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TSSOPand MSOP

Small Outline Packages

• Wide range of body sizes

• 8 to 56 lead counts

• Thermally enhanced versions

available (TSSOP-ep and

MSOP-ep)

FEATURES

DESCRIPTION

STATS ChipPAC offers a complete line of Small Outline

TSSOP

Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.

STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is

suitable for applications requiring a thin profile. TSSOP is a

leadframe based, plastic encapsulated package with gull wing

shaped leads on two sides with lead count ranging from 8 to

56 leads. The ultra thin TSSOP is made possible by optimal wire

looping control during the wire bonding process as well as

optimal package warpage control during the molding process.

TSSOP is designed to fill the niche of low pin count devices

where low profile and small footprint are key design consider-

ations. The TSSOP features 0.5 and 0.65mm lead pitch, and is

ideal for low pin count analog and mixed signal devices in

handheld applications such as PDAs and mobile / cellular

phones.

Taking the reliability of Small Outline Packages (SOP) one

step further, STATS ChipPAC offers a Micro Small Outline

Package (MSOP) for applications requiring thin, small, and

high reliability. This smaller package offers a smaller footprint,

shorter wires for improved electrical connections, and better

moisture reliability (MRT/MSL).

• Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm

• Lead Count: 8L to 56L

• Lead Pitch: 0.50mm & 0.65mm

• Package Height: 1.20mm max.

• JEDEC standard compliant (MO-153)

• Lead-free (Pb-free) and Green

• Thermal Enhancements: ep (exposed pad)

MSOP

• Body Size: 3 x 3mm

• Lead Count: 8L & 10L

• Lead Pitch: 0.65mm (8L) and 0.50mm (10L)

• JEDEC standard compliant

• Lead-free (Pb-free) and Green

• Thermal enhancements: ep (exposed pad)

APPLICATIONS

• Analog and Operation Amplifiers

• Controllers and Drivers

In addition to standard TSSOP and MSOP, STATS ChipPAC

offers thermally enhanced “ep” versions featuring an exposed

die paddle for efficient heat dissipation. The exposed die

attach pad design of the TSSOP package can provide excellent

thermal dissipation by soldering the copper die attach pad

directly onto the PCB, and is ideal for low pin count analog and

mixed signal devices.

• Logic, Memory, and RF/Wireless

• Disk drives, video/audio and consumer electronics/

appliances

STATS ChipPAC uses the latest leadframe technology and

state of the art design and simulation tools to achieve

optimum electrical and thermal performance. STATS ChipPAC’s

state of the art assembly facility and proven materials assure

high yield manufacturing and long term reliability.

www.statschippac.com

TSSOP and MSOP

Small Outline Packages

RELIABILITY (all)

SPECIFICATIONS (TSSOP)

Temperature Cycling

Temp/Humidity Test

Pressure Cooker Test

Condition C, -65°C/150°C, 1000 cycles

85°C/85% RH, 1000 hrs

Die Thickness

9-11mil range preferred (TSSOP)

6-16mil range preferred (TSSOP-ep)

Gold Wire

20µm (0.8mils) diameter, 99.99% Au

121°C, 100% RH, 2 atm, 250 hrs

Lead Finish

Marking

Sn/Pb (85/15%) or Matte Tin

Laser

Tube

Packing Options

SPECIFICATIONS (MSOP)

Die Thickness

6-9mil range preferred

Gold Wire

20µm (0.8mils) diameter, 99.99% Au

Lead Finish

Marking

Sn/Pb (85/15%) or Matte Tin

Laser

Tube

Packing Options

THERMAL PERFORMANCE, θja (°C/W)

Package

Body Size (mm)

4.4 x 7.8 x 0.9

Pad Size

3.0 x 3.0

Die Size

PCB Vias

Thermal Performance θja (°C/W)

30L TSSOP

30L TSSOP-ep

2.54 x 2.54

74.0

49.5

Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-5) under natural convection as defined in JESD51.2.

ELECTRICAL PERFORMANCE: 4.4 x 9.7 x 0.9 (38L)

Conductor

Pad Size

(mm)

Lead/Wire

(mm)

Resistance

(mOhm)

Inductance

Capacitance

Component

Self (nH)

Mutual (nH)

Self (pF)

Mutual (pF)

Lead

185 x 113

0.6-3.09

1.65

5-25

0.30-1.70

1.36

0.14-0.77

0.37-0.65

0.51-1.42

0.09-0.46

0.08

0.04-0.21

0.01-0.02

0.05-0.23

Wire

TOTALS

104-124

1.66-3.06

0.17-0.54

Note: Results are simulated values at 100MHz.

CROSS-SECTION

PACKAGE CONFIGURATIONS

Package

TSSOP

Body Size (mm)

3.0 x 4.4

Lead Count

TSSOP-ep

TSSOP

5.0 x 4.4

6.5 x 4.4

7.8 x 4.4

9.7 x 4.4

7.8 x 4.4

12.5 x 6.1

14.0 x 6.1

3.0 x 3.0

14, 16

MSOP

8, 10

Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823

Global Offices USA 510-979-8000 JAPAN 81-43-351-3320 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222

KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023

The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks

of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information

will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.

STATS ChipPAC reserves the right to change the information at any time and without notice.

January 2005