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产品型号FPF2700MX的概述

芯片FPF2700MX的概述 FPF2700MX是一种高性能的电源管理芯片,属于功率管理集成电路(PMIC)类别,广泛应用于现代电子设备中。这款芯片主要用于高效输出和电源分配,特别是在智能手机、平板电脑、便携式设备及消费类电子产品中,能够有效地优化电源管理,提升整体系统效率。FPF2700MX以其优越的性能、低静态功耗和丰富的功能而受到市场的广泛青睐,适用于多种电源方案。 FPF2700MX设计目标是满足当今快速发展的电子应用需求,其主要功能包括输出电压调节、电池充电、过压保护、短路保护等。其内部集成了多种电源管理功能,使得系统设计更加简洁,也能有效节省PCB空间。此外,FPF2700MX支持多种输入电压范围,具备较强的适应性,能够在不同环境下稳定工作。 芯片FPF2700MX的详细参数 FPF2700MX的详细参数包括但不限于以下内容: - 输入电压范围:2.5V至5.5V - 输出...

产品型号FPF2700MX的Datasheet PDF文件预览

January 2011  
FPF2700 / FPF2701 / FPF2702 — AccuPower™ 0.4~2A  
Adjustable Over-Current Protection Load Switches  
Features  
Description  
.
.
.
.
.
.
.
.
.
2.8V to 36V Input Voltage Range  
The AccuPower™ FPF270X series is a family of  
current-limit load switches that provide full protection to  
systems and loads from excess current conditions.  
Minimum current limit is adjustable from 0.4A to 2.0A.  
The FPF270X contains a slew-rate-controlled N-channel  
MOSFET and slew-rated turn-on to prevent power bus  
disturbances from being caused by “hot plugging” loads  
or momentary excess load demands. The input voltage  
range is 2.8V to 36V. Loads can be activated or  
deactivated with a low-voltage logic-compatible ON pin.  
Fault conditions can be monitored using the error flag  
pin and/or the power-good pin.  
Typical RDS(ON)=88m  
0.4A to 2A Adjustable Current Limit (Min.)  
Slew Rate Controlled  
ESD Protected, above 2000V HBM  
Thermal Shutdown  
Active LOW Enable  
UVLO Protection  
Power-Good Output  
Applications  
Each member of the FPF270X family serves a category  
of load-fault response. All devices clamp the load  
current so that it cannot exceed an externally  
programmed current level. An over temperature feature  
provides further device protection in case of excessive  
levels of power dissipation.  
.
.
.
.
.
.
.
Motor Drives  
Digital Cameras  
Consumer Electronics  
Industrial  
FPF2700 responds to an overload condition that lasts  
longer than a fixed blanking period by turning off the  
load, followed by a retry after the auto-restart time.  
Computing  
Hard Disk Drives  
Telecom Equipment  
FPF2701 responds to an overload condition that lasts  
longer than a fixed blanking period by latching off the  
load. The load remains off unless either the ON pin is  
toggled or the input voltage cycles through UVLO.  
FPF2702 is intended to be used with external fault  
management. Like the FPF2700 and FPF2701, it sets  
the fault signal pin LOW when it activates current  
clamping. This device is intended for applications where  
external fault management coordinates the overload  
response with the FPF2702.  
Figure 1. MLP (Top View) Figure 2. MLP (Bottom View)  
The FPF270X is available in a space-saving Pb and  
Halogen free, 8-lead MLP 3x3mm and SO8 packages.  
Figure 3. SO8 (Top View)  
Ordering Information  
Part  
Number  
Current Limit  
Blanking Time [ms]  
Auto-Restart  
Time [ms]  
ON Pin  
Activity  
Current Limit [A]  
Package  
FPF2700MPX  
FPF2701MPX  
FPF2702MPX  
FPF2700MX  
FPF2701MX  
FPF2702MX  
0.4 – 2.0  
0.4 – 2.0  
0.4 – 2.0  
0.4 – 2.0  
0.4 – 2.0  
0.4 – 2.0  
0.5  
0.5  
NA  
0.5  
0.5  
NA  
127.5  
NA  
Active LOW  
Active LOW  
Active LOW  
Active LOW  
Active LOW  
Active LOW  
MLP3X3  
MLP3X3  
MLP3X3  
SO8  
NA  
127.5  
NA  
SO8  
NA  
SO8  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
Application Diagram  
36V MAX.  
TO LOAD  
VIN  
ON  
VOUT  
FLAGB  
PGOOD  
OFF  
ON  
COUT  
VIN  
2.8V – 36V  
CIN  
ISET  
RSET  
GND  
Figure 4. Typical Application  
Block Diagram  
Figure 5. Block Diagram  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
2
Pin Configurations  
1
2
3
VIN  
VOUT  
8
7
VOUT  
8
1
2
VIN  
PGOOD  
FLAGB  
FLAGB  
7
PGOOD  
GND  
6
5
NC  
ISET  
ON  
3
4
ISET  
ON  
NC  
6
5
GND  
4
GND  
Figure 6. MLP (Bottom View)  
Figure 7. SO8 (Top View)  
Pin Definitions  
Pin #  
Name  
Description  
1
VIN  
Supply Input. Input to the power switch and the supply voltage for the IC.  
Power-Good Output. Open-drain output to indicate that output voltage has reached 90% of  
input voltage.  
2
PGOOD  
3
4
5
6
ISET  
ON  
Current Limit Set Input. A resistor from ISET to ground sets the current limit for the switch.  
ON Control Input. Active LOW.  
Ground  
GND  
NC  
No connection. Leave open or connect to ground.  
Fault Output. Active LOW, open-drain output that indicates current limit, under-voltage, or  
over -temperature state.  
7
8
FLAGB  
VOUT  
Switch Output. Output of the power switch.  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
3
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device  
reliability. The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Min.  
-0.3  
-0.3  
-0.3  
Max.  
40  
Unit  
V
PGOOD, FLAGB, VIN to GND  
VOUT to GND  
ON to GND  
VIN + 0.3  
6
V
V
MLP 3x3(1), See Figure 8  
SO8(1), See Figure 10  
1.25  
1.00  
3.5  
PD  
Power Dissipation (TA=25°C)  
W
ISW  
TJ  
Maximum Continuous Switch Current  
Operating Junction Temperature  
Storage Temperature  
A
-40  
-65  
+125  
+150  
°C  
°C  
TSTG  
Human Body Model, JESD22-A114  
2000  
2000  
Electrostatic Discharge  
Protection Level  
ESD  
V
Charged Device Model, JESD22-C101  
MLP 3x3(1), See Figure 8  
SO8(1), See Figure 10  
80  
Thermal Resistance,  
Junction to Ambient  
°C/W  
JA  
102  
Note:  
1. Thermal resistance, θJA, is determined with the device mounted on a one inch square pad, 2oz copper pad, and  
a 1.5 x 1.5in. board of FR-4 material.  
Figure 8. 80°C/W Mounted on a 1in2 Pad of  
2oz. Copper  
Figure 9. 226°C/W Mounted on a Minimum Pad of  
2oz. Copper  
Figure 10. 102°C/W mounted on a 1in2 Pad of  
2oz. Copper  
Figure 11. 181°C/W Mounted on a Minimum Pad of  
2oz. Copper  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
VIN  
Parameter  
Min.  
2.8  
Max.  
36.0  
85  
Unit  
V
Input Supply Voltage  
Ambient Operating Temperature  
TA  
-40  
°C  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
4
Electrical Characteristics  
VIN=2.8 to 36V and TA=-40 to +85°C unless otherwise noted. Typical values are at VIN=12V and TA=25°C.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Unit  
Basic Operation  
VIN  
IQ  
Operating Voltage  
Quiescent Current  
2.8  
36.0  
140  
14  
V
VIN=12V, VON=0V, IOUT=0A  
VIN=36V, VON=3.3V, IOUT=0A  
TA=25°C, VIN=12V  
92  
5
μA  
μA  
ISHDN  
Shutdown Current  
88  
114  
140  
114  
140  
TA=-40 to +85°C, VIN=12V  
TA=25°C, VIN=5V  
RON  
On-Resistance  
mΩ  
88  
TA=-40 to +85°C, VIN=5V  
VIN=2.8 to 36V  
VIH  
VIL  
ON Input Logic HIGH Voltage  
ON Input Logic LOW Voltage  
ON Input Leakage  
2.0  
-1  
V
V
VIN=2.8 to 36V  
0.8  
1
ILK  
VON=5.5V or GND  
μA  
μA  
V
ISWOFF  
Off Switch Leakage  
VIN=36V, VON=3.3V, VOUT=0V  
VIN=5V, ISINK=1mA  
0.01  
0.1  
VFLAGB(LO) FLAGB Output Logic LOW Voltage  
0.2  
1
FLAGB Output Logic HIGH Leakage  
IFLAGB(HI)  
Current  
VIN=36V, Switch On, VFLAGB=36V  
μA  
VIN=5V, VOUT as Percent of VIN,  
VPGOOD  
PGOOD Trip Voltage  
90  
%
VOUT Rising  
VIN=5V, VOUT as Percent of VIN,  
VPGOOD(HYS) PGOOD Hysteresis  
VPGOOD(LO) PGOOD Output Logic LOW Voltage  
IPGOOD(HI) PGOOD Output High Leakage Current  
Protections  
3
%
V
VOUT Falling  
VIN=5V, ISINK=1mA  
0.1  
0.2  
1
VIN=36V, Switch ON,  
μA  
VPGOOD=36V  
0.8 x 1.0 x 1.2 x  
ILIM  
ISC  
Current Limit  
TA=25°C  
A
A
INOM  
INOM  
INOM  
VOUT < 2V, Switch in Over-  
Current Condition  
0.75 x  
INOM  
Short Circuit Current Limit  
Shutdown Threshold  
Return from Shutdown  
Hysteresis  
140  
110  
30  
TSD  
Thermal Shutdown  
°C  
UVLO  
Under-Voltage Shutdown  
VIN Increasing  
2.3  
2.5  
100  
2.7  
V
UVLO_HYST Under-Voltage Shutdown Hysteresis  
mV  
Dynamic  
tdon  
tdoff  
Turn On Delay  
2.7  
0.1  
Turn Off Delay  
RL=500, CL=2uF  
ms  
tR  
VOUT Rise Time  
7.5  
tF  
VOUT Fall Time  
1.5  
tBLANK  
tRESTART  
tCLR  
Over-Current Blanking Time  
Auto-Restart Time  
Current-Limit Response Time  
FPF2700/1, TA=25°C  
FPF2700, TA=25°C  
VIN=12V, VON=0V  
0.25  
0.50  
0.75  
ms  
ms  
μs  
63.8 127.5 191.2  
50  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
5
Timing Diagram  
90  
90  
10  
10  
VOUT  
VON  
tR  
tF  
3.3  
50  
50  
90  
10  
VOUT  
tdon  
tdoff  
tON = tR + tdon tOFF = tF + tdoff  
Figure 12. Timing Diagram  
Typical Performance Characteristics  
VIN = 12V and TA = 25°C.  
TA = 25°C  
VIN = 12V  
VIH  
VIH  
VIL  
VIL  
Figure 13. ON Threshold vs. Supply  
Figure 14. ON Threshold vs. Temperature  
VON = 0V  
TA = 125°C  
VON = 5V  
TA = 125°C  
TA = 85°C  
TA = 25°C  
TA = 85°C  
TA = 25°C  
TA = 40°C  
TA = 40°C  
Figure 15. Quiescent Current vs. Supply Voltage (ON) Figure 16. Quiescent Current vs. Supply Voltage (OFF)  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
6
Typical Performance Characteristics  
VIN = 12V and TA = 25°C.  
Figure 17. On Resistance vs. Supply Voltage  
Figure 18. On Resistance vs. Junction Temperature  
VIN = 12V  
RL = 500  
CL = 2µF  
Figure 19. Turn-On Delay vs. Junction Temperature Figure 20. Output Rise Time vs. Junction Temperature  
Figure 21. Turn-Off Delay vs. Junction Temperature Figure 22. Output Fall Time vs. Junction Temperature  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
7
Typical Operation Characteristics of FPF2700 and FPF2701  
When VOUT<2V, the current limit is set to 75% of ILIM  
.
Figure 23. Normal Startup to 0.5X ILIM  
Figure 24. OUT Shorted to GND, Short Condition  
Persists (SOA Protection Followed by Current-Limited  
Operation)  
Figure 25. OUT Overloaded with 1.5X ILIM  
(Long-Duration Overload)  
Figure 26. OUT Shorted to GND, Short Condition  
Removed (SOA Protection Followed by  
Normal Operation)  
Figure 27. OUT Overloaded with 1.5X ILIM  
(Transient Overload)  
© 2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
8
Typical Operation Characteristics of FPF2702  
Figure 28. OUT Shorted to GND, Short Condition Persists  
(SOA Protection Current Limit Followed by Current Limit)  
Figure 29. OUT Overloaded with 1.5X ILIM (Long-Duration Overload)  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
9
Typical Performance Characteristics FPF270X  
VIN = 12V and TA = 25°C.  
Figure 30. 12V Turn-On Delay (RL=500, COUT=2µF)  
Figure 31. 12V Turn-Off Delay (RL=500, COUT=2µF)  
Figure 32. 12V Blanking Time  
(Output Overloaded and tblank Expired, FPF2700/01,  
Figure 33. 12V Restart Time  
(Switch Turned ON into Persistent Over-Current  
Condition,tRESTART~127.5ms)  
(2)  
I
LIM=1A, ILOAD=3.3A, COUT=µF, RLOAD=500) VOC  
Figure 34. Soft Overload and Constant Current  
(ILOAD > ILIM, FPF2702 Enters Constant Current Mode,  
Figure 35. OUT Shorted to GND, Short Condition  
Removed (SOA Protection Followed by a Normal  
Operation, FPF2700 / FPF2701)  
Running at ILIM  
)
Note:  
2. VOC signal forces the device into an over-current condition by loading a 500mresistor to the output through an  
NMOS. VOC is the gate drive of the NMOS.  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
10  
Application Information  
Description of Operation  
Current Limiting  
The FPF270X family of current limit load switches is  
designed to meet the power requirements of a variety of  
applications with wide input voltage range of 2.8V to 36V  
and adjustable current-limit value. The FPF270X family  
offers control and protection while providing optimum  
operation current for safe design practices. The core of  
each switch is a typical 88m(VIN = 12V) N-channel  
MOSFET and a controller capable of functioning over an  
input voltage range of 2.8V to 36V.  
The current limit ensures that the current through the  
switch doesn't exceed a maximum value while not  
limiting at less than a minimum value. The current-limit  
level is adjustable through an external resistor  
connected between the ISET pin and GND.  
The typical current limit level is adjustable from 500mA  
to 2.5A. The minimum current limit (ILIM(MIN)) range is  
from 0.4A to 2.0A, including 20% current-limit tolerance.  
The FPF2700 and FPF2701 have a blanking time during  
which the switch acts as a constant-current source  
(Figure 27). If the over-current condition persists beyond  
the blanking time, the FPF2700 latches off and shuts the  
switch off (Figure 32). If the ON pin is kept active, an  
auto-restart feature releases the switch and turns the  
switch on again after the auto-restart time (Figure 33). If  
the over-current condition persists beyond the blanking  
time, the FPF2701 latch-off feature shuts the switch off.  
The switch is kept off until the ON pin is toggled or input  
power is cycled. The FPF2702 has no current-limit  
blanking period, so it remains in a constant-current state  
until the ON pin is deactivated or the thermal shutdown  
turns off the switch.  
FPF270X offers adjustable current limiting, under-  
voltage lockout (UVLO), power-good indicator  
(PGOOD), fault flag output (FLAGB), and thermal  
shutdown protection. In the event of an over-current  
condition, the load switch limits the load to the current  
limit value. The current limit value for each switch can  
be adjusted from 400mA to 2A through the ISET pin.  
On/Off Control  
The ON pin is active LOW for and controls the state of  
the switch. Pulling the ON pin continuously to LOW  
holds the switch in ON state. The switch moves into  
OFF state when the ON pin is pulled HIGH. The ON pin  
can be pulled HIGH to a maximum voltage of 5.5V.  
Besides the current-limiting functionality, the switch is  
protected by the thermal shutdown protection and an  
independent SOA protection circuit is available.  
An under-voltage condition on the input voltage or a  
junction temperature in excess of 140°C overrides the  
ON control and turns off the switch. In addition, an over-  
current condition causes the switch to turn off in the  
FPF2700 and FPF2701 after the expiration of the  
blanking time. The FPF2700 has an auto-restart feature  
that automatically turns the switch ON again after the  
auto-restart time. For the FPF2701, the ON pin must be  
toggled to turn the switch on again. The FPF2702 does  
not turn off in response to an over-current condition; it  
remains operating in Constant-Current Mode as long as  
ON is enabled and the thermal shutdown or UVLO have  
not activated. The ON pin does not have internal pull-  
down or pull-up resistors and should not be left floating.  
SOA Protection Current Limit (IOUT > 12A)  
FPF270X has an SOA protection feature to protect the  
load switch in response to current surges exceeding 12A  
in normal operation. If a short-circuit event occurs  
(IOUT>12A), the switch is turned off in about 1µs by an  
independent Safe Operating Area (SOA) protection  
circuit (Figure 26, Figure 28). This feature protects the  
switch in case of sudden, high-current events at the  
output, such as a short to GND. The switch turns on  
automatically after a turn-on delay of about 2.7ms.  
Short-Circuit Current Limit (VOUT < VSCTH = 2V)  
Fault Reporting  
When the output voltage drops below the short-circuit  
threshold voltage, VSCTH, the current-limit value re-  
conditions itself to the short-circuit current limit value,  
Upon detection of an over-current condition, an input  
UVLO, or an over-temperature condition, the FLAGB  
signals the Fault Mode by activating LOW. In the event  
of an over-current condition for the FPF2700 or  
FPF2701, the FLAGB goes LOW at the end of the  
blanking time (Figure 24 and Figure 25). FLAGB goes  
LOW immediately for the FPF2702 (Figure 29). If the  
over-current condition lasts longer than blanking time,  
FLAGB remains LOW through the auto-restart time for  
the FPF2700. For the FPF2701, FLAGB is latched LOW  
and ON must be toggled to release it.  
which is 75% of the nominal current limit (0.75 x ILIM,  
)
(Figure 24). This prevents early thermal shutdown by  
reducing the power dissipation of the device. The VSCTH  
value is set at 2V. At about VOUT = 2.1V, the switch is  
removed from short-circuit current-limiting mode and the  
current limit is set to the nominal current limit value.  
Setting the Current Limit Value  
For FPF2702, FLAGB is LOW during a fault and  
immediately returns HIGH at the end of the fault  
condition. FLAGB is an open-drain MOSFET that  
requires a pull-up resistor. The maximum pull-up voltage  
is 36V (Figure 29).  
The FPF270X has an adjustable 0.4A to 2.0A minimum  
current limit set through an external resistor, RSET  
,
connected between ISET and GND. A precision RSET  
value must be used, such as 1% tolerance or lower, to  
minimize the total current limit tolerance of the system.  
During shutdown, the pull-down on FLAGB is disabled to  
reduce current draw from the supply. A 100Kpull-up  
resistor is recommended in the application.  
Use the following equation to calculate the value of the  
resistor for intended typical current limit value:  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
11  
277.5  
RSET (K)   
Power Good  
(1)  
ILIM(TYP)(A)  
FPF270X has a power good feature. The PGOOD pin is  
an open-drain MOSFET that asserts HIGH when the  
output voltage reaches 90% of the input voltage (Figure  
26). A typical 3% PGOOD hysteresis is added to  
PGOOD to prevent PGOOD from chattering as VOUT  
falls near the PGOOD threshold voltage.  
ILIM(TYP) is the typical current limit value based on a given  
RSET  
.
Table 1. RSET Selection Guide  
Current Limit [A]  
RSET  
(k)  
Tol. (%)  
The PGOOD pin requires an external pull-up resistor  
connected to an external voltage source compatible with  
input levels of other chips connected to this pin. PGOOD  
is kept LOW when the device is inactive. To save  
current in the OFF state, the pull-up resistor of the  
PGOOD pin can be connected to the output voltage  
when there is no battery, provided that compatibility with  
the input levels of other devices connected to PGOOD is  
observed. A typical value of 100kis recommended for  
the pull up resistor. When the power-good feature is not  
used in the application, the PGOOD pin can be  
connected to GND.  
Min.  
Typ.  
2.50  
2.24  
1.89  
1.52  
1.26  
1.01  
0.74  
0.51  
Max.  
111  
124  
147  
182  
220  
274  
374  
549  
2.00  
1.79  
1.51  
1.22  
1.01  
0.81  
0.59  
0.40  
3.00  
2.69  
2.27  
1.83  
1.51  
1.22  
0.89  
0.61  
20  
20  
20  
20  
20  
20  
20  
20  
Thermal Shutdown  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
100  
Thermal shutdown protects the die from internally or  
externally generated excessive temperatures. During an  
over-temperature condition; as the temperature  
increases above 140°C, FLAGB is activated and the  
switch is turned off.  
When the die cools down sufficiently (die temperature  
drops below the threshold level), the switch  
automatically turns on again. To avoid unwanted thermal  
oscillations, a 30°C (typical) thermal hysteresis is  
implemented between thermal shutdown entry and exit  
temperatures. Proper board layout is required to prevent  
premature thermal shutdown (see Figure 38 for thermal  
shutdown behavior on FPF2702).  
200  
300  
400  
500  
600  
R
SET (k)  
Figure 36. ILIM vs. RSET  
Under-Voltage Lockout (UVLO)  
The under-voltage lockout feature turns off the switch if  
the input voltage drops below the under-voltage lockout  
threshold. With the ON pin active (ON pin pulled LOW),  
the input voltage rising above the under-voltage lockout  
threshold causes a controlled turn-on of the switch  
(Figure 37). The UVLO threshold voltage is set internally  
at 2.5V for VIN rising. The under-voltage lockout  
threshold has a 0.1V hysteresis.  
Figure 38. FPF2702 Thermal Shutdown Behavior  
Figure 37. Under-Voltage Lockout Performance  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
12  
SOA (FPF2702)  
During extended output-short conditions, excessive  
power dissipation occurs in the load switch. FPF2700  
and PFP2701 are protected by turning off the load  
switch after blanking time. FPF2702 has no blanking  
time feature; please refer to Note 3.  
It is possible to estimate the SOA for the two FPF2702  
packages, MPX and MX, through their respective SOA  
curves shown in Figure 39 and Figure 40. These curves  
provide a reference on how long the load switch  
survives under the worst-case scenario with minimum  
pad size of one square inch.(1)  
Figure 39. FPF2702 MPX SOA  
Figure 40. FPF2702 MX SOA  
Note:  
3. To protect FPF2702 from an extended short condition, additional protection must be implemented in the system  
to protect the device. For example, the FLAGB and PGOOD signal can be used to monitor the short-circuit fault  
condition. In applications where FPF2702 can be exposed to persistent short-circuit conditions, it should be used  
only with external fault management control to protect the switch.  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
13  
Input Capacitor  
Power Dissipation  
To limit the voltage drop on the input supply caused by  
transient inrush currents when the switch is turned on  
into a discharged load capacitor or short-circuit; an input  
capacitor, CIN, is recommended between the IN and  
GND pins. The FPF270X features a fast current limit  
response time (50μs). During this period, the device  
relies on the input capacitor to supply the load current. A  
10μF to 100μF ceramic capacitor is adequate for CIN in  
most cases. Larger CIN values may be required in high-  
voltage or high-current applications. An electrolytic  
capacitor can be used in parallel to further reduce the  
voltage drop.  
During normal operation as a switch, the power  
dissipation of the device is small and has little effect on  
the operating temperature of the part. The maximum  
power dissipation for the switch in normal operation  
occurs just before the switch enters into current limit.  
This may be calculated using the equation:  
2
PD _ MAX ( NormalOper ation ) (ILIM ( Max )  
)
RON ( MAX )  
(3)  
The maximum junction temperature should be limited to  
125°C under normal operation. Junction temperature  
can be calculated using the equation:  
TJ PD JA TA  
(4)  
Output Capacitor  
where:  
A 0.1μF to 1μF capacitor, COUT, should be placed  
between the OUT and GND pins. This capacitor helps  
prevent parasitic board inductances from forcing the  
output voltage below ground when the switch turns  
off. This capacitor should have a low dissipation  
factor. An X7R Multilayer Ceramic Chip (MLCC)  
capacitor is recommended.  
.
.
.
TJ is junction temperature;  
PD is power dissipation on the switch;  
Θ
JA is the thermal resistance, junction-to-ambient of  
the package; and  
.
TA is ambient temperature.  
During startup, the total output current consists of both  
the load current and the charge current of the output  
capacitor. For the FPF2700 and FPF2701; if the total  
output current exceeds the set current limit threshold  
(determined via RSET) for longer than the blanking time,  
the device may not be able to start properly. This  
imposes an upper limit to the value of the output  
capacitor, given the load current and the selected  
current limit value. COUT should not exceed the COUTmax  
calculated in Equation 2 or the switch does not start  
properly due to the set current limit:  
Design Example  
For a 12V application and ILIM  
power dissipation in a normal operation is calculated as:  
= 1A, maximum  
(Max)  
PD _MAX(NormalOperation)(VIN12V ) (1)2 0.140 140mW  
(5)  
FPF2702 PD(Max) during OC:  
If device is in over-current condition and VOUT>2V,  
power dissipation can be calculated as:  
PD = (VIN - VOUT) x ILIM (Max)  
(6)  
COUT max ILIM _MIN 500s /V  
(2)  
If device is in short-circuit current limit and VOUT < 2V,  
power dissipation can be calculated as:  
High-Voltage Operation (Output Capacitor)  
During a hard short condition on the output while  
operating at greater than 24V VIN, a large instantaneous  
inrush current is delivered to the shorted output. A  
capacitor must be placed at the OUTPUT pin, acting as  
a current source to support the instantaneous current  
draw (Table 2). A low-ESR capacitor is recommended.  
Once the value of the output capacitor is determined  
from Table 2, Equation 2 must be reevaluated.  
PD = (VIN - VOUT) x (0.75 x ILIM (Max)  
)
(7)  
Design Example:  
Using FPF2702 in a VIN = 5V application where ILIM (Max)  
= 2A, assuming VOUT = 2.5V; power dissipation across  
the switch is calculated as:  
PD = (5 - 2.5) x 2 = 5W  
(8)  
Table 2. COUT Selection Guide  
Whereas in a short-circuit current-limit condition (VOUT  
0V), power dissipation is calculated as:  
VIN (V)  
Capacitance (μF)  
24< VIN 27  
27< VIN 32  
32< VIN 36  
22  
47  
68  
PD = ((VIN - VOUT) x (0.75 x ILIM (Max)) = (5 - 0) x  
(0.75 x 2) = 7.5W  
(9)  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
14  
PCB Layout Recommendations  
For the best performance, all traces should be as short  
as possible. To be most effective, the input and output  
capacitors should be placed close to the device to  
minimize the effects that parasitic trace inductances  
may have on normal and short-circuit operation (Figure  
42). Using wide traces for IN, OUT, and GND pins helps  
minimize parasitic electrical effects as well as the case-  
to-ambient thermal impedance.  
3. The IN, OUT, and GND pins dissipate most of the  
heat generated during high-load current condition.  
The layout suggested in Figure 42 and Figure 43 is  
strongly recommended illustrating a proper layout  
for devices in MLP 3x3 packages. IN, OUT, and  
GND pins are connected to adequate copper so  
that heat may be transferred as efficiently as  
possible out of the device. The low-power FLAGB  
and ON pins traces may be laid-out diagonally from  
the device to maximize the area available to the  
ground pad. Place the input and output capacitors  
as close as possible to the device.  
To minimize the interference between analog ground  
(chip ground, pin 5) and power ground during load  
current excursion, the ground terminal of the input and  
output capacitors and the RSET resistor should be routed  
directly to chip ground and away from power ground.  
Improving Thermal Performance  
Improper layout could result in higher junction  
temperature and trigger thermal shutdown protection.  
This is particularly significant for the FPF2702, where  
the device operates in Constant Current Mode under  
overload conditions. During fault conditions, the power  
dissipation of the switch could exceed the maximum  
absolute power dissipation.  
The following techniques improve the thermal  
performance of this family of devices. These techniques  
are listed in order of the significance of their impact.  
Figure 42. Proper Layout of Output and Ground  
Copper Area (Top, SST, and AST Layers)  
1. Thermal performance of the load switch can be  
improved by connecting the Die Attach Pad (DAP) of  
the MLP 3x3 package to the GND plane of the PCB.  
2. Embedding two exposed through-hole vias into the  
DAP provides a path for heat to transfer to the back  
GND plane of the PCB. A drill size of round, 15 mils  
(0.4mm)  
with  
1-ounce  
copper  
plating  
is  
A
recommended for appropriate solder reflow.  
smaller-size hole prevents the solder from  
penetrating into the via, resulting in device lift-up.  
Similarly, a larger hole consumes excessive solder  
and may result in voiding the DAP.  
Figure 43. Proper Layout (Bottom and ASB Layers)  
Figure 41. Two Through-Hole Open Vias Embedded  
in the DAP  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
15  
FPF270x Demonstration Board  
The FPF270X demonstration board has components  
and circuitry to demonstrate the load switch’s functions  
and features. Thermal performance of the board is  
improved using the techniques recommended in the  
layout recommendations section. Additional information  
about demonstration board can be found in the  
FPF270X board users guide.  
Figure 44. Top, SST, and AST Layers  
Figure 45. Bottom and ASB Layers  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
16  
Physical Dimensions  
5.00  
4.80  
A
0.65  
3.81  
8
5
B
1.75  
6.20  
5.80  
4.00  
3.80  
5.60  
1
4
PIN ONE  
INDICATOR  
1.27  
1.27  
(0.33)  
M
0.25  
C B A  
LAND PATTERN RECOMMENDATION  
SEE DETAIL A  
0.25  
0.10  
0.25  
0.19  
C
1.75 MAX  
0.10  
C
0.51  
0.33  
OPTION A - BEVEL EDGE  
0.50  
0.25  
x 45°  
R0.10  
R0.10  
GAGE PLANE  
OPTION B - NO BEVEL EDGE  
0.36  
NOTES: UNLESS OTHERWISE SPECIFIED  
8°  
0°  
0.90  
A) THIS PACKAGE CONFORMS TO JEDEC  
MS-012, VARIATION AA, ISSUE C,  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS DO NOT INCLUDE MOLD  
FLASH OR BURRS.  
SEATING PLANE  
(1.04)  
0.406  
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.  
E) DRAWING FILENAME: M08AREV13  
DETAIL A  
SCALE: 2:1  
Figure 46. 8-Lead, Small Outline Package (SOP)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
17  
Physical Dimensions  
0.15 C  
2X  
3.00  
A
2.52  
B
5
8
1.94  
3.00  
1.70  
3.30  
PIN1  
IDENT  
0.56 8X  
0.15 C  
1
4
TOP VIEW  
2X  
0.47 8X  
0.65  
RECOMMENDED LAND PATTERN  
0.80 MAX  
0.10 C  
(0.20)  
0.08 C  
0.05  
0.00  
NOTES:  
C
SIDE VIEW  
A. PACKAGE CONFORMS TO JEDEC MO-229  
EXCEPT WHERE NOTED.  
SEATING  
PLANE  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
D. LAND PATTERN RECOMMENDATION IS  
BASED ON FSC DESIGN ONLY.  
2.45  
2.35  
(0.35) 4X  
PIN 1  
IDENT  
E. DRAWING FILENAME: MKT-MLP08Vrev1.  
1
4
1.75  
1.65  
0.40  
8X  
0.30  
0.10  
0.05  
C A B  
C
8
5
0.40  
0.30  
0.65  
8X  
BOTTOM VIEW  
Figure 1.  
8-Lead, 3x3mm Molded Leadless Package (MLP)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
18  
© 2010 Fairchild Semiconductor Corporation  
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.2  
www.fairchildsemi.com  
19  
配单直通车
FPF2700MX产品参数
型号:FPF2700MX
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
IHS 制造商:ROCHESTER ELECTRONICS LLC
零件包装代码:SOIC
包装说明:SOP,
针数:8
Reach Compliance Code:unknown
风险等级:5.69
Is Samacsys:N
内置保护:OVER CURRENT; THERMAL; UNDER VOLTAGE
接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码:R-PDSO-G8
JESD-609代码:e3
长度:4.9 mm
湿度敏感等级:1
功能数量:1
端子数量:8
最高工作温度:85 °C
最低工作温度:-40 °C
输出电流流向:SOURCE
标称输出峰值电流:0.4 A
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260
认证状态:COMMERCIAL
座面最大高度:1.75 mm
最大供电电压:36 V
最小供电电压:2.8 V
标称供电电压:12 V
表面贴装:YES
温度等级:INDUSTRIAL
端子面层:MATTE TIN
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:30
宽度:3.9 mm
Base Number Matches:1
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