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  • LM2941CSX/NOPB图
  • 深圳市广百利电子有限公司

     该会员已使用本站6年以上
  • LM2941CSX/NOPB 现货库存
  • 数量18500 
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  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • LM2941CSX/NOPB 现货库存
  • 数量500 
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  • 深圳市正信鑫科技有限公司

     该会员已使用本站12年以上
  • LM2941CSX/NOPB 现货库存
  • 数量7000 
  • 厂家NS 
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  • LM2941CSX图
  • 深圳市拓森弘电子有限公司

     该会员已使用本站1年以上
  • LM2941CSX
  • 数量5300 
  • 厂家TI(德州仪器) 
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  • 深圳市科雨电子有限公司

     该会员已使用本站8年以上
  • LM2941CSX
  • 数量1001 
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  • LM2941CSX/NOPB图
  • 深圳市正纳电子有限公司

     该会员已使用本站2年以上
  • LM2941CSX/NOPB
  • 数量24780 
  • 厂家TI(德州仪器) 
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  • LM2941CSX图
  • 上海振基实业有限公司

     该会员已使用本站13年以上
  • LM2941CSX
  • 数量998 
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  • LM2941CSX图
  • 上海磐岳电子有限公司

     该会员已使用本站11年以上
  • LM2941CSX
  • 数量5800 
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  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • LM2941CSX/NOPB
  • 数量7068 
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  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • LM2941CSX
  • 数量15 
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  • 深圳市华科泰电子商行

     该会员已使用本站13年以上
  • LM2941CSX
  • 数量840000 
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  • 深圳市集创讯科技有限公司

     该会员已使用本站5年以上
  • LM2941CSX/NOPB
  • 数量12500 
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  • 北京中其伟业科技有限公司

     该会员已使用本站16年以上
  • LM2941CSX NOPB
  • 数量1000 
  • 厂家National Semiconductor 
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  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
  • LM2941CSX
  • 数量6709 
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  • 深圳市宏诺德电子科技有限公司

     该会员已使用本站8年以上
  • LM2941CSX
  • 数量68000 
  • 厂家NS 
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  • 北京首天国际有限公司

     该会员已使用本站16年以上
  • LM2941CSXNOPB
  • 数量2600 
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  • 封装 
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  • 深圳市誉兴微科技有限公司

     该会员已使用本站4年以上
  • LM2941CSX/NOPB
  • 数量12600 
  • 厂家TI/德州仪器 
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  • LM2941CSX图
  • 深圳市硅诺电子科技有限公司

     该会员已使用本站8年以上
  • LM2941CSX
  • 数量39059 
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  • 批号17+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
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  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • LM2941CSX/NOPB
  • 数量5000 
  • 厂家Texas Instruments 
  • 封装DDPAK/TO-263-5 
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  • 深圳市西源信息科技有限公司

     该会员已使用本站9年以上
  • LM2941CSX/NOPB
  • 数量8800 
  • 厂家TI/德州仪器 
  • 封装TO-263 
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  • 深圳市和诚半导体有限公司

     该会员已使用本站11年以上
  • LM2941CSX/NOPB
  • 数量5600 
  • 厂家TI 
  • 封装TO-263 
  • 批号23+ 
  • 100%深圳原装现货库存
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  • LM2941CSX图
  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • LM2941CSX
  • 数量5000 
  • 厂家National Semiconductor (TI) 
  • 封装贴/插片 
  • 批号16+ 
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  • 北京中其伟业科技有限公司

     该会员已使用本站16年以上
  • LM2941CSX-LF
  • 数量18 
  • 厂家MIS 
  • 封装 
  • 批号16+ 
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  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • LM2941CSX/NOPB
  • 数量5000 
  • 厂家Texas Instruments 
  • 封装DDPAK/TO-263-5 
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
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  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • LM2941CSX/NOPB
  • 数量5000 
  • 厂家NS 
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  • LM2941CSX图
  • 万三科技(深圳)有限公司

     该会员已使用本站2年以上
  • LM2941CSX
  • 数量660000 
  • 厂家Texas Instruments 
  • 封装原厂原装 
  • 批号23+ 
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  • 深圳市瑞天芯科技有限公司

     该会员已使用本站7年以上
  • LM2941CSX
  • 数量20000 
  • 厂家TI 
  • 封装TO-263-5 
  • 批号22+ 
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  • LM2941CSX图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • LM2941CSX
  • 数量85000 
  • 厂家TI/德州仪器 
  • 封装TO-263-5 
  • 批号23+ 
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  • 深圳市旺能芯科技有限公司

     该会员已使用本站4年以上
  • LM2941CSX
  • 数量15000 
  • 厂家TI/德州仪器 
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  • 深圳市恒意创鑫电子有限公司

     该会员已使用本站10年以上
  • LM2941CSX/NOPB
  • 数量9000 
  • 厂家TI/德州仪器 
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  • 深圳市一线半导体有限公司

     该会员已使用本站11年以上
  • LM2941CSX
  • 数量45000 
  • 厂家Texas Instruments 
  • 封装 
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  • 深圳市英德州科技有限公司

     该会员已使用本站2年以上
  • LM2941CSX
  • 数量55000 
  • 厂家TI(德州仪器) 
  • 封装 
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  • 深圳市创思克科技有限公司

     该会员已使用本站2年以上
  • LM2941CSX
  • 数量7800 
  • 厂家NS/国半 
  • 封装TO263 
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  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • LM2941CSX/NOPB
  • 数量500 
  • 厂家TI 
  • 封装DDPAK/TO-263 (KTT) 
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  • 北京耐芯威科技有限公司

     该会员已使用本站12年以上
  • LM2941CSX/NOPB
  • 数量5000 
  • 厂家Texas Instruments 
  • 封装DDPAK/TO-263-5 
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  • 上海意淼电子科技有限公司

     该会员已使用本站14年以上
  • LM2941CSX
  • 数量20000 
  • 厂家NS 
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     该会员已使用本站13年以上
  • LM2941CSX/NOPB
  • 数量5000 
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     该会员已使用本站10年以上
  • LM2941CSX/NOPB
  • 数量13062 
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  • 深圳市西源信息科技有限公司

     该会员已使用本站9年以上
  • LM2941CSX/NOPB
  • 数量8800 
  • 厂家TI 
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产品型号LM2941CSX的概述

LM2941CSX简介 LM2941CSX是一款高性能的线性稳压器,它的设计理念是提供稳定的输出电压,以满足各种电子设备的需求。这款芯片具有低压差、高电流输出能力以及良好的瞬态响应性能,适用于各种应用,包括但不限于电源管理、高保真音频设备、通信设备及其他需要稳定电压的电子系统。 LM2941CSX的主输出电压为5V,最大输出电流为1A,适用于绝大多数商业和工业应用。与其他稳压器相比,LM2941CSX在输入电压范围内具有相对较低的压降,这使得其在采用电池供电设备中的使用特别便利。此外,芯片内部集成了热关断和过流保护功能,大大提高了其在意外情况下的安全性。 LM2941CSX的详细参数 1. 输入电压范围:4.75V 至 26V 2. 输出电压:5V(固定) 3. 输出电流:最大 1A 4. 静态电流:约 5 mA 5. 压差:最大 0.5V(1A 时) 6. 纹波抑制比(PSRR):典...

产品型号LM2941CSX的Datasheet PDF文件预览

LM2941, LM2941C  
www.ti.com  
SNVS770G JUNE 1999REVISED APRIL 2013  
LM2941/LM2941C 1A Low Dropout Adjustable Regulator  
Check for Samples: LM2941, LM2941C  
1
FEATURES  
DESCRIPTION  
The LM2941 positive voltage regulator features the  
ability to source 1A of output current with a typical  
dropout voltage of 0.5V and a maximum of 1V over  
2
WSON Space Saving Package  
Output Voltage Adjustable From 5V to 20V  
Dropout Voltage Typically 0.5V @ IO = 1A  
Output Current in Excess of 1A  
Trimmed Reference Voltage  
the entire temperature range. Furthermore,  
a
quiescent current reduction circuit has been included  
which reduces the ground pin current when the  
differential between the input voltage and the output  
voltage exceeds approximately 3V. The quiescent  
current with 1A of output current and an input-output  
differential of 5V is therefore only 30mA. Higher  
quiescent currents only exist when the regulator is in  
the dropout mode (VIN VOUT 3V).  
Reverse Battery Protection  
Internal Short Circuit Current Limit  
Mirror Image Insertion Protection  
P+ Product Enhancement Tested  
TTL, CMOS Compatible ON/OFF Switch  
Designed also for vehicular applications, the LM2941  
and all regulated circuitry are protected from reverse  
battery installations or two-battery jumps. During line  
transients, such as load dump when the input voltage  
can momentarily exceed the specified maximum  
operating voltage, the regulator will automatically shut  
down to protect both the internal circuits and the load.  
Familiar regulator features such as short circuit and  
thermal overload protection are also provided.  
Connection Diagrams  
TO-220 Plastic Package  
8-Lead WSON Surface Mount Package  
ADJ  
ON/OFF  
1
2
3
4
8
7
6
5
GND  
GND  
INPUT  
N/C  
GND*  
N/C  
Figure 1. Top View  
See Package Number KC  
OUTPUT  
TO-263 Surface-Mount Package  
* TIE TO GND OR LEAVE FLOATING  
Figure 3. Top View  
See Package Number NGN  
Figure 2. See Package Number KTT  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)  
LM2941T, LM2941S, LM2941LD  
LM2941CT, LM2941CS  
60V  
45V  
Input Voltage (Survival Voltage, 100ms)  
(3)  
Internal Power Dissipation  
Internally Limited  
150°C  
Maximum Junction Temperature  
Storage Temperature Range  
65°C TJ +150°C  
260°C, 10s  
235°C, 30s  
235°C, 30s  
±2 kV  
TO-220 (T), Wave  
TO-263 (S)  
Soldering Temperature(4)  
WSON-8 (LD)  
(5)  
ESD Rating  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for  
which the device is intended to be functional, but device parameter specifications may not be ensured under these conditions. For  
ensured specifications and test conditions, see the Electrical Characteristics.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient  
temperature is PD = (TJ(max) TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go  
into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area  
thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is  
37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Thermal performance for the WSON package was obtained  
using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θJA for the WSON package is  
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance  
and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that  
6 vias be placed under the center pad to improve thermal performance.  
(4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the  
temperature and time are for Sn-Pb (STD) only.  
(5) The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5kresistor into each pin. Test method is per  
JESD22–A114.  
Operating Ratings  
Maximum Input Voltage  
26V  
40°C TJ 125°C  
0°C TJ 125°C  
40°C TJ 125°C  
0°C TJ 125°C  
40°C TJ 125°C  
LM2941T  
LM2941CT  
LM2941S  
LM2941CS  
LM2941LD  
Temperature Range  
Electrical Characteristics—LM2941T, LM2941S, LM2941LD  
5V VO 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C,  
while those in boldface type apply over the full Operating Temperature Range.  
LM2941T  
LM2941S  
LM2941LD  
Limit  
Units  
(Limits)  
Parameter  
Conditions  
Typ  
1.237/1.211  
1.313/1.339  
10/10  
V(min)  
V(max)  
(1)  
Reference Voltage  
5mA IO 1A  
1.275  
Line Regulation  
Load Regulation  
VO + 2V VIN 26V, IO = 5mA  
50mA IO 1A  
4
7
mV/V(max)  
mV/V(max)  
10/10  
100 mADC and 20 mArms  
fO = 120Hz  
Output Impedance  
Quiescent Current  
7
mΩ/V  
VO + 2V VIN < 26V, IO = 5mA  
10  
30  
15/20  
45/60  
mA(max)  
mA(max)  
VIN = VO + 5V, IO = 1A  
(1) The output voltage range is 5V to 20V and is determined by the two external resistors, R1 and R2. See Typical Application Circuit.  
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Electrical Characteristics—LM2941T, LM2941S, LM2941LD (continued)  
5V VO 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C,  
while those in boldface type apply over the full Operating Temperature Range.  
LM2941T  
LM2941S  
LM2941LD  
Limit  
Units  
(Limits)  
Parameter  
Conditions  
Typ  
10Hz–100kHz  
IO = 5mA  
RMS Output Noise, % of VOUT  
0.003  
%
Ripple Rejection  
fO = 120Hz, 1 Vrms, IL = 100mA  
0.005  
0.4  
0.02/0.04  
%/V(max)  
%/1000 Hr  
V(max)  
Long Term Stability  
IO = 1A  
0.5  
0.8/1.0  
200/200  
1.6  
Dropout Voltage  
IO = 100mA  
VIN Max = 26V(2)  
110  
1.9  
mV(max)  
A(min)  
Short Circuit Current  
Maximum Line Transient  
VO Max 1V Above Nominal VO  
RO = 100, t 100ms  
75  
31  
60/60  
26/26  
V(min)  
VDC  
Maximum Operational Input Voltage  
Reverse Polarity  
DC Input Voltage  
RO = 100, VO ≥ −0.6V  
t 100ms, RO = 100Ω  
30  
15/15  
V(min)  
Reverse Polarity  
Transient Input Voltage  
75  
1.30  
1.30  
50  
50/50  
0.80/0.80  
2.00/2.00  
100/300  
V(min)  
V(max)  
V(min)  
ON/OFF Threshold  
Voltage ON  
I
O 1A  
O 1A  
ON/OFF Threshold  
Voltage OFF  
I
ON/OFF Threshold  
Current  
VON/OFF = 2.0V, IO 1A  
μA(max)  
(2) Output current capability will decrease with increasing temperature, but will not go below 1A at the maximum specified temperatures.  
Electrical Characteristics—LM2941CT, LM2941CS  
5V VO 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C,  
while those in boldface type apply over the full Operating Temperature Range.  
Limit  
(1)  
Units  
(Limits)  
V(min)  
Parameter  
Conditions  
Typ  
1.237/1.211  
(2)  
Reference Voltage  
5mA IO 1A  
1.275  
1.313/1.339  
V(max)  
Line Regulation  
Load Regulation  
VO + 2V VIN 26V, IO = 5mA  
50mA IO 1A  
4
7
10  
10  
mV/V(max)  
mV/V(max)  
100 mADC and 20 mArms  
fO = 120Hz  
Output Impedance  
Quiescent Current  
7
mΩ/V  
VO + 2V VIN < 26V, IO = 5mA  
10  
30  
15  
mA(max)  
mA(max)  
VIN = VO + 5V, IO = 1A  
45/60  
RMS Output Noise,  
% of VOUT  
10Hz–100kHz  
IO = 5mA  
0.003  
%
Ripple Rejection  
fO = 120Hz, 1 Vrms, IL = 100mA  
0.005  
0.4  
0.02  
%/V(max)  
%/1000 Hr  
V(max)  
Long Term Stability  
IO = 1A  
0.5  
0.8/1.0  
200/200  
1.6  
Dropout Voltage  
IO = 100mA  
110  
1.9  
mV(max)  
A(min)  
(3)  
Short Circuit Current  
VIN Max = 26V  
(1) All limits specified at room temperature (standard typeface) and at temperature extremes (boldface type). All room temperature limits are  
100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC)  
methods.  
(2) The output voltage range is 5V to 20V and is determined by the two external resistors, R1 and R2. See Typical Application Circuit.  
(3) Output current capability will decrease with increasing temperature, but will not go below 1A at the maximum specified temperatures.  
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Electrical Characteristics—LM2941CT, LM2941CS (continued)  
5V VO 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C,  
while those in boldface type apply over the full Operating Temperature Range.  
Limit  
(1)  
Units  
Parameter  
Conditions  
Typ  
(Limits)  
Maximum Line  
Transient  
VO Max 1V Above Nominal VO  
RO = 100Ω, T 100ms  
55  
31  
45  
26  
V(min)  
VDC  
Maximum Operational  
Input Voltage  
Reverse Polarity  
DC Input Voltage  
RO = 100Ω, VO ≥ −0.6V  
T 100ms, RO = 100Ω  
30  
55  
1.30  
1.30  
50  
15  
45  
0.80  
2.00  
100  
V(min)  
V(min)  
V(max)  
V(min)  
μA(max)  
Reverse Polarity  
Transient Input Voltage  
ON/OFF Threshold  
Voltage ON  
I
O 1A  
O 1A  
ON/OFF Threshold  
Voltage OFF  
I
ON/OFF Threshold  
Current  
VON/OFF = 2.0V, IO 1A  
Thermal Performance  
Thermal Resistance  
Junction-to-Case, θJC  
5-Lead TO-220  
1
1
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
5-Lead TO-263  
8-Lead WSON  
5.3  
53  
73  
35  
Thermal Resistance  
Junction-to-Ambient, θJA  
5-Lead TO-220  
(1)  
5-Lead TO-263 (See TO-263 Mounting)  
8-Lead WSON (See WSON Mounting)  
(1) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient  
temperature is PD = (TJ(max) TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go  
into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area  
thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is  
37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Thermal performance for the WSON package was obtained  
using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θJA for the WSON package is  
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance  
and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that  
6 vias be placed under the center pad to improve thermal performance.  
4
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Typical Performance Characteristics  
Dropout Voltage  
Dropout Voltage vs. Temperature  
Figure 4.  
Figure 5.  
Output Voltage  
Quiescent Current vs. Temperature  
Figure .  
Figure 6.  
Quiescent Current  
Quiescent Current  
Figure 7.  
Figure 8.  
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Typical Performance Characteristics (continued)  
Line Transient Response  
Load Transient Response  
Figure 9.  
Figure 10.  
Ripple Rejection  
Output Impedance  
Figure 11.  
Figure 12.  
Low Voltage Behavior  
Low Voltage Behavior  
Figure 13.  
Figure 14.  
6
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Typical Performance Characteristics (continued)  
Output Capacitor ESR  
Output at Voltage Extremes  
Figure 15.  
Figure 16.  
Output at Voltage Extremes  
Peak Output Current  
Figure 17.  
Figure 18.  
Maximum Power Dissipation (TO-220)  
Maximum Power Dissipation (TO-263)  
Figure 19.  
Figure 20.  
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Definition of Terms  
Dropout Voltage: The input-voltage differential at which the circuit ceases to regulate against further reduction  
in input voltage. Measured when the output voltage has dropped 100mV from the nominal value obtained at  
(VOUT + 5V) input, dropout voltage is dependent upon load current and junction temperature.  
Input Voltage: The DC voltage applied to the input terminals with respect to ground.  
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated  
output voltage for which the regulator will operate.  
Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made  
under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not  
significantly affected.  
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.  
Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with  
maximum rated voltage and junction temperature.  
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over  
a specified frequency range.  
Quiescent Current: That part of the positive input current that does not contribute to the positive load current.  
The regulator ground lead current.  
Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage.  
Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room  
temperature to either temperature extreme.  
APPLICATION HINTS  
Output Capacitor  
A Tantalum capacitor with a minimum capacitance value of 22 μF, and ESR in the range of 0.01to 5, is  
required at the output pin for loop stability. It must be located less than 1 cm from the device. There is no  
limitation on any additional capacitance.  
Alternately, a high quality X5R/X7R 22 μF ceramic capacitor may be used for the output capacitor only if an  
appropriate value of series resistance is added to simulate the ESR requirement. The ceramic capacitor selection  
must include an appropriate voltage de-rating of the capacitance value due to the applied output voltage. The  
series resistor (for ESR simulation) should be in the range of 0.1to 1.0.  
Setting the Output Voltage  
The output voltage range is 5V to 20V and is set by the two external resistors, R1 and R2. See the Typical  
Applications. The output voltage is given by the formula:  
VOUT = VREF x ((R1+R2) / R1)  
(1)  
where VREF is typically 1.275V.  
Using 1.00 kfor R1 will ensure that the bias current error of the adjust pin will be negligible. Using a R1 value  
higher than 10 kmay cause the output voltage to shift across temperature due to variations in the adjust pin  
bias current.  
Calculating the upper resistor (R2) value of the pair when the lower resistor (R1) value is known is accomplished  
with the following formula:  
R2 = R1 x ((VOUT / VREF) - 1)  
(2)  
The resistors used for R1 and R2 should be high quality, tight tolerance, and with matching temperature  
coefficients. It is important to remember that, although the value of VREF is ensured, the final value of VOUT is not.  
The use of low quality resistors for R1 and R2 can easily produce a VOUT value that is unacceptable.  
8
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ON/OFF  
The ON/OFF pin has no internal pull-up or pull-down to establish a default condition and, as a result, this pin  
must be terminated externally, either actively or passively.  
The ON/OFF pin requires a low level to enable the output, and a high level to disable the output. To ensure  
reliable operation, the ON/OFF pin voltage must rise above the maximum ON/OFF(OFF) voltage threshold (2.00V)  
to disable the output, and must fall below the minimum ON/OFF(ON) voltage threshold (0.80V) to enable the  
output. If the ON/OFF function is not needed this pin can be connected directly to Ground.  
If the ON/OFF pin is being pulled to a high state through a series resistor, an allowance must be made for the  
ON/OFF pin current that will cause a voltage drop across the pull-up resistor.  
Thermal Overload Protection  
The LM2941 incorporates a linear form of thermal protection that limits the junction temperature (TJ) to typically  
155°C.  
Should the LM2941 see a fault condition that results in excessive power dissipation and the junction temperature  
approaches 155°C, the device will respond by reducing the output current (which reduces the power dissipation)  
to hold the junction temperature at 155°C.  
Thermal Overload protection is not an ensured operating condition. Operating at, or near to, the Thermal  
Overload condition for any extended period of time is not encouraged, or recommended, as this may shorten the  
lifetime of the device.  
Power Dissipation  
Consideration should be given to the maximum power dissipation (PD(MAX)) which is limited by the maximum  
operating junction temperature (TJ(MAX)) of 125°C, the maximum operating ambient temperature (TA(MAX)) of the  
application, and the thermal resistance (θJA) of the package. Under all possible conditions, the junction  
temperature (TJ) must be within the range specified in the Operating Ratings. The total power dissipation of the  
device is given by:  
PD = ( (VIN VOUT) x IOUT) + (VIN x IGND  
)
(3)  
where IGND is the operating ground pin current of the device (specified under Electrical Characteristics).  
The maximum allowable junction temperature rise (ΔTJ) depends on the maximum expected ambient  
temperature (TA(MAX)) of the application, and the maximum allowable junction temperature (TJ(MAX)):  
ΔTJ = TJ(MAX) TA(MAX)  
(4)  
The maximum allowable value for junction to ambient Thermal Resistance, θJA, required to keep the junction  
temperature, TJ, from exceeding maximum allowed can be calculated using the formula:  
θJA = ΔTJ / PD(MAX)  
(5)  
The maximum allowable power dissipation, PD(MAX), required allowed for a specific ambient temperature can be  
calculated using the formula:  
PD(MAX) = ΔTJ / θJA  
(6)  
Additional information for thermal performance of surface mount packages can be found in AN-1520: A Guide to  
Board Layout for Best Thermal Resistance for Exposed Packages (literature number SNVA183), AN-1187:  
Leadless Leadframe Package (LLP) (literature number SNOA401), and AN-2020: Thermal Design By Insight, Not  
Hindsight (literature number SNVA419).  
TO-263 Mounting  
The thermal dissipation of the TO-263 package is directly related to the printed circuit board construction and the  
amount of additional copper area connected to the TAB.  
The TAB on the bottom of the TO-263 package is connected to the die substrate via a conductive die attach  
adhesive, and to device pin 3. As such, it is strongly recommend that the TAB area be connected to copper area  
directly under the TAB that is extended into the ground plane via multiple thermal vias. Alternately, but not  
recommended, the TAB may be left floating (i.e. no direct electrical connection). The TAB must not be connected  
to any potential other than ground.  
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For the LM2941S in the KTT TO-263 package, the junction-to-case thermal rating, θJC, is 1°C/W, where the  
CASE is defined as the bottom of the package at the center of the TAB area. The junction-to-ambient thermal  
performance for the LM2941S in the TO-263 package, using the JEDEC JESD51 standards is summarized in the  
following table:  
Board  
Type  
Thermal  
Vias  
θJC  
θJA  
JEDEC  
2-Layer  
None  
1°C/W  
73°C/W  
JESD 51-3  
1
2
4
8
1°C/W  
1°C/W  
1°C/W  
1°C/W  
35°C/W  
30°C/W  
26°C/W  
24°C/W  
JEDEC  
4-Layer  
JESD 51-7  
6
5
4
3
2
1
0
= 35°C/W  
JA  
JA  
= 30°C/W  
= 26°C/W  
JA  
= 24°C/W  
JA  
LM2941S (TO-263)  
0
20  
40  
60  
80  
100  
AMBIENT TEMPERATURE (°C)  
Figure 21. PD(MAX) vs TA for LM2941S (TO-263)  
WSON Mounting  
The NGN (Pullback) 8-Lead WSON package requires specific mounting techniques which are detailed in  
Application Note 1187 (literature number SNOA401). Referring to the section PCB Design Recommendations  
in AN-1187 (Page 5), it should be noted that the pad style which should be used with the WSON package is the  
NSMD (non-solder mask defined) type.  
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the  
amount of additional copper area connected to the DAP.  
The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate via a conductive  
die attach adhesive, and to device pin 2 and pin 7. As such, it is strongly recommend that the DAP area be  
connected copper area directly under the DAP that is extended into the ground plane via multiple thermal vias.  
Alternately, but not recommended, the DAP area may be left floating (i.e. no direct electrical connection). The  
DAP area must not be connected to any potential other than ground.  
10  
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For the LM2941LD in the NGN 8-Lead WSON package, the junction-to-case thermal rating, θJC, is 5.3°C/W,  
where the CASE is defined as the bottom of the package at the center of the DAP area. The junction-to-ambient  
thermal performance for the LM2941LD in the NGN 8-Lead WSON package, using the JEDEC JESD51  
standards is summarized in the following table:  
Board  
Type  
Thermal  
Vias  
θJC  
θJA  
JEDEC  
2-Layer  
None  
5.3°C/W  
181°C/W  
JESD 51-3  
1
2
4
6
5.3°C/W  
5.3°C/W  
5.3°C/W  
5.3°C/W  
58°C/W  
49°C/W  
40°C/W  
35°C/W  
JEDEC  
4-Layer  
JESD 51-7  
6
5
4
3
2
1
0
= 58°C/W  
JA  
= 49°C/W  
JA  
= 40°C/W  
JA  
= 35°C/W  
JA  
LM2941LD (LLP)  
20 40  
0
60  
80  
100  
AMBIENT TEMPERATURE (°C)  
Figure 22. PD(MAX) vs TA for LM2941LD (WSON)  
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Typical Applications  
Note: Using 1k for R1 will ensure that the bias current error from the adjust pin will be negligible. Do not bypass R1 or  
R2. This will lead to instabilities.  
* Required if regulator is located far from power supply filter.  
** COUT must be at least 22μF to maintain stability. May be increased without bound to maintain regulation during  
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating  
temperature range as the regulator and the ESR is critical; see curve.  
Figure 23. 5V to 20V Adjustable Regulator  
*** To assure shutdown, select Resistor R3 to ensure at least 300μA of pull-up current when S1 is open. (Assume 2V  
at the ON/OFF pin.)  
Figure 24. 1A Switch  
12  
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM2941 LM2941C  
LM2941, LM2941C  
www.ti.com  
SNVS770G JUNE 1999REVISED APRIL 2013  
Equivalent Schematic Diagram  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Links: LM2941 LM2941C  
 
LM2941, LM2941C  
SNVS770G JUNE 1999REVISED APRIL 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision F (April 2013) to Revision G  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 13  
14  
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM2941 LM2941C  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
LM2941CS  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
DDPAK/  
TO-263  
KTT  
5
5
5
5
5
5
5
5
5
45  
TBD  
Call TI  
CU SN  
Call TI  
CU SN  
Call TI  
Call TI  
CU SN  
CU SN  
CU SN  
Call TI  
Level-3-245C-168 HR  
Call TI  
LM2941CS  
P+  
LM2941CS/NOPB  
LM2941CSX  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DDPAK/  
TO-263  
KTT  
KTT  
KTT  
KC  
45  
500  
500  
45  
Pb-Free (RoHS  
Exempt)  
0 to 125  
LM2941CS  
P+  
DDPAK/  
TO-263  
TBD  
0 to 125  
LM2941CS  
P+  
LM2941CSX/NOPB  
LM2941CT  
DDPAK/  
TO-263  
Pb-Free (RoHS  
Exempt)  
Level-3-245C-168 HR  
Call TI  
0 to 125  
LM2941CS  
P+  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
TBD  
0 to 125  
LM2941CT  
P+  
LM2941CT/LB03  
LM2941CT/LF03  
LM2941CT/LF04  
LM2941CT/NOPB  
NDH  
NDH  
NEB  
KC  
45  
TBD  
Call TI  
LM2941CT  
P+  
45  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
LM2941CT  
P+  
45  
Green (RoHS  
& no Sb/Br)  
LM2941CT  
P+  
45  
Green (RoHS  
& no Sb/Br)  
0 to 125  
LM2941CT  
P+  
LM2941LD  
ACTIVE  
ACTIVE  
WSON  
WSON  
NGN  
NGN  
8
8
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L2941LD  
LM2941LD/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
L2941LD  
LM2941LDX  
ACTIVE  
ACTIVE  
WSON  
WSON  
NGN  
NGN  
8
8
4500  
4500  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L2941LD  
L2941LD  
LM2941LDX/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
LM2941S  
LM2941S/NOPB  
LM2941SX  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DDPAK/  
TO-263  
KTT  
KTT  
KTT  
KTT  
5
5
5
5
45  
45  
TBD  
Call TI  
CU SN  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
LM2941S  
P+  
DDPAK/  
TO-263  
Pb-Free (RoHS  
Exempt)  
Level-3-245C-168 HR  
Call TI  
LM2941S  
P+  
DDPAK/  
TO-263  
500  
500  
TBD  
LM2941S  
P+  
LM2941SX/NOPB  
DDPAK/  
TO-263  
Pb-Free (RoHS  
Exempt)  
Level-3-245C-168 HR  
LM2941S  
P+  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
LM2941T  
ACTIVE  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
KC  
5
5
5
5
5
5
45  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
CU SN  
CU SN  
Call TI  
-40 to 125  
LM2941T  
P+  
LM2941T/LB03  
LM2941T/LB04  
LM2941T/LB08  
LM2941T/LF03  
LM2941T/NOPB  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
NDH  
NEB  
NEC  
NDH  
KC  
45  
45  
45  
45  
45  
Call TI  
LM2941T  
P+  
Call TI  
LM2941T  
P+  
Call TI  
LM2941T  
P+  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
LM2941T  
P+  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
LM2941T  
P+  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Apr-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM2941CSX  
DDPAK/  
TO-263  
KTT  
KTT  
5
5
500  
500  
330.0  
24.4  
10.75 14.85  
5.0  
16.0  
24.0  
Q2  
LM2941CSX/NOPB  
DDPAK/  
TO-263  
330.0  
24.4  
10.75 14.85  
5.0  
16.0  
24.0  
Q2  
LM2941LD  
LM2941LD/NOPB  
LM2941LDX  
WSON  
WSON  
WSON  
WSON  
NGN  
NGN  
NGN  
NGN  
KTT  
8
8
8
8
5
1000  
1000  
4500  
4500  
500  
178.0  
178.0  
330.0  
330.0  
330.0  
12.4  
12.4  
12.4  
12.4  
24.4  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
1.3  
1.3  
1.3  
1.3  
5.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
24.0  
Q1  
Q1  
Q1  
Q1  
Q2  
8.0  
LM2941LDX/NOPB  
LM2941SX  
8.0  
DDPAK/  
TO-263  
10.75 14.85  
16.0  
LM2941SX/NOPB  
DDPAK/  
TO-263  
KTT  
5
500  
330.0  
24.4  
10.75 14.85  
5.0  
16.0  
24.0  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Apr-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM2941CSX  
LM2941CSX/NOPB  
LM2941LD  
DDPAK/TO-263  
DDPAK/TO-263  
WSON  
KTT  
KTT  
NGN  
NGN  
NGN  
NGN  
KTT  
KTT  
5
5
8
8
8
8
5
5
500  
500  
367.0  
367.0  
210.0  
213.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
185.0  
191.0  
367.0  
367.0  
367.0  
367.0  
45.0  
45.0  
35.0  
55.0  
35.0  
35.0  
45.0  
45.0  
1000  
1000  
4500  
4500  
500  
LM2941LD/NOPB  
LM2941LDX  
WSON  
WSON  
LM2941LDX/NOPB  
LM2941SX  
WSON  
DDPAK/TO-263  
DDPAK/TO-263  
LM2941SX/NOPB  
500  
Pack Materials-Page 2  
MECHANICAL DATA  
NDH0005D  
www.ti.com  
MECHANICAL DATA  
NGN0008A  
LDC08A (Rev B)  
www.ti.com  
MECHANICAL DATA  
KTT0005B  
TS5B (Rev D)  
BOTTOM SIDE OF PACKAGE  
www.ti.com  
MECHANICAL DATA  
NEB0005F  
www.ti.com  
MECHANICAL DATA  
NEC0005D  
TA05D (Rev A)  
www.ti.com  
IMPORTANT NOTICE  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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配单直通车
LM2941CSX产品参数
型号:LM2941CSX
Brand Name:Texas Instruments
是否无铅: 含铅
是否Rohs认证: 不符合
生命周期:Obsolete
零件包装代码:D2PAK
包装说明:TO-263, SMSIP5H,.6,67TB
针数:4
Reach Compliance Code:not_compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.1
可调性:ADJUSTABLE
最大回动电压 1:1 V
标称回动电压 1:0.5 V
JESD-30 代码:R-PSSO-G5
JESD-609代码:e0
长度:10.16 mm
最大电网调整率 (%/V):0.032
最大负载调整率 (%):0.78%
湿度敏感等级:3
功能数量:1
输出次数:1
端子数量:5
工作温度TJ-Max:125 °C
工作温度TJ-Min:
最高工作温度:125 °C
最低工作温度:
最大输出电流 1:1 A
最大输出电压 1:20 V
最小输出电压 1:5 V
封装主体材料:PLASTIC/EPOXY
封装代码:TO-263
封装等效代码:SMSIP5H,.6,67TB
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
包装方法:TAPE AND REEL
峰值回流温度(摄氏度):235
认证状态:Not Qualified
调节器类型:ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度:4.8 mm
子类别:Other Regulators
表面贴装:YES
技术:BIPOLAR
端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING
端子节距:1.7 mm
端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:8.64 mm
Base Number Matches:1
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