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产品型号HD74HC133FP的Datasheet PDF文件预览

HD74HC133

13-input NAND Gate

Description

This device contains a single 13-input NAND gate. They perform the boolean functions in positive logic.

Y = A•B•C•D•E•F•G•H•I•J•K•L•M or

Y = A + B + C + D + E + F + G + H + I + J + K + L + M

Features

•

High Speed Operation: t_pd= 12.5 ns typ (C_L= 50 pF)

High Output Current: Fanout of 10 LSTTL Loads

Wide Operating Voltage: V_CC= 2 to 6 V

Low Input Current: 1 µA max

Low Quiescent Supply Current: I_CC(static) = 1 µA max (Ta = 25°C)

HD74HC133

Pin Arrangement

16 V_CC

15 M

14 L

13 K

12 J

11 I

10 H

GND

9 Y

(Top view)

Logic Diagram

HD74HC133

DC Characteristics

Ta = –40 to

Ta = 25°C

+85°C

Item

Symbol V_CC(V) Min Typ Max Min Max Unit Test Conditions

Input voltage

V_IH

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

4.5

6.0

2.0

4.5

6.0

4.5

6.0

1.5

—

0.5

1.5

3.15

4.2

—

3.15 —

—

4.2

—

V_IL

0.5

1.35

1.8

—

1.35 —

1.8

—

Output voltage

V_OH

1.9 2.0

4.4 4.5

5.9 6.0

4.18 —

5.68 —

1.9

4.4

5.9

4.13

5.63

—

Vin = V_IHor V_ILI_OH= –20 µA

—

I_OH= –4 mA

I_OH= –5.2 mA

—

V_OL

—

0.0 0.1

0.1

0.33

Vin = V_IHor V_ILI_OL= 20 µA

—

0.26 —

±0.1 —

1.0

I_OL= 4 mA

I_OL= 5.2 mA

Input current

Iin

±1.0 µA

10 µA

Vin = V_CCor GND

Quiescent supply I_CC

current

—

Vin = V_CCor GND, Iout = 0 µA

HD74HC133

AC Characteristics (C_L= 50 pF, Input t_r= t_f= 6 ns)

Ta = –40 to

+85°C

Ta = 25°C

Symbol V_CC(V) Min Typ Max Min Max Unit Test Conditions

Item

Propagation delay t_PLH

time

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

—

150 —

190 ns

12 30

—

t_PHL

150 —

190 ns

13 30

—

Output rise time

Output fall time

t_TLH

—

t_THL

—

Input capacitance Cin

Unit: mm

19.20

20.00 Max

1.3

1.11 Max

7.62

+ 0.13

– 0.05

0.25

2.54 ± 0.25

0.48 ± 0.10

0° – 15°

Hitachi Code

DP-16

JEDEC

EIAJ

Conforms

Weight (reference value) 1.07 g

Unit: mm

10.06

10.5 Max

+ 0.20

7.80

– 0.30

0.80 Max

1.15

0° – 8°

1.27

0.70 ± 0.20

*0.42 ± 0.08

0.40 ± 0.06

0.15

0.12

Hitachi Code

JEDEC

EIAJ

FP-16DA

—

Conforms

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.24 g

Unit: mm

9.9

10.3 Max

1.27

+ 0.10

6.10

– 0.30

1.08

0.635 Max

0° – 8°

+ 0.67

0.60

– 0.20

*0.42 ± 0.08

0.40 ± 0.06

0.15

0.25

Hitachi Code

JEDEC

EIAJ

FP-16DN

Conforms

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.15 g

Unit: mm

5.00

5.30 Max

0.65

0.13 M

0.65 Max

1.0

+ 0.08

– 0.07

*0.22

0.20 ± 0.06

6.40 ± 0.20

0° – 8°

0.50 ± 0.10

0.10

Hitachi Code

JEDEC

EIAJ

TTP-16DA

—

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.05 g

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,

Hitachi bears no responsibility for problems that may arise with third party’s rights, including

intellectual property rights, in connection with use of the information contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you have

received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,

contact Hitachi’s sales office before using the product in an application that demands especially high

quality and reliability or where its failure or malfunction may directly threaten human life or cause risk

of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,

traffic, safety equipment or medical equipment for life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly

for maximum rating, operating supply voltage range, heat radiation characteristics, installation

conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used

beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable

failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-

safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other

consequential damage due to operation of the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without

written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor

products.

Hitachi, Ltd.

Semiconductor & Integrated Circuits.

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109

URL

NorthAmerica

Europe

: http:semiconductor.hitachi.com/

: http://www.hitachi-eu.com/hel/ecg

Asia (Singapore)

Asia (Taiwan)

: http://www.has.hitachi.com.sg/grp3/sicd/index.htm

: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm

Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm

Japan

: http://www.hitachi.co.jp/Sicd/indx.htm

For further information write to:

Hitachi Semiconductor

(America) Inc.

Hitachi Europe GmbH

Hitachi Asia (Hong Kong) Ltd.

Group III (Electronic Components)

7/F., North Tower, World Finance Centre,

Harbour City, Canton Road, Tsim Sha Tsui,

Kowloon, Hong Kong

Tel: <852> (2) 735 9218

Fax: <852> (2) 730 0281

Hitachi Asia Pte. Ltd.

16 Collyer Quay #20-00

Hitachi Tower

Singapore 049318

Tel: 535-2100

Electronic components Group

Dornacher Stra§e 3

D-85622 Feldkirchen, Munich

Germany

Tel: <49> (89) 9 9180-0

Fax: <49> (89) 9 29 30 00

179 East Tasman Drive,

San Jose,CA 95134

Tel: <1> (408) 433-1990

Fax: <1>(408) 433-0223

Fax: 535-1533

Hitachi Asia Ltd.

Taipei Branch Office

3F, Hung Kuo Building. No.167,

Tun-Hwa North Road, Taipei (105)

Tel: <886> (2) 2718-3666

Fax: <886> (2) 2718-8180

Telex: 40815 HITEC HX

Hitachi Europe Ltd.

Electronic Components Group.

Whitebrook Park

Lower Cookham Road

Maidenhead

Berkshire SL6 8YA, United Kingdom

Tel: <44> (1628) 585000

Fax: <44> (1628) 778322

型号:	HD74HC133FP
是否无铅：	不含铅
是否Rohs认证：	不符合
生命周期：	Obsolete
IHS 制造商：	RENESAS TECHNOLOGY CORP
零件包装代码：	SOIC
包装说明：	SOP,
针数：	16
Reach Compliance Code：	unknown
ECCN代码：	EAR99
HTS代码：	8542.31.00.01
风险等级：	5.37
Is Samacsys：	N
系列：	HC/UH
JESD-30 代码：	R-PDSO-G16
长度：	10.06 mm
逻辑集成电路类型：	NAND GATE
湿度敏感等级：	1
功能数量：	1
输入次数：	13
端子数量：	16
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
传播延迟（tpd）：	190 ns
认证状态：	Not Qualified
座面最大高度：	2.2 mm
最大供电电压 (Vsup)：	6 V
最小供电电压 (Vsup)：	2 V
标称供电电压 (Vsup)：	4.5 V
表面贴装：	YES
技术：	CMOS
温度等级：	INDUSTRIAL
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	5.5 mm
Base Number Matches：	1

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