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产品型号TJA1050T/CM的概述

TJA1050T/CM 芯片概述 TJA1050T/CM是一款高度集成的CAN（控制器局域网络）收发器，其主要用于汽车电子和工业控制系统中。这款芯片专为支持CAN网络的数据通信而设计，具备较高的抗干扰能力和低功耗特性，适合在恶劣环境中可靠工作。TJA1050T/CM符合ISO 11898标准，能够实现高速和低速CAN通信，支持节点间的差分信号传输。 TJA1050T/CM的设计重点在于确保多节点间的通信高效稳定。该芯片的收发器部分提供了良好的传输特性，能够支持数据传输速率高达1 Mbps，适用于各种实时性要求较高的应用场景。此外，该芯片在功耗管理上表现出色，采用休眠模式能显著降低能耗，延长设备的使用寿命，尤其对于电池供电的设备显得尤为重要。详细参数 TJA1050T/CM的主要参数包括： - 工作电压：4.5V至5.5V - 最大数据传输速率：1 Mbps - 工作温度范围：-40°...

产品型号TJA1050T/H/V,112的Datasheet PDF文件预览

INTEGRATED CIRCUITS

DATA SHEET

TJA1050

High speed CAN transceiver

Product speciﬁcation

2003 Oct 22

Supersedes data of 2002 May 16

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

FEATURES

GENERAL DESCRIPTION

• Fully compatible with the “ISO 11898” standard

• High speed (up to 1 Mbaud)

The TJA1050 is the interface between the Controller Area

Network (CAN) protocol controller and the physical bus.

The device provides differential transmit capability to the

bus and differential receive capability to the CAN

controller.

• Very low ElectroMagnetic Emission (EME)

• Differential receiver with wide common-mode range for

high ElectroMagnetic Immunity (EMI)

The TJA1050 is the third Philips high-speed CAN

transceiver after the PCA82C250 and the PCA82C251.

The most important differences are:

• An unpowered node does not disturb the bus lines

• Transmit Data (TXD) dominant time-out function

• Silent mode in which the transmitter is disabled

• Much lower electromagnetic emission due to optimal

matching of the output signals CANH and CANL

• Bus pins protected against transients in an automotive

environment

• Improved behaviour in case of an unpowered node

• No standby mode.

• Input levels compatible with 3.3 V and 5 V devices

• Thermally protected

This makes the TJA1050 eminently suitable for use in

nodes that are in a power-down situation in partially

powered networks.

• Short-circuit proof to battery and to ground

• At least 110 nodes can be connected.

QUICK REFERENCE DATA

SYMBOL

V_CC

PARAMETER

supply voltage

CONDITIONS

MIN. MAX. UNIT

4.75

−27

1.5

−

5.25

+40

V_CANH

DC voltage at pin CANH

0 < V_CC< 5.25 V; no time limit

dominant

V_CANL

DC voltage at pin CANL

V_i(dif)(bus)

t_PD(TXD-RXD)

T_vj

differential bus input voltage

propagation delay TXD to RXD

virtual junction temperature

V_S= 0 V; see Fig.7

250

−40

+150 °C

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

VERSION

TJA1050T

TJA1050U

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

−

bare die; die dimensions 1700 × 1280 × 380 µm

−

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

BLOCK DIAGRAM

handbook, full pagewidth

30 µA

GND

TEMPERATURE

PROTECTION

200

µA

TXD

DOMINANT

TIME-OUT

TIMER

DRIVER

TXD

RXD

CANH

CANL

kΩ

0.5V

kΩ

RECEIVER

GND

REFERENCE

VOLTAGE

TJA1050

ref

MGS374

GND

Fig.1 Block diagram.

PINNING

SYMBOL

DESCRIPTION

TXD

transmit data input; reads in data

from the CAN controller to the bus

line drivers

handbook, halfpage

GND

V_CC

ground

TXD

supply voltage

GND

CANH

CANL

RXD

receive data output; reads out

data from the bus lines to the

CAN controller

TJA1050T

RXD

ref

V_ref

reference voltage output

LOW-level CAN bus line

HIGH-level CAN bus line

MGS375

CANL

CANH

select input for high-speed mode

or silent mode

Fig.2 Pin configuration.

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

FUNCTIONAL DESCRIPTION

Control pin S allows two operating modes to be selected:

high-speed mode or silent mode.

The TJA1050 is the interface between the CAN protocol

controller and the physical bus. It is primarily intended for

high-speed automotive applications using baud rates from

60 kbaud up to 1 Mbaud. It provides differential transmit

capability to the bus and differential receiver capability to

the CAN protocol controller. It is fully compatible to the

“ISO 11898” standard.

The high-speed mode is the normal operating mode and is

selected by connecting pin S to ground. It is the default

mode if pin S is not connected. However, to ensure EMI

performance in applications using only the high-speed

mode, it is recommended that pin S is connected to

ground.

A current-limiting circuit protects the transmitter output

stage from damage caused by accidental short-circuit to

either positive or negative supply voltage, although power

dissipation increases during this fault condition.

In the silent mode, the transmitter is disabled. All other

IC functions continue to operate. The silent mode is

selected by connecting pin S to V_CCand can be used to

prevent network communication from being blocked, due

to a CAN controller which is out of control.

A thermal protection circuit protects the IC from damage

by switching off the transmitter if the junction temperature

exceeds a value of approximately 165 °C. Because the

transmitter dissipates most of the power, the power

dissipation and temperature of the IC is reduced. All other

IC functions continue to operate. The transmitter off-state

resets when pin TXD goes HIGH. The thermal protection

A ‘TXD dominant time-out’ timer circuit prevents the bus

lines being driven to a permanent dominant state (blocking

all network communication) if pin TXD is forced

permanently LOW by a hardware and/or software

application failure. The timer is triggered by a negative

edge on pin TXD. If the duration of the LOW-level on

circuit is particularly needed when a bus line short-circuits. pin TXD exceeds the internal timer value, the transmitter is

disabled, driving the bus into a recessive state. The timer

is reset by a positive edge on pin TXD.

The pins CANH and CANL are protected from automotive

electrical transients (according to “ISO 7637”; see Fig.4).

Table 1 Function table of the CAN transceiver; X = don’t care

V_CC

TXD

CANH

CANL

BUS STATE

RXD

4.75 V to 5.25 V

LOW

LOW (or

ﬂoating)

HIGH

LOW

dominant

LOW

4.75 V to 5.25 V

HIGH

0.5V_CC

recessive

HIGH

HIGH (or

ﬂoating)

<2 V (not powered)

2 V < V_CC< 4.75 V

0 V < V_CANH< V_CC0 V < V_CANL< V_CC

recessive

>2 V

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND (pin 2).

Positive currents ﬂow into the IC.

SYMBOL

V_CC

V_CANH

PARAMETER

supply voltage

CONDITIONS

MIN.

−0.3

MAX.

UNIT

DC voltage at pin CANH

0 < V_CC< 5.25 V;

no time limit

−27

+40

V_CANL

DC voltage at pin CANL

0 < V_CC< 5.25 V;

no time limit

−27

+40

V_TXD

DC voltage at pin TXD

DC voltage at pin RXD

DC voltage at pin V_ref

−0.3

−200

−4000

−200

−55

V_CC+ 0.3

+200

V_RXD

V_ref

V_S

DC voltage at pin S

V_trt(CANH)

V_trt(CANL)

V_esd

transient voltage at pin CANH

transient voltage at pin CANL

note 1

+200

electrostatic discharge voltage at all pins note 2

+4000

+200

note 3

T_stg

T_vj

storage temperature

+150

°C

virtual junction temperature

note 4

−40

+150

Notes

1. The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b

(see Fig.4).

2. Human body model: C = 100 pF and R = 1.5 kΩ.

3. Machine model: C = 200 pF, R = 10 Ω and L = 0.75 µH.

4. In accordance with “IEC 60747-1”. An alternative definition of T_vjis: T_vj= T_amb+ P × R_th(vj-a), where R_th(vj-a)is a fixed

value to be used for the calculation of T_vj. The rating for T_vjlimits the allowable combinations of power dissipation (P)

and ambient temperature (T_amb).

THERMAL CHARACTERISTICS

According to IEC 60747-1.

SYMBOL

R_th(vj-a)

PARAMETER

CONDITIONS

in free air

VALUE

UNIT

thermal resistance from junction to

ambient in SO8 package

145

K/W

R_th(vj-s)

thermal resistance from junction to

substrate of bare die

in free air

K/W

QUALITY SPECIFICATION

Quality specification “SNW-FQ-611 part D” is applicable.

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

CHARACTERISTICS

V_CC= 4.75 V to 5.25 V; T_vj= −40 °C to +150 °C; R_L= 60 Ω unless speciﬁed otherwise; all voltages are referenced to

GND (pin 2); positive currents ﬂow into the IC; see notes 1 and 2.

SYMBOL

Supply (pin V_CC

I_CC

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

)

supply current

dominant; V_TXD= 0 V

recessive; V_TXD= V_CC

2.5

Transmitter data input (pin TXD)

V_IH

V_IL

I_IH

I_IL

HIGH-level input voltage

output recessive

output dominant

V_TXD= V_CC

2.0

−0.3

−5

−

V_CC+ 0.3

+0.8

LOW-level input voltage

HIGH-level input current

LOW-level input current

input capacitance

µA

V_TXD= 0 V

−100

−

−200

−300

C_i

not tested

Mode select input (pin S)

V_IH

V_IL

I_IH

HIGH-level input voltage

silent mode

high-speed mode

V_S= 2 V

2.0

−0.3

−

V_CC+ 0.3

+0.8

LOW-level input voltage

HIGH-level input current

LOW-level input current

−

µA

I_IL

V_S= 0.8 V

Receiver data output (pin RXD)

I_OHHIGH-level output current

I_OLLOW-level output current

Reference voltage output (pin V_ref

V_refreference output voltage

Bus lines (pins CANH and CANL)

V_RXD= 0.7V_CC

V_RXD= 0.45 V

−2

−6

−15

8.5

)

−50 µA < I_Vref< +50 µA 0.45V_CC

0.5V_CC

0.55V_CC

V_{o(reces)(CANH)}recessive bus voltage at

pin CANH

V_TXD= V_CC; no load

2.0

2.5

−

3.0

V_{o(reces)(CANL)}recessive bus voltage at

pin CANL

3.0

I_{o(reces)(CANH)}

I_{o(reces)(CANL)}

V_o(dom)(CANH)

V_o(dom)(CANL)

V_i(dif)(bus)

recessive output current at

pin CANH

−27 V < V_CANH< +32 V; −2.0

0 V < V_CC< 5.25 V

+2.5

4.25

1.75

3.0

recessive output current at

pin CANL

−27 V < V_CANL< +32 V; −2.0

0 V < V_CC< 5.25 V

−

dominant output voltage at

pin CANH

V_TXD= 0 V

3.0

0.5

1.5

3.6

1.4

2.25

dominant output voltage at

pin CANL

differential bus input voltage V_TXD= 0 V; dominant;

(V_CANH− V_CANL42.5 Ω < R_L< 60 Ω

_TXD= V_CC; recessive; −50

no load

)

+50

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

−70

MAX.

−95

UNIT

I_o(sc)(CANH)

short-circuit output current at V_CANH= 0 V; V_TXD= 0 V −45

pin CANH

I_o(sc)(CANL)

V_i(dif)(th)

short-circuit output current at V_CANL= 36 V;

pin CANL _TXD= 0 V

differential receiver threshold −12 V < V_CANL< +12 V; 0.5

100

0.9

0.7

voltage

−12 V < V_CANH< +12 V;

see Fig.5

V_i(dif)(hys)

differential receiver input

voltage hysteresis

−12 V < V_CANL< +12 V; 50

−12 V < V_CANH< +12 V;

see Fig.5

100

R_i(cm)(CANH)

R_i(cm)(CANL)

R_i(cm)(m)

common mode input

resistance at pin CANH

kΩ

common mode input

resistance at pin CANL

matching between

pin CANH and pin CANL

common mode input

resistance

V_CANH= V_CANL

−3

R_i(dif)

differential input resistance

kΩ

C_i(CANH)

input capacitance at

pin CANH

V_TXD= V_CC; not tested

−

7.5

C_i(CANL)

input capacitance at

pin CANL

−

7.5

C_i(dif)

differential input capacitance V_TXD= V_CC; not tested

−

3.75

170

I_LI(CANH)

input leakage current at

pin CANH

V_CC= 0 V; V_CANH= 5 V 100

250

µA

I_LI(CANL)

input leakage current at

pin CANL

V_CC= 0 V; V_CANL= 5 V 100

170

250

180

µA

°C

Thermal shutdown

T_j(sd)shutdown junction

temperature

Timing characteristics (see Figs.6 and 7)

155

165

t_d(TXD-BUSon)

t_{d(TXD-BUSoff)}

t_d(BUSon-RXD)

t_{d(BUSoff-RXD)}

t_dom(TXD)

delay TXD to bus active

delay TXD to bus inactive

delay bus active to RXD

delay bus inactive to RXD

V_S= 0 V

V_TXD= 0 V

250

450

110

µs

110

155

750

TXD dominant time for

time-out

Notes

1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at 125 °C

ambient temperature for dies on wafer level and in addition to this 100 % tested at 25 °C ambient temperature for

cased products, unless speciﬁed otherwise.

2. For bare die, all parameters are only guaranteed if the backside of the bare die is connected to ground.

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

APPLICATION AND TEST INFORMATION

handbook, full pagewidth

47 nF

5 V

100

60 Ω

TXD

TX0

CANH

CANL

SJA1000

ref

CAN

BUS LINE

CAN

TJA1050

CONTROLLER

RXD

RX0

GND

60 Ω

MICRO-

CONTROLLER

47 nF

MGS380

Fig.3 Application information.

5 V

handbook, full pagewidth

100

TXD

1 nF

CANH

CANL

ref

TRANSIENT

GENERATOR

TJA1050

RXD

MGS379

GND

15 pF

The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b.

Fig.4 Test circuit for automotive transients.

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

handbook, full pagewidth

MGS378

RXD

HIGH

LOW

(V)

hysteresis

0.5

0.9

i(dif)(bus)

Fig.5 Hysteresis of the receiver.

5 V

handbook, halfpage

100

TXD

CANH

CANL

ref

TJA1050

60 Ω

100 pF

RXD

GND

15 pF

MGS376

Fig.6 Test circuit for timing characteristics.

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

HIGH

LOW

handbook, full pagewidth

TXD

CANH

CANL

dominant

(BUS on)

0.9 V

0.5 V

(1)

i(dif)(bus)

recessive

(BUS off)

HIGH

0.7V

RXD

0.3V

LOW

d(TXD-BUSon)

d(TXD-BUSoff)

d(BUSon-RXD)

d(BUSoff-RXD)

PD TXD-RXD

(

)

(

)

PD TXD-RXD

MGS377

(1) V_i(dif)(bus)= V_CANH− V_CANL

Fig.7 Timing diagram for AC characteristics.

handbook, full pagewidth

6.2 kΩ

CANL

CANH

10 nF

ACTIVE PROBE

TJA1050

Ω

SPECTRUM-

ANALYZER

47 nF

GND

test PCB

MGT229

Fig.8 Basic test set-up (with split termination) for electromagnetic emission measurement (see Figs 9 and 10).

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

MGT231

handbook, full pagewidth

(dBµV)

f (MHz)

Data rate of 500 kbits/s.

Fig.9 Typical electromagnetic emission up to 50 MHz (peak amplitude measurement).

MGT233

handbook, full pagewidth

(dBµV)

f (MHz)

Data rate of 500 kbits/s.

Fig.10 Typical electromagnetic emission up to 10 MHz (peak amplitude measurement and envelope on peak

amplitudes).

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

handbook, full pagewidth

30 Ω

CANL

CANH

4.7 nF

RF VOLTMETER

AND POWER

AMPLIFIER

TJA1050

Ω

RF SIGNAL

GENERATOR

TJA1050

GND

test PCB

MGT230

Fig.11 Basic test set-up for electromagnetic immunity measurement (see Fig.12).

MGT232

handbook, full pagewidth

RF(rms)

(V)

max RF voltage reached with no errors

−1

f (MHz)

Data rate of 500 kbits/s.

Fig.12 Typical electromagnetic immunity.

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

BONDING PAD LOCATIONS

COORDINATES⁽¹⁾

SYMBOL

TXD

PAD

handbook, halfpage

103

740

103

GND

V_CC

886.5

1371.5

1394

998

111

TJA1050U

RXD

V_ref

111

test pad

1094

1115

1097

CANL

CANH

538.5

103

MGS381

Note

The backside of the bare die must be connected to ground.

1. All x/y coordinates represent the position of the centre

of each pad (in µm) with respect to the lefthand bottom

corner of the top aluminium layer (see Fig.13).

Fig.13 Bonding pad locations.

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

PACKAGE OUTLINE

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

(A )

pin 1 index

detail X

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

(2)

UNIT

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

SOLDERING

If wave soldering is used the following conditions must be

observed for optimal results:

Introduction to soldering surface mount packages

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certain surface mount ICs, but it is not suitable for fine pitch

SMDs. In these situations reflow soldering is

recommended.

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

Reﬂow soldering

The footprint must incorporate solder thieves at the

downstream end.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Driven by legislation and environmental forces the

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

worldwide use of lead-free solder pastes is increasing.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250 °C or 265 °C, depending on solder

material applied, SnPb or Pb-free respectively.

Typical reflow peak temperatures range from

215 to 270 °C depending on solder paste material. The

top-surface temperature of the packages should

preferably be kept:

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

• below 220 °C (SnPb process) or below 245 °C (Pb-free

process)

Manual soldering

– for all BGA and SSOP-T packages

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a

volume ≥ 350 mm³so called thick/large packages.

• below 235 °C (SnPb process) or below 260 °C (Pb-free

process) for packages with a thickness < 2.5 mm and a

volume < 350 mm³so called small/thin packages.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

Moisture sensitivity precautions, as indicated on packing,

must be respected at all times.

Wave soldering

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

Suitability of surface mount IC packages for wave and reﬂow soldering methods

SOLDERING METHOD

PACKAGE⁽¹⁾

WAVE

not suitable

REFLOW⁽²⁾

BGA, LBGA, LFBGA, SQFP, SSOP-T⁽³⁾, TFBGA, VFBGA

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN, HVSON, SMS

not suitable⁽⁴⁾

suitable

PLCC⁽⁵⁾, SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO, VSSOP

PMFP⁽⁸⁾

suitable

not recommended⁽⁵⁾⁽⁶⁾suitable

not recommended⁽⁷⁾

suitable

not suitable

Notes

1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature

exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Hot bar or manual soldering is suitable for PMFP packages.

REVISION HISTORY

REV

DATE

CPCN

DESCRIPTION

Product speciﬁcation (9397 750 12157)

Modiﬁcation:

20031013

−

• Added recommendation to connect unused pin S to ground

• Added Chapter REVISION HISTORY

Product speciﬁcation (9397 750 09778)

20020516

2003 Oct 22

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1050

DATA SHEET STATUS

DATA SHEET

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾⁽³⁾

LEVEL

DEFINITION

Objective data

Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

Preliminary data Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Relevant changes will

be communicated via a Customer Product/Process Change Notiﬁcation

(CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

DEFINITIONS

DISCLAIMERS

Short-form specification

The data in a short-form

Life support applications

These products are not

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductors customers using or selling these products

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

at these or at any other conditions above those given in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -

including circuits, standard cells, and/or software -

described or contained herein in order to improve design

and/or performance. When the product is in full production

(status ‘Production’), relevant changes will be

Application information

Applications that are

communicated via a Customer Product/Process Change

Notification (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these

products, conveys no licence or title under any patent,

makes no representations or warranties that these

products are free from patent, copyright, or mask work

right infringement, unless otherwise specified.

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

no representation or warranty that such applications will be

suitable for the specified use without further testing or

modification.

2003 Oct 22

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

SCA75

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

R16/04/pp18

Date of release: 2003 Oct 22

Document order number: 9397 750 12157

TJA1050T/CM相关文章

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TJA1050T/H/V,112产品参数

型号:	TJA1050T/H/V,112
Brand Name：	NXP Semiconductor
是否Rohs认证：	符合
生命周期：	Obsolete
IHS 制造商：	NXP SEMICONDUCTORS
零件包装代码：	SOIC
包装说明：	SOP, SOP8,.25
针数：	8
制造商包装代码：	SOT96-1
Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01
风险等级：	5.78
数据速率：	1000 Mbps
JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e4
长度：	4.9 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	8
收发器数量：	1
最高工作温度：	125 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP8,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
电源：	5 V
认证状态：	Not Qualified
座面最大高度：	1.75 mm
子类别：	Network Interfaces
最大压摆率：	0.075 mA
标称供电电压：	5 V
表面贴装：	YES
技术：	CMOS
电信集成电路类型：	INTERFACE CIRCUIT
温度等级：	AUTOMOTIVE
端子面层：	NICKEL PALLADIUM GOLD
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	30
宽度：	3.9 mm
Base Number Matches：	1

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