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  • NX2301P图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • NX2301P 现货库存
  • 数量1015 
  • 厂家NXP 
  • 封装SOT23 
  • 批号 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
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  • NX2301P图
  • 深圳市富科达科技有限公司

     该会员已使用本站13年以上
  • NX2301P 现货库存
  • 数量28998 
  • 厂家Nexperia 
  • 封装SOT23 
  • 批号22+ 
  • 全新原装进口现货特价热卖,长期供货
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    QQ:1220223788QQ:1220223788 复制
  • 0755-28767101 QQ:1327510916QQ:1220223788
  • NX2301P图
  • 深圳市芯球通科技有限公司

     该会员已使用本站8年以上
  • NX2301P 现货库存
  • 数量8000 
  • 厂家NXP/恩智浦 
  • 封装SMD 
  • 批号20+ 
  • 原装现货,假一赔十,可开原型号发票
  • QQ:591882259QQ:591882259 复制
  • 0755-23816608 QQ:591882259
  • NX2301P图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • NX2301P 现货库存
  • 数量18000 
  • 厂家NXP 
  • 封装SOT23-3 
  • 批号新年份 
  • 新到现货、一手货源、当天发货、bom配单
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  • 0755-84507451 QQ:1435424310
  • NX2301P,215图
  • 深圳市斌腾达科技有限公司

     该会员已使用本站9年以上
  • NX2301P,215 现货库存
  • 数量279000 
  • 厂家Nexperia USA Inc. 
  • 封装TO-236AB 
  • 批号18/19+ 
  • 一级代理进口原装!长期供应!绝对优势价格(诚信经营
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  • 0755-82815082 QQ:2881704051QQ:2881704535
  • NX2301P图
  • 深圳市宗天技术开发有限公司

     该会员已使用本站10年以上
  • NX2301P 现货库存
  • 数量20000 
  • 厂家NXP(恩智浦) 
  • 封装N/A 
  • 批号21+ 
  • 只做原装正品原厂原包
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    QQ:2824256784QQ:2824256784 复制
  • 0755-88601327 QQ:444961496QQ:2824256784
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  • 深圳市一呈科技有限公司

     该会员已使用本站9年以上
  • NX2301P 215 现货热卖
  • 数量3860 
  • 厂家NXP/恩智浦 
  • 封装SOT23-3 
  • 批号23+ 
  • ▉原厂渠道▉支持实单
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  • 0755-82779553 QQ:3003797048QQ:3003797050
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  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • NX2301P,215 现货热卖
  • 数量630000 
  • 厂家NEXPERIA 
  • 封装SOT23 
  • 批号23+ 
  • 全新原装正品现货特价
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    QQ:2885348317QQ:2885348317 复制
  • 0755-82519391 QQ:2885348339QQ:2885348317
  • NX2301P图
  • 深圳市拓森弘电子有限公司

     该会员已使用本站1年以上
  • NX2301P
  • 数量5300 
  • 厂家Nexperia(安世) 
  • 封装 
  • 批号21+ 
  • 全新原装正品,库存现货实报
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  • 13714410484 QQ:1300774727
  • NX2301P图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • NX2301P
  • 数量85000 
  • 厂家NEXPERIA/安世 
  • 封装17+ 
  • 批号23+ 
  • 真实库存全新原装正品!代理此型号
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  • 0755-23605827 QQ:2881495753
  • NX2301P图
  • 集好芯城

     该会员已使用本站13年以上
  • NX2301P
  • 数量17167 
  • 厂家NXP/恩智浦 
  • 封装NA 
  • 批号最新批次 
  • 原装原厂 现货现卖
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    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • NX2301P图
  • 深圳市欧昇科技有限公司

     该会员已使用本站10年以上
  • NX2301P
  • 数量120000 
  • 厂家NXP/恩智浦 
  • 封装SOT-23-3 
  • 批号2021+ 
  • 原厂/代理渠道,价格优势
  • QQ:2885514621QQ:2885514621 复制
    QQ:1017582752QQ:1017582752 复制
  • 0755-83237676 QQ:2885514621QQ:1017582752
  • NX2301P图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • NX2301P
  • 数量8800 
  • 厂家NXP/恩智浦 
  • 封装SMD 
  • 批号新年份 
  • 羿芯诚只做原装,原厂渠道,价格优势可谈!
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  • 0755-82570683 QQ:2853992132
  • NX2301P图
  • 深圳市三得电子有限公司

     该会员已使用本站15年以上
  • NX2301P
  • 数量91752 
  • 厂家NEXPERIA/安世 
  • 封装SOT-23 
  • 批号2024 
  • 深圳原装现货库存,欢迎咨询合作
  • QQ:414322027QQ:414322027 复制
    QQ:565106636QQ:565106636 复制
  • 13509684848 QQ:414322027QQ:565106636
  • NX2301P,215图
  • 深圳市积美福电子科技有限公司

     该会员已使用本站4年以上
  • NX2301P,215
  • 数量1560 
  • 厂家NEXPERIA/安世 
  • 封装SOT-23-3 
  • 批号21+ 
  • 只做原装正品,深圳现货库存
  • QQ:647176908QQ:647176908 复制
    QQ:499959596QQ:499959596 复制
  • 0755-83228296 QQ:647176908QQ:499959596
  • NX2301P图
  • 深圳市科庆电子有限公司

     该会员已使用本站16年以上
  • NX2301P
  • 数量22554 
  • 厂家NXP 
  • 封装SOT-23 
  • 批号23+ 
  • 只做进口原装/到货/可含13%税
  • QQ:2850188252QQ:2850188252 复制
    QQ:2850188256QQ:2850188256 复制
  • 0755 QQ:2850188252QQ:2850188256
  • NX2301P图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • NX2301P
  • 数量1015 
  • 厂家NXP 
  • 封装SOT23 
  • 批号 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
  • 075584507705 QQ:2881512844
  • NX2301P图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • NX2301P
  • 数量127048 
  • 厂家NXP(恩智浦) 
  • 封装NA 
  • 批号23+ 
  • 原厂可订货,技术支持,直接渠道。可签保供合同
  • QQ:3007947087QQ:3007947087 复制
    QQ:3007947087QQ:3007947087 复制
  • 0755-83061789 QQ:3007947087QQ:3007947087
  • NX2301P图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站15年以上
  • NX2301P
  • 数量98000 
  • 厂家NEXP 
  • 封装SOT-23 
  • 批号24+ 
  • 假一罚十,原装进口正品现货供应,价格优势。
  • QQ:198857245QQ:198857245 复制
  • 0755-82865294 QQ:198857245
  • NX2301P图
  • 北京首天国际有限公司

     该会员已使用本站16年以上
  • NX2301P
  • 数量22554 
  • 厂家NXP 
  • 封装SOT-23 
  • 批号2024+ 
  • 百分百原装正品,现货库存
  • QQ:528164397QQ:528164397 复制
    QQ:1318502189QQ:1318502189 复制
  • 010-62565447 QQ:528164397QQ:1318502189
  • NX2301P图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • NX2301P
  • 数量12500 
  • 厂家NXP 
  • 封装SOT-23 
  • 批号2023+ 
  • 绝对原装全新正品现货/优势渠道商、原盘原包原盒
  • QQ:1002316308QQ:1002316308 复制
    QQ:515102657QQ:515102657 复制
  • 美驻深办0755-83777708“进口原装正品专供” QQ:1002316308QQ:515102657
  • NX2301P图
  • 千层芯半导体(深圳)有限公司

     该会员已使用本站9年以上
  • NX2301P
  • 数量5500 
  • 厂家NXP 
  • 封装SMD 
  • 批号2019+ 
  • 长期供应原装现货实单可谈
  • QQ:2685694974QQ:2685694974 复制
    QQ:2593109009QQ:2593109009 复制
  • 0755-83978748,0755-23611964,13760152475 QQ:2685694974QQ:2593109009
  • NX2301P图
  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • NX2301P
  • 数量5000 
  • 厂家NXP 
  • 封装SOT23 
  • 批号2024+ 
  • 百分百原装正品,现货库存
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931 QQ:857273081QQ:1594462451
  • NX2301PVL图
  • 深圳市一呈科技有限公司

     该会员已使用本站9年以上
  • NX2301PVL
  • 数量300000 
  • 厂家NEXPERIA/安世 
  • 封装SOT-23 
  • 批号22+ 
  • 原厂代理支持订货
  • QQ:3003797048QQ:3003797048 复制
    QQ:3003797050QQ:3003797050 复制
  • 0755-82779553 QQ:3003797048QQ:3003797050
  • NX2301P图
  • 深圳市硅诺电子科技有限公司

     该会员已使用本站8年以上
  • NX2301P
  • 数量18320 
  • 厂家NXP 
  • 封装SOT-23 
  • 批号17+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
  • QQ:1091796029QQ:1091796029 复制
    QQ:916896414QQ:916896414 复制
  • 0755-82772151 QQ:1091796029QQ:916896414
  • NX2301P,215图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • NX2301P,215
  • 数量12500 
  • 厂家NEXPERIA 
  • 封装3000 
  • 批号2023+ 
  • 绝对原装正品现货/优势渠道商、原盘原包原盒
  • QQ:1002316308QQ:1002316308 复制
    QQ:515102657QQ:515102657 复制
  • 深圳分公司0755-83777708“进口原装正品专供” QQ:1002316308QQ:515102657
  • NX2301P图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • NX2301P
  • 数量83500 
  • 厂家NXP-恩智浦 
  • 封装SOT-23-3 
  • 批号▉▉:2年内 
  • ▉▉¥10一一有问必回一一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • NX2301P125图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • NX2301P125
  • 数量78800 
  • 厂家NXP-恩智浦 
  • 封装SOT-23-3 
  • 批号▉▉:2年内 
  • ▉▉¥10一一有问必回一一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • NX2301PVL图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • NX2301PVL
  • 数量236000 
  • 厂家NXP-恩智浦 
  • 封装TO-236-3 
  • 批号▉▉:2年内 
  • ▉▉¥0.5元一有问必回一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • NX2301P125图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • NX2301P125
  • 数量78800 
  • 厂家NXP-恩智浦 
  • 封装SOT-23-3 
  • 批号▉▉:2年内 
  • ▉▉¥10一一有问必回一一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • NX2301P,215图
  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • NX2301P,215
  • 数量5000 
  • 厂家Vishay Semiconductors 
  • 封装贴/插片 
  • 批号2024+ 
  • 百分百原装正品,现货库存
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    QQ:1594462451QQ:1594462451 复制
  • 010-62104891 QQ:857273081QQ:1594462451
  • NX2301P图
  • 深圳市湘达电子有限公司

     该会员已使用本站10年以上
  • NX2301P
  • 数量6600 
  • 厂家NEXPERIA/安世 
  • 封装TO-236AB 
  • 批号20+ 
  • 原盒原装原标签,市场最低价。
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  • NX2301P 215图
  • 深圳市炎凯科技有限公司

     该会员已使用本站7年以上
  • NX2301P 215
  • 数量132645 
  • 厂家NXP 
  • 封装SOT23-3 
  • 批号24+ 
  • 原装现货
  • QQ:354696650QQ:354696650 复制
    QQ:2850471056QQ:2850471056 复制
  • 0755-89587732 QQ:354696650QQ:2850471056
  • NX2301PVL图
  • 深圳市高捷芯城科技有限公司

     该会员已使用本站11年以上
  • NX2301PVL
  • 数量14843 
  • 厂家Nexperia(安世) 
  • 封装SOT-23(TO-236) 
  • 批号23+ 
  • 支持大陆交货,美金交易。原装现货库存。
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  • 0755-83062789 QQ:3007977934QQ:3007947087

产品型号NX2301P的概述

NX2301P芯片概述 NX2301P是一款高效能、低功耗的集成电路,专门设计用于多种应用,包括但不限于工业控制、智能家居、消费电子等。这款芯片拥有多种功能模块,使其在各种不同的应用场景中具备了很高的灵活性。NX2301P不仅支持多种通信协议,还具备强大的计算能力,有助于实现复杂控制算法和数据处理任务。 NX2301P的核心架构采用了先进的制造工艺,确保其在高温和高压环境下稳定工作。该芯片的功耗设计在动态和静态状态下都非常出色,使其成为对能耗敏感应用的理想选择。此外,NX2301P的易于集成特性,使用户在系统设计时能够大大简化PCB布局和电路设计,从而加快产品上市的速度。 NX2301P的详细参数 NX2301P的具体参数如下: - 主频:最高可达120 MHz - 工作电压:3.3V ± 10% - 功耗:典型功耗约为50 mW - 引脚数:32个引脚封装 - 存储器: - 内部...

产品型号NX2301P的Datasheet PDF文件预览

NX2301P  
20 V, 2 A P-channel Trench MOSFET  
Rev. 1 — 26 October 2010  
Product data sheet  
1. Product profile  
1.1 General description  
P-channel enhancement mode Field-Effect Transistor (FET) in a small  
SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using  
Trench MOSFET technology.  
1.2 Features and benefits  
„ 1.8 V RDSon rated for Low Voltage Gate Drive  
„ Very fast switching  
„ Trench MOSFET technology  
„ AEC-Q101 qualified  
1.3 Applications  
„ Relay driver  
„ High-speed line driver  
„ High-side loadswitch  
„ Switching circuits  
1.4 Quick reference data  
Table 1.  
Quick reference data  
Symbol Parameter  
Conditions  
Tamb = 25 °C  
Tamb = 25 °C  
Min  
Typ  
Max  
20  
±8  
Unit  
V
VDS  
VGS  
ID  
drain-source voltage  
-
-
-
-
-
-
gate-source voltage  
drain current  
V
[1]  
[2]  
Tamb = 25 °C;  
VGS = 4.5 V  
2  
A
RDSon  
drain-source on-state  
resistance  
Tj = 25 °C;  
-
100  
120  
mΩ  
VGS = 4.5 V;  
ID = 1 A  
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2, t 5 s.  
[2] Pulse test: tp 300 μs; δ ≤ 0.01.  
NX2301P  
NXP Semiconductors  
20 V, 2 A P-channel Trench MOSFET  
2. Pinning information  
Table 2.  
Pinning  
Pin  
1
Symbol  
Description  
gate  
Simplified outline  
Graphic symbol  
G
S
D
D
3
2
source  
drain  
3
G
1
2
S
017aaa094  
3. Ordering information  
Table 3.  
Ordering information  
Type number Package  
Name  
Description  
Version  
NX2301P  
TO-236AB plastic surface-mounted package; 3 leads  
SOT23  
4. Marking  
Table 4.  
Marking codes  
Type number  
Marking code[1]  
NX2301P  
MG*  
[1] * = placeholder for manufacturing site code  
5. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
Tamb = 25 °C  
Tamb = 25 °C  
VGS = 4.5 V  
Tamb = 25 °C  
Tamb = 100 °C  
Min  
Max  
20  
±8  
Unit  
V
VDS  
VGS  
ID  
drain-source voltage  
-
-
gate-source voltage  
drain current  
V
[1]  
-
-
-
2  
A
A
A
1.2  
6  
IDM  
peak drain current  
Tamb = 25 °C;  
single pulse; tp 10 μs  
NX2301P  
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Product data sheet  
Rev. 1 — 26 October 2010  
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20 V, 2 A P-channel Trench MOSFET  
Table 5.  
Limiting values …continued  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
Min  
Max  
400  
710  
2.8  
Unit  
mW  
mW  
W
[2]  
[1]  
Ptot  
total power dissipation  
Tamb = 25 °C  
-
-
-
Tsp = 25 °C  
Tj  
junction temperature  
ambient temperature  
storage temperature  
150  
+150  
+150  
°C  
Tamb  
Tstg  
55  
65  
°C  
°C  
Source-drain diode  
IS source current  
[1]  
Tamb = 25 °C  
-
0.7  
A
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2, t 5 s.  
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
017aaa001  
017aaa002  
120  
120  
P
I
der  
der  
(%)  
(%)  
80  
80  
40  
40  
0
75  
0
75  
25  
25  
75  
125  
175  
(°C)  
25  
25  
75  
125  
T
amb  
175  
(°C)  
T
amb  
Ptot  
-----------------------  
ID  
-------------------  
Pder  
=
× 100 %  
Ider  
=
× 100 %  
Ptot(25°C)  
ID(25°C)  
Fig 1. Normalized total power dissipation as a  
function of ambient temperature  
Fig 2. Normalized continuous drain current as a  
function of ambient temperature  
NX2301P  
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Product data sheet  
Rev. 1 — 26 October 2010  
3 of 16  
NX2301P  
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20 V, 2 A P-channel Trench MOSFET  
017aaa095  
10  
Limit R  
= V /I  
DS D  
DSon  
I
D
(1)  
(A)  
1  
(2)  
(3)  
(4)  
1  
10  
(5)  
2  
10  
10  
1  
2
1  
10  
10  
V
DS  
(V)  
I
DM = single pulse  
(1) tp = 1 ms  
(2) tp = 10 ms  
(3) DC; Tsp = 25 °C  
(4) tp = 100 ms  
(5) DC; Tamb = 25 °C; drain mounting pad 6 cm2  
Fig 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of  
drain-source voltage  
6. Thermal characteristics  
Table 6.  
Symbol  
Rth(j-a)  
Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
[1]  
[2]  
thermal resistance from  
junction to ambient  
in free air  
-
-
-
-
-
-
315  
175  
45  
K/W  
K/W  
K/W  
Rth(j-sp)  
thermal resistance from  
junction to solder point  
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2, t 5 s.  
NX2301P  
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Product data sheet  
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4 of 16  
NX2301P  
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20 V, 2 A P-channel Trench MOSFET  
017aaa096  
3
10  
Z
th(j-a)  
duty cycle = 1  
0.75  
(K/W)  
0.5  
2
10  
0.33  
0.2  
0.25  
0.1  
0.05  
0.01  
10  
0.02  
0
1
10  
3  
2  
1  
2
3
10  
10  
1
10  
10  
10  
t
p
(s)  
FR4 PCB, standard footprint  
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values  
017aaa097  
3
10  
Z
th(j-a)  
(K/W)  
duty cycle = 1  
0.75  
2
0.5  
10  
0.33  
0.2  
0.25  
0.1  
0
0.05  
10  
0.02  
0.01  
1
10  
3  
2  
1  
2
3
10  
10  
1
10  
10  
10  
t
p
(s)  
FR4 PCB, mounting pad for drain 6 cm2  
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values  
NX2301P  
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Product data sheet  
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7. Characteristics  
Table 7.  
Characteristics  
Tj = 25 °C unless otherwise specified.  
Symbol Parameter  
Static characteristics  
Conditions  
Min  
Typ  
Max Unit  
V(BR)DSS  
drain-source breakdown ID = 250 μA; VGS = 0 V  
20  
-
-
V
voltage  
VGS(th)  
gate-source threshold  
voltage  
ID = 250 μA; VDS = VGS  
0.5 0.75 1.1  
V
IDSS  
drain leakage current  
gate leakage current  
VDS = 20 V; VGS = 0 V  
VGS = ±8 V; VDS = 0 V  
-
-
-
-
1  
μA  
IGSS  
±100 nA  
[1]  
RDSon  
drain-source on-state  
resistance  
VGS = 4.5 V; ID = 1 A  
Tj = 25 °C  
100  
-
120  
180  
190  
270  
mΩ  
mΩ  
mΩ  
mΩ  
Tj = 150 °C  
VGS = 2.5 V; ID = 1 A  
-
-
155  
210  
VGS = 1.8 V;  
ID = 0.2 A  
[1]  
gfs  
forward  
VDS = 5 V; ID = 2 A  
-
4.7  
-
S
transconductance  
Dynamic characteristics  
QG(tot)  
QGS  
QGD  
Ciss  
total gate charge  
gate-source charge  
gate-drain charge  
input capacitance  
output capacitance  
ID = 2.2 A; VDS = 6 V;  
VGS = 4.5 V  
-
-
-
-
-
-
4.5  
1.1  
0.9  
380  
135  
115  
6
-
nC  
nC  
nC  
pF  
pF  
pF  
-
VGS = 0 V; VDS = 6 V;  
f = 1 MHz  
-
Coss  
Crss  
-
reverse transfer  
capacitance  
-
td(on)  
tr  
td(off)  
tf  
turn-on delay time  
rise time  
VDD = 6 V;  
RL = 6 Ω;  
VGS = 4.5 V;  
RG = 6 Ω  
-
-
-
-
7
-
-
-
-
ns  
ns  
ns  
ns  
15  
50  
25  
turn-off delay time  
fall time  
Source-drain diode  
[1]  
VSD  
source-drain voltage  
IS = 1 A; VGS = 0 V  
-
0.8 1.0  
V
[1] Pulse test: tp 300 μs; δ ≤ 0.01.  
NX2301P  
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Product data sheet  
Rev. 1 — 26 October 2010  
6 of 16  
NX2301P  
NXP Semiconductors  
20 V, 2 A P-channel Trench MOSFET  
017aaa098  
017aaa099  
3  
4  
5  
6  
3.0  
10  
V
GS  
= 2.0 V  
1.8 V  
I
D
I
D
(A)  
(A)  
2.0  
10  
(1)  
(2)  
(3)  
1.6 V  
1.4 V  
1.0  
10  
10  
1.2 V  
4.0  
0.0  
0.0  
1.0  
2.0  
3.0  
5.0  
(V)  
0.0  
0.5  
1.0  
1.5  
V
DS  
V
(V)  
GS  
Tamb = 25 °C  
Tamb = 25 °C; VDS = 10 V  
(1) minimum values  
(2) typical values  
(3) maximum values  
Fig 6. Output characteristics: drain current as a  
function of drain-source voltage; typical  
values  
Fig 7. Sub-threshold drain current as a function of  
gate-source voltage  
017aaa100  
017aaa101  
1.0  
0.4  
R
DSon  
R
Dson  
(Ω)  
(Ω)  
(1)  
(2)  
0.75  
0.50  
0.25  
0.0  
0.3  
0.2  
0.1  
0.0  
(3)  
(4)  
(1)  
(2)  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0.0  
2.0  
4.0  
6.0  
8.0  
I
D
(A)  
V
GS  
(V)  
Tamb = 25 °C  
ID = 2 A  
(1) VGS = 1.4 V  
(2) VGS = 1.6 V  
(3) VGS = 1.8 V  
(4) VGS = 2.0 V  
(1) Tamb = 125 °C  
(2) Tamb = 25 °C  
Fig 8. Drain-source on-state resistance as a function  
of drain current; typical values  
Fig 9. Drain-source on-state resistance as a function  
of gate-source voltage; typical values  
NX2301P  
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Product data sheet  
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20 V, 2 A P-channel Trench MOSFET  
017aaa102  
017aaa103  
2.0  
2.0  
1.5  
1.0  
0.5  
0.0  
I
a
D
(A)  
1.5  
(1)  
(2)  
1.0  
0.5  
0.0  
0.0  
1.0  
2.0  
3.0  
60  
0
60  
120  
180  
(°C)  
V
(V)  
T
amb  
GS  
VDS > ID × RDSon  
RDSon  
a =  
-----------------------------  
RDSon(25°C)  
(1) Tamb = 150 °C  
(2) Tamb = 25 °C  
Fig 10. Transfer characteristics: drain current as a  
function of gate-source voltage; typical values  
Fig 11. Normalized drain-source on-state resistance  
as a function of ambient temperature; typical  
values  
017aaa104  
017aaa105  
3
1.5  
10  
V
GS(th)  
(V)  
(1)  
C
(pF)  
1.0  
0.5  
0.0  
(1)  
(2)  
2
10  
(3)  
(2)  
(3)  
10  
10  
1  
2
60  
0
60  
120  
180  
(°C)  
1  
10  
10  
T
amb  
V
DS  
(V)  
ID = 0.25 mA; VDS = VGS  
f = 1 MHz; VGS = 0 V  
(1) Ciss  
(1) maximum values  
(2) typical values  
(2) Coss  
(3) Crss  
(3) minimum values  
Fig 12. Gate-source threshold voltage as a function of  
ambient temperature  
Fig 13. Input, output and reverse transfer  
capacitances as a function of drain-source  
voltage; typical values  
NX2301P  
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Product data sheet  
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20 V, 2 A P-channel Trench MOSFET  
017aaa106  
5.0  
V
GS  
(V)  
4.0  
V
DS  
I
D
3.0  
2.0  
1.0  
0.0  
V
GS(pl)  
V
GS(th)  
V
GS  
Q
Q
GS2  
GS1  
Q
Q
GD  
GS  
Q
G(tot)  
0.0  
1.25  
2.5  
3.75  
5.0  
Q
G
(nC)  
003aaa508  
ID = 2 A; VDS = 6 V; Tamb = 25 °C  
Fig 14. Gate-source voltage as a function of gate  
charge; typical values  
Fig 15. Gate charge waveform definitions  
017aaa107  
1.0  
I
S
(A)  
0.75  
(1)  
(2)  
0.5  
0.25  
0.0  
0.0  
0.25  
0.5  
0.75  
1.0  
V
SD  
(V)  
VGS = 0 V  
(1) Tamb = 150 °C  
(2) Tamb = 25 °C  
Fig 16. Source current as a function of source-drain voltage; typical values  
NX2301P  
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Product data sheet  
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9 of 16  
NX2301P  
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20 V, 2 A P-channel Trench MOSFET  
8. Test information  
t
t
1
2
P
duty cycle δ =  
t
2
t
1
t
006aaa812  
Fig 17. Duty cycle definition  
8.1 Quality information  
This product has been qualified in accordance with the Automotive Electronics Council  
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is  
suitable for use in automotive applications.  
NX2301P  
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Product data sheet  
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10 of 16  
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20 V, 2 A P-channel Trench MOSFET  
9. Package outline  
Plastic surface-mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w M  
B
1
L
p
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
04-11-04  
06-03-16  
SOT23  
TO-236AB  
Fig 18. Package outline SOT23 (TO-236AB)  
NX2301P  
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Product data sheet  
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20 V, 2 A P-channel Trench MOSFET  
10. Soldering  
3.3  
2.9  
1.9  
solder lands  
solder resist  
2
3
1.7  
solder paste  
occupied area  
0.6  
0.7  
(3×)  
(3×)  
Dimensions in mm  
0.5  
(3×)  
0.6  
(3×)  
1
sot023_fr  
Fig 19. Reflow soldering footprint SOT23 (TO-236AB)  
2.2  
1.2  
(2×)  
1.4  
(2×)  
solder lands  
solder resist  
occupied area  
2.6  
4.6  
Dimensions in mm  
1.4  
preferred transport direction during soldering  
2.8  
4.5  
sot023_fw  
Fig 20. Wave soldering footprint SOT23 (TO-236AB)  
NX2301P  
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Product data sheet  
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11. Revision history  
Table 8.  
Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
NX2301P v.1  
20101026  
Product data sheet  
-
-
NX2301P  
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Product data sheet  
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12. Legal information  
12.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
12.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
12.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
NX2301P  
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Product data sheet  
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20 V, 2 A P-channel Trench MOSFET  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
12.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
13. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
NX2301P  
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© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 26 October 2010  
15 of 16  
NX2301P  
NXP Semiconductors  
20 V, 2 A P-channel Trench MOSFET  
14. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . 1  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics . . . . . . . . . . . . . . . . . . 4  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Test information. . . . . . . . . . . . . . . . . . . . . . . . 10  
Quality information . . . . . . . . . . . . . . . . . . . . . 10  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13  
3
4
5
6
7
8
8.1  
9
10  
11  
12  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
12.1  
12.2  
12.3  
12.4  
13  
14  
Contact information. . . . . . . . . . . . . . . . . . . . . 15  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 26 October 2010  
Document identifier: NX2301P  
配单直通车
NX2301P产品参数
型号:NX2301P
是否Rohs认证: 符合
生命周期:Transferred
IHS 制造商:NXP SEMICONDUCTORS
零件包装代码:SOT-23
包装说明:PLASTIC PACKAGE-3
针数:3
Reach Compliance Code:unknown
ECCN代码:EAR99
风险等级:5.73
Is Samacsys:N
配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V
最大漏源导通电阻:0.19 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-236AB
JESD-30 代码:R-PDSO-G3
JESD-609代码:e3
湿度敏感等级:1
元件数量:1
端子数量:3
工作模式:ENHANCEMENT MODE
最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL
认证状态:Not Qualified
表面贴装:YES
端子面层:TIN
端子形式:GULL WING
端子位置:DUAL
处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING
晶体管元件材料:SILICON
Base Number Matches:1
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