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产品型号OPA2376AIYZDR的概述

OPA2376AIYZDR芯片概述 OPA2376AIYZDR是一款由德州仪器（Texas Instruments）公司生产的高性能运算放大器。这款芯片采用了先进的CMOS技术，具备优异的电源电压范围和低功耗特性。OPA2376系列运算放大器通常被广泛应用于信号处理、音频应用、传感器放大以及医疗设备等多个领域，因其高增益、低噪声和宽带宽特性而备受青睐。该芯片特别适合于需要高精度、高动态范围和高线性的应用场景。OPA2376的设计理念旨在提高系统的整体性能，并通过其出色的频率响应和失真指数，满足各种工业和消费类电子设备的需求。详细参数 OPA2376AIYZDR的具体技术参数如下： - 增益带宽积：频率范围达到 60 MHz - 输入失调电压：最大值为 100 µV，确保高精度特性 - 输入偏置电流：典型值为 1 pA，适合高阻抗信号源 - 共模抑制比（CMRR）：在高达 80 dB...

产品型号OPA2376AIYZDR的Datasheet PDF文件预览

OPA376

OPA2376

OPA4376

www.ti.com

SBOS406F –JUNE 2007–REVISED MARCH 2013

Low-Noise, Low Quiescent Current,

Precision Operational Amplifier

e-trim™ Series

Check for Samples: OPA376, OPA2376, OPA4376

FEATURES

DESCRIPTION

The OPA376 family represent a new generation of

low-noise operational amplifiers with e-trim, offering

outstanding dc precision and ac performance. Rail-to-

rail input and output, low offset (25μV max), low noise

(7.5nV/√Hz), quiescent current of 950μA max, and a

5.5MHz bandwidth make this part very attractive for a

variety of precision and portable applications. In

addition, this device has a reasonably wide supply

range with excellent PSRR, making it attractive for

applications that run directly from batteries without

regulation.

•

LOW NOISE: 7.5nV/√Hz at 1kHz

0.1Hz TO 10Hz NOISE: 0.8μV_PP

QUIESCENT CURRENT: 760μA (typ)

LOW OFFSET VOLTAGE: 5μV (typ)

GAIN BANDWIDTH PRODUCT: 5.5MHz

RAIL-TO-RAIL INPUT AND OUTPUT

SINGLE-SUPPLY OPERATION

•

SUPPLY VOLTAGE: 2.2V to 5.5V

SPACE-SAVING PACKAGES:

The OPA376 (single version) is available in

MicroSIZE SC70-5, SOT23-5, and SO-8 packages.

The OPA2376 (dual) is offered in the WCSP-8,

MSOP-8, and SO-8 packages. The OPA4376 (quad)

is offered in a TSSOP-14 package. All versions are

specified for operation from –40°C to +125°C.

–

SC-70, SOT23, WCSP, MSOP, TSSOP

APPLICATIONS

•

ADC BUFFER

AUDIO EQUIPMENT

MEDICAL INSTRUMENTATION

HANDHELD TEST EQUIPMENT

ACTIVE FILTERING

SENSOR SIGNAL CONDITIONING

OFFSET VOLTAGE PRODUCTION DISTRIBUTION

INPUT VOLTAGE NOISE SPECTRAL DENSITY

100

10k

100k

Frequency (Hz)

Offset Voltage (mV)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

e-trim, NanoStar, NanoFree are trademarks of Texas Instruments Incorporated.

All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

OPA376

OPA2376

OPA4376

SBOS406F –JUNE 2007–REVISED MARCH 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATING⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

OPA376, OPA2376, OPA4376

UNIT

Supply Voltage

V_S= (V+) – (V–)

(V–) – 0.5 to (V+) + 0.5

±10

Voltage⁽²⁾

Current⁽²⁾

Signal Input Terminals

Output Short-Circuit⁽³⁾

Operating Temperature

Storage Temperature

Junction Temperature

Continuous

–40 to +150

–65 to +150

+150

T_A

T_J

°C

Human Body Model

Charged Device Model

Machine Model

4000

ESD Rating

1000

200

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should

be current limited to 10mA or less.

(3) Short-circuit to ground, one amplifier per package.

PACKAGE INFORMATION⁽¹⁾

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

BUR

SC70-5

DCK

DBV

OPA376

SOT23-5

BUQ

SO-8

OPA376

SO-8

OPA2376

OBBI

OPA2376

MSOP-8

DGK

YZD

OPA2376

OPA4376

Lead- (Pb-) Free WCSP-8

TSSOP-14

OPA2376

OPA4376

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

Submit Documentation Feedback

Product Folder Links: OPA376 OPA2376 OPA4376

OPA376

OPA2376

OPA4376

www.ti.com

SBOS406F –JUNE 2007–REVISED MARCH 2013

ELECTRICAL CHARACTERISTICS: V_S= +2.2V to +5.5V

Boldface limits apply over the specified temperature range: T_A= –40°C to +125°C.

At T_A= +25°C, R_L= 10kΩ connected to V_S/2, V_CM= V_S/2, and V_{O UT}= V_S/2, unless otherwise noted.

OPA376, OPA2376, OPA4376

PARAMETERS

OFFSET VOLTAGE

CONDITIONS

MIN TYP MAX

UNIT

Input Offset Voltage

vs Temperature

V_OS

0.26

0.32

μV

dV_OS/dT

–40°C to +85°C

μV/°C

μV/V

mV/V

–40°C to +125°C

vs Power Supply

PSRR

V_S= +2.2V to +5.5V, V_CM< (V+) – 1.3V

Over Temperature

Channel Separation, dc (dual, quad)

INPUT BIAS CURRENT

Input Bias Current

0.5

I_B

0.2

Over Temperature

See Typical Characteristics

Input Offset Current

I_OS

0.2

NOISE

Input Voltage Noise, f = 0.1Hz to 10Hz

Input Voltage Noise Density, f = 1kHz

Input Current Noise, f = 1kHz

INPUT VOLTAGE RANGE

Common-Mode Voltage Range

Common-Mode Rejection Ratio

INPUT CAPACITANCE

Differential

0.8

7.5

μV_PP

nV/√Hz

fA/√Hz

e_n

i_n

V_CM

(V–) – 0.1

(V+) + 0.1

CMRR

(V–) < V_CM< (V+) – 1.3 V

6.5

Common-Mode

OPEN-LOOP GAIN

Open-Loop Voltage Gain

A_OL

50mV < V_O< (V+) – 50mV, R_L= 10kΩ

100mV < V_O< (V+) – 100mV, R_L= 2kΩ

C_L= 100pF, V_S= 5.5V

120

134

126

FREQUENCY RESPONSE

Gain-Bandwidth Product

Slew Rate

GBW

t_S

5.5

MHz

V/μs

μs

G = +1

Settling Time 0.1%

Settling Time 0.01%

Overload Recovery Time

THD + Noise

2V Step , G = +1

V_IN× Gain > V_S

1.6

t_S

μs

0.33

0.00027

μs

THD+N V_O= 1V_RMS, G = +1, f = 1kHz, R_L= 10kΩ

OUTPUT

Voltage Output Swing from Rail

R_L= 10kΩ⁽¹⁾

R_L= 10kΩ⁽²⁾

Over Temperature

R_L= 10kΩ

R_L= 2kΩ⁽¹⁾

R_L= 2kΩ⁽²⁾

Voltage Output Swing from Rail

Over Temperature

Short-Circuit Current

R_L= 2kΩ

I_SC

C_LOAD

R_O

+30/–50

Capacitive Load Drive

Open-Loop Output Impedance

See Typical Characteristics

150

Ω

(1) SC70-5, SOT23-5, SO-8, MSOP-8, and TSSOP-14 packages only.

(2) Wafer chip-scale package only.

Submit Documentation Feedback

Product Folder Links: OPA376 OPA2376 OPA4376

OPA376

OPA2376

OPA4376

SBOS406F –JUNE 2007–REVISED MARCH 2013

www.ti.com

ELECTRICAL CHARACTERISTICS: V_S= +2.2V to +5.5V (continued)

Boldface limits apply over the specified temperature range: T_A= –40°C to +125°C.

At T_A= +25°C, R_L= 10kΩ connected to V_S/2, V_CM= V_S/2, and V_{O UT}= V_S/2, unless otherwise noted.

OPA376, OPA2376, OPA4376

PARAMETERS

POWER SUPPLY

CONDITIONS

MIN

TYP

MAX

UNIT

Specified Voltage Range

Operating Voltage Range

Quiescent Current per amplifier

Over Temperature

TEMPERATURE RANGE

Specified Range

V_S

I_Q

2.2

5.5

2 to 5.5

760

I_O= 0, V_S= +5.5V, V_CM< (V+) – 1.3V

950

μA

–40

+125

+150

°C

Operating Range

°C

Thermal Resistance

SC70

θ_JA

°C/W

250

200

150

250

SOT23

SO-8, TSSOP-14, MSOP-8

WCSP-8

Submit Documentation Feedback

Product Folder Links: OPA376 OPA2376 OPA4376

OPA376

OPA2376

OPA4376

www.ti.com

SBOS406F –JUNE 2007–REVISED MARCH 2013

PIN CONFIGURATIONS

OPA376

SOT23-5

(TOP VIEW)

OPA2376

SO-8, MSOP-8

(TOP VIEW)

OUT

V-

V+

OUT A

-IN A

+IN A

V-

V+

OUT B

-IN B

+IN B

+IN

-IN

OPA376

SC70-5

(TOP VIEW)

OPA2376

WCSP-8

(TOP VIEW)

+IN

V-

V+

D1 V-

+IN B

-IN

OUT

C1 +IN A

-IN B

2,188 mm

2,038 mm

-IN A

OUT B

V+

A1 OUT A

OPA376

SO-8

(TOP VIEW)

1,15 mm

1,00 mm

NC⁽¹⁾

(Bump Side Down)

-IN

+IN

V-

V+

OUT

NC⁽¹⁾

OPA4376

TSSOP-14

(TOP VIEW)

OUT A

14 OUT D

-IN A

+IN A

V+

13 -IN D

12 +IN D

11 V-

+IN B

-IN B

OUT B

10 +IN C

-IN C

OUT C

NOTE: (1) NC denotes no internal connection.

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Product Folder Links: OPA376 OPA2376 OPA4376

OPA376

OPA2376

OPA4376

SBOS406F –JUNE 2007–REVISED MARCH 2013

www.ti.com

TYPICAL CHARACTERISTICS

At T_A= +25°C, V_S= +5V, R_L= 10kΩ connected to V_S/2, V_CM= V_S/2, and V_{O UT}= V_S/2, unless otherwise noted.

POWER-SUPPLY AND COMMON-MODE

OPEN-LOOP GAIN/PHASE vs FREQUENCY

REJECTION RATIO vs FREQUENCY

120

100

160

140

120

100

V(+) Power-Supply Rejection Ratio

-20

-40

Gain

-60

Phase

Common-Mode

Rejection Ratio

-80

-100

-120

-140

-160

-180

V(-) Power-Supply Rejection Ratio

-20

100

10k

100k

10M

0.1

100

10k

100k 1M

10M

Frequency (Hz)

Figure 2.

Frequency (Hz)

Figure 1.

OPEN-LOOP GAIN AND POWER-SUPPLY

REJECTION RATIO vs TEMPERATURE

0.1Hz to 10Hz

INPUT VOLTAGE NOISE

160

140

120

100

Open-Loop Gain (R_L= 2kW)

Power-Supply Rejection Ratio

(V_S= 2.1V to 5.5V)

1s/div

-50

-25

100

125

150

Temperature (°C)

Figure 3.

Figure 4.

TOTAL HARMONIC DISTORTION + NOISE

vs FREQUENCY

INPUT VOLTAGE NOISE SPECTRAL DENSITY

100

V_S= 5V, V_CM= 2V, V_OUT= 1V_RMS

0.1

0.01

Gain = 10V/V

Gain = 1V/V

0.001

0.0001

100

10k

100k

100

10k

100k

Frequency (Hz)

Figure 5.

Figure 6.

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OPA376

OPA2376

OPA4376

www.ti.com

SBOS406F –JUNE 2007–REVISED MARCH 2013

TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C, V_S= +5V, R_L= 10kΩ connected to V_S/2, V_CM= V_S/2, and V_{O UT}= V_S/2, unless otherwise noted.

COMMON-MODE REJECTION RATIO

QUIESCENT CURRENT

vs TEMPERATURE

110

100

1000

900

800

700

600

500

-50

-25

100

125

150

-50

-25

100

125

150

Temperature (°C)

Figure 7.

Figure 8.

QUIESCENT AND SHORT-CIRCUIT CURRENT

vs SUPPLY VOLTAGE

SHORT-CIRCUIT CURRENT

vs TEMPERATURE

1000

900

800

700

600

500

V_S= ±2.75V

I_SC+

I_Q

-25

-50

-75

-100

I_SC-

-50

-25

100

125

150

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Temperature (°C)

Supply Voltage (V)

Figure 9.

Figure 10.

INPUT BIAS CURRENT vs TEMPERATURE

OUTPUT VOLTAGE vs OUTPUT CURRENT

1000

900

800

700

600

500

400

300

200

100

V_S= ±2.75

+150°C

+125°C

+25°C

-40°C

-1

-2

-3

-50

-25

100

125

150

Output Current (mA)

Temperature (°C)

Figure 11.

Figure 12.

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Product Folder Links: OPA376 OPA2376 OPA4376

OPA376

OPA2376

OPA4376

SBOS406F –JUNE 2007–REVISED MARCH 2013

www.ti.com

TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C, V_S= +5V, R_L= 10kΩ connected to V_S/2, V_CM= V_S/2, and V_{O UT}= V_S/2, unless otherwise noted.

OFFSET VOLTAGE DRIFT

PRODUCTION DISTRIBUTION

(–40°C to +125°C)

OFFSET VOLTAGE

PRODUCTION DISTRIBUTION

½Offset Voltage Drift½ (mV/°C)

Offset Voltage (mV)

Figure 13.

Figure 14.

MAXIMUM OUTPUT VOLTAGE vs FREQUENCY

SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE

V_S= 5.5V

V_S= 5V

G = +1V/V

V_S= 2.5V

10k

100k

10M

100

Frequency (Hz)

Load Capacitance (pF)

Figure 15.

Figure 16.

SMALL-SIGNAL PULSE RESPONSE

LARGE-SIGNAL PULSE RESPONSE

G = +1

R_L= 10kW

G = +1

R_L= 2kW

C_L= 50pF

Time (400ns/div)

Time (2ms/div)

Figure 17.

Figure 18.

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OPA376

OPA2376

OPA4376

www.ti.com

SBOS406F –JUNE 2007–REVISED MARCH 2013

TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C, V_S= +5V, R_L= 10kΩ connected to V_S/2, V_CM= V_S/2, and V_{O UT}= V_S/2, unless otherwise noted.

SETTLING TIME vs CLOSED-LOOP GAIN

CHANNEL SEPARATION vs FREQUENCY

140

120

100

0.01%

0.1%

0.1

100

10k

100k

10M

100M

100

Frequency (Hz)

Closed-Loop Gain (V/V)

Figure 19.

Figure 20.

OPEN-LOOP OUTPUT RESISTANCE vs FREQUENCY

100

400mA Load

2mA Load

0.1

100

10k

100k

10M

Frequency (Hz)

Figure 21.

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Product Folder Links: OPA376 OPA2376 OPA4376

OPA376

OPA2376

OPA4376

SBOS406F –JUNE 2007–REVISED MARCH 2013

www.ti.com

APPLICATION INFORMATION

The OPA376 family of operational amplifiers is built

using e-trim, a proprietary technique in which offset

voltage is adjusted during the final steps of

manufacturing. This technique compensates for

performance shifts that can occur during the molding

process. Through e-trim, the OPA376 family delivers

excellent offset voltage (5μV, typ). Additionally, the

amplifier boasts a fast slew rate, low drift, low noise,

and excellent PSRR and A_OL. These 5.5MHz CMOS

op amps operate on 760μA (typ) quiescent current.

R₂

10kW

+5V

C₁

100nF

R₁

1kW

V_OUT

OPA376

OPERATING CHARACTERISTICS

V_IN

The OPA376 family of amplifiers has parameters that

are fully specified from 2.2V to 5.5V (±1.1V to

±2.75V). Many of the specifications apply from –40°C

to +125°C. Parameters that can exhibit significant

variance with regard to operating voltage or

temperature are presented in the Typical

Characteristics.

V_CM= 2.5V

GENERAL LAYOUT GUIDELINES

Figure 22. Basic Single-Supply Connection

COMMON-MODE VOLTAGE RANGE

For best operational performance of the device, good

printed circuit board (PCB) layout practices are

required. Low-loss, 0.1μF bypass capacitors must be

connected between each supply pin and ground,

placed as close to the device as possible. A single

bypass capacitor from V+ to ground is applicable to

single-supply applications.

The input common-mode voltage range of the

OPA376 series extends 100mV beyond the supply

rails. The offset voltage of the amplifier is very low,

from approximately (V–) to (V+) – 1V, as shown in

Figure 23. The offset voltage increases as common-

mode voltage exceeds (V+) –1V. Common-mode

rejection is specified from (V–) to (V+) – 1.3V.

BASIC AMPLIFIER CONFIGURATIONS

The OPA376 family is unity-gain stable. It does not

exhibit output phase inversion when the input is

overdriven. A typical single-supply connection is

shown in Figure 22. The OPA376 is configured as a

basic inverting amplifier with a gain of –10V/V. This

single-supply connection has an output centered on

the common-mode voltage, V_CM. For the circuit

shown, this voltage is 2.5V, but may be any value

within the common-mode input voltage range.

-1

-2

-V

-3

-0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Common-Mode Voltage (V)

Figure 23. Offset and Common-Mode Voltage

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OPA376

OPA2376

OPA4376

www.ti.com

SBOS406F –JUNE 2007–REVISED MARCH 2013

INPUT AND ESD PROTECTION

load, a voltage divider is created, introducing a gain

error at the output and slightly reducing the output

swing. The error introduced is proportional to the ratio

R_S/R_L, and is generally negligible at low output

current levels.

The OPA376 family incorporates internal electrostatic

discharge (ESD) protection circuits on all pins. In the

case of input and output pins, this protection primarily

consists of current steering diodes connected

between the input and power-supply pins. These ESD

protection diodes also provide in-circuit, input

overdrive protection, as long as the current is limited

to 10mA as stated in the Absolute Maximum Ratings.

Figure 24 shows how a series input resistor may be

added to the driven input to limit the input current.

The added resistor contributes thermal noise at the

amplifier input and its value should be kept to a

minimum in noise-sensitive applications.

V+

R_S

V_OUT

OPA376

10W to

20W

V_IN

C_L

R_L

Figure 25. Improving Capacitive Load Drive

ACTIVE FILTERING

V+

I_OVERLOAD

10mA max

V_OUT

OPA376

The OPA376 series is well-suited for filter

applications requiring a wide bandwidth, fast slew

rate, low-noise, single-supply operational amplifier.

Figure 26 shows a 50kHz, 2nd-order, low-pass filter.

The components have been selected to provide a

maximally-flat Butterworth response. Beyond the

cutoff frequency, roll-off is –40dB/dec. The

Butterworth response is ideal for applications

requiring predictable gain characteristics such as the

anti-aliasing filter used ahead of an analog-to-digital

converter (ADC).

V_IN

5kW

Figure 24. Input Current Protection

CAPACITIVE LOAD AND STABILITY

The OPA376 series of amplifiers may be used in

applications where driving

a capacitive load is

required. As with all op amps, there may be specific

instances where the OPAx376 can become unstable,

leading to oscillation. The particular op amp circuit

configuration, layout, gain, and output loading are

some of the factors to consider when establishing

whether an amplifier will be stable in operation. An op

amp in the unity-gain (+1V/V) buffer configuration and

driving a capacitive load exhibits a greater tendency

to be unstable than an amplifier operated at a higher

noise gain. The capacitive load, in conjunction with

the op amp output resistance, creates a pole within

the feedback loop that degrades the phase margin.

The degradation of the phase margin increases as

the capacitive loading increases.

R₃

5.49kW

C₂

150pF

V+

R₁

R₂

5.49kW

12.4kW

OPA376

V_OUT

C₁

1nF

V_IN

The OPAx376 in a unity-gain configuration can

directly drive up to 250pF pure capacitive load.

Increasing the gain enhances the ability of the

amplifier to drive greater capacitive loads; see the

typical characteristic plot, Small-Signal Overshoot vs

Capacitive Load. In unity-gain configurations,

capacitive load drive can be improved by inserting a

small (10Ω to 20Ω) resistor, R_S, in series with the

output, as shown in Figure 25. This resistor

significantly reduces ringing while maintaining dc

performance for purely capacitive loads. However, if

there is a resistive load in parallel with the capacitive

(V+)/2

Figure 26. Second-Order Butterworth 50kHz Low-

Pass Filter

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OPA2376

OPA4376

SBOS406F –JUNE 2007–REVISED MARCH 2013

www.ti.com

OPA2376 WCSP PACKAGE

should be expected. Fluorescent lighting may

introduce noise or hum because of the time-varying

light output. Best layout practices include end-product

packaging that provides shielding from possible light

sources during operation.

The OPA2376YZD is a lead- (PB-) free, die-level,

wafer chip-scale package (WCSP). Unlike devices

that are in plastic packages, these devices have no

molding compound, lead frame, wire bonds, or leads.

Using standard surface-mount assembly procedures,

the WCSP can be mounted to a PCB without

additional underfill. Figure 27 and Figure 28 detail the

pinout and package marking. See the NanoStar™

and NanoFree™ 300μm Solder Bump WCSP

Application Note (SBVA017) for more detailed

information on package characteristics and PCB

design.

DRIVING AN ANALOG-TO-DIGITAL

CONVERTER

The low noise and wide gain bandwidth of the

OPA376 family make it an ideal driver for ADCs.

Figure 29 illustrates the OPA376 driving an

ADS8327, 16-bit, 250kSPS converter. The amplifier is

connected as a unity-gain, noninverting buffer.

OPA2376YZD

Top View

+5V

(bump side down)

Not to Scale

C₁

0.1mF

+5V

(1)

R₁

D1 V-

+IN B

-IN B

OUT B

V+

100W

+IN

ADS8327

Low Power

16-Bit

OPA376

C1 +IN A

(1)

C₃

-IN A

-IN

1.2nF

500kSPS

V_IN

A1 OUT A

REF IN

+5V

WCSP-8

REF5040

4.096V

Figure 27. Pin Description

100nF

OPA2376YZD

WCSP-8 Enlarged Image

Top View

NOTE: (1) Suggested value; may require adjustment based on

specific application.

(bump side down)

Figure 29. Driving an ADS8327

Actual Size:

Package Marking Code:

YMD = year/month/day

PHANTOM-POWERED MICROPHONE

Exact Size:

CGL = indicates OPA2376YZD

S = for engineering purposes only

1.150mm x 2.188mm

The circuit shown in Figure 30 depicts how a remote

microphone amplifier can be powered by a phantom

source on the output side of the signal cable. The

cable serves double duty, carrying both the

differential output signal from and dc power to the

microphone amplifier stage.

Figure 28. Top View Package Marking

An OPA2376 serves as a single-ended input to a

differential output amplifier with a 6dB gain. Common-

mode bias for the two op amps is provided by the dc

voltage developed across the electret microphone

element. A 48V phantom supply is reduced to 5.1V

by the series 6.8kΩ resistors on the output side of the

cable, and the 4.7kΩ and zener diode on the input

side of the cable. AC coupling blocks the different dc

voltage levels from each other on each end of the

cable.

PHOTOSENSITIVITY

Although the OPA2376YZD package has a protective

backside coating that reduces the amount of light

exposure on the die, unless fully shielded, ambient

light can reach the active region of the device. Input

bias current for the package is specified in the

absence of light. Depending on the amount of light

exposure in a given application, an increase in bias

current, and possible increases in offset voltage

Submit Documentation Feedback

Product Folder Links: OPA376 OPA2376 OPA4376

OPA376

OPA2376

OPA4376

www.ti.com

SBOS406F –JUNE 2007–REVISED MARCH 2013

An INA163 instrumentation amplifier provides

differential inputs and receives the balanced audio

signals from the cable.

The INA163 gain may be set from 0dB to 80dB by

selecting the R_Gvalue. The INA163 circuit is typical

of the input circuitry used in mixing consoles.

Phantom Power

(Provides power source for microphone)

48V

Microphone

100W

1mF

33mF

D₁

5.1V

R₁

2.7kW

R₈

R₉

C₂

R₆

4.7kW

R₁₀

R₁₁

33mF

100W

+15V

1/2

6.8kW

OPA2376

10mF

1kW

R_G

INA163

10mF

Panasonic

WM-034CY

C₃

R₇

3.3kW

10kW

10mF

33mF

100W

1/2

Low-level differential audio signal

is transmitted differentially on the

same cable as power to the microphone.

OPA2376

-15V

Typical microphone input circuit used in mixing consoles.

Figure 30. Phantom-Powered Electret Microphone

V+ = +2.7V to 5V

Passband 300Hz to 3kHz

R₉

510kW

R₁

R₄

R₂

1.5kW

20kW

1MW

C₃

C₁

33pF

1000pF

R₇

R₈

V+

V_REF

51kW

150kW

1/2

DCLOCK

D_OUT

OPA2376

+IN

1/2

R₃

ADS7822

Electret

Microphone⁽¹⁾

Serial

OPA2376

1MW

R₆

12-Bit A/D

Interface

1000pF

C₂

CS/SHDN

-IN

100kW

G = 100

R₅

20kW

GND

NOTE: (1) Electret microphone powered by R₁.

Figure 31. OPA2376 as a Speech Bandpass Filtered Data Acquisition System

Submit Documentation Feedback

Product Folder Links: OPA376 OPA2376 OPA4376

OPA376

OPA2376

OPA4376

SBOS406F –JUNE 2007–REVISED MARCH 2013

www.ti.com

REVISION HISTORY

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (January 2013) to Revision F

Page

•

Changed unit (typo) for Quiescent Current feature bullet ..................................................................................................... 1

Changed TSSOP-14 pinout for OPA4376 ............................................................................................................................ 5

Changes from Revision D (August 2010) to Revision E

Page

•

Changed rail-to-rail feature bullet to show input and output ................................................................................................. 1

Changed description text to show rail-to-rail input and output ............................................................................................. 1

Changes from Revision C (October 2008) to Revision D

Page

•

Updated format of Electrical Characteristics table ................................................................................................................ 3

Updated Figure 11 ................................................................................................................................................................ 7

Submit Documentation Feedback

Product Folder Links: OPA376 OPA2376 OPA4376

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

PACKAGING INFORMATION

Orderable Device

OPA2376AID

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

SNAGCU

Level-2-260C-1 YEAR

Level-1-260C-UNLIM

Level-2-260C-1 YEAR

OPA

2376

OPA2376AIDG4

OPA2376AIDGKR

OPA2376AIDGKRG4

OPA2376AIDGKT

OPA2376AIDGKTG4

OPA2376AIDR

ACTIVE

Green (RoHS

& no Sb/Br)

OPA

2376

VSSOP

SOIC

DGK

2500

250

Green (RoHS

& no Sb/Br)

OBBI

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

250

Green (RoHS

& no Sb/Br)

2500

3000

250

Green (RoHS

& no Sb/Br)

OPA

2376

OPA2376AIDRG4

OPA2376AIYZDR

OPA2376AIYZDT

OPA376AID

SOIC

Green (RoHS

& no Sb/Br)

OPA

2376

DSBGA

SOIC

YZD

Green (RoHS

& no Sb/Br)

OPA2376

Green (RoHS

& no Sb/Br)

SNAGCU

OPA2376

Green (RoHS

& no Sb/Br)

CU NIPDAU

OPA

376

OPA376AIDBVR

OPA376AIDBVRG4

OPA376AIDBVT

OPA376AIDBVTG4

OPA376AIDCKR

OPA376AIDCKRG4

SOT-23

SC70

DBV

DCK

3000

250

Green (RoHS

& no Sb/Br)

BUQ

BUR

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

250

Green (RoHS

& no Sb/Br)

3000

Green (RoHS

& no Sb/Br)

SC70

Green (RoHS

& no Sb/Br)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

OPA376AIDCKT

OPA376AIDCKTG4

OPA376AIDG4

ACTIVE

SC70

DCK

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

BUR

ACTIVE

DCK

250

Green (RoHS

& no Sb/Br)

BUR

SOIC

Green (RoHS

& no Sb/Br)

OPA

376

OPA376AIDR

SOIC

2500

Green (RoHS

& no Sb/Br)

OPA

376

OPA376AIDRG4

OPA4376AIPW

SOIC

Green (RoHS

& no Sb/Br)

OPA

376

TSSOP

Green (RoHS

& no Sb/Br)

OPA4376

OPA4376AIPWG4

OPA4376AIPWR

OPA4376AIPWRG4

Green (RoHS

& no Sb/Br)

2000

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF OPA376 :

Automotive: OPA376-Q1

•

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•

Addendum-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com

9-Oct-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

OPA2376AIDR

OPA2376AIYZDR

OPA2376AIYZDT

OPA376AIDBVR

OPA376AIDBVT

OPA376AIDCKR

OPA376AIDCKT

OPA376AIDR

SOIC

DSBGA

SOT-23

SC70

2500

3000

250

330.0

180.0

179.0

180.0

179.0

178.0

179.0

330.0

12.4

8.4

9.0

8.4

12.4

6.4

1.24

3.23

3.2

5.2

2.29

3.17

3.2

2.1

0.81

1.37

1.4

8.0

4.0

8.0

12.0

8.0

12.0

YZD

DBV

DCK

250

3000

250

3.2

1.4

250

3.23

2.2

3.17

2.5

1.37

1.2

3000

250

SC70

2.4

2.5

1.2

SC70

2.4

2.5

1.2

SC70

250

2.2

2.5

1.2

SOIC

2500

2000

6.4

5.2

2.1

OPA4376AIPWR

TSSOP

6.9

5.6

1.6

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

9-Oct-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

OPA2376AIDR

OPA2376AIYZDR

OPA2376AIYZDT

OPA376AIDBVR

OPA376AIDBVT

OPA376AIDCKR

OPA376AIDCKT

OPA376AIDR

SOIC

DSBGA

SOT-23

SC70

2500

3000

250

367.0

182.0

220.0

182.0

202.0

195.0

202.0

195.0

180.0

195.0

367.0

182.0

220.0

182.0

201.0

200.0

201.0

200.0

180.0

200.0

367.0

35.0

17.0

34.0

17.0

28.0

45.0

28.0

45.0

18.0

45.0

35.0

YZD

DBV

DCK

250

3000

250

3000

250

SC70

250

SOIC

2500

2000

OPA4376AIPWR

TSSOP

Pack Materials-Page 2

D: Max = 2.178 mm, Min =2.118 mm

E: Max = 1.14 mm, Min = 1.08 mm

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

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of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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Applications

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www.ti.com/audio

amplifier.ti.com

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www.dlp.com

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DLP® Products

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OPA2376AIYZDR产品参数

型号:	OPA2376AIYZDR
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	TEXAS INSTRUMENTS INC
零件包装代码：	BGA
包装说明：	VFBGA, BGA8,2X4,20
针数：	8
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.33.00.01
Factory Lead Time：	6 weeks
风险等级：	1.08
放大器类型：	OPERATIONAL AMPLIFIER
架构：	VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)：	0.00001 µA
25C 时的最大偏置电流 (IIB)：	0.00001 µA
最小共模抑制比：	76 dB
标称共模抑制比：	90 dB
频率补偿：	YES
最大输入失调电流 (IIO)：	0.00001 µA
最大输入失调电压：	25 µV
JESD-30 代码：	R-XBGA-B8
JESD-609代码：	e1
长度：	2.25 mm
低-偏置：	YES
低-失调：	YES
微功率：	NO
湿度敏感等级：	1
功能数量：	2
端子数量：	8
最高工作温度：	125 °C
最低工作温度：	-40 °C
封装主体材料：	UNSPECIFIED
封装代码：	VFBGA
封装等效代码：	BGA8,2X4,20
封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
包装方法：	TR
峰值回流温度（摄氏度）：	260
功率：	NO
电源：	2.5/5 V
可编程功率：	NO
认证状态：	Not Qualified
座面最大高度：	0.625 mm
标称压摆率：	2 V/us
子类别：	Operational Amplifier
最大压摆率：	1.9 mA
供电电压上限：	7 V
标称供电电压 (Vsup)：	2.2 V
表面贴装：	YES
技术：	CMOS
温度等级：	AUTOMOTIVE
端子面层：	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：	BALL
端子节距：	0.5 mm
端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	NOT SPECIFIED
标称均一增益带宽：	5500 kHz
最小电压增益：	1000000
宽带：	NO
宽度：	1.25 mm
Base Number Matches：	1

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