leadless Package (MLP)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2

www.fairchildsemi.com

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FPF2700MX产品参数

型号:	FPF2700MX
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	ROCHESTER ELECTRONICS LLC
零件包装代码：	SOIC
包装说明：	SOP,
针数：	8
Reach Compliance Code：	unknown
风险等级：	5.69
Is Samacsys：	N
内置保护：	OVER CURRENT; THERMAL; UNDER VOLTAGE
接口集成电路类型：	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e3
长度：	4.9 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	8
最高工作温度：	85 °C
最低工作温度：	-40 °C
输出电流流向：	SOURCE
标称输出峰值电流：	0.4 A
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
认证状态：	COMMERCIAL
座面最大高度：	1.75 mm
最大供电电压：	36 V
最小供电电压：	2.8 V
标称供电电压：	12 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子面层：	MATTE TIN
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	30
宽度：	3.9 mm
Base Number Matches：	1

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