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  • MC33990DR2G图
  • 深圳市恒达亿科技有限公司

     该会员已使用本站12年以上
  • MC33990DR2G
  • 数量3000 
  • 厂家ON 
  • 封装SOP8 
  • 批号23+ 
  • 全新原装正品现货
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  • MC33990D图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • MC33990D
  • 数量8800 
  • 厂家ON/安森美 
  • 封装SOP8 
  • 批号新年份 
  • 羿芯诚只做原装,原厂渠道,价格优势可谈!
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  • MC33990DR2图
  • 千层芯半导体(深圳)有限公司

     该会员已使用本站9年以上
  • MC33990DR2
  • 数量18700 
  • 厂家MOT 
  • 封装SOP 
  • 批号2018+ 
  • 假一赔十原装最低价格深圳北京均可交货
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  • MC33990D图
  • 深圳市赛尔通科技有限公司

     该会员已使用本站12年以上
  • MC33990D
  • 数量12850 
  • 厂家ON 
  • 封装SOP8 
  • 批号NEW 
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  • 深圳市华科泰电子商行

     该会员已使用本站13年以上
  • MC33990DR2
  • 数量2000 
  • 厂家Freescal 
  • 封装SOP-8 
  • 批号2009+ 
  • 绝对原装现货特价
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  • 北京耐芯威科技有限公司

     该会员已使用本站13年以上
  • MC33990DR2
  • 数量5000 
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  • 封装 
  • 批号21+ 
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  • MC33990D图
  • 北京耐芯威科技有限公司

     该会员已使用本站12年以上
  • MC33990D
  • 数量3500 
  • 厂家 
  • 封装 
  • 批号21+ 
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  • 深圳市能元时代电子有限公司

     该会员已使用本站10年以上
  • MC33990D
  • 数量23000 
  • 厂家ON 
  • 封装SOP8 
  • 批号24+ 
  • 原装现货假一赔十,可含长期供货!
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  • 深圳市欧昇科技有限公司

     该会员已使用本站10年以上
  • MC33990D
  • 数量9000 
  • 厂家MOTOROLA 
  • 封装SOP-8 
  • 批号2021+ 
  • 优势价格.十年专营渠道.深圳原装现货
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  • MC33990D图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • MC33990D
  • 数量18531 
  • 厂家FREESCAL 
  • 封装SOP8 
  • 批号23+ 
  • 全新原装正品现货特价
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  • MC33990DR2图
  • 首天国际(深圳)集团有限公司

     该会员已使用本站17年以上
  • MC33990DR2
  • 数量5000 
  • 厂家MOT 
  • 封装SOIC-8/3.9mm 
  • 批号2024+ 
  • 百分百原装正品,现货库存
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  • MC33990D图
  • 昂富(深圳)电子科技有限公司

     该会员已使用本站4年以上
  • MC33990D
  • 数量87280 
  • 厂家NXP/恩智浦 
  • 封装N/A 
  • 批号23+ 
  • 一站式BOM配单,短缺料找现货,怕受骗,就找昂富电子.
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  • MC33990DR图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • MC33990DR
  • 数量65000 
  • 厂家ON 
  • 封装SOP8 
  • 批号23+ 
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  • MC33990D图
  • 深圳市宏世佳电子科技有限公司

     该会员已使用本站13年以上
  • MC33990D
  • 数量3725 
  • 厂家NXP 
  • 封装8-SOIC(0.154,3.90mm 宽) 
  • 批号2023+ 
  • 全新原厂原装产品、公司现货销售
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  • MC33990D图
  • 深圳市宏世佳电子科技有限公司

     该会员已使用本站13年以上
  • MC33990D
  • 数量3725 
  • 厂家NXP 
  • 封装8-SOIC(0.154,3.90mm 宽) 
  • 批号2023+ 
  • 全新原厂原装产品、公司现货销售
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  • MC33990DR2G图
  • 深圳市宏捷佳电子科技有限公司

     该会员已使用本站12年以上
  • MC33990DR2G
  • 数量12300 
  • 厂家ON/安森美 
  • 封装SOP8 
  • 批号24+ 
  • ★原装真实库存★13点税!
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  • MC33990D图
  • 上海磐岳电子有限公司

     该会员已使用本站11年以上
  • MC33990D
  • 数量5800 
  • 厂家MOT 
  • 封装SMD 
  • 批号2024+ 
  • 全新原装现货,杜绝假货。
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  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • MC33990D
  • 数量5600 
  • 厂家ON 
  • 封装SOP-8 
  • 批号2024+ 
  • 原装正品,假一罚十
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  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • MC33990DR
  • 数量18800 
  • 厂家ON-安森美 
  • 封装SOP-8.贴片 
  • 批号▉▉:2年内 
  • ▉▉¥10一一有问必回一一有长期订货一备货HK仓库
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  • MC33990D图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • MC33990D
  • 数量36000 
  • 厂家ON 
  • 封装SOP8 
  • 批号23+ 
  • 真实库存全新原装正品!代理此型号
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  • MC33990DR2G图
  • 深圳市硅诺电子科技有限公司

     该会员已使用本站8年以上
  • MC33990DR2G
  • 数量10000 
  • 厂家ON 
  • 封装SOP8 
  • 批号17+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
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  • MC33990DR2图
  • 深圳市卓越微芯电子有限公司

     该会员已使用本站12年以上
  • MC33990DR2
  • 数量5500 
  • 厂家ON 
  • 封装SOP8 
  • 批号20+ 
  • 百分百原装正品 真实公司现货库存 本公司只做原装 可开13%增值税发票,支持样品,欢迎来电咨询!
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  • MC33990DR2图
  • 深圳市意好科技有限公司

     该会员已使用本站15年以上
  • MC33990DR2
  • 数量6780 
  • 厂家MOT 
  • 封装原厂 
  • 批号24+ 
  • 中华地区销售
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  • MC33990D图
  • 深圳市迈锐达科技有限公司

     该会员已使用本站14年以上
  • MC33990D
  • 数量506 
  • 厂家MOT 
  • 封装 
  • 批号08+ 
  • 原装现货!冷门优势库存
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  • MC33990D图
  • 深圳市宗天技术开发有限公司

     该会员已使用本站10年以上
  • MC33990D
  • 数量385 
  • 厂家MOTOROLA/摩托罗拉 
  • 封装SMD 
  • 批号21+ 
  • 宗天技术 原装现货/假一赔十
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  • MC33990D图
  • 深圳市赛矽电子有限公司

     该会员已使用本站13年以上
  • MC33990D
  • 数量940 
  • 厂家Freescale 
  • 封装原包 
  • 批号最新 
  • 全新原装,优势型号
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  • MC33990DR2图
  • 深圳市富科达科技有限公司

     该会员已使用本站13年以上
  • MC33990DR2
  • 数量12100 
  • 厂家ON 
  • 封装SOP8 
  • 批号2020+ 
  • 全新原装特价热卖
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  • 深圳市顺鑫诚电子科技有限公司

     该会员已使用本站14年以上
  • MC33990DR2
  • 数量5000 
  • 厂家MOT 
  • 封装SOIC-8/3.9mm 
  • 批号18+ 
  • 保证原装正品,欢迎来电咨询
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  • MC33990D图
  • 深圳市宇川湘科技有限公司

     该会员已使用本站6年以上
  • MC33990D
  • 数量12660 
  • 厂家ON 
  • 封装SOP 
  • 批号23+ 
  • 原装正品现货,郑重承诺只做原装!
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  • 深圳市双微电子科技有限公司

     该会员已使用本站10年以上
  • MC33990DR2G
  • 数量1000 
  • 厂家FREESCALE 
  • 封装SOP8 
  • 批号20+ 
  • 询货请加QQ 全新原装 现货库存
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  • 深圳市顺兴源微电子商行

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  • MC33990DR2
  • 数量6890000 
  • 厂家Freescal 
  • 封装SOP-8 
  • 批号16+ 
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  • 深圳市凯信扬科技有限公司

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  • MC33990D
  • 数量9820 
  • 厂家ON/安森美 
  • 封装SOP-8 
  • 批号21+ 
  • 原则深圳现货,优势价格
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  • 深圳市创思克科技有限公司

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  • MC33990D
  • 数量10000 
  • 厂家FREESCALE 
  • 封装 
  • 批号19+ 
  • 全新原装挺实单欢迎来撩/可开票
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产品型号MC33990D的概述

MC33990D芯片概述 MC33990D是一款高度集成的电机驱动控制器,专为低功耗和高效的汽车及工业应用设计。该芯片由美国半导体制造商NXP Semiconductors负责生产,旨在实现多种电机控制需求,包括直流电动机的控制、步进电动机的驱动以及无刷直流电动机的应用等。 MC33990D的设计考虑到了诸多行业标准和性能指标,使其适合用于汽车电动转向、车门控制、座椅调节及其他自动化设备。同时,该芯片具备温度监控、过流保护、空载检测等功能,增强了系统的安全性与稳定性。 详细参数 MC33990D的参数特点包括: - 电源电压范围:MC33990D支持广泛的电源电压范围,从5V至40V,适应了多种应用场景。 - 最大输出电流:该芯片能够提供高达2A的输出电流,适合驱动中等功率的电动机。 - 工作温度范围:设备设计用于-40°C至+125°C的工作环境,确保在极端环境中稳定工作。 - 输入...

产品型号MC33990D的Datasheet PDF文件预览

Freescale Semiconductor, Inc.  
MOTOROLA  
Document order number: MC33990/D  
Rev 1.0, 2/2003  
SEMICONDUCTOR TECHNICAL DATA  
Advance Information  
33990  
Enhanced Class B Serial  
Transceiver  
The 33990 is a serial transceiver designed to provide bi-directional half-  
duplex communication meeting the automotive SAE Standard J-1850 Class B  
Data Communication Network Interface specification. It is designed to  
interface directly to on-board vehicle microcontrollers and serves to transmit  
and receive data on a single-wire bus at data rates of 10.4 kbps using Variable  
Pulse Width Modulation (VPWM). The 33990 operates directly from a vehicle's  
12 V battery system and functions in a logic fashion as an I/O interface  
between the microcontroller's 5.0 V CMOS logic level swings and the required  
0 V to 7.0 V waveshaped signal swings of the bus. The bus output driver is  
short circuit current limited.  
J-1850 SERIAL TRANSCEIVER  
Features  
• Designed for SAE J-1850 Class B Data Rates  
• Full Operational Bus Dynamics Over a Supply Voltage of 9.0 V to 16 V  
• Ambient Operating Temperature of -40°C to 125°C  
• Interfaces Directly to Standard 5.0 V CMOS Microcontroller  
• BUS Pin Protected Against Shorts to Battery and Ground  
• Thermal Shutdown with Hysteresis  
D SUFFIX  
PLASTIC PACKAGE  
CASE 751  
(8-LEAD SOICN)  
ORDERING INFORMATION  
Temperature  
• Voltage Waveshaping of Bus Output Driver  
• Internally Reverse Battery Protected  
Device  
Package  
Range (T )  
A
• 40 V Max VBAT Capability  
-40 to 125°C  
8 SOICN  
MC33990D/DR2  
33990 Simplified Application Diagram  
33990  
VBAT  
VBAT  
Primary  
Node  
47 µH  
BUS  
470 pF  
10.6 kΩ  
SLEEP  
Tx  
Secondary  
Nodes  
LOAD  
GND  
MCU  
Rx  
4X/LOOP  
This document contains certain information on a new product.  
Specifications and information herein are subject to change without notice.  
For More Information On This Product,  
© Motorola, Inc. 2003  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
33990  
Bus  
BUS  
Driver  
VBAT  
Voltage  
Regulator  
SLEEP  
Thermal  
4.5 V  
Shutdown  
Reference  
Waveshaping  
Filter  
Tx  
Rx  
Digital Output  
Driver  
Loss of Ground  
Protection  
LOAD  
GND  
4X Enable  
Loopback  
4X/LOOP  
Note This device contains approximately 400 active transistors and 250 gates.  
Figure 1. 33990 Simplified Block Diagram  
33990  
2
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
1
8
SLEEP  
GND  
Rx  
2
7
Tx  
3
6
LOAD  
BUS  
4X/LOOP  
4
5
V
BAT  
PIN FUNCTION DESCRIPTION  
Pin  
Pin Name  
SLEEP  
GND  
Description  
1
Enables the transceiver when Logic 1 and disables the transceiver when Logic 0.  
Device ground pin.  
2
3
LOAD  
BUS  
Accommodates an external pull-down resistor to ground to provide loss of ground protection.  
Waveshaped SAE Standard J-1850 Class B transmitter output and receiver input.  
Provides device operating input power.  
4
5
V
BAT  
6
4X/LOOP  
Tristate input mode control; Logic 0 = normal waveshaping, Logic 1 = waveshaping disabled for 4X  
transmitting, high impedance = loopback mode.  
7
8
Tx  
Rx  
Serial data input (DI) from the microcontroller to be transmitted onto Bus.  
Bus received serial data output (DO) sent to the microcontroller.  
33990  
3
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MAXIMUM RATINGS  
All voltages are with respect to ground unless otherwise noted.  
Rating  
Symbol  
Value  
Unit  
V
-16 to 40  
V
V
DC Supply Voltage (Note 1)  
BAT  
BAT  
V
-0.3 to 7.0  
-2.0 to 16  
V
V
V
Input I/O Terminals (Note 2)  
BUS and LOAD Outputs  
I/O(CPU)  
V
BUS  
ESD Voltage  
V
±2000  
±200  
Human Body Model (Note 3)  
Machine Model (Note 4)  
ESD1  
V
ESD2  
T
-65 to 150  
-40 to 125  
-40 to 150  
260  
°C  
°C  
Storage Temperature  
STG  
T
A
Operating Ambient Temperature  
Operating Junction Temperature  
Soldering Temperature (for 10 seconds)  
Thermal Resistance (Junction-to-Ambient)  
Notes  
T
J
°C  
T
°C  
SOLDER  
R
180  
°C/W  
θJ-A  
1. An external series diode must be used to provide reverse battery protection of the device.  
2. SLEEP, TX, RX, and 4X/LOOP are normally connected to a microcontroller.  
3. ESD1 testing is performed in accordance with the Human Body Model (C  
=100 pF, R  
=1500 ).  
ZAP  
ZAP  
4. ESD2 testing is performed in accordance with the Machine Model (C  
=200 pF, R  
=0 ).  
ZAP  
ZAP  
33990  
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STATIC ELECTRICAL CHARACTERISTICS  
Characteristics noted under conditions of 7.0 V VBAT 16 V, -40°C TA 125°C, SLEEP = 5.0 V unless otherwise noted. Typical  
values reflect the parameter's approximate midpoint average value with VBAT = 13 V, TA = 25°C. All positive currents are into the  
pin. All negative currents are out of the pin.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
POWER CONSUMPTION  
mA  
Operational Battery Current (RMS with Tx = 7.812 kHz Square Wave)  
BUS Load = 1380 to GND, 3.6 nF to GND  
IBAT(OP1)  
IBAT(OP2)  
3.0  
22.4  
11.5  
32  
BUS Load = 257 to GND, 20.2 nF to GND  
mA  
µA  
Battery Bus Low Input Current  
I
I
1.1  
6.4  
3.0  
8.5  
After SLEEP Toggle Low to High; Prior to Tx Toggling  
After Tx Toggle High to Low  
BAT(BUS L1)  
BAT(BUS L2)  
I
Sleep State Battery Current  
BAT(SLEEP)  
38.2  
65  
V
SLEEP = 0 V  
BUS  
V
V
BUS Input Receiver Threshold (Note 5)  
V
V
4.25  
2.4  
0.1  
3.9  
3.7  
3.0  
0.2  
BUS(IH)  
Threshold High (Bus Increasing until Rx 3.0 V)  
Threshold Low (Bus Decreasing until Rx 3.0 V)  
Threshold in Sleep State (SLEEP = 0 V)  
3.5  
3.4  
0.6  
BUS(IL)  
BUS  
V
TH(SLEEP)  
Hysteresis (V  
- V  
, SLEEP = 0 V)  
BUS(IH)  
BUS(IL)  
BUS(HYST)  
BUS-Out Voltage (257 Ω ≤ RBUS(L) to GND 1380 )  
8.2 V V 16 V, Tx = 5.0 V  
VBUS(OUT1)  
VBUS(OUT2)  
VBUS(OUT3)  
6.25  
6.9  
0.27  
8.0  
BAT  
V
- 1.6  
V
BAT  
BAT  
0.7  
4.25 V V  
8.2 V, Tx = 5.0 V  
BAT  
Tx = 0 V  
IBUS(SHORT)  
mA  
mA  
BUS Short Circuit Output Current  
60  
129  
170  
Tx = 5.0 V, -2.0 V VBUS 4.8 V  
BUS Leakage Current  
I
-0.5  
-0.5  
-0.055  
0.5  
0.25  
0.5  
1.0  
0.5  
-2.0 V V  
0 V V  
0 V (2.0 ms after Tx Falls to 0 V)  
BUS(LEAK1)  
BUS  
I
V  
BUS(LEAK2)  
BUS  
BAT  
I
0 V V  
8.0 V  
BUS(LEAK3)  
BUS  
TBUS(LIM)  
°C  
BUS Thermal Shutdown (Note 6) (Tx = 5.0 V, I  
= -0.1 mA)  
BUS  
150  
170  
190  
Increase Temperature until V  
2.5 V  
BUS  
TBUS(LIMHYS)  
ILOAD(LOG)  
IBUS(LOG)  
°C  
mA  
mA  
BUS Thermal Shutdown Hysteresis (Note 7)  
TBUS(LIM) - TBUS(REEN)  
10  
12  
15  
0.1  
0.1  
LOAD Input Current with Loss of Ground  
-1.0  
-1.0  
V
= -18 V (see Figure 2)  
LOAD  
BUS Input Current with Loss of Ground  
= -18 V (see Figure 2)  
V
BUS  
Notes  
5. Typical threshold value is the approximate actual occurring switch point value with V  
= 13 V, T = 25°C.  
A
BAT  
6. Device characterized but not production tested for thermal shutdown.  
7. Device characterized but not production tested for thermal shutdown hysteresis.  
33990  
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STATIC ELECTRICAL CHARACTERISTICS (continued)  
Characteristics noted under conditions of 7.0 V VBAT 16 V, -40°C TA 125°C, SLEEP = 5.0 V unless otherwise noted. Typical  
values reflect the parameter's approximate midpoint average value with VBAT = 13 V, TA = 25°C. All positive currents are into the  
pin. All negative currents are out of the pin.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
BUS (continued)  
IBUS(LOB)  
mA  
BUS Input Current with Loss of V  
BAT  
0.5  
V
= 9.0 V (see Figure 3)  
BUS  
L
V
V
LOAD Output  
ON  
0.07  
0.67  
0.2  
0.9  
I = 6.0 mA  
L
L
Unpowered LOAD Output  
DIO  
0.3  
V
= 0 V, I = 6.0 mA  
BAT  
L
Tx  
V
Tx Input Voltage  
V
V
Tx(IL)  
3.5  
0.8  
Tx Input Logic Low Level  
Tx Input Logic High Level  
Tx(IH)  
µA  
Tx Input Current  
I
50  
-2.0  
120  
-0.1  
200  
2.0  
V
= 5.0 V  
Tx(IH)  
Tx  
Tx  
I
V
= 0 V  
Tx(IL)  
LOOP  
µA  
V
4X/LOOP Input Current  
I
4X/LOOP(IL)  
-200  
-95  
95  
200  
V
V
= 0 V (Normal Mode)  
4X/LOOP  
4X/LOOP  
I
= 5.0 V (4X Mode)  
4X/LOOP(IH)  
4X/LOOP Input Threshold (Tx = 4096 Hz square wave)  
Normal Mode to Loopback Mode  
V
1.4  
3.2  
1.6  
3.43  
1.8  
3.6  
4X/LOOP(IL)  
Loopback Mode to 4X Mode  
V
4X/LOOP(IH)  
Rx  
V
V
V
Rx Output Voltage Low  
= 0 V, I = 1.6 mA  
Rx(LOW)  
0.01  
4.25  
2.0  
0.18  
4.48  
5.9  
0.4  
4.75  
8.0  
V
BUS  
Rx  
Rx Output Voltage High  
= 7.0 V, I = -200 µA  
V
Rx(HIGH)  
V
BUS  
Rx  
Rx Output Current  
VR = High; Short Circuit Protection Limits  
I
mA  
Rx  
x
SLEEP  
µA  
SLEEP Input Current  
ISLEEP(IL)  
ISLEEP(IH)  
1.0  
-0.003  
9.5  
-2.0  
20  
V
V
= 0 V  
SLEEP  
SLEEP  
= 5.0 V  
33990  
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DYNAMIC ELECTRICAL CHARACTERISTICS  
Characteristics noted under conditions of 7.0 V VBAT 16 V, -40°C TA 125°C, SLEEP = 5.0 V unless otherwise noted. Typical  
values reflect the parameter's approximate midpoint average value with VBAT = 13 V, TA = 25°C. All positive currents are into the  
pin. All negative currents are out of the pin.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
BUS  
t
µs  
rise(BUS)  
BUS Voltage Rise Time (Note 8) (9.0 V V  
Wave) (see Figure 4)  
16 V, Tx = 7.812 kHz Square  
16 V, Tx = 7.812 kHz Square  
BAT  
9.0  
9.0  
11.15  
11.86  
15  
15  
BUS Load = 3,300 pF and 1.38 kto GND  
BUS Load = 16,500 pF and 300 to GND  
t
µs  
fall(BUS)  
BUS Voltage Fall Time (Note 8) (9.0 V V  
BAT  
Wave) (see Figure 4)  
9.0  
9.0  
10.50  
11.17  
15  
15  
BUS Load = 3,300 pF and 1.38 kto GND  
BUS Load = 16,500 pF and 300 to GND  
t
µs  
µs  
Pulse Width Distortion Time (9.0 V V  
(see Figure 5)  
16 V, Tx = 7.812 kHz Square Wave)  
pwd(BUS)  
t
BAT  
35  
62  
93  
25  
BUS Load = 3,300 pF and 1.38 kto GND  
Propagation Delay  
(BUS)  
pd  
17.7  
Tx Threshold to Rx Threshold  
Tx  
t
µs  
Tx to BUS Delay Time (Tx = 2.5 V to V  
= 3.875 V) (Figure 6)  
TxDelay  
BUS  
13  
2.6  
17.3  
4.0  
24  
4X Mode  
Normal Mode  
t
80  
40  
µs  
µs  
SLEEP to Tx Setup Time (Figure 6)  
SLEEPTxSU  
Rx  
Rx Output Delay Time (Tx = 2.5 V to V  
= 3.875 V) (see Figure 7)  
BUS  
t
t
0.11  
0.38  
2.0  
2.0  
RxDelay/L–H  
RxDelay/H–L  
Low-to-Output High  
High-to-Output Low  
µs  
µs  
Rx Output Transition Time (C = 50 pF to GND, 10% and 90% Points)  
Rx  
(see Figure 8)  
t
t
0.34  
0.08  
1.0  
1.0  
RxTrans/L–H  
RxTrans/H–L  
Low-to-Output High  
High-to-Output Low  
Rx Output Transition Time (Note 9) (C = 50 pF to GND, SLEEP = 0 V, 10% and  
Rx  
90% Points) (see Figure 8)  
t
t
0.32  
0.08  
5.0  
5.0  
RxTrans/L–H  
RxTrans/H–L  
Low-to-Output High  
High-to-Output Low  
Notes  
8. Typical is the parameter's approximate average value with V  
9. Rx Output Transition Time from a sleep state.  
= 13 V, T = 25°C.  
A
BAT  
33990  
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Electrical Performance Curves  
Test Figures  
5.0 V  
Tx  
0 V  
64 µs  
33990  
IBUS(LOG)  
-18 V  
VBAT  
GND  
BUS  
t
pwd(min)  
t
pwd  
t
pwd(max)  
-18 V  
LOAD  
1.5 V  
Floating  
ILOAD(LOG)  
Figure 2. Loss of Ground Test Circuit  
Figure 5. Pulse Width Distortion  
33990  
SLEEP  
Tx  
2.5 V  
IBUS(LOB)  
9.0 V  
VBAT  
GND  
BUS  
Floating  
t
SLEEPTxSU  
2.5 V  
t
3.875 V  
TxDelay  
BUS  
Figure 3. Loss of VBAT Test Circuit  
Figure 6. SLEEP to Tx Delay Times  
3.5 V  
Tx  
122 µs  
3.875 V  
BUS  
64 µs  
0.8 V  
t
RxDelay/low-  
to-output high  
t
RxDelay/high-to-  
80%  
output low  
BUS  
Rx  
2.5 V  
20%  
t
t
fall  
rise  
Figure 4. BUS Rise and Fall Times  
Figure 7. BUS-to-Rx Delay Time  
33990  
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t
/
RxTrans L–H  
t
/
RxTrans H–L  
90%  
90%  
Rx  
10%  
10%  
Figure 8. Rx Rise and Fall Time  
33990  
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SYSTEM/APPLICATION INFORMATION  
INTRODUCTION  
The 33990 is a serial transceiver device designed to meet  
DMOS power FETs. Though the 33990 was principally  
designed for automotive applications requiring SAE J-1850  
Class B standards, it is suited for other serial communication  
applications. It is parametrically specified over an ambient  
the SAE Standard J-1850 Class B performance for bi-  
directional half-duplex communication. The device is packaged  
in an economical surface-mount SOIC plastic package. An  
internal block diagram of the device is shown in Figure 1.  
temperature range of -40°C TA 125°C and 7.0 V VBAT  
16 V supply. The economical 8-pin SOICN surface mount  
The 33990 derives its robustness to temperature and voltage  
extremes from being built on a SMARTMOS process,  
plastic package makes the device a cost-effective solution.  
incorporating CMOS logic, bipolar/MOS analog circuitry, and  
FUNCTIONAL DESCRIPTION  
maximum capacitance and resistance on the Class B bus is  
given by the expressions shown in Table 1.  
Input Power (V  
Pin)  
BAT  
This is the only required input power source necessary to  
operate the 33990. The internal voltage reference of the 33990  
will remain fully operational with a minimum of 9.0 V on this pin.  
Bus transmissions can continue with battery voltages down to  
5.0 V. The bus output voltage will follow the battery voltage  
down and, in doing so, track approximately 1.6 V below the  
battery voltage. The device will continue to receive and transmit  
bus data to the microcontroller with battery voltages as low as  
4.25 V. The pin can withstand voltages from -16 V to 40 V.  
One Primary Node  
470 pF  
1.5 kΩ  
3300 pF  
10.6 kΩ  
Figure 9. Minimum Bus Load  
Sleep Input (SLEEP Pin)  
Primary Node  
This input is used to enable and disable the Class B  
transmitter. The Class B receiver is always enabled so long as  
adequate VBAT pin voltage is applied. When the SLEEP pin  
voltage is 5.0 V, the Class B transmitter is enabled. If this input  
is 0 V, the Class B transmitter will be disabled and less than  
65 µA of current will be drawn by the VBAT pin. The pin also  
3300 pF  
470 pF  
1.5 kΩ  
10.6 kΩ  
provides a 5.0 V reference, internal to the device, used to  
establish the Rx output level and slew rate times.  
24 Secondary Nodes  
Class B Functional Description  
The transmitter provides an analog waveshaped 0 V to 7.0 V  
waveform on the BUS output. It also receives waveforms and  
transmits a digital level signal back to a logic IC. The transmitter  
can drive up to 32 secondary Class B transceivers (see  
Figures 9 and 10). These secondary nodes may be at ground  
potentials that are ±2.0 V relative to the control assembly.  
Waveshaping will only be maintained during 2 of the 4 corners  
when the 0 to ±2.0 V ground potential difference condition  
exists. The 33990 is a secondary node on the Class B bus.  
Each secondary transceiver has a 470 ±10% pF capacitor on  
its output for EMI suppression purposes, as well as a 10.6 kΩ  
±5% pull-down resistor to ground. The primary node has a  
3300 ±10% pF capacitor on its output for EMI suppression, as  
well as a 1.5 kΩ ±5% pull-down resistor to ground. With more  
than 26 nodes, there is no primary node (see Figure 11). All  
nodes will have a 470 ±10% pF capacitor and a 10.6 kΩ ±5%  
pull-down resistor. No matter how many secondary nodes are  
on the Class B bus, the RC time constant of the Class B bus is  
maintained at approximately 5.0 µs. The minimum and  
11280 pF  
442 Ω  
Figure 10. Maximum Number of Nodes  
31 Secondary Nodes  
470 pF  
342 Ω  
14570 pF  
10.6 kΩ  
Figure 11. Maximum Bus Load  
33990  
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Table 1. Class B Bus Capacitance and Resistance Expressions  
Level  
Minimum  
Maximum  
Capacitance  
Resistance to Ground  
(3.3 x 0.9) + (0.47 x 0.9) = 3.39 nF  
(3.3 x 1.1) + 25(0.47 x 1.1) = 16.55 nF  
(1.5 x 0.95) || (10.6 x 0.95) / 25 = 314 Ω  
(1.5 x 1.05) || (10.6 x 1.05) = 1.38 kΩ  
APPLICATIONS  
the assembly, the bus transmitter's output stage will be disabled  
and the leakage current from the BUS output will not source or  
sink more than 100 µA of current. The transceiver will operate  
with a remote ground offset of ±2.0 V, but the lower corners of  
transmission will not be rounded during this condition.  
Class B Module Inputs  
Transmitter Data from the MCU (Tx)  
The Tx input is a push-pull (N-channel/P-channel FETs)  
buffer with hysteresis for noise immunity purposes. This pin is a  
5.0 V CMOS logic level input from the MCU following a true  
logic protocol. A logic [0] input drives the BUS output to 0 V (via  
the external pull-down resistor to ground on each node), while  
a logic [1] input produces a high voltage at the BUS output. A  
logic [0] input level is guaranteed when the Tx input pin is open-  
circuited by virtue of an internal 40 kpull-down resistor. No  
external resistor is required for its operation.  
Receiver Output to the Microcontroller (Rx)  
This is a 5.0 V CMOS compatible push-pull output used to  
send received data to the microcontroller. It does not require an  
external pull-up resistor to be used. The receiver is always  
enabled and draws less than 65 µA of current from VBAT. The  
receive threshold is dependent on the state of the SLEEP pin.  
The receiver circuitry is able to operate with VBAT voltages as  
low as 4.25 V and still remains capable of “waking up” the  
33990 when remote Class B activity is detected.  
Waveshaping and 4X/Loop  
This input is a tristateable input: 0 V = normal waveshaping,  
5.0 V = waveshaping is disabled for 4X transmitting, and high  
impedance = loopback mode of operation. This is a logic level  
input used to select whether waveshaping for the Class B  
output is enabled or disabled. A logic [0] enables waveshaping,  
while a logic [1] disables waveshaping. In the 4X mode, the  
BUS output rise time is less than 2.0 µs and the fall time is less  
than 5.0 µs (owing to the external RC pull-down to ground). In  
the loopback condition, the Tx signal is fed back to the Rx  
output after waveshaping without being transmitted onto the  
BUS. This mode of operation is useful for system diagnostic  
purposes.  
When the SLEEP pin is 0 V and message activity occurs on  
the bus, the receiver passes the bus message through to the  
microcontroller. The 33990 does not automatically “wake up”  
from a sleep state when bus activity occurs: the microcontroller  
must tell it to do so.  
In the Static Electrical Characteristics table, the maximum  
voltage for Rx is specified as 4.75 V over an operating range of  
-40°C to 125°C temperature and 7.0 V to 16 V VBAT. This  
maximum Rx voltage is compatible with the minimum VDD  
voltage of microcontrollers to prevent the 33990 from sourcing  
current to the microcontroller's output.  
Class B Module Outputs  
Transceiver Output (BUS)  
Switched Ground Output (LOAD)  
Normally this output is a saturated switch to ground, which  
pulls down the external resistor between the BUS and LOAD  
outputs. In the event ground is lost to the assembly, the LOAD  
output will bias itself “off” and will not leak more than 100 µA of  
current out of this pin.  
This is the output driver stage that sources current to the bus.  
Its output follows the waveshaped waveform input. Its output  
voltage is limited to 6.25 V to 8.0 V under normal battery level  
conditions. The limited level is controlled by an internal  
regulator/clamp circuit. Once the battery voltage drops below  
9.0 V, the regulator/clamp circuit saturates, causing the bus  
voltage to track the battery voltage. A 1.5 kΩ ±5% external  
resistor (as well as any 10.6 kpull-down resistors of any  
secondary nodes) sinks the current to discharge the capacitors  
during high-to-low transitions. This sourcing output is short  
circuit-protected (60 mA to 170 mA) against a short to -2.0 V  
and sinks less than 1.0 mA when shorted to VBAT. If a short  
Overtemperature Shutdown  
If the BUS output becomes shorted to ground for any  
duration, an overtemperature shutdown circuit “latches off” the  
output source transistor whenever the die temperature exceeds  
150°C to 190°C. The output transistor remains latched off until  
the Tx input is toggled from a logic [0] to a logic [1]. The rising  
edge provides the clearing function, provided the locally sensed  
temperature is 10°C to 15°C below the latch-off temperature trip  
temperature.  
occurs, the overtemperature shutdown circuit protects the  
source driver of the device. In the event battery power is lost to  
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Waveshaping  
The LOAD pin of the device has an internal transistor switch  
connected to it that is normally saturated to ground. This pulls  
the LOAD-side of the external resistor (tied from BUS to LOAD)  
to ground under normal conditions. The LOAD pin switch is  
essentially that of an “upside down” FET, which is normally  
biased “on” so long as module ground is present and biased  
“off” when loss-of-ground occurs. When a loss of assembly  
ground occurs, the load transistor switch is self-biased “off”,  
allowing no more than 100 µA of leakage current to flow in the  
LOAD pin. During such a loss of assembly ground condition, the  
BUS and LOAD pins exhibit a high impedance to VBAT; all other  
Waveshaping is incorporated into the 33990 to minimize  
radiated EMI emissions.  
Receiver Protocol  
The Class B communication scheme uses a variable pulse  
width (VPW) protocol. The microcontroller provides the VPW  
decoding function. Once the receiver detects a transition on Rx,  
it starts an internal counter. The initial “start of frame” bit is a  
logic [1] and lasts 200 µs. For subsequent bits, if there is a bus  
transition before 96 µs, one logic state is inferred. If there is a  
bus transition after 96 µs, the other logic state is inferred. The  
“end of data” bit is a logic [0] and lasts 200 µs. If there is no  
activity on the bus for 280 µs to 320 µs following a broadcast  
message, multiple unit nodes may arbitrate for control of the  
next message. During an arbitration, after the “start of frame” bit  
has been transmitted, the secondary node transmitting the  
most consecutive logic [0] bits will be granted sole transmission  
access to the bus for that message.  
pins will exhibit a low impedance to VBAT. During this condition  
the BUS pin is prevented from sourcing any current or loading  
the bus, which would cause a corruption of any data being  
transmitted on the bus. While a particular assembly is  
experiencing a loss of ground, all other assembly nodes are  
permitted to function normally. It should be noted that with other  
nodes existing on the bus, the bus will always have some  
minimum/maximum impedance to ground as shown in Table 1,  
page 11.  
Loss of Assembly Ground Connection  
Loss of Assembly Battery Connection  
The definition of a loss of assembly ground condition at the  
device level is that all pins of the 33990, with the exception of  
The definition of a loss of assembly battery condition at the  
device level is that the VBAT pin of the 33990 sees an infinite  
impedance to VBAT, but there is some undefined impedance  
BUS and LOAD, see a very low impedance to VBAT  
.
between these pins and ground.  
33990  
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12  
Freescale Semiconductor, Inc.  
PACKAGE DIMENSIONS  
D SUFFIX  
(8-LEAD SOIC NARROW BODY)  
PLASTIC PACKAGE  
CASE 751-06  
ISSUE T  
NOTES:  
D
A
C
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. DIMENSIONS ARE IN MILLIMETERS.  
3. DIMENSION D AND E DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.  
5. DIMENSION B DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.127 TOTAL IN EXCESS OF THE B  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
8
1
5
4
M
M
0.25  
B
H
E
h X 45  
°
MILLIMETERS  
θ
B
e
DIM MIN  
MAX  
1.75  
0.25  
0.49  
0.25  
5.00  
4.00  
A
A1  
B
C
D
E
e
H
h
1.35  
0.10  
0.35  
0.19  
4.80  
3.80  
A
C
SEATING  
PLANE  
L
1.27 BSC  
0.10  
5.80  
0.25  
0.40  
0
6.20  
0.50  
1.25  
7
A1  
B
0.25  
L
θ
M
S
S
C B  
A
°
°
33990  
13  
MOTOROLA ANALOG INTEGRATED CIRFCoUIrTMDEoVrICeEIDnAfToArmation On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
NOTES  
33990  
14  
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
NOTES  
33990  
15  
MOTOROLA ANALOG INTEGRATED CIRFCoUIrTMDEoVrICeEIDnAfToArmation On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied  
copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.  
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee  
regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product  
or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be  
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© Motorola, Inc. 2003  
HOW TO REACH US:  
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MC33990/D  
For More Information On This Product,  
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WWW.ALLDATASHEET.COM  
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配单直通车
MC33990D产品参数
型号:MC33990D
是否Rohs认证: 不符合
生命周期:Transferred
包装说明:PLASTIC, SOIC-8
Reach Compliance Code:unknown
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:8.67
Is Samacsys:N
差分输出:NO
驱动器位数:1
输入特性:SCHMITT TRIGGER
接口集成电路类型:LINE TRANSCEIVER
接口标准:GENERAL PURPOSE
JESD-30 代码:R-PDSO-G8
长度:4.9 mm
功能数量:1
端子数量:8
最高工作温度:125 °C
最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
认证状态:Not Qualified
最大接收延迟:2000 ns
接收器位数:1
座面最大高度:1.75 mm
最大供电电压:16 V
最小供电电压:7 V
标称供电电压:13 V
表面贴装:YES
温度等级:AUTOMOTIVE
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
最大传输延迟:24000 ns
宽度:3.9 mm
Base Number Matches:1
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