欢迎访问ic37.com |
会员登录 免费注册
发布采购
所在地: 型号: 精确
  • 批量询价
  •  
  • 供应商
  • 型号
  • 数量
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
  •  
  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • HI5960IA/IB
  • 数量-
  • 厂家-
  • 封装-
  • 批号-
  • -
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
更多
  • HI5960IA/IB图
  • 北京首天国际有限公司

     该会员已使用本站16年以上
  • HI5960IA/IB
  • 数量13450 
  • 厂家INTERSIL 
  • 封装 
  • 批号2024+ 
  • 百分百原装正品,现货库存
  • QQ:528164397QQ:528164397 复制
    QQ:1318502189QQ:1318502189 复制
  • 010-62565447 QQ:528164397QQ:1318502189
  • HI5960IA/IB图
  • 深圳市一线半导体有限公司

     该会员已使用本站16年以上
  • HI5960IA/IB
  • 数量24500 
  • 厂家原厂品牌 
  • 封装原厂外观 
  • 批号 
  • 全新原装部分现货其他订货
  • QQ:2881493920QQ:2881493920 复制
    QQ:2881493921QQ:2881493921 复制
  • 0755-88608801多线 QQ:2881493920QQ:2881493921

产品型号HI5960IAZ的Datasheet PDF文件预览

HI5960  
®
Data Sheet  
March 31, 2005  
FN4655.6  
14-Bit, 130MSPS, High Speed D/A  
Converter  
Features  
• Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . .130MSPS  
The HI5960 is a 14-bit, 130MSPS (Mega Samples Per  
Second), high speed, low power, D/A converter which is  
implemented in an advanced CMOS process. Operating  
from a single +3V to +5V supply, the converter provides  
20mA of full scale output current and includes edge-  
triggered CMOS input data latches. Low glitch energy and  
excellent frequency domain performance are achieved using  
a segmented current source architecture.  
• Low Power (at 100MSPS) at 5V . . . . . . . . . . . . . .175mW  
at 3V. . . . . . . . . . . . . . . .32mW  
• Adjustable Full Scale Output Current. . . . . 2mA to 20mA  
• Internal 1.2V Bandgap Voltage Reference  
• Single Power Supply from +5V to +3V  
• Power Down Mode  
• CMOS Compatible Inputs  
This device complements the HI5x60 and HI5x28 family of  
high speed converters, which includes 8, 10, 12, and 14-bit  
devices.  
• Excellent Spurious Free Dynamic Range  
(77dBc, f = 50MSPS,  
= 2.51MHz)  
S
fOUT  
• Excellent Multitone Intermodulation Distortion  
Ordering Information  
Pb-Free Available (RoHS Compliant)  
TEMP.  
PART  
NUMBER  
RANGE  
( C)  
PKG.  
DWG. # SPEED  
CLOCK  
o
Applications  
PACKAGE  
HI5960IB  
-40 to 85 28 Ld SOIC  
M28.3  
M28.3  
130MHz  
130MHz  
• Cellular Basestations  
HI5960IBZ  
(See Note)  
-40 to 85 28 Ld SOIC  
(Pb-free)  
• WLL, Basestation and Subscriber Units  
• Medical/Test Instrumentation  
• Wireless Communications Systems  
• Direct Digital Frequency Synthesis  
• High Resolution Imaging Systems  
• Arbitrary Waveform Generators  
HI5960IA  
-40 to 85 28 Ld TSSOP M28.173 130MHz  
HI5960IAZ  
(See Note)  
-40 to 85 28 Ld TSSOP M28.173 130MHz  
(Pb-free)  
HI5960IA-T  
-40 to 85 28 Ld TSSOP M28.173 130MHz  
Tape and Reel  
HI5960IAZ-T  
(See Note)  
-40 to 85 28 Ld TSSOP M28.173 130MHz  
Tape and Reel  
(Pb-free)  
Pinout  
HI5960 (SOIC, TSSOP)  
HI5960SOICEVAL1  
25  
Evaluation Platform  
130MHz  
TOP VIEW  
NOTE: Intersil Pb-free products employ special Pb-free material sets;  
molding compounds/die attach materials and 100% matte tin plate  
termination finish, which are RoHS compliant and compatible with  
both SnPb and Pb-free soldering operations. Intersil Pb-free products  
are MSL classified at Pb-free peak reflow temperatures that meet or  
exceed the Pb-free requirements of IPC/JEDEC J STD-020.  
D13 (MSB)  
D12  
D11  
D10  
D9  
1
2
3
4
5
6
7
8
9
CLK  
28  
27 DV  
DD  
26 DCOM  
25 ACOM  
24 AV  
DD  
D8  
23 COMP2  
22 IOUTA  
21 IOUTB  
D7  
D6  
D5  
20  
ACOM  
D4 10  
D3 11  
19 COMP1  
18 FSADJ  
17 REFIO  
16 REFLO  
15 SLEEP  
D2 12  
D1 13  
D0 (LSB) 14  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2003, 2005. All Rights Reserved. All other trademarks mentioned are the property of their respective owners.  
HI5960  
Typical Applications Circuit  
HI5960  
(25) ACOM  
D13  
D12  
D11  
D10  
D9  
D13 (1)  
D12 (2)  
D11 (3)  
D10 (4)  
D9 (5)  
(15) SLEEP  
(16) REFLO  
ACOM  
DCOM  
(17) REFIO  
0.1µF  
D8  
D8 (6)  
D7  
D7 (7)  
(18) FSADJ  
(22) IOUTA  
D6  
D6 (8)  
1.91kΩ  
R
SET  
D5  
D5 (9)  
D/A OUT  
D4  
D4 (10)  
D3 (11)  
D2 (12)  
D1 (13)  
D0 (LSB) (14)  
50Ω  
50Ω  
D3  
D2  
(21) IOUTB  
(23) COMP2  
(19) COMP1  
(20) ACOM  
D/A OUT  
D1  
D0  
CLK (28)  
0.1µF  
DCOM (26)  
50Ω  
0.1µF  
FERRITE  
BEAD  
BEAD  
(24) AV  
DD  
DV  
(27)  
DD  
+
+
10µH  
10µH  
+5V OR +3V (V  
)
DD  
10µF  
0.1µF  
0.1µF  
10µF  
Functional Block Diagram  
IOUTA IOUTB  
(LSB) D0  
D1  
CASCODE  
CURRENT  
SOURCE  
D2  
D3  
D4  
9 LSBs  
LATCH  
SWITCH  
MATRIX  
40  
D5  
40  
+
31 MSB  
SEGMENTS  
D6  
D7  
D8  
LATCH  
D9  
D10  
31  
UPPER  
5-BIT  
D11  
D12  
DECODER  
(MSB) D13  
COMP2  
COMP1  
CLK  
INT/EXT  
VOLTAGE  
INT/EXT  
BIAS  
GENERATION  
REFERENCE  
SELECT  
REFERENCE  
FSADJ  
SLEEP  
AV  
ACOM DV  
DCOM  
REFLO  
REFIO  
DD  
DD  
2
HI5960  
Pin Des criptions  
PIN NO.  
PIN NAME  
DESCRIPTION  
1-14  
D13 (MSB) Through Digital Data Bit 13, (Most Significant Bit) through Digital Data Bit 0, (Least Significant Bit).  
D0 (LSB)  
15  
16  
17  
18  
SLEEP  
REFLO  
REFIO  
FSADJ  
Control Pin for Power-Down mode. Sleep Mode is active high; Connect to ground for Normal Mode. Sleep  
pin has internal 20µA active pulldown current.  
Connect to analog ground to enable internal 1.2V reference or connect to AV  
reference.  
to disable internal  
DD  
Reference voltage input if internal reference is disabled. Reference voltage output if internal reference is  
enabled. Use 0.F cap to ground when internal reference is enabled.  
Full Scale Current Adjust. Use a resistor to ground to adjust full scale output current. Full Scale Output  
Current = 32 x V  
/R .  
FSADJ SET  
19  
21  
COMP1  
IOUTB  
For use in reducing bandwidth/noise. Recommended: connect 0.1µF to AV  
.
DD  
The complimentary current output of the device. Full scale output current is achieved when all input bits  
are set to binary 0.  
22  
23  
IOUTA  
Current output of the device. Full scale output current is achieved when all input bits are set to binary 1.  
COMP2  
Connect 0.1µF capacitor to ACOM.  
Analog Supply (+3V to +5V).  
Connect to Analog Ground.  
Connect to Digital Ground.  
Digital Supply (+3V to +5V).  
24  
AV  
DD  
20, 25  
26  
ACOM  
DCOM  
27  
DV  
DD  
28  
CLK  
Clock Input. Input data to the DAC passes through the “master” latches when the clock is low and is  
latched into the “master” latches when the clock is high. Data presented to the “slave” latch passes  
through when the clock is logic high and is latched into the “slave” latches when the clock is logic low.  
Adequate setup time must be allowed for the MSBs to pass through the thermometer decoder before the  
clock goes high. This master-slave arrangement comprises an edge-triggered flip-flop, with the DAC  
being updated on the rising clock edge. It is recommended that the clock edge be skewed such that setup  
time is larger than the hold time.  
3
HI5960  
Absolute Maximum Ratings  
Thermal Information  
o
Digital Supply Voltage DV  
to DCOM . . . . . . . . . . . . . . . . . +5.5V  
to ACOM . . . . . . . . . . . . . . . . . +5.5V  
Thermal Resistance (Typical, Note 1)  
θ
( C/W)  
DD  
Analog Supply Voltage AV  
JA  
DD  
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . .  
75  
110  
Grounds, ACOM TO DCOM . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V  
Digital Input Voltages (D9-D0, CLK, SLEEP). . . . . . . . DV  
Reference Input Voltage Range. . . . . . . . . . . . . . . . . . AV  
o
+ 0.3V  
DD  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150 C  
Maximum Storage Temperature Range . . . . . . . . . -65 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300 C  
o
o
+ 0.3V  
DD  
o
Analog Output Current (I  
) . . . . . . . . . . . . . . . . . . . . . . . . . 24mA  
OUT  
(SOIC - Lead Tips Only)  
Operating Conditions  
o
o
HI5960IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
o
Electrical Specifications AV = DV = +5V, V  
= Internal 1.2V, IOUTFS = 20mA, T = 25 C for All Typical Values  
A
DD  
DD  
REF  
PARAMETER  
SYSTEM PERFORMANCE  
Resolution  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
14  
-5  
-
-
Bits  
LSB  
LSB  
Integral Linearity Error, INL  
Differential Linearity Error, DNL  
“Best Fit” Straight Line (Note 8)  
±2.5  
±1.5  
+5  
+3  
(Note 8)  
(Note 8)  
(Note 8)  
-3  
Offset Error, I  
-0.025  
-
+0.025 % FSR  
OS  
Offset Drift Coefficient  
0.1  
-
ppm  
o
FSR/ Χ  
Full Scale Gain Error, FSE  
With External Reference (Notes 2, 8)  
With Internal Reference (Notes 2, 8)  
With External Reference (Note 8)  
-10  
-10  
-
±2  
±1  
+10  
+10  
-
% FSR  
% FSR  
ppm  
Full Scale Gain Drift  
±50  
ο
FSR/ Χ  
With Internal Reference (Note 8)  
(Note 3, 8)  
-
±100  
-
ppm  
FSR/ Χ  
ο
2
-
-
20  
mA  
V
Full Scale Output Current, IFS  
Output Voltage Compliance Range  
-0.3  
1.25  
DYNAMIC CHARACTERISTICS  
Maximum Clock Rate, f  
Output Settling Time, (t  
(Note 3)  
130  
-
-
-
-
-
-
-
-
-
MHz  
ns  
CLK  
)
±0.05% (±8 LSB) (Note 8)  
-
-
-
-
-
-
-
35  
5
SETT  
Singlet Glitch Area (Peak Glitch)  
Output Rise Time  
R
= 25(Note 8)  
pV•s  
ns  
L
Full Scale Step  
Full Scale Step  
2.5  
2.5  
10  
50  
30  
Output Fall Time  
ns  
Output Capacitance  
Output Noise  
pF  
IOUTFS = 20mA  
IOUTFS = 2mA  
pA/Hz  
pA/Hz  
AC CHARACTERISTICS  
+5V Power Supply  
Spurious Free Dynamic Range,  
SFDR Within a Window  
f
= 100MSPS, f  
= 100MSPS, f  
= 20.2MHz, 30MHz Span (Notes 4, 8)  
= 5.04MHz, 8MHz Span (Notes 4, 8)  
-
-
-
77  
97  
97  
-
-
-
dBc  
dBc  
dBc  
CLK  
OUT  
f
CLK  
OUT  
f
= 50MSPS, f = 5.02MHz, 8MHz Span (Notes 4, 8)  
OUT  
CLK  
4
HI5960  
o
Electrical Specifications AV = DV = +5V, V  
= Internal 1.2V, IOUTFS = 20mA, T = 25 C for All Typical Values (Continued)  
A
DD  
DD  
REF  
TEST CONDITIONS  
= 4.0MHz (Notes 4, 8)  
PARAMETER  
MIN  
TYP  
-71  
-75  
-77  
56  
67  
74  
-
MAX  
UNITS  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
+5V Power Supply  
Total Harmonic Distortion (THD) to  
Nyquist  
f
f
f
f
f
f
f
f
f
f
f
f
f
f
f
f
f
f
f
= 100MSPS, f  
OUT  
-
-
-
-
-
-
-
-
-
-
-
-
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
= 50MSPS, f  
= 25MSPS, f  
= 2.0MHz (Notes 4, 8)  
= 1.0MHz (Notes 4, 8)  
= 40.4MHz (Notes 4, 8)  
= 10.1MHz (Notes 4, 8)  
OUT  
OUT  
-
+5V Power Supply  
Spurious Free Dynamic Range,  
SFDR to Nyquist (f  
= 130MSPS, f  
= 130MSPS, f  
= 130MSPS, f  
= 130MSPS, f  
= 100MSPS, f  
= 100MSPS, f  
= 100MSPS, f  
= 100MSPS, f  
= 100MSPS, f  
-
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
-
/2)  
CLK  
o
= 5.02MHz, T = 25 C (Notes 4, 8)  
68  
66  
-
= 5.02MHz, T = Min to Max (Notes 4, 8)  
= 40.4MHz (Notes 4, 8)  
55  
63  
74  
-
= 20.2MHz (Notes 4, 8)  
-
o
= 5.04MHz, T = 25 C (Notes 4, 8)  
68  
66  
-
= 5.04MHz, T = Min to Max (Notes 4, 8)  
= 2.51MHz (Notes 4, 8)  
76  
65  
74  
-
-
-
-
-
-
-
-
-
= 50MSPS, f  
= 50MSPS, f  
= 50MSPS, f  
= 50MSPS, f  
= 50MSPS, f  
= 25MSPS, f  
= 20MSPS, f  
= 20.2MHz (Notes 4, 8)  
-
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
o
= 5.02MHz, T = 25 C (Notes 4, 8)  
68  
66  
-
= 5.02MHz, T = Min to Max (Notes 4, 8)  
= 2.51MHz (Notes 4, 8)  
77  
79  
79  
76  
= 1.00MHz (Notes 4, 8)  
-
= 1.0MHz (Notes 4, 8)  
-
+5V Power Supply  
= 2.0MHz to 2.99MHz, 8 Tones at 110kHz  
-
Multitone Power Ratio  
Spacing (Notes 4, 8)  
f
= 100MSPS, f  
= 10MHz to 14.95MHz, 8 Tones at 530kHz  
-
76  
-
dBc  
CLK  
OUT  
Spacing (Notes 4, 8)  
+3V Power Supply  
Spurious Free Dynamic Range,  
SFDR Within a Window  
f
= 100MSPS, f  
= 100MSPS, f  
= 20.2MHz, 30MHz Span (Notes 4, 8)  
= 5.04MHz, 8MHz Span (Notes 4, 8)  
-
-
-
-
-
-
80  
95  
-
-
-
-
-
-
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
CLK  
OUT  
f
CLK  
OUT  
f
= 50MSPS, f  
OUT  
= 5.02MHz, 8MHz Span (Notes 4, 8)  
= 4.0MHz (Notes 4, 8)  
95  
CLK  
+3V Power Supply  
Total Harmonic Distortion (THD) to  
Nyquist  
f
f
f
= 100MSPS, f  
OUT  
-70  
-74  
-76  
CLK  
CLK  
CLK  
= 50MSPS, f  
= 25MSPS, f  
= 2.0MHz (Notes 4, 8)  
= 1.0MHz (Notes 4, 8)  
OUT  
OUT  
5
HI5960  
o
Electrical Specifications AV = DV = +5V, V  
= Internal 1.2V, IOUTFS = 20mA, T = 25 C for All Typical Values (Continued)  
A
DD  
DD  
REF  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
48  
66  
74  
49  
59  
72  
77  
56  
73  
-
MAX  
UNITS  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
+3V Power Supply  
f
f
f
f
f
f
f
f
f
f
f
f
f
f
= 130MSPS, f  
= 130MSPS, f  
= 130MSPS, f  
= 100MSPS, f  
= 100MSPS, f  
= 100MSPS, f  
= 100MSPS, f  
= 40.4MHz (Notes 4, 8)  
= 10.1MHz (Notes 4, 8)  
= 5.02MHz (Notes 4, 8)  
= 40.4MHz (Notes 4, 8)  
= 20.2MHz (Notes 4, 8)  
= 5.04MHz (Notes 4, 8)  
= 2.51MHz (Notes 4, 8)  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
CLK  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
Spurious Free Dynamic Range,  
SFDR to Nyquist (f /2)  
CLK  
-
-
-
-
-
= 50MSPS, f  
= 50MSPS, f  
= 50MSPS, f  
= 50MSPS, f  
= 50MSPS, f  
= 25MSPS, f  
= 20MSPS, f  
= 20.2MHz (Notes 4, 8)  
-
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
o
= 5.02MHz, T = 25 C (Notes 4, 8)  
68  
66  
-
= 5.02MHz, T = Min to Max (Notes 4, 8)  
= 2.51MHz (Notes 4, 8)  
76  
79  
78  
75  
= 1.00MHz (Notes 4, 8)  
-
= 1.0MHz (Notes 4, 8)  
-
+3V Power Supply  
Multitone Power Ratio  
= 2.0MHz to 2.99MHz, 8 Tones at 110kHz  
-
Spacing (Notes 4, 8)  
f
= 100MSPS, f  
= 10MHz to 14.95MHz, 8 Tones at 530kHz  
-
77  
-
dBc  
CLK  
OUT  
Spacing (Notes 4, 8)  
VOLTAGE REFERENCE  
Internal Reference Voltage, V  
Pin 18 Voltage with Internal Reference  
1.13  
1.2  
±60  
±50  
1.28  
V
FSADJ  
ο
Internal Reference Voltage Drift  
-
-
-
-
ppm/ Χ  
Internal Reference Output Current  
Sink/Source Capability  
µA  
Reference Input Impedance  
-
-
1
-
-
MΩ  
Reference Input Multiplying Bandwidth (Note 8)  
1.4  
MHz  
DIGITAL INPUTS D11-D0, CLK  
Input Logic High Voltage with  
5V Supply, V  
(Note 3)  
(Note 3)  
(Note 3)  
(Note 3)  
3.5  
2.1  
-
5
3
0
0
-
V
V
V
V
IH  
Input Logic High Voltage with  
3V Supply, V  
-
IH  
Input Logic Low Voltage with  
5V Supply, V  
1.3  
0.9  
IL  
Input Logic Low Voltage with  
3V Supply, V  
-
IL  
Sleep Input Current, I  
-25  
-20  
-10  
-
-
-
+25  
+20  
+10  
-
µA  
µA  
µA  
pF  
IH  
IH  
IL  
Input Logic Current, I  
Input Logic Current, I  
-
Digital Input Capacitance, C  
5
IN  
TIMING CHARACTERISTICS  
Data Setup Time, t  
See Figure 4 (Note 3)  
See Figure 4 (Note 3)  
See Figure 4  
-
-
1.5  
1.2  
2.5  
-
-
-
-
-
ns  
ns  
ns  
ns  
SU  
Data Hold Time, t  
HLD  
Propagation Delay Time, t  
PD  
-
CLK Pulse Width, t  
, t  
PW1 PW2  
See Figure 4 (Note 3)  
4
6
HI5960  
o
Electrical Specifications AV = DV = +5V, V  
= Internal 1.2V, IOUTFS = 20mA, T = 25 C for All Typical Values (Continued)  
A
DD  
DD  
REF  
PARAMETER  
POWER SUPPLY CHARACTERISTICS  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
AV  
Power Supply  
Power Supply  
(Notes 9)  
(Notes 9)  
2.7  
5.0  
5.0  
23  
5
5.5  
V
V
DD  
DD  
DV  
2.7  
5.5  
Analog Supply Current (I  
AVDD  
)
5V or 3V, IOUTFS = 20mA  
5V or 3V, IOUTFS = 2mA  
5V (Note 5)  
-
-
mA  
-
-
mA  
Digital Supply Current (I  
)
-
7
-
mA  
DVDD  
5V (Note 6)  
-
13  
10  
2
-
mA  
5V (Note 7)  
-
-
mA  
3V (Note 5)  
-
-
mA  
3V (Note 6)  
-
6
-
mA  
3V (Note 7)  
-
5
-
mA  
Supply Current (I  
) Sleep Mode  
5V or 3V, IOUTFS = Don’t Care  
5V, IOUTFS = 20mA (Note 5)  
5V, IOUTFS = 20mA (Note 6)  
5V, IOUTFS = 20mA (Note 7)  
5V, IOUTFS = 2mA (Note 6)  
3V, IOUTFS = 20mA (Note 5)  
3V, IOUTFS = 20mA (Note 6)  
3V, IOUTFS = 20mA (Note 7)  
3V, IOUTFS = 2mA (Note 6)  
Single Supply (Note 8)  
-
2.7  
150  
180  
165  
80  
75  
87  
84  
32  
-
-
mA  
AVDD  
Power Dissipation  
-
-
mW  
mW  
mW  
mW  
mW  
mW  
mW  
mW  
% FSR/V  
-
200  
-
-
-
-
-
-
100  
-
-
-
-
-
Power Supply Rejection  
NOTES:  
-0.2  
+0.2  
2. Gain Error measured as the error in the ratio between the full scale output current and the current through R  
ratio should be 32.  
(typically 625µA). Ideally the  
SET  
3. Parameter guaranteed by design or characterization and not production tested.  
4. Spectral measurements made with differential transformer coupled output and no external filtering.  
5. Measured with the clock at 50MSPS and the output frequency at 10MHz.  
6. Measured with the clock at 100MSPS and the output frequency at 40MHz.  
7. Measured with the clock at 130MSPS and the output frequency at 10MHz.  
8. See “Definition of Specifications”.  
9. It is recommended that the output current be reduced to 12mA or less to maintain optimum performance for operation below 3V. DV and AV  
DD  
DD  
do not have to be equal.  
7
HI5960  
by using a sinusoidal waveform as the external reference  
with the digital inputs set to all 1s. The frequency is  
increased until the amplitude of the output waveform is  
0.707 (-3dB) of its original value.  
Definition of Specifications  
Differential Linearity Error, DNL, is the measure of the  
step size output deviation from code to code. Ideally the step  
size should be 1 LSB. A DNL specification of 1 LSB or less  
guarantees monotonicity.  
Singlet Glitch Area, is the switching transient appearing on  
the output during a code transition. It is measured as the  
area under the overshoot portion of the curve and is  
expressed as a Volt-Time specification. This is tested using  
a single code transition across a major current source.  
Full Scale Gain Drift, is measured by setting the data inputs  
to be all logic high (all 1s) and measuring the output voltage  
through a known resistance as the temperature is varied  
from T  
to T . It is defined as the maximum deviation  
MIN  
MAX  
from the value measured at room temperature to the value  
Spurious Free Dynamic Range, SFDR, is the amplitude  
difference from the fundamental signal to the largest  
harmonically or non-harmonically related spur within the  
specified frequency window.  
measured at either T or T . The units are ppm of FSR  
MIN  
MAX  
o
(full scale range) per C.  
Full Scale Gain Error, is the error from an ideal ratio of 32  
between the output current and the full scale adjust current  
Total Harmonic Distortion, THD, is the ratio of the RMS  
value of the fundamental output signal to the RMS sum of  
the first five harmonic components.  
(through R  
SET  
).  
Integral Linearity Error, INL, is the measure of the worst  
case point that deviates from a best fit straight line of data  
values along the transfer curve.  
Detailed Des cription  
The HI5960 is a 14-bit, current out, CMOS, digital to analog  
converter. Its maximum update rate is 130MSPS and can be  
powered by either single or dual power supplies in the  
recommended range of +3V to +5V. Operation with clock  
rates higher than 130MSPS is possible; please contact the  
factory for more information. It consumes less than 180mW  
of power when using a +5V supply with the data switching at  
130MSPS. The architecture is based on a segmented  
current source arrangement that reduces glitch by reducing  
the amount of current switching at any one time. In previous  
architectures that contained all binary weighted current  
sources or a binary weighted resistor ladder, the converter  
might have a substantially larger amount of current turning  
on and off at certain, worst-case transition points such as  
midscale and quarter scale transitions. By greatly reducing  
the amount of current switching at certain “major” transitions,  
the overall glitch of the converter is dramatically reduced,  
improving settling time, transient problems, and accuracy.  
Internal Reference Voltage Drift, is defined as the  
maximum deviation from the value measured at room  
temperature to the value measured at either T  
The units are ppm per C.  
or T .  
MAX  
MIN  
o
Offset Drift, is measured by setting the data inputs to all  
logic low (all 0s) and measuring the output voltage through a  
known resistance as the temperature is varied from T to  
MIN  
. It is defined as the maximum deviation from the value  
T
MAX  
measured at room temperature to the value measured at  
either T or T . The units are ppm of FSR (full scale  
MIN  
MAX  
o
range) per degree C.  
Offset Error, is measured by setting the data inputs to all  
logic low (all 0s) and measuring the output voltage through a  
known resistance. Offset error is defined as the maximum  
deviation of the output current from a value of 0mA.  
Output Settling Time, is the time required for the output  
voltage to settle to within a specified error band measured  
from the beginning of the output transition. The  
Digital Inputs and Termination  
The HI5960 digital inputs are guaranteed to CMOS levels.  
However, TTL compatibility can be achieved by lowering the  
supply voltage to 3V due to the digital threshold of the input  
buffer being approximately half of the supply voltage. The  
internal register is updated on the rising edge of the clock.  
To minimize reflections, proper termination should be  
implemented. If the lines driving the clock and the digital  
inputs are long 50lines, then 50termination resistors  
should be placed as close to the converter inputs as possible  
connected to the digital ground plane (if separate grounds  
are used). These termination resistors are not likely needed  
as long as the digital waveform source is within a few inches  
of the DAC.  
measurement is done by switching quarter scale.  
Termination impedance was 25due to the parallel  
resistance of the 50loading on the output and the  
oscilloscope’s 50input. This also aids the ability to resolve  
the specified error band without overdriving the oscilloscope.  
Output Voltage Compliance Range, is the voltage limit  
imposed on the output. The output impedance should be  
chosen such that the voltage developed does not violate the  
compliance range.  
Power Supply Rejection, is measured using a single power  
supply. The supply’s nominal +5V is varied ±10% and the  
change in the DAC full scale output is noted.  
Ground Planes  
Reference Input Multiplying Bandwidth, is defined as the  
Separate digital and analog ground planes should be used.  
All of the digital functions of the device and their  
3dB bandwidth of the voltage reference input. It is measured  
8
HI5960  
corresponding components should be located over the  
digital ground plane and terminated to the digital ground  
plane. The same is true for the analog components and the  
analog ground plane. Consult Application Note 9853.  
loading each current output) should be chosen so that the  
desired output voltage is produced in conjunction with the  
output full scale current. If a known line impedance is to be  
driven, then the output load resistor should be chosen to  
match this impedance. The output voltage equation is:  
Nois e Reduction  
V
= I  
X R .  
LOAD  
OUT  
OUT  
To minimize power supply noise, 0.1µF capacitors should be  
placed as close as possible to the converter’s power supply  
These outputs can be used in a differential-to-single-ended  
arrangement to achieve better harmonic rejection. The  
SFDR measurements in this data sheet were performed with  
a 1:1 transformer on the output of the DAC (see Figure 1).  
With the center tap grounded, the output swing of pins 21  
and 22 will be biased at zero volts. The loading as shown in  
Figure 1 will result in a 500mV signal at the output of the  
transformer if the full scale output current of the DAC is set  
to 20mA.  
pins, AV  
and DV . Also, the layout should be designed  
DD  
DD  
using separate digital and analog ground planes and these  
capacitors should be terminated to the digital ground for  
DV  
DD  
and to the analog ground for AV . Additional  
DD  
filtering of the power supplies on the board is recommended.  
Voltage Reference  
The internal voltage reference of the device has a nominal  
o
value of +1.2V with a ±60ppm/ C drift coefficient over the  
full temperature range of the converter. It is recommended  
that a 0.1µF capacitor be placed as close as possible to the  
REFIO pin, connected to the analog ground. The REFLO pin  
(16) selects the reference. The internal reference can be  
selected if pin 16 is tied low (ground). If an external  
reference is desired, then pin 16 should be tied high (the  
analog supply voltage) and the external reference driven into  
REFIO, pin 17. The full scale output current of the converter  
is a function of the voltage reference used and the value of  
R
IS THE IMPEDANCE  
EQ  
LOADING EACH OUTPUT  
V
= (2 x I x R )V  
OUT EQ  
50Ω  
100Ω  
50Ω  
OUT  
IOUTB  
PIN 21  
50Ω  
PIN 22  
HI5960  
IOUTA  
50REPRESENTS THE  
SPECTRUM ANALYZER  
R
. I should be within the 2mA to 20mA range,  
SET OUT  
FIGURE 1.  
though operation below 2mA is possible, with performance  
degradation.  
V
= 2 x I  
OUT  
x R , where R is ~12.5. Allowing the  
EQ EQ  
OUT  
If the internal reference is used, V  
FSADJ  
will equal  
center tap to float will result in identical transformer output,  
however the output pins of the DAC will have positive DC  
offset. Since the DAC’s output voltage compliance range is -  
0.3V to +1.25V, the center tap may need to be left floating or  
DC offset in order to increase the amount of signal swing  
available. The 50load on the output of the transformer  
represents the spectrum analyzer’s input impedance.  
approximately 1.2V (pin 18). If an external reference is used,  
will equal the external reference. The calculation for  
V
FSADJ  
I
(Full Scale) is:  
OUT  
I
(Full Scale) = (V  
/R X 32.  
OUT  
FSADJ SET)  
If the full scale output current is set to 20mA by using the  
internal voltage reference (1.2V) and a 1.91kR  
SET  
resistor, then the input coding to output current will resemble  
the following:  
TABLE 1. INPUT CODING vs OUTPUT CURRENT  
INPUT CODE (D13-D0)  
1111 11111 11111  
1000 00000 00000  
0000 00000 00000  
IOUTA (mA)  
IOUTB (mA)  
20  
10  
0
0
10  
20  
Outputs  
IOUTA and IOUTB are complementary current outputs. The  
sum of the two currents is always equal to the full scale  
output current minus one LSB. If single ended use is  
desired, a load resistor can be used to convert the output  
current to a voltage. It is recommended that the unused  
output be either grounded or equally terminated. The voltage  
developed at the output must not violate the output voltage  
compliance range of -0.3V to 1.25V. R  
(the impedance  
LOAD  
9
HI5960  
Timing Diagrams  
50%  
CLK  
D13-D0  
1
GLITCH AREA =  
/ (H x W)  
2
V
HEIGHT (H)  
ERROR BAND  
I
OUT  
t(ps)  
WIDTH (W)  
t
SETT  
t
PD  
FIGURE 2. OUTPUT SETTLING TIME DIAGRAM  
FIGURE 3. PEAK GLITCH AREA (SINGLET) MEASUREMENT  
METHOD  
t
t
PW2  
PW1  
50%  
CLK  
t
t
t
SU  
SU  
SU  
t
t
t
HLD  
HLD  
HLD  
D13-D0  
t
SETT  
t
PD  
I
OUT  
t
t
SETT  
SETT  
t
t
PD  
PD  
FIGURE 4. PROPAGATION DELAY, SETUP TIME, HOLD TIME AND MINIMUM PULSE WIDTH DIAGRAM  
10  
HI5960  
Small Outline Plas tic Packages (SOIC)  
M28.3 (JEDEC MS-013-AE ISSUE C)  
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
0.25(0.010)  
M
B M  
H
AREA  
INCHES  
MILLIMETERS  
E
SYMBOL  
MIN  
MAX  
MIN  
2.35  
0.10  
0.33  
0.23  
MAX  
2.65  
0.30  
0.51  
0.32  
18.10  
7.60  
NOTES  
-B-  
A
A1  
B
C
D
E
e
0.0926  
0.0040  
0.013  
0.1043  
0.0118  
0.0200  
0.0125  
-
-
1
2
3
L
9
SEATING PLANE  
A
0.0091  
0.6969  
0.2914  
-
0.7125 17.70  
3
-A-  
o
h x 45  
D
0.2992  
7.40  
4
0.05 BSC  
1.27 BSC  
-
-C-  
α
H
h
0.394  
0.01  
0.419  
0.029  
0.050  
10.00  
0.25  
0.40  
10.65  
0.75  
1.27  
-
e
A1  
C
5
B
0.10(0.004)  
L
0.016  
6
0.25(0.010) M  
C
A M B S  
N
α
28  
28  
7
o
o
o
o
0
8
0
8
-
NOTES:  
Rev. 0 12/93  
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2  
of Publication Number 95.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs. Mold flash, protrusion and gate burrs shall not exceed  
0.15mm (0.006 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. In-  
terlead flash and protrusions shall not exceed 0.25mm (0.010  
inch) per side.  
5. The chamfer on the body is optional. If it is not present, a visual  
index feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch)  
10. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are not necessarily exact.  
11  
HI5960  
Thin Shrink Small Outline Plas tic Packages (TSSOP)  
M28.173  
N
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC  
PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
E
E1  
-B-  
INCHES  
MIN  
MILLIMETERS  
GAUGE  
PLANE  
SYMBOL  
MAX  
0.047  
0.006  
0.051  
0.0118  
0.0079  
0.386  
0.177  
MIN  
-
MAX  
1.20  
0.15  
1.05  
0.30  
0.20  
9.80  
4.50  
NOTES  
A
A1  
A2  
b
-
-
1
2
3
0.002  
0.031  
0.0075  
0.0035  
0.378  
0.169  
0.05  
0.80  
0.19  
0.09  
9.60  
4.30  
-
L
-
0.25  
0.010  
0.05(0.002)  
SEATING PLANE  
A
9
-A-  
D
c
-
D
3
-C-  
E1  
e
4
α
A2  
e
A1  
0.026 BSC  
0.65 BSC  
-
c
b
0.10(0.004)  
E
0.246  
0.256  
6.25  
0.45  
6.50  
0.75  
-
0.10(0.004) M  
C
A M B S  
L
0.0177  
0.0295  
6
N
28  
28  
7
o
o
o
o
NOTES:  
0
8
0
8
-
α
1. These package dimensions are within allowable dimensions of  
JEDEC MO-153-AE, Issue E.  
Rev. 0 6/98  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm  
(0.006 inch) per side.  
4. Dimension “E1” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “b” does not include dambar protrusion. Allowable dambar  
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-  
sion at maximum material condition. Minimum space between protru-  
sion and adjacent lead is 0.07mm (0.0027 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact. (Angles in degrees)  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
12  
配单直通车
HI5960IAZ-T产品参数
型号:HI5960IAZ-T
Brand Name:Intersil
生命周期:Unknown
零件包装代码:SOIC, TSSOP
包装说明:TSSOP, TSSOP28,.25
针数:28, 28
Reach Compliance Code:compliant
风险等级:5.61
Is Samacsys:N
最大模拟输出电压:1.25 V
最小模拟输出电压:-0.3 V
转换器类型:D/A CONVERTER
输入位码:BINARY
输入格式:PARALLEL, WORD
JESD-30 代码:R-PDSO-G28
JESD-609代码:e3
长度:9.7 mm
最大线性误差 (EL):0.0305%
湿度敏感等级:3
位数:14
功能数量:1
端子数量:28
最高工作温度:85 °C
最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP
封装等效代码:TSSOP28,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260
电源:3/5 V
认证状态:Not Qualified
座面最大高度:1.2 mm
标称安定时间 (tstl):0.035 µs
子类别:Other Converters
标称供电电压:5 V
表面贴装:YES
技术:CMOS
温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:40
宽度:4.4 mm
Base Number Matches:1
  •  
  • 供货商
  • 型号 *
  • 数量*
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
批量询价选中的记录已选中0条,每次最多15条。
 复制成功!