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产品型号LM567CM/NOPB的概述

LM567CM/NOPB芯片概述 LM567CM/NOPB是一款功能强大的相位锁定环(PLL)音频解调器,专门设计用于广泛的应用,包括接收调幅(AM)和调频(FM)信号。LM567CM是一款集成电路,能够有效地提取频率调制(FM)信号中的低频音频,并且能够在多种条件下提供稳定的输出。 该芯片的工作频率范围广泛,适合多种音频信号处理场景。其内部的高增益放大器和相位比较器使得LM567CM/NOPB在实现信号解调方面表现出色。该芯片在使用时提供了高效的滤波功能,能够过滤掉多余的噪声信号,从而实现更加纯净的音频输出。在音频技术及其它领域,LM567CM/NOPB的使用为高质量音频传输和信号处理打下了基础。 参数细节 LM567CM/NOPB的关键参数包括: - 工作电压:通常在4.5V到15V之间,适应多种电源配置。 - 工作频率范围:该芯片可以处理的频率范围通常为10Hz至100kHz。 ...

产品型号LM567CM/NOPB的Datasheet PDF文件预览

LM567, LM567C  
www.ti.com  
SNOSBQ4D MAY 1999REVISED MARCH 2013  
LM567/LM567C Tone Decoder  
Check for Samples: LM567, LM567C  
1
FEATURES  
APPLICATIONS  
2
20 to 1 Frequency Range with an External  
Resistor  
Touch Tone Decoding  
Precision Oscillator  
Logic Compatible Output with 100 mA Current  
Sinking Capability  
Frequency Monitoring and Control  
Wide Band FSK Demodulation  
Ultrasonic Controls  
Bandwidth Adjustable from 0 to 14%  
High Rejection of Out of Band Signals and  
Noise  
Carrier Current Remote Controls  
Communications Paging Decoders  
Immunity to False Signals  
Highly Stable Center Frequency  
DESCRIPTION  
Center Frequency Adjustable from 0.01 Hz to  
500 kHz  
The LM567 and LM567C are general purpose tone  
decoders designed to provide a saturated transistor  
switch to ground when an input signal is present  
within the passband. The circuit consists of an I and  
Q detector driven by a voltage controlled oscillator  
which determines the center frequency of the  
decoder. External components are used to  
independently set center frequency, bandwidth and  
output delay.  
CONNECTION DIAGRAM  
Figure 1. Metal Can Package  
Figure 2. PDIP and SOIC Packages  
Top View  
Top View  
See Package Number LMC0008C  
OBSOLETE  
See Package Number D0008A  
See Package Number P0008E  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1999–2013, Texas Instruments Incorporated  
LM567, LM567C  
SNOSBQ4D MAY 1999REVISED MARCH 2013  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS(1)(2)(3)  
Supply Voltage Pin  
9V  
1100 mW  
15V  
(4)  
Power Dissipation  
V8  
V3  
10V  
V3  
V4 + 0.5V  
65°C to +150°C  
Storage Temperature Range  
Operating Temperature Range  
LM567H  
55°C to +125°C  
LM567CH, LM567CM, LM567CN  
0°C to +70°C  
Soldering Information  
PDIP Package  
Soldering (10 sec.)  
260°C  
SOIC Package  
Vapor Phase (60 sec.)  
215°C  
220°C  
Infrared (15 sec.)  
See http://www.ti.com for other methods of soldering surface mount devices.  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical  
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the  
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication  
of device performance.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) Refer to RETS567X drawing for specifications of military LM567H version.  
(4) The maximum junction temperature of the LM567 and LM567C is 150°C. For operating at elevated temperatures, devices in the TO-5  
package must be derated based on a thermal resistance of 150°C/W, junction to ambient or 45°C/W, junction to case. For the DIP the  
device must be derated based on a thermal resistance of 110°C/W, junction to ambient. For the SOIC package, the device must be  
derated based on a thermal resistance of 160°C/W, junction to ambient.  
ELECTRICAL CHARACTERISTICS  
AC Test Circuit, TA = 25°C, V+ = 5V  
LM567  
Typ  
5.0  
6
LM567C/LM567CM  
Parameters  
Conditions  
Units  
Min  
Max  
9.0  
8
Min  
Typ  
5.0  
7
Max  
Power Supply Voltage Range  
Power Supply Current Quiescent  
Power Supply Current Activated  
Input Resistance  
4.75  
4.75  
9.0  
10  
15  
V
mA  
RL = 20k  
RL = 20k  
11  
13  
12  
20  
20  
15  
mA  
18  
10  
20  
15  
10  
kΩ  
Smallest Detectable Input Voltage  
Largest No Output Input Voltage  
IL = 100 mA, fi = fo  
IC = 100 mA, fi = fo  
20  
25  
25  
mVrms  
mVrms  
15  
Largest Simultaneous Outband Signal to  
Inband Signal Ratio  
6
6
dB  
dB  
Minimum Input Signal to Wideband Noise  
Ratio  
Bn = 140 kHz  
6  
6  
Largest Detection Bandwidth  
12  
14  
1
16  
2
10  
14  
2
18  
3
% of fo  
% of fo  
Largest Detection Bandwidth Skew  
Largest Detection Bandwidth Variation with  
Temperature  
±0.1  
±0.1  
%/°C  
Largest Detection Bandwidth Variation with 4.75–6.75V  
Supply Voltage  
±1  
±2  
±1  
±5  
%V  
Highest Center Frequency  
100  
500  
100  
500  
kHz  
2
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM567 LM567C  
LM567, LM567C  
www.ti.com  
SNOSBQ4D MAY 1999REVISED MARCH 2013  
ELECTRICAL CHARACTERISTICS (continued)  
AC Test Circuit, TA = 25°C, V+ = 5V  
LM567  
Typ  
LM567C/LM567CM  
Units  
Parameters  
Conditions  
Min  
Max  
Min  
Typ  
Max  
Center Frequency Stability (4.75–5.75V)  
0 < TA < 70  
55 < TA < +125  
35 ± 60  
35 ± 140  
35 ± 60  
35 ± 140  
ppm/°C  
ppm/°C  
Center Frequency Shift with Supply Voltage 4.75V–6.75V  
4.75V–9V  
0.5  
1.0  
2.0  
0.4  
2.0  
2.0  
%/V  
%/V  
Fastest ON-OFF Cycling Rate  
fo/20  
0.01  
fo/20  
0.01  
Output Leakage Current  
Output Saturation Voltage  
V8 = 15V  
25  
25  
µA  
V
ei = 25 mV, I8 = 30 mA  
ei = 25 mV, I8 = 100 mA  
0.2  
0.6  
0.4  
1.0  
0.2  
0.6  
0.4  
1.0  
Output Fall Time  
Output Rise Time  
30  
30  
ns  
ns  
150  
150  
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LM567, LM567C  
SNOSBQ4D MAY 1999REVISED MARCH 2013  
www.ti.com  
SCHEMATIC DIAGRAM  
4
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM567 LM567C  
LM567, LM567C  
www.ti.com  
SNOSBQ4D MAY 1999REVISED MARCH 2013  
TYPICAL PERFORMANCE CHARACTERISTICS  
Typical Frequency Drift  
Typical Bandwidth Variation  
Figure 3.  
Figure 4.  
Typical Frequency Drift  
Typical Frequency Drift  
Figure 5.  
Figure 6.  
Bandwidth  
vs  
Input SignalAmplitude  
Largest Detection Bandwidth  
Figure 7.  
Figure 8.  
Copyright © 1999–2013, Texas Instruments Incorporated  
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LM567, LM567C  
SNOSBQ4D MAY 1999REVISED MARCH 2013  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Typical Supply Current  
vs  
Supply Voltage  
Detection Bandwidth as a  
Function of C2 and C3  
Figure 9.  
Figure 10.  
Typical Output Voltage  
Greatest Number of Cycles  
Before Output  
vs  
Temperature  
Figure 11.  
Figure 12.  
6
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Product Folder Links: LM567 LM567C  
LM567, LM567C  
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SNOSBQ4D MAY 1999REVISED MARCH 2013  
TYPICAL APPLICATIONS  
Component values (typ)  
R1 6.8 to 15k  
R2 4.7k  
R3 20k  
C1 0.10 mfd  
C2 1.0 mfd 6V  
C3 2.2 mfd 6V  
C4 250 mfd 6V  
Figure 13. Touch-Tone Decoder  
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SNOSBQ4D MAY 1999REVISED MARCH 2013  
www.ti.com  
Connect Pin 3 to 2.8V to Invert Output  
Figure 14. Oscillator with Quadrature Output  
Figure 15. Oscillator with Double Frequency Output  
Figure 16. Precision Oscillator Drive 100 mA Loads  
8
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM567 LM567C  
LM567, LM567C  
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SNOSBQ4D MAY 1999REVISED MARCH 2013  
AC TEST CIRCUIT  
fi = 100 kHz + 5V  
*Note: Adjust for fo = 100 kHz.  
APPLICATIONS INFORMATION  
The center frequency of the tone decoder is equal to the free running frequency of the VCO. This is given by  
The bandwidth of the filter may be found from the approximation  
where  
Vi = Input voltage (volts rms), Vi 200mV  
C2 = Capacitance at Pin 2(μF)  
Copyright © 1999–2013, Texas Instruments Incorporated  
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LM567, LM567C  
SNOSBQ4D MAY 1999REVISED MARCH 2013  
www.ti.com  
LM567C MDC MWC ToNE DECODER  
Figure 17. Die Layout (C - Step)  
Table 1. Die/Wafer Characteristics  
Fabrication Attributes  
General Die Information  
Bond Pad Opening Size (min) 91µm x 91µm  
Physical Die Identification  
Die Step  
LM567C  
C
Bond Pad Metalization  
0.5% COPPER_BAL.  
ALUMINUM  
Physical Attributes  
Passivation  
VOM NITRIDE  
BARE BACK  
Floating  
Wafer Diameter  
150mm  
Back Side Metal  
Back Side Connection  
Dise Size (Drawn)  
1600µm x 1626µm  
63.0mils x 64.0mils  
Thickness  
Min Pitch  
406µm Nominal  
198µm Nominal  
Special Assembly Requirements:  
Note: Actual die size is rounded to the nearest micron.  
Die Bond Pad Coordinate Locations (C - Step)  
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used  
X/Y COORDINATES  
PAD SIZE  
SIGNAL NAME  
PAD# NUMBER  
X
Y
X
91  
Y
91  
91  
91  
91  
91  
91  
91  
104  
OUTPUT FILTER  
LOOP FILTER  
INPUT  
1
2
3
4
5
6
7
8
-673  
-673  
-673  
-356  
673  
686  
-419  
-686  
-686  
-122  
76  
x
x
x
x
x
x
x
x
91  
91  
V+  
91  
TIMING RES  
TIMING CAP  
GND  
91  
673  
91  
178  
686  
679  
117  
117  
OUTPUT  
-318  
10  
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Product Folder Links: LM567 LM567C  
 
LM567, LM567C  
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SNOSBQ4D MAY 1999REVISED MARCH 2013  
REVISION HISTORY  
Changes from Revision C (March 2013) to Revision D  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 10  
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11  
Product Folder Links: LM567 LM567C  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
LM567CM  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
PDIP  
D
8
8
8
8
8
8
95  
TBD  
Call TI  
CU SN  
CU SN  
Call TI  
Call TI  
Call TI  
Call TI  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Call TI  
LM  
567CM  
LM567CM/NOPB  
LM567CMX/NOPB  
LM567CN  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
P
P
P
95  
2500  
40  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LM  
567CM  
Green (RoHS  
& no Sb/Br)  
0 to 70  
LM  
567CM  
TBD  
0 to 70  
LM  
567CN  
LM567CN/NOPB  
NE567V  
40  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
Call TI  
0 to 70  
LM  
567CN  
40  
TBD  
0 to 70  
LM  
567CN  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM567CMX/NOPB  
SOIC  
D
8
2500  
330.0  
12.4  
6.5  
5.4  
2.0  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
LM567CMX/NOPB  
D
8
2500  
Pack Materials-Page 2  
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配单直通车
LM567CM/NOPB产品参数
型号:LM567CM/NOPB
是否Rohs认证:符合
生命周期:Transferred
IHS 制造商:NATIONAL SEMICONDUCTOR CORP
包装说明:SOP,
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.03
Is Samacsys:N
JESD-30 代码:R-PDSO-G8
JESD-609代码:e3
长度:4.9 mm
湿度敏感等级:1
功能数量:1
端子数量:8
最高工作温度:70 °C
最低工作温度:
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260
认证状态:Not Qualified
座面最大高度:1.75 mm
最大压摆率:15 mA
标称供电电压:5 V
表面贴装:YES
电信集成电路类型:TONE DECODER CIRCUIT
温度等级:COMMERCIAL
端子面层:Matte Tin (Sn)
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:40
宽度:3.9 mm
Base Number Matches:1
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