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产品型号JM38510/30106B2A的Datasheet PDF文件预览

SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,  
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175  
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR  
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001  
Copyright 2001, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,  
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175  
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR  
SDLS068A DECEMBER 1972 REVISED OCTOBER 2001  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,  
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175  
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR  
SDLS068A DECEMBER 1972 REVISED OCTOBER 2001  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54174, SN54175, SN74174, SN74175  
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR  
SDLS068A DECEMBER 1972 REVISED OCTOBER 2001  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54LS174, SN54LS175, SN74LS174, SN74LS175  
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR  
SDLS068A DECEMBER 1972 REVISED OCTOBER 2001  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54S174, SN54S175, SN74S174, SN74S175  
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR  
SDLS068A DECEMBER 1972 REVISED OCTOBER 2001  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CFP  
Drawing  
JM38510/01702BEA  
JM38510/01702BFA  
JM38510/07105BEA  
JM38510/07105BFA  
JM38510/07106BEA  
JM38510/30106B2A  
JM38510/30106BEA  
JM38510/30106BFA  
JM38510/30107B2A  
JM38510/30107BEA  
JM38510/30107BFA  
JM38510/30107SEA  
JM38510/30107SFA  
SN54175J  
OBSOLETE  
OBSOLETE  
ACTIVE  
J
W
J
16  
16  
16  
16  
16  
20  
16  
16  
20  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
CDIP  
CFP  
1
1
1
1
1
1
1
1
1
1
1
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
ACTIVE  
W
J
ACTIVE  
CDIP  
LCCC  
CDIP  
CFP  
A42 SNPB  
ACTIVE  
FK  
J
POST-PLATE N / A for Pkg Type  
ACTIVE  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
ACTIVE  
W
FK  
J
ACTIVE  
LCCC  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
ACTIVE  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
ACTIVE  
W
J
ACTIVE  
CDIP  
CFP  
A42 SNPB  
A42  
ACTIVE  
W
J
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
PDIP  
PDIP  
PDIP  
SOIC  
Call TI  
SN54LS174J  
J
1
1
1
1
A42 SNPB  
A42 SNPB  
A42 SNPB  
A42 SNPB  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
SN54LS175J  
ACTIVE  
J
SN54S174J  
ACTIVE  
J
SN54S175J  
ACTIVE  
J
SN74174N  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
N
N
N
D
SN74175N  
Call TI  
Call TI  
SN74175N3  
Call TI  
Call TI  
SN74LS174D  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS174DE4  
SN74LS174DG4  
SN74LS174DR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS174DRE4  
SN74LS174DRG4  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS174J  
SN74LS174N  
OBSOLETE  
ACTIVE  
CDIP  
PDIP  
J
16  
16  
TBD  
Call TI  
Call TI  
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS174N3  
SN74LS174NE4  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
16  
16  
TBD  
Call TI  
Call TI  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS174NSR  
SN74LS174NSRE4  
SN74LS174NSRG4  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
SO  
NS  
NS  
NS  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
Orderable Device  
SN74LS175D  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS175DE4  
SN74LS175DG4  
SN74LS175DR  
SN74LS175DRE4  
SN74LS175DRG4  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS175J  
SN74LS175N  
OBSOLETE  
ACTIVE  
CDIP  
PDIP  
J
16  
16  
TBD  
Call TI  
Call TI  
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS175N3  
SN74LS175NE4  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
16  
16  
TBD  
Call TI  
Call TI  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74LS175NSR  
SN74LS175NSRE4  
SN74LS175NSRG4  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
SO  
NS  
NS  
NS  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S174J  
SN74S174N  
OBSOLETE  
ACTIVE  
CDIP  
PDIP  
J
16  
16  
TBD  
Call TI  
Call TI  
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S174N3  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
16  
16  
TBD  
Call TI  
Call TI  
SN74S174NE4  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S174NSR  
SN74S174NSRE4  
SN74S174NSRG4  
SN74S175D  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
NS  
NS  
NS  
D
16  
16  
16  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S175DE4  
SN74S175DG4  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S175DR  
SN74S175N  
OBSOLETE  
ACTIVE  
SOIC  
PDIP  
D
N
16  
16  
TBD  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S175N3  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
N
N
16  
16  
TBD  
Call TI  
Call TI  
SN74S175NE4  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SN74S175NSR  
ACTIVE  
SO  
NS  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
Orderable Device  
SN74S175NSRE4  
SN74S175NSRG4  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SO  
NS  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
NS  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SNJ54175J  
SNJ54175W  
OBSOLETE  
OBSOLETE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
W
FK  
J
16  
16  
20  
16  
16  
20  
16  
16  
20  
16  
16  
20  
16  
16  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
SNJ54LS174FK  
SNJ54LS174J  
SNJ54LS174W  
SNJ54LS175FK  
SNJ54LS175J  
SNJ54LS175W  
SNJ54S174FK  
SNJ54S174J  
LCCC  
CDIP  
CFP  
1
1
1
1
1
1
1
1
1
1
1
1
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
W
FK  
J
LCCC  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
W
FK  
J
LCCC  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
SNJ54S174W  
SNJ54S175FK  
SNJ54S175J  
W
FK  
J
LCCC  
CDIP  
CFP  
POST-PLATE N / A for Pkg Type  
A42 SNPB  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
SNJ54S175W  
W
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Jun-2007  
TAPE AND REEL INFORMATION  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Jun-2007  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
330  
330  
330  
330  
330  
330  
(mm)  
16  
SN74LS174DR  
SN74LS174NSR  
SN74LS175DR  
SN74LS175NSR  
SN74S174NSR  
SN74S175NSR  
D
16  
16  
16  
16  
16  
16  
FMX  
MLA  
FMX  
MLA  
MLA  
MLA  
6.5  
8.2  
6.5  
8.2  
8.2  
8.2  
10.3  
10.5  
10.3  
10.5  
10.5  
10.5  
12.1  
2.5  
2
16  
16  
16  
16  
16  
16  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
NS  
D
16  
12  
2
16  
12.1  
2.5  
NS  
NS  
NS  
16  
12  
12  
12  
16  
2.5  
16  
2.5  
TAPE AND REEL BOX INFORMATION  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
SN74LS174DR  
SN74LS174NSR  
SN74LS175DR  
SN74LS175NSR  
SN74S174NSR  
SN74S175NSR  
D
16  
16  
16  
16  
16  
16  
FMX  
MLA  
FMX  
MLA  
MLA  
MLA  
342.9  
342.9  
342.9  
342.9  
342.9  
342.9  
336.6  
336.6  
336.6  
336.6  
336.6  
336.6  
28.58  
28.58  
28.58  
28.58  
28.58  
28.58  
NS  
D
NS  
NS  
NS  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Jun-2007  
Pack Materials-Page 3  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  
配单直通车
JM38510/30106B2A产品参数
型号:JM38510/30106B2A
Brand Name:Texas Instruments
生命周期:Active
零件包装代码:QLCC
包装说明:QCCN,
针数:20
Reach Compliance Code:not_compliant
HTS代码:8542.39.00.01
Factory Lead Time:1 week
风险等级:5.15
系列:LS
JESD-30 代码:S-CQCC-N20
长度:8.89 mm
负载电容(CL):15 pF
逻辑集成电路类型:D FLIP-FLOP
最大频率@ Nom-Sup:30000000 Hz
最大I(ol):0.008 A
位数:6
功能数量:1
端子数量:20
最高工作温度:125 °C
最低工作温度:-55 °C
输出极性:TRUE
封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:QCCN
封装形状:SQUARE
封装形式:CHIP CARRIER
包装方法:TUBE
峰值回流温度(摄氏度):NOT SPECIFIED
最大电源电流(ICC):26 mA
Prop。Delay @ Nom-Sup:30 ns
传播延迟(tpd):30 ns
认证状态:Not Qualified
筛选级别:MIL-M-38510 Class B
座面最大高度:2.03 mm
最大供电电压 (Vsup):5.25 V
最小供电电压 (Vsup):4.75 V
标称供电电压 (Vsup):5 V
表面贴装:YES
技术:TTL
温度等级:MILITARY
端子形式:NO LEAD
端子节距:1.27 mm
端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED
触发器类型:POSITIVE EDGE
宽度:8.89 mm
最小 fmax:30 MHz
Base Number Matches:1
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