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产品型号UCC5606DP的概述

UCC5606DP芯片概述 UCC5606DP是一款高集成度的电源管理芯片，由德州仪器（Texas Instruments，TI）制造。该芯片专为电源转换和管理系统设计，具有高效率、宽输入电压范围以及多种保护功能。这使得UCC5606DP非常适合用于消费电子、工业设备和通信设备等领域。UCC5606DP能够优化电源的使用，减少能耗，并提高系统的可靠性与稳定性。 UCC5606DP详细参数 UCC5606DP提供了一系列引人注目的功能和参数。其主要特性包括： - 输入电压范围：适用的输入电压范围广，一般在4.5V到40V之间，便于适应不同电源环境。 - 输出电流：最大输出电流可达到2A，可以满足大部分中低功耗系统的需求。 - 开关频率：该芯片的开关频率可以配置，在100kHz到1MHz之间，这使得设计人员可以根据具体应用选择合适的转换效率和输出纹波。 - 效率：在特定条件下，UCC560...

产品型号UCC5606DP的Datasheet PDF文件预览

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SLUS347A – MAY 1995 – REVISED APRIL 2003

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FEATURES

DESCRIPTION

Complies with SCSI, SCSI–2 and SPI–2

Standards

The UCC5606 provides 9 lines of active termination for

a small computer systems interface (SCSI) parallel bus.

The SCSI standard recommends active termination at

both ends of the cable segment.

2.7-V to 5.25-V Operation

1.8-pF Channel Capacitance during

Disconnect

The UCC5606 is ideal for high performance 3.3-V SCSI

systems. The key features contributing to such low

operating voltage are the 0.1-V drop out regulator and

the 2.7-V reference. During disconnect the supply

current is typically only 0.5 µA, which makes the device

attractive for battery powered systems.

0.5-µA Supply Current in Disconnect Mode

110-Ω/2.5-kΩ Programmable Termination

Completely Meets SCSI Hot Plugging

–400-mA Sourcing Current for Termination

+400-mA Sinking Current for Active Negation

Drivers

The UCC5606 is designed with an ultra-low channel

capacitance of 1.8 pF, which eliminates effects on signal

integrity from disconnected terminators at interim points

on the bus.

Trimmed Termination Current to 4%

Trimmed Impedance to 7%

Current Limit and Thermal Shutdown

Protection

BLOCK DIAGRAM

UDG–94067–1

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

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www.ti.com

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SLUS347A – MAY 1995 – REVISED APRIL 2003

DESCRIPTION (CONTINUED)

The UCC5606 can be programmed for either a 110-Ω or 2.5-kΩ termination. The 110-Ω termination is used for

standard SCSI bus lengths and the 2.5-kΩ termination is typically used in short bus applications. When driving

the TTL compatible DISCNCT pin directly, the 110-Ω termination is connected when the DISCNCT pin is driven

high, and disconnected when low. When the DISCNCT pin is driven through an impedance between 80 kΩ and

150 kΩ, the 2.5-kΩ termination is connected when the DISCNCT pin is driven high, and disconnected when

driven low.

The power amplifier output stage allows the UCC5606 to source full termination current and sink active negation

current when all termination lines are actively negated.

The UCC5606 is pin-for-pin compatible with Unitrode’s other 9-line single-ended SCSI terminators, except that

DISCNCT is now active low, allowing lower capacitance and lower voltage upgrades to existing systems. The

UCC5606 is completely hot pluggable and appears as high impedance at the terminating channels with

= 0 V or open.

TRMPWR

Internal circuit trimming is utilized, first to trim the 110-Ω termination impedance to a 7% tolerance, and then most

importantly, to trim the output current to a 4% tolerance, as close to the maximum SCSI specification as possible,

which maximizes noise margin in fast SCSI operation.

Other features include thermal shutdown and current limit.

This device is offered in low thermal resistance versions of the industry standard 16-pin narrow body SOIC,

16-pin N and 24-pin TSSOP.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted{}

UCC5606

UNIT

TRMPWR voltage

Signal line voltage

0 to 7

Regulator output current

0.6

Storage temperature, T

stg

–65 to 150

–55 to 150

300

Operating junction temperature, T

°C

Lead temperature (soldering, 10 sec.)

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is

not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect

to GND. Currents are positive into and negative out of, the specified terminal.

‡

Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and

considerations of packages. All voltages are referenced to GND.

RECOMMENDED OPERATING CONDITIONS

MIN

2.7

NOM

MAX UNIT

TRMPWR voltage

5.25

Signal line voltage

Disconnect input voltage

TRMPWR

°C

ORDERING INFORMATION

PACKAGED DEVICE{

SOIC–16 (DP)

DISCONNECT

STATUS

DIL–16 (N)

TSSOP–24 (PWP)

0°C to 70°C

UCC5606N

UCC5606DP

UCC5606PWP

†

The LQFP packages are available taped and reeled. Add TR suffix to device type (e.g. UCC5606PWPTR) to order quantities of 2,500 devices

per reel.

www.ti.com

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SLUS347A – MAY 1995 – REVISED APRIL 2003

CONNECTION DIAGRAM

DIL–16 (Top View)

SOIC–16 (Top View)

TSSOP–24 (Top View)

N Package

DP Package

PWP Package

NOTE: GND* serves as a heat sink ground which must be tied to a large copper area or the grounding plate.

ELECTRICAL CHARACTERISTICS

T = 0°C to 70°C, TRMPWR = 3.3 V, DISCNCT = 3.3 V, R

= 0 Ω, T = T , (unless otherwise noted)

A J

DISCNCT

PARAMETER

Supply Current Section

TEST CONDITIONS

MIN

TYP

MAX

UNITS

All termination lines = open

Termpwr supply current

All termination lines = 0.2 V

DISCNCT = 0 V

210

0.5

218

5.0

Power down mode

µA

Output Section (110 ohms – Terminator Lines)

Terminator impedance

102.3

2.5

110.0

2.7

117.7 Ohms

(1)

Output high voltage

TRMPWR = 3 V

3.0

–24.0

–24

= 0.2 V,

= 0.2 V

= 0.2 V,

= 25°C

–22.1

–21

–23.0

–23

LINE

TRMPWR = 3 V,

TRMPWR = 3 V

–20.2

–19

–23.0

–23

–24.0

Max output current

(1)

T = 25°C

(1)

= 0.2 V,

= 0.5 V

–24

–22.4

400

LINE

Output leakage

DISCNCT = 0 V,

TRMPWR = 0 V to 5.25 V

(2)

Output capacitance

DP package

1.8

2.5

Output Section (2.5 kΩ – Terminator Lines) (R

Terminator impedance

= 80 kΩ)

DISCNCT

2.0

2.5

2.7

3.0

kΩ

(1)

Output high voltage

TRMPWR = 3 V

= 0.2 V

= 0.2 V,

–0.7

–0.6

–1.0

–1.4

–1.5

400

2.5

LINE

Max output current

(1)

TRMPWR = 3 V

TRMPWR = 0 to 5.25 V

(2)

Output leakage

DISCNCT = 0 V,

Output capacitance

DP package

1.8

www.ti.com

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SLUS347A – MAY 1995 – REVISED APRIL 2003

ELECTRICAL CHARACTERISTICS

T = 0°C to 70°C, TRMPWR = 3.3 V, DISCNCT = 3.3 V, R

= 0 Ω, T = T , (unless otherwise noted)

DISCNCT

PARAMETER

Regulator Section

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Regulator output voltage

Drop-out voltage

5.25 V > TRMPWR > 3 V

All termination lines = 0.2 V

2.5

2.7

3.0

0.1

–400

400

170

0.2

–800

800

Short circuit current

Sinking current capability

Thermal shutdown

= 0 V

= 3 V

–200

°C

REG

200

(2)

Thermal shutdown hysteresis

Disconnect Section

Disconnect threshold

Input current

= 0 kΩ to 80 kΩ

0.8

1.5

2.0

DISCNCT

DISCNCT = 3.3 V

µA

NOTES: 1. Measuring each termination line while other eight are low (0.2 V).

2. Ensured by design. Not production tested.

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

DISCNCT

GND

NO.

Taking this pin low causes the 9 channels to become high impedance and the chip to go into low

power mode. In short laptop buses an 80-kΩ to 150-kΩ resister to TERPWR terminates the bus at

2.5 kΩ. Less than 110 Ω to TERPWR enables the terminator.

Ground reference for the device

LINE1 TO

LINE9

110-Ω termination channels

REG

Output of the internal 2.7-V regulator

TRMPWR

GND*

Power for the device

Heat sink ground, must be tied to a large copper area or the grounding plate.

www.ti.com

ꢀ ꢁꢁ ꢂꢃ ꢄꢃ

SLUS347A – MAY 1995 – REVISED APRIL 2003

APPLICATION INFORMATION

UDG–98100

Figure 1. Typical SCSI Bus Configurations Utilizing two UCC5606 Devices

UDG–98100

Figure 2. Typical Wide SCSI Bus Configurations Utilizing three UCC5606 Devices

www.ti.com

PACKAGE OPTION ADDENDUM

www.ti.com

17-May-2014

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

UCC5606DP

LIFEBUY

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

0 to 70

UCC5606DP

UCC5606DPG4

UCC5606DPTR

LIFEBUY

SOIC

TBD

Call TI

0 to 70

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

UCC5606DP

UCC5606DPTRG4

LIFEBUY

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

0 to 70

UCC5606J

UCC5606N

OBSOLETE

LIFEBUY

UTR

TBD

Call TI

0 to 70

PDIP

UCC5606PWP

TSSOP

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

UCC5606PWP

UCC5606PWPG4

UCC5606PWPTR

LIFEBUY

ACTIVE

TSSOP

TBD

Call TI

0 to 70

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

UCC5606PWPTRG4

ACTIVE

TSSOP

TBD

Call TI

0 to 70

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

17-May-2014

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

UCC5606DPTR

SOIC

2500

2000

330.0

16.4

6.5

10.3

8.3

2.1

1.6

8.0

16.0

UCC5606PWPTR

TSSOP

6.95

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

UCC5606DPTR

SOIC

2500

2000

367.0

38.0

UCC5606PWPTR

TSSOP

Pack Materials-Page 2

IMPORTANT NOTICE

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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

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UCC5606DP产品参数

型号:	UCC5606DP
Brand Name：	Texas Instruments
是否无铅：	含铅
是否Rohs认证：	符合
生命周期：	Obsolete
零件包装代码：	SOIC
包装说明：	SOP, SOP16,.25
针数：	16
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	1 week
风险等级：	5.66
差分输出：	NO
接口集成电路类型：	SCSI BUS TERMINATOR
JESD-30 代码：	R-PDSO-G16
JESD-609代码：	e4
长度：	9.9 mm
湿度敏感等级：	2
功能数量：	1
信号线数量：	9
端子数量：	16
最高工作温度：	70 °C
最低工作温度：
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP16,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
电源：	3.3 V
标称上拉电阻：	110 Ω
认证状态：	Not Qualified
座面最大高度：	1.75 mm
子类别：	Bus Terminators
最大供电电压：	5.25 V
最小供电电压：	2.7 V
标称供电电压：	3.3 V
表面贴装：	YES
技术：	BICMOS
温度等级：	COMMERCIAL
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	3.9 mm
Base Number Matches：	1

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