HMC851LC3C到现货批次新！

HMC851LC3C到现货批次新！目前有102只可以发货，批次2011+，更多包装详情联系18038133932朱泉

HMC851LC3C特点：

• 输入内部端接至50 Ω

• 差分与单端工作

• 传播延迟： 97 ps

• 快速上升和下降时间： 15/14 ps

• 可编程差分输出电压摆幅： 500 - 1,300 mV

• 低功耗： 241 mW（典型值）

• 单电源： -3.3V

• 16引脚3x3mm SMT封装： 9mm2

• Inputs Terminated Internally in 50 Ohms

• Differential & Singe-Ended Operation

• Fast Rise and Fall Times: 15 / 14 ps

• Low Power Consumption: 241 mW typ.

• Programmable Differential

•  Output Voltage Swing: 500 - 1300 mV

• Propagation Delay: 97 ps

• Single Supply: -3.3V

• 16 Lead Ceramic 3x3 mm SMT Package: 9 mm2

HMC851LC3C应用：

• RF ATE应用

• 宽带测试和测量

• 串行数据传输高达28 Gbps

The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. The exposed metal package base must be connected to Vee. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. Install jumper on JP1 to short VR to GND for normal operation