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产品型号LM74CIM-3的概述

一、芯片LM74CIM-3的概述 LM74CIM-3是一款广泛应用于温度监测和控制领域的芯片，属于LM系列集成电路。它主要用于多种温度传感器的应用，能够提供精准的温度测量与显示，适用于多种工业和消费类设备。该芯片基于高效的测量原理，更多地用于需要实时反馈及温度监控的系统中。LM74CIM-3在医用设备、制冷系统、家用电器及汽车电子等领域都有着重要的应用，得益于其高可靠性和稳定性。二、芯片LM74CIM-3的详细参数 LM74CIM-3具有多项重要参数，使其在各种温度监测应用中具备出色的性能。以下为该型号芯片的主要参数： 1. 工作电压范围：通常在4.0V至40V之间。 2. 最大工作温度：-40°C至85°C，适应各种环境下的温度监测需求。 3. 温度测量精度：±0.5°C，确保了温度读数的准确性。 4. 响应时间：典型响应时间为500毫秒，适合对快速变化的温度进行监测。 5. 功...

产品型号LM74CIM-3的Datasheet PDF文件预览

April 2003

LM74

™

SPI/MICROWIRE 12-Bit Plus Sign Temperature Sensor

General Description

The LM74 is a temperature sensor, Delta-Sigma analog-to-

n Electronic Test Equipment

Features

digital converter with an SPI and MICROWIRE compatible

n 0.0625˚C temperature resolution.

n Shutdown mode conserves power between temperature

reading

interface. The host can query the LM74 at any time to read

temperature. A shutdown mode decreases power consump-

tion to less than 10 µA. This mode is useful in systems where

low average power consumption is critical.

n SPI and MICROWIRE Bus interface

n 5-Bump micro SMD package saves space

The LM74 has 12-bit plus sign temperature resolution

(0.0625˚C per LSB) while operating over a temperature

range of −55˚C to +150˚C.

Key Specifications

The LM74’s 3.0V to 5.5V supply voltage range, low supply

current and simple SPI interface make it ideal for a wide

range of applications. These include thermal management

and protection applications in hard disk drives, printers, elec-

tronic test equipment, and office electronics. The LM74 is

available in the SO-8 package as well as an 5-Bump micro

SMD package.

Supply Voltage

3.0V or 2.65V to

5.5V

Supply Current

operating

shutdown

265µA (typ)

520µA (max)

3µA (typ)

Temperature

Accuracy

−10˚C to 65˚C

−25˚C to 110˚C

−55˚C to 125˚C

1.25˚C(max)

2.1˚C(max)

3˚C(max)

Applications

n System Thermal Management

n Personal Computers

n Disk Drives

n Office Electronics

Simplified Block Diagram

10090901

MICROWIRE^®is a registered trademark of National Semiconductor Corporation.

TRI-STATE^®is a registered trademark of National Semiconductor Corporation.

DS100909

www.national.com

Connection Diagrams

SO-8

5-Bump micro SMD

10090902

TOP VIEW

NS Package Number M08A

10090924

Note:

Pin numbers are referenced to the package marking text orientation. Pin

1 is designated by the square.

Reference JEDEC Registration MO-211, variation BC

- The top 4 characters designate the date code. The bottom 3 characters

designate the device type (see ordering information).

TOP VIEW

NS Package Number BPD05MPB

Ordering Information

Package

Order Number

NS Package

Number

SO-8, M08A

Supply Voltage

Transport Media

95 Units in Rail

Marking

LM74CIM-3

LM74CIMX-3

LM74CIM-5

LM74CIMX-5

LM74CIBP-3

LM74CIM-3

LM74CIM-5

3.0V to 3.6V

4.5V to 5.5V

2.65V to 3.6V

SO-8, M08A

micro SMD,

BPD05MPB

micro SMD,

BPD05MPB

micro SMD,

BPD05MPB

micro SMD,

BPD05MPB

2500 Units in Tape and Reel

95 Units in Rail

2500 Units in Tape and Reel

250 Units in Tape and Reel

LM74CIBPX-3

LM74CIBP-5

LM74CIBPX-5

2.65V to 3.6V

4.5V to 5.5V

3000 Units in Tape and Reel

250 Units in Tape and Reel

3000 Units in Tape and Reel

www.national.com

Pin Descriptions

Label

SO-8

micro

SMD

Function

Typical Connection

SI/O

Slave Input/Output - Serial bus bi-directional data

line. Schmitt trigger input.

From and to Controller

Slave Clock - Serial bus clock Schmitt trigger input From Controller

line.

GND

V⁺

No Connection

Power Supply Ground

No Connection

Ground

No Connection

Chip Select input.

Positive Supply Voltage Input

From Controller

DC Voltage from 3.0V to 5.5V for the

LM74CIM and 2.65V to 5.5V for the

LM74CIBP. Bypass with a 0.1 µF ceramic

capacitor.

Typical Application

10090903

FIGURE 1. COP Microcontroller Interface

www.national.com

Absolute Maximum Ratings (Note 1)

LM74CIM and LM74CIBP all

other pins

2000V

200V

Supply Voltage

−0.3V to 6.0V

−0.3V to V⁺+ 0.3V

5 mA

Machine Model

Voltage at any Pin

Input Current at any Pin (Note 2)

Package Input Current (Note 2)

Storage Temperature

Operating Ratings

Specified Temperature Range

20 mA

−65˚C to +150˚C

T_MINto T_MAX

Soldering Information, Lead Temperature

SO-8 Package (Note 3)

Vapor Phase (60 seconds)

Infrared (15 seconds)

(Note 5)

LM74CIBP

−40˚C to +125˚C

−55˚C to +150˚C

215˚C

220˚C

LM74CIM

Supply Voltage Range (+V_S)

LM74CIBP

ESD Susceptibility (Note 4)

Human Body Mode

+2.65V to +5.5V

+3.0V to +5.5V

LM74CIM

LM74CIBP SC, pin 5

1900V

Temperature-to-Digital Converter Characteristics

Unless otherwise noted, these specifications apply for V⁺= 2.65V to 3.6V for the LM74CIBP -3, V⁺= 3.0V to 3.6V for the

LM74CIM -3 and V⁺= 4.5V to 5.5V for the LM74 -5 (Note 6). Boldface limits apply for T_A= T_J= T_MINto T_MAX; all other lim-

its T_A= T_J=+25˚C, unless otherwise noted.

Typical

(Note 7)

LM74-5

Limits

(Note 8)

1.25

LM74-3

Limits

(Note 8)

1.25

Units

(Limit)

Parameter

Conditions

Temperature Error (Note 6)

T_A= −10˚C to +65˚C

T_A= −25˚C to +110˚C

T_A= −40˚C to +85˚C

T_A= −40˚C to +110˚C

˚C (max)

2.1

+2.65/−2.15

2.15

+2.65/−1.65

+2.65/

−2.0

+2.65/−2.15

T_A= −55˚C to +125˚C

T_A= −55˚C to +150˚C

3.0

3.5

5.0

˚C (max)

Bits

5.0

Resolution

280

611

310

265

310

Temperature

Conversion Time

SO-8 (Note 9)

micro SMD (Note 9)

SO-8 Serial Bus Inactive

micro SMD

SO-8 Serial Bus Active

micro SMD

SO-8 Shutdown Mode,

V⁺= 3.3V

425

925

520

470

425

925

520

470

ms (max)

µA (max)

µA

Quiescent Current

µA

micro SMD

µA

SO-8 Shutdown Mode,

V⁺= 5V

µA

micro SMD

µA

Logic Electrical Characteristics

DIGITAL DC CHARACTERISTICS Unless otherwise noted, these specifications apply for V⁺= 2.65V to 3.6V for the

LM74CIBP -3, V⁺= 3.0V to 3.6V for the LM74CIM -3 and V⁺= 4.5V to 5.5V for the LM74 -5 (Note 6). Boldface limits apply

for T_A= T_J= T_MINto T_MAX; all other limits T_A= T_J=+25˚C, unless otherwise noted.

Typical

(Note 7)

Limits

(Note 8)

V⁺x 0.7

V⁺+ 0.3

−0.3

Units

(Limit)

Symbol

V_IN(1)

Parameter

Conditions

Logical “1” Input Voltage

V (min)

V (max)

V (min)

V (max)

V (min)

µA (max)

V_IN(0)

Logical “0” Input Voltage

Input Hysteresis Voltage

Logical “1” Input Current

V⁺x 0.3

V⁺= 3.0V to 3.6V

V⁺= 4.5V to 5.5V

V_IN= V⁺

0.8

0.35

0.33

I_IN(1)

0.005

3.0

www.national.com

Logic Electrical Characteristics (Continued)

DIGITAL DC CHARACTERISTICS Unless otherwise noted, these specifications apply for V⁺= 2.65V to 3.6V for the

LM74CIBP -3, V⁺= 3.0V to 3.6V for the LM74CIM -3 and V⁺= 4.5V to 5.5V for the LM74 -5 (Note 6). Boldface limits apply

for T_A= T_J= T_MINto T_MAX; all other limits T_A= T_J=+25˚C, unless otherwise noted.

Typical

(Note 7)

−0.005

Limits

(Note 8)

−3.0

Units

(Limit)

µA (min)

Symbol

I_IN(0)

Parameter

Conditions

V_IN= 0V

Logical “0” Input Current

All Digital Inputs

C_IN

V_OH

High Level Output Voltage

Low Level Output Voltage

TRI-STATE Output Leakage

Current

I_OH= −400 µA

I_OL= +2 mA

V_O= GND

V_O= V⁺

2.4

0.4

−1

V (min)

V (max)

µA (min)

µA

V_OL

I_{O_TRI-STATE}

(max)

SERIAL BUS DIGITAL SWITCHING CHARACTERISTICS Unless otherwise noted, these specifications apply for V⁺= 2.65V

to 3.6V for the LM74CIBP -3, V⁺= 3.0V to 3.6V for the LM74CIM -3 and V⁺= 4.5V to 5.5V for the LM74 -5 (Note 6); C_L(load

capacitance) on output lines = 100 pF unless otherwise specified. Boldface limits apply for T_A= T_J= T_MINto T_MAX; all other

limits T_A= T_J= +25˚C, unless otherwise noted.

Typical

(Note 7)

Limits

(Note 8)

0.16

Units

(Limit)

Symbol

t₁

Parameter

Conditions

SC (Clock) Period

µs (min)

(max)

t₂

t₃

t₄

t₅

t₆

t₇

CS Low to SC (Clock) High Set-Up Time

CS Low to Data Out (SO) Delay

100

ns (min)

ns (max)

ns (min)

SC (Clock) Low to Data Out (SO) Delay

CS High to Data Out (SO) TRI-STATE

SC (Clock) High to Data In (SI) Hold Time

Data In (SI) Set-Up Time to SC (Clock) High

100

200

10090904

FIGURE 2. Data Output Timing Diagram

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Logic Electrical Characteristics (Continued)

10090905

FIGURE 3. TRI-STATE Data Output Timing Diagram

10090906

FIGURE 4. Data Input Timing Diagram

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating

the device beyond its rated operating conditions.

+V ) the current at that pin should be limited to 5 mA. The 20 mA

Note 2: When the input voltage (V ) at any pin exceeds the power supplies (V

GND or V

maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.

Note 3: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in a current National

Semiconductor Linear Data Book for other methods of soldering surface mount devices.

Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin.

Note 5: The life expectancy of the LM74 will be reduced when operating at elevated temperatures. LM74 θ (thermal resistance, junction-to-ambient) when

attached to a printed circuit board with 2 oz. foil is summarized in the table below:

NS Package

Number

Thermal

Resistance (θ_JA

160˚C/W

Device Number

)

LM74CIM

M08A

LM74CIBP

BPD05MPB

250˚C/W

Note 6: All SOP (LM74CIM) parts will function over the V supply voltage range of 3V to 5.5V. All micro SMD (LM74SIBP) parts will function over the V supply

voltage range of 2.65V to 5.5V. The SOP (LM74CIM) parts are tested and specified for rated temperature error at their nominal supply voltage for temperature ranges

of −10˚C to +65˚C, −55˚C to +125˚C and −55˚C to +150˚C. For the SOP (LM74CIM) parts the temperature error specifications for temperature ranges of −40˚C to

+85˚C, −25˚C to +110˚C and −40˚C to +110˚C include error induced by power supply variation of 5% from the nominal value. For the LM74CIM (SOP) parts the

temperature error will increase by 0.3˚C for a power supply voltage (V ) variation of 10% from the nominal value.

For the LM74CIBP-3 (micro SMD) parts all accuracies are guaranteed over the supply range of 2.65V to 3.6V, except for the temperature ranges of -55˚C to 125˚C

and −55˚C to +150˚C where the accuracy applies for the nominal supply voltage of 3.3V. For the LM74CIBP-5 (micro SMD) parts all accuracies are guranteed over

the supply range of 4.75V to 5.25V, except for the temperature ranges of -55˚C to 125˚C and −55˚C to +150˚C where the accuracy applies for the nominal supply

voltage of 5.0V. For the LM74CIBP over -55˚C to 125˚C and −55˚C to +150˚C, a power supply variation of 10% will degrade the accuracy by 0.3˚C.

www.national.com

Logic Electrical Characteristics (Continued)

Note 7: Typicals are at T = 25˚C and represent most likely parametric norm.

Note 8: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).

Note 9: This specification is provided only to indicate how often temperature data is updated. The LM74 can be read at any time without regard to conversion state

(and will yield last conversion result). A conversion in progress will not be interrupted. The output shift register will be updated at the completion of the read and a

new conversion restarted.

Note 10: For best accuracy, minimize output loading. Higher sink currents can affect sensor accuracy with internal heating. This can cause an error of 0.64˚C at full

rated sink current and saturation voltage based on junction-to-ambient thermal resistance.

Electrical Characteristics

10090908

FIGURE 5. Temperature-to-Digital Transfer Function (Non-linear scale for clarity)

TRI-STATE Test Circuit

10090907

FIGURE 6.

www.national.com

Typical Performance Characteristics

Average Power-On Reset Voltage vs Temperature

Static Supply Current vs Temperature (SO-8)

10090923

10090921

Temperature Error (SO-8)

Static Supply Current vs Temperature (micro SMD)

10090925

10090922

conversion, the register will contain temperature measure-

ment data in bits D15 (the temperature data MSB) through

D3 (the temperature data LSB). Bit D2 will be fixed high; bits

D1 and D0 are undefined. See Section 1.5.3 for a diagram of

the Temperature Regisiter contents after the first complete

temperature conversion. Note that bit D2 represents a com-

plete conversion flag. During POR it is low and, after the first

temperature conversion is complete, it goes high. This bit

can be polled to indicate when the POR data in the Tem-

perature Register has been replaced with valid temperature

data.

1.0 Functional Description

The LM74 temperature sensor incorporates a band-gap type

temperature sensor and 12-bit plus sign ∆Σ ADC (Delta-

Sigma Analog-to-Digital Converter). Compatibility of the

LM74’s three wire serial interface with SPI and MICROWIRE

allows simple communications with common microcontrol-

lers and processors. Shutdown mode can be used to opti-

mize current drain for different applications. A Manufacture’s/

Device ID register identifies the LM74 as National

Semiconductor product.

After the first conversion, and any subsequent conversions,

the value in the temperature register does not change until

the completion of the next conversion, at which time the

temperature register is updated with the latest temperature

value.

1.1 POWER UP AND POWER DOWN

When the supply voltage is less than about 1.6V (typical),

the LM74 is considered powered down. The LM74 always

powers up in a known state. When the supply voltage rises

above 1.6V (typical), an internal Power-On Reset (POR)

occurs and the temperature register will then contain a value

of 1111 1111 0000 00XX, where XX indicates undefined

values. See Section 1.5.2 for a diagram of the Temperature

Regisiter contents after POR but before completion of the

first temperature conversion.

1.2 SERIAL BUS INTERFACE

The LM74 operates as a slave and is compatible with SPI or

MICROWIRE bus specifications. Data is clocked out on the

falling edge of the serial clock (SC), while data is clocked in

on the rising edge of SC. A complete transmit/receive com-

The LM74 power-up default condition is continuous conver-

sion mode. After completion of the first full temperature

www.national.com

Note that one complete temperature conversion period will

have to pass before the LM74 Temperature register will

contain the new temperature data. Until then, it will contain a

"stale" temperature (the data that was in the register before

going into shutdown mode).

1.0 Functional Description (Continued)

munication will consist of 32 serial clocks. The first 16 clocks

comprise the transmit phase of communication, while the

second 16 clocks are the receive phase.

When CS is high SI/O will be in TRI-STATE^®. Communica-

tion should be initiated by taking chip select (CS) low. This

should not be done when SC is changing from a low to high

state. Once CS is low the serial I/O pin (SI/O) will transmit

the first bit of data. The master can then read this bit with the

rising edge of SC. The remainder of the data will be clocked

out by the falling edge of SC. Once the 14 bits of data (one

sign bit, twelve temperature bits and 1 high bit) are transmit-

ted the SI/O line will go into TRI-STATE. CS can be taken

high at any time during the transmit phase. If CS is brought

low in the middle of a conversion the LM74 will complete the

conversion and the output shift register will be updated after

CS is brought back high.

1.3 TEMPERATURE DATA FORMAT

Temperature data is represented by a 13-bit, two’s comple-

ment word with an LSB (Least Significant Bit) equal to

0.0625˚C:

Temperature

Digital Output

Binary

Hex

+150˚C

+125˚C

+25˚C

0100 1011 0000 0111

0011 1110 1000 0111

0000 1100 1000 0111

0000 0000 0000 1111

0000 0000 0000 0111

1111 1111 1111 1111

1111 0011 1000 0111

1110 0100 1000 0111

4B 07h

3E 87h

0C 87h

00 0Fh

00 07h

FF FFh

F3 87h

E4 87h

+0.0625˚C

0˚C

The receive phase of a communication starts after 16 SC

periods. CS can remain low for 32 SC cycles. The LM74 will

read the data available on the SI/O line on the rising edge of

the serial clock. Input data is to an 8-bit shift register. The

part will detect the last eight bits shifted into the register. The

receive phase can last up to 16 SC periods. All ones must be

shifted in order to place the part into shutdown. A zero in any

location will take the LM74 out of shutdown. The following

codes should only be transmitted to the LM74:

−0.0625˚C

−25˚C

−55˚C

Note: The last two bits are TRI-STATE^®and depicted as one

in the table.

The first data byte is the most significant byte with most

significant bit first, permitting only as much data as neces-

sary to be read to determine temperature condition. For

instance, if the first four bits of the temperature data indicate

an overtemperature condition, the host processor could im-

mediately take action to remedy the excessive tempera-

tures.

•

00 hex

01 hex

03 hex

07 hex

0F hex

1F hex

3F hex

7F hex

FF hex

1.4 SHUTDOWN MODE/MANUFACTURER’S ID

Shutdown mode is enabled by writing XX FF to the LM74 as

shown in Figure 7c. The serial bus is still active when the

LM74 is in shutdown. Current draw drops to less than 10 µA

between serial communications. When in shutdown mode

the LM74 always will output 1000 0000 0000 00XX. This is

the manufacturer’s/Device ID information. The first 5-bits of

the field (1000 0XXX) are reserved for manufacturer’s ID. As

mentioned in Section 1.2, writing a zero to the LM74 con-

figuration register will take it out of shutdown mode and

place it in conversion mode. In other words, any valid code

listed in Section 1.2 other than XX FF will put it in conversion

mode. After leaving shutdown, but before the first tempera-

ture conversion is complete, the temperature register will

contain the last measured temperature which resided in the

temperature register before entering shutdown mode. After

the completion of the first conversion, the temperature reg-

ister will be updated with the new temperature data.

any others may place the part into a Test Mode. Test Modes

are used by National Semiconductor to thoroughly test the

function of the LM74 during production testing. Only eight

bits have been defined above since only the last eight trans-

mitted are detected by the LM74, before CS is taken HIGH.

The following communication can be used to determine the

Manufacturer’s/Device ID and then immediately place the

part into continuous conversion mode. With CS continuously

low:

•

Read 16 bits of temperature data

Write 16 bits of data commanding shutdown

Read 16 bits of Manufacture’s/Device ID data

Write 8 to 16 bits of data commanding Conversion Mode

Take CS HIGH.

www.national.com

1.0 Functional Description (Continued)

1.5 INTERNAL REGISTER STRUCTURE

The LM74 has three registers, the temperature register, the

configuration register and the manufacturer’s/device identifi-

cation register. The temperature and manufacturer’s/device

identification registers are read only. The configuration reg-

ister is write only.

1.5.1 Configuration Register

(Selects shutdown or continuous conversion modes):

(Write Only):

D15

D14

D13

D12

D11

D10

Shutdown

D0–D15 set to XX FF hex enables shutdown mode.

D0–D15 set to 00 00 hex sets Continuous conversion mode.

Note: setting D0-D15 to any other values may place the LM74 into a manufacturer’s test mode, upon which the LM74 will stop

responding as described. These test modes are to be used for National Semiconductor production testing only. See Section 1.2

Serial Bus Interface for a complete discussion.

1.5.2 Temperature Register (after power-up, before first complete temperature conversion)

(Read Only):

D15

D14

D13

D12

D11

D10

D0–D1: Undefined. TRI-STATE will be output on SI/0.

D2–D15: Power-on Reset (POR) values.

1.5.3 Temperature Register (after completion of first temperature conversion)

(Read Only):

D15

D14

D13

D12

D11

D10

MSB Bit 11 Bit 10 Bit 9

Bit 8

Bit 7

Bit 6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

LSB

D0–D1: Undefined. TRI-STATE will be output on SI/0.

D2: High.

D3–D15: Temperature Data. One LSB = 0.0625˚C. Two’s complement format.

1.5.4 Manufacturer’s Device ID Register

(Read Only):

D15

D14

D13

D12

D11

D10

D0–D1: Undefined. TRI-STATE will be output on SI/0.

D2–D15: Manufacturer’s/Device ID Data. This register is accessed whenever the LM74 is in shutdown mode.

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2.0 Serial Bus Timing Diagrams

10090914

a) Reading Continuous Conversion - Single Eight-Bit Frame

10090915

b) Reading Continuous Conversion - Two Eight-Bit Frames

10090918

c) Writing Shutdown Control

FIGURE 7. Timing Diagrams

www.national.com

where condensation can occur. Printed-circuit coatings and

varnishes such as Humiseal and epoxy paints or dips are

often used to insure that moisture cannot corrode the LM74

or its connections.

3.0 Application Hints

To get the expected results when measuring temperature

with an integrated circuit temperature sensor like the LM74,

it is important to understand that the sensor measures its

own die temperature. For the LM74, the best thermal path

between the die and the outside world is through the LM74’s

pins. In the SO-8 package all the pins on the LM74 will have

an equal effect on the die temperature. Because the pins

represent a good thermal path to the LM74 die, the LM74 will

provide an accurate measurement of the temperature of the

printed circuit board on which it is mounted. There is a less

efficient thermal path between the plastic package and the

LM74 die. If the ambient air temperature is significantly

different from the printed circuit board temperature, it will

have a small effect on the measured temperature.

3.1 micro SMD LIGHT SENSITIVITY

The LM74 in the micro SMD package should not be exposed

to ultraviolet light. The micro SMD package does not com-

pletely encapsulate the LM74 die in epoxy. Exposing the

LM74 micro SMD package to bright sunlight will not imme-

diatly cause a change in the output reading. Our experi-

ments show that directly exposing the circuit side (bump

side) of the die to high intensity (≥ 1mW/cm²) ultraviolet light,

centered at a wavelength of 254nm, for greater than 20

minutes will deprogram the EEPROM cells in the LM74.

Since the EEPROM is used for storing calibration coeffi-

cients, the LM74 will function but the temperature accuracy

will no longer be as specified. Light can penetrate through

the side of the package as well, so exposure to ultra violet

radiation is not recommended even after mounting.

In probe-type applications, the LM74 can be mounted inside

a sealed-end metal tube, and can then be dipped into a bath

or screwed into a threaded hole in a tank. As with any IC, the

LM74 and accompanying wiring and circuits must be kept

insulated and dry, to avoid leakage and corrosion. This is

especially true if the circuit may operate at cold temperatures

4.0 Typical Applications

10090920

FIGURE 8. Temperature monitor using Intel 196 processor

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4.0 Typical Applications (Continued)

10090919

FIGURE 9. LM74 digital input control using micro-controller’s general purpose I/O.

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Physical Dimensions inches (millimeters) unless otherwise noted

8-Lead Molded Small Outline Package

Order Number LM74CIM-3, LM74CIMX-3, LM74CIM-5 or LM74CIMX-5

NS Package Number M08A

5-Bump micro SMD Ball Grid Array Package

Order Number LM74CIBP-3,LM74CIBPX-3, LM74CIBP-5, LM74CIBPX-5

NS Package Number BPD05MPB

The following dimensions apply to the BPD05MPB package

shown above: X1=1565µm 30µm, X2=1615µm 30µm, X3=850µm 50µm.

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Notes

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or

systems which, (a) are intended for surgical implant

into the body, or (b) support or sustain life, and

whose failure to perform when properly used in

accordance with instructions for use provided in the

labeling, can be reasonably expected to result in a

significant injury to the user.

2. A critical component is any component of a life

support device or system whose failure to perform

can be reasonably expected to cause the failure of

the life support device or system, or to affect its

safety or effectiveness.

BANNED SUBSTANCE COMPLIANCE

National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products

Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification

(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.

National Semiconductor

Americas Customer

Support Center

National Semiconductor

Europe Customer Support Center

Fax: +49 (0) 180-530 85 86

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Support Center

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Fax: 81-3-5639-7507

Email: new.feedback@nsc.com

Tel: 1-800-272-9959

Email: europe.support@nsc.com

Deutsch Tel: +49 (0) 69 9508 6208

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Email: ap.support@nsc.com

Email: jpn.feedback@nsc.com

Tel: 81-3-5639-7560

www.national.com

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

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LM74CIM-3产品参数

型号:	LM74CIM-3
Brand Name：	Texas Instruments
生命周期：	Not Recommended
包装说明：	SOP8,.25
Reach Compliance Code：	not_compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	1 week
风险等级：	7.26
最大精度（摄氏度）：	3 Cel
主体宽度：	3.899 mm
主体高度：	1.5495 mm
主体长度或直径：	4.902 mm
JESD-609代码：	e0
安装特点：	SURFACE MOUNT
位数：	12
端子数量：	8
最大工作电流：	0.265 mA
最高工作温度：	150 °C
最低工作温度：	-55 °C
输出接口类型：	3-WIRE INTERFACE
最大输出电压：	2.4 V
最小输出电压：	0.4 V
封装主体材料：	PLASTIC/EPOXY
封装等效代码：	SOP8,.25
封装形状/形式：	RECTANGULAR
电源：	3.3 V
传感器/换能器类型：	TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
子类别：	Other Sensors/Transducers
最大供电电压：	3.6 V
最小供电电压：	3 V
表面贴装：	YES
端子面层：	Tin/Lead (Sn/Pb)
端接类型：	SOLDER
Base Number Matches：	1

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