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产品型号ULN2803ADW的概述

ULN2803ADW 芯片的概述 ULN2803ADW 是一种八通道继电器驱动器和驱动晶体管的集成电路,广泛应用于各种电子项目和自动化系统中。该芯片的主要功能是在较低的控制电压下提供高于普通逻辑电平的输出电流,适用于控制高功率负载,如电机、灯光或其他电气设备。ULN2803ADW 是由多家半导体制造商生产的,因其高可靠性和灵活性,在工业及汽车等领域得到了广泛应用。 ULN2803ADW 的详细参数 1. 供电电压:ULN2803ADW 的工作电压通常范围在 5V 到 30V 之间,能够与大多数逻辑电平兼容。 2. 输出电流:每个通道能够支持高达 500mA 的输出电流。 3. 输入电流:为了驱动输出,输入端需要提供约 1.5mA 的电流,这通常由微控制器或其他逻辑电路提供。 4. 总功耗:在最大负载条件下,该芯片的功耗会相对较高,因此散热处理十分重要,避免因过热导致故障。 5. 引脚配...

产品型号ULN2803ADW的Datasheet PDF文件预览

ꢀ ꢁꢂ ꢃꢄꢅ ꢆꢇ  
ꢈꢇꢉ ꢁꢊ ꢂꢋ ꢌꢍ ꢂ ꢌ ꢉꢇꢂꢎ ꢊꢎꢌꢍ ꢉ ꢇ ꢉꢉ ꢇꢏ  
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004  
DW OR N PACKAGE  
(TOP VIEW)  
D
500-mA Rated Collector Current (Single  
Output)  
D
D
D
High-Voltage Outputs . . . 50 V  
Output Clamp Diodes  
1
2
3
4
5
6
7
8
9
18  
17  
16  
15  
14  
13  
12  
11  
10  
1B  
2B  
1C  
2C  
3C  
4C  
5C  
6C  
7C  
8C  
COM  
3B  
Inputs Compatible With Various Types of  
Logic  
4B  
5B  
D
Relay Driver Applications  
6B  
D
Compatible with ULN2800A Series  
7B  
8B  
description/ordering information  
GND  
The ULN2803A is a high-voltage, high-current Darlington  
transistor array. The device consists of eight npn Darlington pairs  
that feature high-voltage outputs with common-cathode clamp  
diodes for switching inductive loads. The collector-current rating of  
each Darlington pair is 500 mA. The Darlington pairs may be  
connected in parallel for higher current capability.  
Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line  
drivers, and logic buffers. The ULN2803A has a 2.7-kseries base resistor for each Darlington pair for operation  
directly with TTL or 5-V CMOS devices.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP (N)  
Tube of 20  
Tube of 40  
Reel of 2000  
ULN2803AN  
ULN2803AN  
−40°C to 85°C  
ULN2803ADW  
SOIC (DW)  
ULN2803A  
ULN2003ADWR  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢌꢝ  
Copyright 2004, Texas Instruments Incorporated  
ꢙ ꢝ ꢚ ꢙꢒ ꢓꢧ ꢕꢔ ꢘ ꢠꢠ ꢞꢘ ꢖ ꢘ ꢗ ꢝ ꢙ ꢝ ꢖ ꢚ ꢢ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂꢃ ꢄ ꢅ ꢆ ꢇ  
ꢈ ꢇꢉꢁ ꢊ ꢂ ꢋꢌꢍꢂ ꢌꢉ ꢇꢂ ꢎꢊ ꢎ ꢌꢍ ꢉ ꢇꢉ ꢉꢇꢏ  
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004  
logic diagram  
1
18  
17  
16  
15  
14  
13  
12  
1B  
2B  
3B  
4B  
5B  
6B  
7B  
8B  
1C  
2C  
3C  
4C  
5C  
6C  
7C  
2
3
4
5
6
7
8
11  
10  
8C  
COM  
schematic (each Darlington pair)  
COM  
Output C  
2.7 kΩ  
Input B  
7.2 kΩ  
3 kΩ  
E
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅ ꢆꢇ  
ꢈꢇꢉ ꢁꢊ ꢂꢋ ꢌꢍ ꢂ ꢌ ꢉꢇꢂꢎ ꢊꢎꢌꢍꢉ ꢇ ꢉꢉ ꢇꢏ  
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004  
absolute maximum ratings at 25°C free-air temperature (unless otherwise noted)  
Collector-emitter voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V  
Input voltage (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V  
Continuous collector current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA  
Output clamp diode current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA  
Total substrate-terminal current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −2.5 A  
Package thermal impedance, θ (see Notes 2 and 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W  
JA  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W  
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
J
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the emitter/substrate terminal GND.  
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable  
J
JA  
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
A
JA  
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
electrical characteristics at 25°C free-air temperature (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
= 50 V, I = 0,  
CE  
See Figure 1  
I
I
Collector cutoff current  
50  
µA  
CEX  
V
T
A
= 50 V,  
I = 500 µA,  
C
CE  
= 70°C,  
I
I
Off-state input current  
Input current  
50  
65  
µA  
I(off)  
See Figure 2  
V = 3.85 V,  
I
See Figure 3  
0.93  
1.35  
2.4  
2.7  
3
mA  
I(on)  
I
C
I
C
I
C
I
C
= 200 mA  
= 250 mA  
= 300 mA  
= 100 mA,  
V
= 2 V,  
CE  
See Figure 4  
V
On-state input voltage  
V
V
I(on)  
I = 250 µA,  
I
0.9  
1
1.1  
1.3  
1.6  
See Figure 5  
I = 350 µA,  
I
= 200 mA,  
= 350 mA,  
I
C
C
V
Collector-emitter saturation voltage  
CE(sat)  
See Figure 5  
I = 500 µA,  
I
I
1.3  
See Figure 5  
I
Clamp diode reverse current  
Clamp diode forward voltage  
Input capacitance  
V
= 50 V,  
See Figure 6  
= 350 mA, See Figure 7  
F
50  
2
µA  
V
R
R
V
I
1.7  
15  
F
C
V = 0 V,  
I
f = 1 MHz  
25  
pF  
i
switching characteristics at 25°C free-air temperature  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
130  
20  
MAX  
UNIT  
t
t
Propagation delay time, low- to high-level output  
Propagation delay time, high- to low-level output  
PLH  
V
C
= 50 V,  
= 15 pF,  
R = 163 ,  
L
See Figure 8  
I 300 mA,  
O
S
L
ns  
PHL  
V
S
= 50 V,  
V
OH  
High-level output voltage after switching  
V
S
− 20  
mV  
See Figure 9  
3
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SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004  
PARAMETER MEASUREMENT INFORMATION  
Open V  
CE  
Open  
V
CE  
I
C
I
I(off)  
I
CEX  
Open  
Figure 1. I  
Test Circuit  
Figure 2. I  
Test Circuit  
CEX  
I(off)  
Open  
Open  
I
C
I
I
V
I
V
I
Open  
V
CE  
Figure 3. I  
Test Circuit  
Figure 4. V  
Test Circuit  
I(on)  
I(on)  
Open  
I
C
I
I
V
R
h
I
=
FE  
I
R
I
I
C
Open  
V
CE  
Figure 5. h , V  
Test Circuit  
Figure 6. I Test Circuit  
R
FE CE(sat)  
4
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SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004  
PARAMETER MEASUREMENT INFORMATION  
I
F
V
F
Open  
Figure 7. V Test Circuit  
F
Input  
Open  
V
S
= 50 V  
R
= 163 Ω  
L
Pulse  
Generator  
(see Note A)  
Output  
C
= 15 pF  
L
(see Note B)  
Test Circuit  
<5 ns  
<10 ns  
V
IH  
90%  
50%  
90%  
50%  
(see Note C)  
Input  
10%  
10%  
0
0.5 µs  
t
t
PHL  
PLH  
50%  
V
OH  
50%  
Output  
Voltage Waveforms  
NOTES: A. The pulse generator has the following characteristics: PRR = 1 MHz, Z = 50 .  
O
B.  
C.  
C
includes probe and jig capacitance.  
= 3 V  
L
V
IH  
Figure 8. Propagation Delay Times  
5
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SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004  
PARAMETER MEASUREMENT INFORMATION  
V
S
Input  
2 mH  
163 Ω  
Pulse  
Generator  
(see Note A)  
Output  
C
= 15 pF  
L
(see Note B)  
Test Circuit  
<5 ns  
<10 ns  
V
IH  
90%  
1.5 V  
90%  
1.5 V  
(see Note C)  
Input  
10%  
10%  
0
40 µs  
V
OH  
Output  
Voltage Waveforms  
NOTES: A. The pulse generator has the following characteristics: PRR = 12.5 KHz, Z = 50 .  
O
B.  
C.  
C
includes probe and jig capacitance.  
= 3 V  
L
V
IH  
Figure 9. Latch-Up Test  
6
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SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004  
7
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PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
ULN2803ADW  
ULN2803ADWR  
ULN2803AN  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
DW  
18  
18  
18  
40 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR  
no Sb/Br)  
SOIC  
PDIP  
DW  
N
2000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR  
no Sb/Br)  
20  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
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of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
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www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  
配单直通车
ULN2803ADW产品参数
型号:ULN2803ADW
Brand Name:Texas Instruments
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
零件包装代码:SOIC
包装说明:SOIC-18
针数:18
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8541.29.00.95
Factory Lead Time:6 weeks
风险等级:0.94
Samacsys Confidence:3
Samacsys Status:Released
Samacsys PartID:234190
Samacsys Pin Count:18
Samacsys Part Category:Integrated Circuit
Samacsys Package Category:Small Outline Packages
Samacsys Footprint Name:DW (R-PDSO-G18)
Samacsys Released Date:2015-10-18 19:06:11
Is Samacsys:N
其他特性:LOGIC LEVEL COMPATIBLE
最大集电极电流 (IC):0.5 A
集电极-发射极最大电压:50 V
配置:COMPLEX
JEDEC-95代码:MS-013AB
JESD-30 代码:R-PDSO-G18
JESD-609代码:e4
湿度敏感等级:2
元件数量:8
端子数量:18
最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260
极性/信道类型:NPN
认证状态:Not Qualified
表面贴装:YES
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING
晶体管元件材料:SILICON
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