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产品型号LM20145的Datasheet PDF文件预览

November 1, 2007  
LM20145  
5A, PowerWise® Adjustable Frequency Synchronous Buck  
Regulator  
General Description  
Features  
The LM20145 is a full featured adjustable frequency syn-  
chronous buck regulator capable of delivering up to 5A of  
continuous output current. The current mode control loop can  
be compensated to be stable with virtually any type of output  
capacitor. For most cases, compensating the device only re-  
quires two external components, providing maximum flexibil-  
ity and ease of use. The device is optimized to work over the  
input voltage range of 2.95V to 5.5V making it suited for a wide  
variety of low voltage systems.  
Input voltage range 2.95V to 5.5V  
Accurate current limit minimizes inductor size  
97% peak efficiency  
Adjustable switching frequency (250 kHz to 750 kHz)  
32 mintegrated FET switches  
Starts up into pre-biased loads  
Output voltage tracking  
Peak current mode control  
The device features internal over voltage protection (OVP)  
and over current protection (OCP) circuits for increased sys-  
tem reliability. A precision enable pin and integrated UVLO  
allows the turn-on of the device to be tightly controlled and  
sequenced. Start-up inrush currents are limited by both an  
internally fixed and externally adjustable Soft-Start circuit.  
Fault detection and supply sequencing is possible with the  
integrated power good circuit.  
Adjustable output voltage down to 0.8V  
Adjustable Soft-Start with external capacitor  
Precision enable pin with hysteresis  
Integrated OVP, UVLO, power good and thermal  
shutdown  
eTSSOP-16 exposed pad package  
The LM20145 is designed to work well in multi-rail power  
supply architectures. The output voltage of the device can be  
configured to track a higher voltage rail using the SS/TRK pin.  
If the output of the LM20145 is pre-biased at startup it will not  
sink current to pull the output low until the internal soft-start  
ramp exceeds the voltage at the feedback pin.  
Applications  
Simple to design, high efficiency point of load regulation  
from a 5V or 3.3V bus  
High Performance DSPs, FPGAs, ASICs and  
microprocessors  
Broadband, Networking and Optical Communications  
Infrastructure  
The frequency of this device can be adjusted from 250 kHz to  
750 kHz by connecting an external resistor from the RT pin to  
ground.  
The LM20145 is offered in a 16-pin eTSSOP package with an  
exposed pad that can be soldered to the PCB, eliminating the  
need for bulky heatsinks.  
Typical Application Circuit  
30030701  
®
PowerWise is a registered trademark of National Semiconductor Corporation.  
© 2007 National Semiconductor Corporation  
300307  
www.national.com  
Connection Diagram  
30030702  
Top View  
eTSSOP-16 Package  
Ordering Information  
Order Number  
LM20145MH  
Package Type  
eTSSOP-16  
NSC Package Drawing  
Package Marking  
Supplied As  
MXA16A  
20145MH  
92 Units of Rail  
LM20145MHE  
LM20145MHX  
250 Units of Tape and Reel  
2500 Units of Tape and Reel  
Pin Descriptions  
Pin #  
Name  
Description  
1
SS/TRK  
Soft-Start or Tracking control input. An internal 5 µA current source charges an external capacitor to  
set the Soft-Start ramp rate. If driven by a external source less than 800 mV, this pin overrides the  
internal reference that sets the output voltage. If left open, an internal 1ms Soft-Start ramp is activated.  
2
3
FB  
Feedback input to the error amplifier from the regulated output. This pin is connected to the inverting  
input of the internal transconductance error amplifier. An 800 mV reference connected to the non-  
inverting input of the error amplifier sets the closed loop regulation voltage at the FB pin.  
PGOOD  
Power good output signal. Open drain output indicating the output voltage is regulating within  
tolerance. A pull-up resistor of 10 kto 100 kis recommend for most applications.  
External compensation pin. Connect a resistor and capacitor to this pin to compensate the device.  
These pins must be connected to GND to ensure proper operation  
4
5
COMP  
NC  
6,7  
PVIN  
Input voltage to the power switches inside the device. These pins should be connected together at the  
device. A low ESR capacitor should be placed near these pins to stabilize the input voltage.  
8,9  
10,11  
12  
SW  
PGND  
EN  
Switch pin. The PWM output of the internal power switches.  
Power ground pin for the internal power switches.  
Precision enable input for the device. An external voltage divider can be used to set the device turn-  
on threshold. If not used the EN pin should be connected to PVIN.  
13  
14  
VCC  
Internal 2.7V sub-regulator. This pin should be bypassed with a 1 µF ceramic capacitor.  
AVIN  
Analog input supply that generates the internal bias. Must be connected to VIN through a low pass  
RC filter.  
15  
16  
EP  
AGND  
RT  
Quiet analog ground for the internal bias circuitry.  
Frequency adjust pin. Connecting a resistor on this pin to ground will set the oscillator frequency.  
Exposed Pad Exposed metal pad on the underside of the package with a weak electrical connection to ground. It is  
recommended to connect this pad to the PC board ground plane in order to improve heat dissipation.  
www.national.com  
2
Power Dissipation (Note 2)  
Lead Temperature  
(Soldering, 10 sec)  
Minimum ESD Rating (Note  
3)  
2.6W  
260°C  
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
±2kV  
Voltages from the indicated pins to GND  
AVIN, PVIN, EN, PGOOD,  
SS/TRK, COMP, FB, RT  
Storage Temperature  
Junction Temperature  
-0.3V to +6V  
Operating Ratings  
PVIN, AVIN to GND  
2.95V to 5.5V  
−40°C to + 125°C  
-65°C to 150°C  
150°C  
Junction Temperature  
Electrical Characteristics Unless otherwise stated, the following conditions apply: AVIN = PVIN = VIN = 5V.  
Limits in standard type are for TJ = 25°C only, limits in bold face type apply over the junction temperature (TJ) range of -40°C to  
+125°C. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the  
most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.  
Symbol  
Parameter  
Conditions  
Min  
Typ Max  
Unit  
V
VFB  
Feedback pin voltage  
Load Regulation  
VIN = 2.95V to 5.5V  
IOUT = 100 mA to 5A  
0.788 0.8 0.812  
0.08  
%/A  
ΔVOUTIOUT  
ICL  
Switch Current Limit Threshold  
High-Side Switch On Resistance  
Low-Side Switch On Resistance  
Operating Quiescent Current  
Shutdown Quiescent current  
VIN Under Voltage Lockout  
VIN Under Voltage Lockout Hysteresis  
VCC Voltage  
VIN = 3.3V  
6.7  
7.4  
36  
32  
3.5  
90  
8.1  
55  
52  
6
A
RDS_ON  
RDS_ON  
IQ  
ISW = 3.5A  
mΩ  
mΩ  
mA  
µA  
V
ISW = 3.5A  
Non-switching, VFB = VCOMP  
VEN = 0V  
ISD  
180  
VUVLO  
VUVLO_HYS  
VVCC  
Rising VIN  
2.45  
2.7 2.95  
45 100  
2.7 2.95  
Falling VIN  
mV  
V
IVCC = 0 µA  
2.45  
2
ISS  
Soft-Start Pin Source Current  
SS/TRK Accuracy, VSS - VFB  
VSS/TRK = 0V  
VSS/TRK = 0.4V  
4.5  
3
7
µA  
mV  
VTRACK  
Oscillator  
FOSCH  
-10  
15  
Oscillator Frequency  
Oscillator Frequency  
Minimum Off Time  
675  
225  
750 825  
260 290  
85  
kHz  
kHz  
ns  
RT = 49.9 kΩ  
RT = 249 kΩ  
FOSCL  
TOFF_TIME  
TON_TIME  
TCL_BLANK  
Minimum On Time  
100  
ns  
Current Sense Blanking Time  
After Rising VSW  
80  
ns  
Error Amplifier and Modulator  
IFB  
ICOMP_SRC  
ICOMP_SNK  
Gm  
Feedback pin bias current  
VFB = 0.8V  
1
100  
nA  
µA  
µA  
COMP Output Source Current  
COMP Output Sink Current  
Error Amplifier Transconductance  
Error Amplifier Voltage Gain  
VFB = VCOMP = 0.6V  
VFB = 1.0V, VCOMP = 0.6V  
ICOMP = ± 50 µA  
80  
80  
100  
100  
450  
510 600 µmho  
AVOL  
2000  
V/V  
Power Good  
VOVP  
Over Voltage Protection Rising Threshold  
Over Voltage Protection Hysteresis  
PGOOD Rising Threshold  
With respect to VFB  
With respect to VFB  
105  
92  
108 111  
%
%
VOVP_HYS  
VPGTH  
2
94  
2
3
96  
3
%
VPGHYS  
TPGOOD  
IOL  
PGOOD Falling Hysteresis  
%
PGOOD deglitch time  
16  
1
µs  
mA  
nA  
PGOOD Low Sink Current  
VPGOOD = 0.4V  
VPGOOD = 5V  
0.6  
IOH  
PGOOD High Leakage Current  
5
100  
3
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Symbol  
Enable  
Parameter  
Conditions  
Min  
Typ Max  
Unit  
VIH_EN  
EN Pin turn-on Threshold  
EN Pin Hysteresis  
VEN Rising  
1.08 1.18 1.28  
V
VEN_HYS  
66  
mV  
Thermal Shutdown  
TSD  
Thermal Shutdown  
Thermal Shutdown Hysteresis  
160  
10  
°C  
°C  
TSD_HYS  
Thermal Resistance  
Junction to Ambient  
38  
°C/W  
θJA  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.  
Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ_MAX, the junctions-to-ambient thermal resistance, θJA  
and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD_MAX = (TJ_MAX – TA)/θJA. The  
maximum power dissipations of 2.6W is determined using TA = 25°C, θJA = 38°C/W, and TJ_MAX = 125°C.  
,
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kresistor to each pin.  
Typical Performance Characteristics Unless otherwise specified: CIN = COUT = 100 µF, L = 1.5 µH  
(Coilcraft MSS1038), VIN = 5V, VOUT = 1.2V, RLOAD = 1.2Ω, fSW = 500 kHz, TA = 25°C for efficiency curves, loop gain plots and  
waveforms, and TJ = 25°C for all others.  
Efficiency vs. Load Current (VIN = 5V)  
Efficiency vs. Load Current (VIN = 3.3V)  
30030731  
30030730  
High-Side FET Resistance vs. Temperature  
Low-Side FET Resistance vs. Temperature  
30030757  
30030758  
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4
Error Amplifier Gain vs. Frequency  
Line Regulation  
30030736  
30030737  
Load Regulation  
Feedback Pin Voltage vs. Temperature  
30030738  
30030751  
Switching Frequency vs. Temperature  
Switching Frequency vs. RT  
30030739  
30030750  
5
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Quiescent Current vs. VIN (Not Switching)  
Shutdown Current vs. Temperature  
30030741  
30030740  
Enable Threshold vs. Temperature  
UVLO Threshold vs. Temperature  
30030728  
30030745  
Peak Current Limit vs. Temperature  
Peak Current Limit vs. VOUT  
30030742  
30030754  
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6
Peak Current Limit vs. VIN  
Load Transient Response  
30030734  
30030755  
Line Transient Response  
Start-Up (Soft-Start)  
30030744  
30030743  
Start-Up (Tracking)  
Power Down  
30030732  
30030733  
7
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Short Circuit Input Current vs. VIN  
PGOOD vs. IPGOOD  
30030756  
30030727  
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8
Block Diagram  
30030703  
9
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low-side FET turns on allowing the inductor current to ramp  
down until the next switching cycle. For each sequential over-  
current event, the reference voltage is decremented and  
PWM pulses are skipped resulting in a current limit that does  
not aggressively fold back for brief over-current events, while  
at the same time providing frequency and voltage foldback  
protection during hard short circuit conditions.  
Operation Description  
GENERAL  
The LM20145 switching regulator features all of the functions  
necessary to implement an efficient low voltage buck regula-  
tor using a minimum number of external components. This  
easy to use regulator features two integrated switches and is  
capable of supplying up to 5A of continuous output current.  
The regulator utilizes peak current mode control with nonlin-  
ear slope compensation to optimize stability and transient  
response over the entire output voltage range. Peak current  
mode control also provides inherent line feed-forward, cycle-  
by-cycle current limiting and easy loop compensation. The  
switching frequency can be varied from 250 kHz to 750 kHz.  
The device can operate at high switching frequency allowing  
use of a small inductor while still achieving high efficiency.  
The precision internal voltage reference allows the output to  
be set as low as 0.8V. Fault protection features include: cur-  
rent limiting, thermal shutdown, over voltage protection, and  
shutdown capability. The device is available in the  
eTSSOP-16 package featuring an exposed pad to aid thermal  
dissipation. The LM20145 can be used in numerous applica-  
tions to efficiently step-down from a 5V or 3.3V bus. The  
typical application circuit for the LM20145 is shown in Figure  
2 in the design guide.  
SOFT-START AND VOLTAGE TRACKING  
The SS/TRK pin is a dual function pin that can be used to set  
the start up time or track an external voltage source. The start  
up or Soft-Start time can be adjusted by connecting a capac-  
itor from the SS/TRK pin to ground. The Soft-Start feature  
allows the regulator output to gradually reach the steady state  
operating point, thus reducing stresses on the input supply  
and controlling start up current. If no Soft-Start capacitor is  
used the device defaults to the internal Soft-Start circuitry re-  
sulting in a start up time of approximately 1 ms. For applica-  
tions that require a monotonic start up or utilize the PGOOD  
pin, an external Soft-Start capacitor is recommended. The  
SS/TRK pin can also be set to track an external voltage  
source. The tracking behavior can be adjusted by two external  
resistors connected to the SS/TRK pin as shown in Figure 7.  
in the design guide.  
PRE-BIAS START UP CAPABILITY  
The LM20145 is in a pre-biased state when the device starts  
up with an output voltage greater than zero. This often occurs  
in many multi-rail applications such as when powering an FP-  
GA, ASIC, or DSP. In these applications the output can be  
pre-biased through parasitic conduction paths from one sup-  
ply rail to another. Even though the LM20145 is a syn-  
chronous converter it will not pull the output low when a  
prebias condition exists. During start up the LM20145 will not  
sink current until the Soft-Start voltage exceeds the voltage  
on the FB pin. Since the device can not sink current it protects  
the load from damage that might otherwise occur if current is  
conducted through the parasitic paths of the load.  
PRECISION ENABLE  
The enable (EN) pin allows the output of the device to be en-  
abled or disabled with an external control signal. This pin is a  
precision analog input that enables the device when the volt-  
age exceeds 1.18V (typical). The EN pin has 66 mV of hys-  
teresis and will disable the output when the enable voltage  
falls below 1.11V (typical). If the EN pin is not used, it should  
be connected to VIN. Since the enable pin has a precise turn-  
on threshold it can be used along with an external resistor  
divider network from VIN to configure the device to turn-on at  
a precise input voltage. The precision enable circuitry will re-  
main active even when the device is disabled.  
POWER GOOD AND OVER VOLTAGE FAULT HANDLING  
PEAK CURRENT MODE CONTROL  
The LM20145 has built in under and over voltage compara-  
tors that control the power switches. Whenever there is an  
excursion in output voltage above the set OVP threshold, the  
part will terminate the present on-pulse, turn-on the low-side  
FET, and pull the PGOOD pin low. The low-side FET will re-  
main on until either the FB voltage falls back into regulation  
or the zero cross detection is triggered which in turn tri-states  
the FETs. If the output reaches the UVP threshold the part will  
continue switching and the PGOOD pin will be asserted and  
go low. Typical values for the PGOOD resistor are on the or-  
der of 100 kor less. To avoid false tripping during transient  
glitches the PGOOD pin has 16 µs of built in deglitch time to  
both rising and falling edges.  
In most cases, the peak current mode control architecture  
used in the LM20145 only requires two external components  
to achieve a stable design. The compensation can be select-  
ed to accommodate any capacitor type or value. The external  
compensation also allows the user to set the crossover fre-  
quency and optimize the transient performance of the device.  
For duty cycles above 50% all current mode control buck  
converters require the addition of an artificial ramp to avoid  
sub-harmonic oscillation. This artificial linear ramp is com-  
monly referred to as slope compensation. What makes the  
LM20145 unique is the amount of slope compensation will  
change depending on the output voltage. When operating at  
high output voltages the device will have more slope com-  
pensation than when operating at lower output voltages. This  
is accomplished in the LM20145 by using a non-linear  
parabolic ramp for the slope compensation. The parabolic  
slope compensation of the LM20145 is much better than the  
traditional linear slope compensation because it optimizes the  
stability of the device over the entire output voltage range.  
UVLO  
The LM20145 has a built-in under-voltage lockout protection  
circuit that keeps the device from switching until the input  
voltage reaches 2.7V (typical). The UVLO threshold has 45  
mV of hysteresis that keeps the device from responding to  
power-on glitches during start up. If desired the turn-on point  
of the supply can be changed by using the precision enable  
pin and a resistor divider network connected to VIN as shown  
in Figure 6. in the design guide.  
CURRENT LIMIT  
The precise current limit of the LM20123 is set at the factory  
to be within 10% over the entire operating temperature range.  
This enables the device to operate with smaller inductors that  
have lower saturation currents. When the peak inductor cur-  
rent reaches the current limit threshold, an over current event  
is triggered and the internal high-side FET turns off and the  
THERMAL PROTECTION  
Internal thermal shutdown circuitry is provided to protect the  
integrated circuit in the event that the maximum junction tem-  
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10  
perature is exceeded. When activated, typically at 160°C, the  
LM20145 tri-states the power FETs and resets soft start. After  
the junction cools to approximately 150°C, the part starts up  
using the normal start up routine. This feature is provided to  
prevent catastrophic failures from accidental device over-  
heating.  
Several diagrams are shown in Figure 1 illustrating continu-  
ous conduction mode (CCM), discontinuous conduction  
mode, and the boundary condition.  
It can be seen that in diode emulation mode, whenever the  
inductor current reaches zero the SW node will become high  
impedance. Ringing will occur on this pin as a result of the LC  
tank circuit formed by the inductor and the parasitic capaci-  
tance at the node. If this ringing is of concern an additional  
RC snubber circuit can be added from the switch node to  
ground.  
LIGHT LOAD OPERATION  
The LM20145 offers increased efficiency when operating at  
light loads. Whenever the load current is reduced to a point  
where the peak to peak inductor ripple current is greater than  
two times the load current, the part will enter the diode emu-  
lation mode preventing significant negative inductor current.  
The point at which this occurs is the critical conduction bound-  
ary and can be calculated by the following equation:  
At very light loads, usually below 100 mA, several pulses may  
be skipped in between switching cycles, effectively reducing  
the switching frequency and further improving light-load effi-  
ciency.  
30030705  
FIGURE 1. Modes of Operation for LM20145  
11  
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Design Guide  
This section walks the designer through the steps necessary  
to select the external components to build a fully functional  
power supply. As with any DC-DC converter numerous trade-  
offs are possible to optimize the design for efficiency, size, or  
performance. These will be taken into account and highlight-  
ed throughout this discussion. To facilitate component selec-  
tion discussions the circuit shown in Figure 2 below may be  
used as a reference. Unless otherwise indicated all formulas  
assume units of amps (A) for current, farads (F) for capaci-  
tance, henries (H) for inductance and volts (V) for voltages.  
30030709  
FIGURE 3. Switch and Inductor Current Waveforms  
If needed, slightly smaller value inductors can be used, how-  
ever, the peak inductor current, IOUT + ΔiL/2, should be kept  
below the peak current limit of the device. In general, the in-  
ductor ripple current, ΔiL, should be greater than 10% of the  
rated output current to provide adequate current sense infor-  
mation for the current mode control loop. If the ripple current  
in the inductor is too low, the control loop will not have suffi-  
cient current sense information and can be prone to instability.  
30030723  
FIGURE 2. Typical Application Circuit  
OUTPUT CAPACITOR SELECTION (COUT  
)
The first equation to calculate for any buck converter is duty-  
cycle. Ignoring conduction losses associated with the FETs  
and parasitic resistances it can be approximated by:  
The output capacitor, COUT, filters the inductor ripple current  
and provides a source of charge for transient load conditions.  
A wide range of output capacitors may be used with the  
LM20145 that provide excellent performance. The best per-  
formance is typically obtained using ceramic, SP, or OSCON  
type chemistries. Typical trade-offs are that the ceramic ca-  
pacitor provides extremely low ESR to reduce the output  
ripple voltage and noise spikes, while the SP and OSCON  
capacitors provide a large bulk capacitance in a small volume  
for transient loading conditions.  
INDUCTOR SELECTION (L)  
The inductor value is determined based on the operating fre-  
quency, load current, ripple current, and duty cycle.  
When selecting the value for the output capacitor the two per-  
formance characteristics to consider are the output voltage  
ripple and transient response. The output voltage ripple can  
be approximated by using the formula shown below.  
The inductor selected should have a saturation current rating  
greater than the peak current limit of the device. Keep in mind  
the specified current limit does not account for delay of the  
current limit comparator, therefore the current limit in the ap-  
plication may be higher than the specified value. To optimize  
the performance and prevent the device from entering current  
limit at maximum load, the inductance is typically selected  
such that the ripple current, ΔiL, is less than 30% of the rated  
output current. Figure 3, shown below illustrates the switch  
and inductor ripple current waveforms. Once the input volt-  
age, output voltage, operating frequency, and desired ripple  
current are known, the minimum value for the inductor can be  
calculated by the formula shown below:  
Where, ΔVOUT (V) is the amount of peak to peak voltage ripple  
at the power supply output, RESR (Ω) is the series resistance  
of the output capacitor, fSW(Hz) is the switching frequency,  
and COUT (F) is the output capacitance used in the design.  
The amount of output ripple that can be tolerated is applica-  
tion specific; however a general recommendation is to keep  
the output ripple less than 1% of the rated output voltage.  
Keep in mind ceramic capacitors are sometimes preferred  
because they have very low ESR; however, depending on  
package and voltage rating of the capacitor the value of the  
capacitance can drop significantly with applied voltage. The  
output capacitor selection will also affect the output voltage  
droop during a load transient. The peak droop on the output  
voltage during a load transient is dependent on many factors;  
however, an approximation of the transient droop ignoring  
loop bandwidth can be obtained using the following equation.  
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12  
Where, COUT (F) is the minimum required output capacitance,  
L (H) is the value of the inductor, VDROOP (V) is the output  
voltage drop ignoring loop bandwidth considerations, ΔIOUT-  
shown below can be used to calculate the value of RT for a  
given operating frequency.  
(A) is the load step change, RESR (Ω) is the output  
STEP  
capacitor ESR, VIN (V) is the input voltage, and VOUT (V) is  
the set regulator output voltage. Both the tolerance and volt-  
age coefficient of the capacitor needs to be examined when  
designing for a specific output ripple or transient drop target.  
Where, fSW is the switching frequency in kHz, and RT is the  
frequency adjust resistor in k. Please refer to the curve Os-  
cillator Frequency verses RT in the typical performance char-  
acteristics section If the RT resistor is omitted the device will  
not operate.  
INPUT CAPACITOR SELECTION (CIN)  
Good quality input capacitors are necessary to limit the ripple  
voltage at the VIN pin while supplying most of the switch cur-  
rent during the on-time. In general it is recommended to use  
a ceramic capacitor for the input as they provide both a low  
impedance and small footprint. One important note is to use  
a good dielectric for the ceramic capacitor such as X5R or  
X7R. These provide better over temperature performance  
and also minimize the DC voltage derating that occurs on Y5V  
capacitors. For most applications, a 22 µF, X5R, 6.3V input  
capacitor is sufficient; however, additional capacitance may  
be required if the connection to the input supply is far from the  
PVIN pins. The input capacitor should be placed as close as  
possible PVIN and PGND pins of the device.  
LOOP COMPENSATION (RC1, CC1  
)
The purpose of loop compensation is to meet static and dy-  
namic performance requirements while maintaining adequate  
stability. Optimal loop compensation depends on the output  
capacitor, inductor, load, and the device itself. Table 2 below  
gives values for the compensation network that will result in  
a stable system when using a 100 µF, 6.3V ceramic X5R out-  
put capacitor and 1 µH inductor.  
TABLE 2. Recommended Compensation for  
COUT = 100 µF, L = 2.5 µH & fSW = 250 kHz  
Non-ceramic input capacitors should be selected for RMS  
current rating and minimum ripple voltage. A good approxi-  
mation for the required ripple current rating is given by the  
relationship:  
VIN  
VOUT CC1 (nF)  
RC1 (kΩ)  
11  
5.00  
5.00  
5.00  
5.00  
5.00  
5.00  
3.30  
3.30  
3.30  
3.30  
3.30  
3.30  
2.50  
1.80  
1.50  
1.20  
0.80  
2.50  
1.80  
1.50  
1.20  
0.80  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
9.53  
6.98  
5.36  
4.87  
1.91  
10.5  
7.87  
5.62  
4.42  
2.26  
As indicated by the RMS ripple current equation, highest re-  
quirement for RMS current rating occurs at 50% duty cycle.  
For this case, the RMS ripple current rating of the input ca-  
pacitor should be greater than half the output current. For best  
performance, low ESR ceramic capacitors should be placed  
in parallel with higher capacitance capacitors to provide the  
best input filtering for the device.  
SETTING THE OUTPUT VOLTAGE (RFB1, RFB2  
)
The resistors RFB1 and RFB2 are selected to set the output  
voltage for the device. Table 1, shown below, provides sug-  
gestions for RFB1 and RFB2 for common output voltages.  
If the desired solution differs from the table above the loop  
transfer function should be analyzed to optimize the loop  
compensation. The overall loop transfer function is the prod-  
uct of the power stage and the feedback network transfer  
functions. For stability purposes, the objective is to have a  
loop gain slope that is -20db/decade from a very low frequen-  
cy to beyond the crossover frequency. Figure 4, shown below,  
shows the transfer functions for power stage, feedback/com-  
pensation network, and the resulting closed loop system for  
the LM20145.  
TABLE 1. Suggested Values for RFB1 and RFB2  
VOUT  
RFB1(kΩ) RFB2(kΩ)  
short  
4.99  
8.87  
12.7  
21.5  
31.6  
open  
10  
0.8  
1.2  
1.5  
1.8  
2.5  
3.3  
10.2  
10.2  
10.2  
10.2  
If different output voltages are required, RFB2 should be se-  
lected to be between 4.99 kto 49.9 kand RFB1 can be  
calculated using the equation below.  
ADJUSTING THE OPERATING FREQUENCY (RT)  
The operating frequency of the LM20145 can be adjusted by  
connecting a resistor from the RT pin to ground. The equation  
13  
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A higher crossover frequency can be obtained, usually at the  
expense of phase margin, by lowering the value of CC1 and  
recalculating the value of RC1. Likewise, increasing CC1 and  
recalculating RC1 will provide additional phase margin at a  
lower crossover frequency. As with any attempt to compen-  
sate the LM20145 the stability of the system should be verified  
for desired transient droop and settling time.  
If the output filter zero, FZ(FIL) approaches the crossover fre-  
quency (FC), an additional capacitor (CC2) should be placed  
at the COMP pin to ground. This capacitor adds a pole to  
cancel the output filter zero assuring the crossover frequency  
will occur before the double pole at fSW/2 degrades the phase  
margin. The output filter zero is set by the output capacitor  
value and ESR as shown in the equation below.  
If needed, the value for CC2 should be calculated using the  
equation shown below.  
30030713  
Where RESR is the output capacitor series resistance and  
RC1 is the calculated compensation resistance.  
FIGURE 4. LM20145 Loop Compensation  
The power stage transfer function is dictated by the modula-  
tor, output LC filter, and load; while the feedback transfer  
function is set by the feedback resistor ratio, error amp gain,  
and external compensation network.  
AVIN FILTERING COMPONENTS (CF and RF)  
To prevent high frequency noise spikes from disturbing the  
sensitive analog circuitry connected to the AVIN and AGND  
pins, a high frequency RC filter is required between PVIN and  
AVIN. These components are shown in Figure 2. as CF and  
RF. The required value for RF is 1. CF must be used. Rec-  
ommended value of CF is 1.0 µF. The filter capacitor, CF  
should be placed as close to the IC as possible with a direct  
connection from AVIN to AGND. A good quality X5R or X7R  
ceramic capacitor should be used for CF.  
To achieve a -20dB/decade slope, the error amplifier zero,  
located at fZ(EA), should positioned to cancel the output filter  
pole (fP(FIL)). An additional error amp pole, located at fP2(EA)  
,
can be added to cancel the output filter zero at fZ(FIL). Can-  
cellation of the output filter zero is recommended if larger  
value, non-ceramic output capacitors are used.  
Compensation of the LM20144 is achieved by adding an RC  
SUB-REGULATOR BYPASS CAPACITOR (CVCC  
)
network as shown in Figure 5 below.  
The capacitor at the VCC pin provides noise filtering and sta-  
bility for the internal sub-regulator. The recommended value  
of CVCC should be no smaller than 1 µF and no greater than  
10 µF. The capacitor should be a good quality ceramic X5R  
or X7R capacitor. In general, a 1 µF ceramic capacitor is rec-  
ommended for most applications.  
SETTING THE START UP TIME (CSS  
)
The addition of a capacitor connected from the SS pin to  
ground sets the time at which the output voltage will reach the  
final regulated value. Larger values for CSS will result in longer  
start up times. Table 3, shown below provides a list of soft  
start capacitors and the corresponding typical start up times.  
30030714  
FIGURE 5. Compensation Network for LM20145  
TABLE 3. Start Up Times for Different Soft-Start  
Capacitors  
A good starting value for CC1 for most applications is 4.7 nF.  
Once the value of CC1 is chosen the value of RC should be  
calculated using the equation below to cancel the output filter  
pole (FP(FIL)) as shown in Figure 4.  
Start Up Time (ms)  
CSS (nF)  
none  
33  
1
5
10  
15  
20  
68  
100  
120  
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14  
If different start up times are needed the equation shown be-  
low can be used to calculate the start up time.  
TRACKING AN EXTERNAL SUPPLY  
By using a properly chosen resistor divider network connect-  
ed to the SS/TRK pin, as shown in Figure 7, the output of the  
LM20145 can be configured to track an external voltage  
source to obtain a simultaneous or ratiometric start up.  
As shown above, the start up time is influenced by the value  
of the Soft-Start capacitor CSS(F) and the 5 µA Soft-Start pin  
current ISS(A). that may be found in the electrical character-  
istics table.  
While the Soft-Start capacitor can be sized to meet many start  
up requirements, there are limitations to its size. The Soft-  
Start time can never be faster than 1ms due to the internal  
default 1 ms start up time. When the device is enabled there  
is an approximate time interval of 50 µs when the Soft-Start  
capacitor will be discharged just prior to the Soft-Start ramp.  
If the enable pin is rapidly pulsed or the Soft-Start capacitor  
is large there may not be enough time for CSS to completely  
discharge resulting in start up times less than predicted. To  
aid in discharging of Soft-Start capacitor during long disable  
periods an external 1 Mresistor from SS/TRK to ground can  
be used without greatly affecting the start-up time.  
30030720  
FIGURE 7. Tracking an External Supply  
Since the Soft-Start charging current ISS is always present on  
the SS/TRK pin, the size of R2 should be less than 10 kto  
minimize the errors in the tracking output. Once a value for  
R2 is selected the value for R1 can be calculated using ap-  
propriate equation in Figure 8, to give the desired start up.  
Figure 8 shows two common start up sequences; the top  
waveform shows a simultaneous start up while the waveform  
at the bottom illustrates a ratiometric start up.  
USING PRECISION ENABLE AND POWER GOOD  
The precision enable (EN) and power good (PGOOD) pins of  
the LM20145 can be used to address many sequencing re-  
quirements. The turn-on of the LM20145 can be controlled  
with the precision enable pin by using two external resistors  
as shown in Figure 6.  
30030726  
FIGURE 6. Sequencing LM20145 with Precision Enable  
The value for resistor RB can be selected by the user to control  
the current through the divider. Typically this resistor will be  
selected to be between 10 kand 1 M. Once the value for  
RB is chosen the resistor RA can be solved using the equation  
below to set the desired turn-on voltage.  
30030721  
When designing for a specific turn-on threshold (VTO) the tol-  
erance on the input supply, enable threshold (VIH_EN), and  
external resistors needs to be considered to insure proper  
turn-on of the device.  
FIGURE 8. Common Start Up Sequences  
A simultaneous start up is preferred when powering most FP-  
GAs, DSPs, or other microprocessors. In these systems the  
higher voltage, VOUT1, usually powers the I/O, and the lower  
voltage, VOUT2, powers the core. A simultaneous start up pro-  
vides a more robust power up for these applications since it  
avoids turning on any parasitic conduction paths that may ex-  
ist between the core and the I/O pins of the processor..  
The LM20145 features an open drain power good (PGOOD)  
pin to sequence external supplies or loads and to provide fault  
detection. This pin requires an external resistor (RPG) to pull  
PGOOD high while when the output is within the PGOOD tol-  
erance window. Typical values for this resistor range from 10  
kto 100 kΩ.  
15  
www.national.com  
The second most common power on behavior is known as a  
ratiometric start up. This start up is preferred in applications  
where both supplies need to be at the final value at the same  
time.  
PCB LAYOUT CONSIDERATIONS  
PC board layout is an important part of DC-DC converter de-  
sign. Poor board layout can disrupt the performance of a DC-  
DC converter and surrounding circuitry by contributing to EMI,  
ground bounce, and resistive voltage loss in the traces. These  
can send erroneous signals to the DC-DC converter resulting  
in poor regulation or instability.  
Similar to the Soft-Start function, the fastest start up possible  
is 1ms regardless of the rise time of the tracking voltage.  
When using the track feature the final voltage seen by the SS/  
TRACK pin should exceed 1V to provide sufficient overdrive  
and transient immunity.  
Good layout can be implemented by following a few simple  
design rules.  
1. Minimize area of switched current loops. In a buck regulator  
there are two loops where currents are switched very fast. The  
first loop starts from the input capacitor, to the regulator VIN  
pin, to the regulator SW pin, to the inductor then out to the  
output capacitor and load. The second loop starts from the  
output capacitor ground, to the regulator PGND pins, to the  
inductor and then out to the load (see Figure 10). To minimize  
both loop areas the input capacitor should be placed as close  
as possible to the PVIN pin. Grounding for both the input and  
output capacitor should consist of a small localized top side  
plane that connects to PGND and the die attach pad (DAP).  
The inductor should be placed as close as possible to the SW  
pin and output capacitor.  
THERMAL CONSIDERATIONS  
The thermal characteristics of the LM20145 are specified us-  
ing the parameter θJA, which relates the junction temperature  
to the ambient temperature. Although the value of θJA is de-  
pendant on many variables, it still can be used to approximate  
the operating junction temperature of the device.  
To obtain an estimate of the device junction temperature, one  
may use the following relationship:  
TJ = PDθJA + TA  
and  
PD = PIN x (1 - Efficiency) - 1.1 x IOUT2 x DCR  
2. Minimize the copper area of the switch node. Since the  
LM20145 has the SW pins on opposite sides of the package  
it is recommended to via these pins down to the bottom or  
internal layer with 2 to 4 vias on each SW pin. The SW pins  
should be directly connected with a trace that runs across the  
bottom of the package. To minimize IR losses this trace  
should be no smaller that 50 mils wide, but no larger than 100  
mils wide to keep the copper area to a minimum. In general  
the SW pins should not be connected on the top layer since  
it could block the ground return path for the power ground.  
The inductor should be placed as close as possible to one of  
the SW pins to further minimize the copper area of the switch  
node.  
Where:  
TJ is the junction temperature in °C.  
PIN is the input power in Watts (PIN = VIN x IIN).  
θJA is the junction to ambient thermal resistance for the  
LM20145.  
TA is the ambient temperature in °C.  
IOUT is the output load current.  
DCR is the inductor series resistance.  
It is important to always keep the operating junction temper-  
ature (TJ) below 125°C for reliable operation. If the junction  
temperature exceeds 160°C the device will cycle in and out  
of thermal shutdown. If thermal shutdown occurs it is a sign  
of inadequate heatsinking or excessive power dissipation in  
the device.  
3. Have a single point ground for all device analog grounds  
located under the DAP. The ground connections for the com-  
pensation, feedback, and Soft-Start components should be  
connected together then routed to the AGND pin of the de-  
vice. The AGND pin should connect to PGND under the DAP.  
This prevents any switched or load currents from flowing in  
the analog ground plane. If not properly handled poor ground-  
ing can result in degraded load regulation or erratic switching  
behavior.  
Figure 9, shown below, provides a better approximation of the  
θJA for a given PCB copper area. The PCB heatsink area  
consists of 2oz. copper located on the bottom layer of the PCB  
directly under the eTSSOP exposed pad. The bottom copper  
area is connected to the eTSSOP exposed pad by means of  
a 4 x 4 array of 12 mil thermal vias.  
4. Minimize trace length to the FB pin. Since the feedback  
node can be high impedance the trace from the output resistor  
divider to FB pin should be as short as possible. This is most  
important when high value resistors are used to set the output  
voltage. The feedback trace should be routed away from the  
SW pin and inductor to avoid contaminating the feedback sig-  
nal with switch noise.  
5. Make input and output bus connections as wide as possi-  
ble. This reduces any voltage drops on the input or output of  
the converter and can improve efficiency. If voltage accuracy  
at the load is important make sure feedback voltage sense is  
made at the load. Doing so will correct for voltage drops at the  
load and provide the best output accuracy.  
6. Provide adequate device heatsinking. Use as many vias as  
is possible to connect the DAP to the power plane heatsink.  
For best results use a 4x4 via array with a minimum via di-  
ameter of 12 mils. See the Thermal Considerations section to  
insure enough copper heatsinking area is used to keep the  
junction temperature below 125°C.  
30030735  
FIGURE 9. Thermal Resistance vs PCB Area  
www.national.com  
16  
30030722  
FIGURE 10. Schematic of LM20145 Highlighting Layout Sensitive Nodes  
17  
www.national.com  
The compensation for these solutions were optimized to work  
over a wide range of input and output voltages; if a faster  
transient response is needed reduce the value of CC1 and  
calculate the new value for RC1 as outline in the design guide.  
Typical Application Circuits  
This section provides several application solutions with a bill  
of materials. All bill of materials reference the below figure.  
30030760  
FIGURE 11.  
Bill of Materials (VIN = 5V, VOUT = 3.3V, FSW = 300kHz, IOUTMAX = 5A)  
Designator  
U1  
Description  
Synchronous Buck Regulator  
100 µF, 1210, X5R, 6.3V  
330 µF, 6.3V  
Part Number  
LM20145  
Manufacturer  
National Semiconductor  
Murata  
Qty  
1
CIN  
GRM32ER60J107ME20  
6TPE330ML  
1
COUT  
L
Sanyo  
1
IHLP4040DZER2R2M01  
CRCW06031R0J-e3  
GRM188R71C104KA01  
GRM188R60J105KA01  
CRCW06034992F-e3  
VJ0603Y222KXXA  
VJ0603A101KXAA  
VJ0603Y333KXXA  
CRCW06032053F-e3  
CRCW06033162F-e3  
CRCW06031022F-e3  
Vishay  
1
2.2 µH, 8.2 mΩ  
1Ω, 0603  
RF  
Vishay-Dale  
Murata  
1
CF  
100 nF, 0603, X7R, 16V  
1
CVCC  
RC1  
1 µF, 0603, X5R, 6.3V  
Murata  
1
Vishay-Dale  
Vishay-Vitramon  
Vishay-Dale  
Vishay-Vitramon  
Vishay-Dale  
Vishay-Dale  
Vishay-Dale  
1
49.9 kΩ, 0603  
CC1  
2.2 nF, 0603, X7R, 25V  
100 pF, 0603, COG, 50V  
33 nF, 0603, X7R, 25V  
1
CC2  
1
CSS  
RT  
1
1
205 kΩ, 0603  
31.6 kΩ, 0603  
10.2 kΩ, 0603  
RFB1  
RFB2  
1
1
Bill of Materials (VIN = 3.3V to 5V, VOUT = 1.2V, FSW = 300kHz, IOUTMAX = 5A)  
Designator  
U1  
Description  
Synchronous Buck Regulator  
100 µF, 1210, X5R, 6.3V  
330 µF, 6.3V  
Part Number  
LM20145  
Manufacturer  
National Semiconductor  
Murata  
Qty  
1
CIN  
GRM32ER60J107ME20  
6TPE330ML  
1
COUT  
L
Sanyo  
1
IHLP4040DZER2R2M01  
CRCW06031R0J-e3  
GRM188R71C104KA01  
GRM188R60J105KA01  
CRCW06032002F-e3  
VJ0603Y332KXXA  
VJ0603A331AKXAA  
VJ0603Y333KXXA  
CRCW06032053F-e3  
Vishay  
1
2.2 µH, 8.2 mΩ  
1Ω, 0603  
RF  
Vishay-Dale  
Murata  
1
CF  
100 nF, 0603, X7R, 16V  
1
CVCC  
RC1  
CC1  
CC2  
CSS  
RT  
1 µF, 0603, X5R, 6.3V  
Murata  
1
Vishay-Dale  
Vishay-Vitramon  
Vishay-Dale  
Vishay-Vitramon  
Vishay-Dale  
1
20 kΩ, 0603  
3.3 nF, 0603, X7R, 25V  
330 pF, 0603, COG, 50V  
33 nF, 0603, X7R, 25V  
1
1
1
1
205 kΩ, 0603  
www.national.com  
18  
Designator  
RFB1  
Description  
4.99 kΩ, 0603  
10 kΩ, 0603  
Part Number  
Manufacturer  
Vishay-Dale  
Vishay-Dale  
Qty  
1
CRCW06034991F-e3  
CRCW06031002F-e3  
RFB2  
1
19  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
16-Lead eTSSOP Package  
NS Package Number MXA16A  
www.national.com  
20  
Notes  
21  
www.national.com  
Notes  
For more National Semiconductor product information and proven design tools, visit the following Web sites at:  
Products  
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Design Support  
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www.national.com/AU  
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Analog University  
App Notes  
Clock Conditioners  
Data Converters  
Displays  
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www.national.com/quality/green  
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Distributors  
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www.national.com/lvds  
Green Compliance  
Packaging  
Ethernet  
Interface  
Quality and Reliability www.national.com/quality  
LVDS  
Reference Designs  
Feedback  
www.national.com/refdesigns  
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Power Management  
Switching Regulators  
LDOs  
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LED Lighting  
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www.national.com/powerwise  
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Temperature Sensors  
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www.national.com/tempsensors  
www.national.com/wireless  
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配单直通车
LM20145MH产品参数
型号:LM20145MH
是否Rohs认证: 不符合
生命周期:Transferred
IHS 制造商:NATIONAL SEMICONDUCTOR CORP
包装说明:TSSOP-16
Reach Compliance Code:not_compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.15
模拟集成电路 - 其他类型:SWITCHING REGULATOR
控制模式:CURRENT-MODE
控制技术:PULSE WIDTH MODULATION
最大输入电压:5.5 V
最小输入电压:2.95 V
标称输入电压:5 V
JESD-30 代码:R-PDSO-G16
JESD-609代码:e0
长度:5 mm
湿度敏感等级:1
功能数量:1
端子数量:16
最高工作温度:125 °C
最低工作温度:-40 °C
最大输出电流:8.1 A
封装主体材料:PLASTIC/EPOXY
封装代码:HSSOP
封装等效代码:TSSOP16,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
峰值回流温度(摄氏度):260
认证状态:Not Qualified
子类别:Switching Regulator or Controllers
表面贴装:YES
切换器配置:BUCK
最大切换频率:825 kHz
温度等级:AUTOMOTIVE
端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:40
宽度:4.4 mm
Base Number Matches:1
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