UPB123D现货热卖使用介绍供应商报价哪里找芯片批发报价-中国IC网-芯三七

DATA SHEET

BIPOLAR DIGITAL INTEGRATED CIRCUITS

µPB1502GR, 1502GR(1)

1.7 GHz/ 2.0 GHz LOW-POWER TWO-MODULUS PRESCALER

DIVIDED-BY-64/65, 128/129

FEATURES

• High toggle frequency – 2.0 GHz: µPB1502GR(1), 1.7 GHz: µPB1502GR

• Low power consumption – 6.7 mA TYP. at 3 V

• Operating supply voltage – 2.7 V to 3.3 V

• High input sensitivity – 130 to 220 mVP-P: µPB1502GR(1), 100 to 320 mVP-P: µPB1502GR (@50 Ω)

• Equipped with power-save function: 5 µA (standard) on power-save mode.

• Packaged in 8 pins plastic SOP suitable for surface mounting.

DESCRIPTION

µPB1502GR and µPB1502GR(1) are two-modulus prescaler divided by 64/65 or 128/129. This device is designed for

mobile communication applications for example 0.8-1.9 GHz cellular and cordless telephones. The ICs operate on low power

and therefore are suitable for hand-held, battery-operated systems.

These products are manufactured using NEC’s 20 GHz f^TNESAT™ III silicon bipolar process. This process uses silicon

nitride passivation film and gold metallization wirings. These materials can protect the chips from external pollution and

prevent corrosion and migration. Thus, these products have excellent performance, uniformity and reliability.

ORDER INFORMATION

ORDER NUMBER

PACKAGE

SUPPLYING FORM

fin MAX.

µPB1502GR–E1

8 pin plastic SOP

(225 mil)

Embossed tape 12 mm wide. QTY 2.5 k/reel

Pin1 is in tape pull-out direction.

1.7 GHz

2.0 GHz

µPB1502GR(1)–E1

Remarks Toorderevaluationsamples,pleasecontactyourlocalNECsalesoffice.(Ordernumber:µPB1502GR,µPB1502GR(1))

Caution electro-static sensitive devices

The information in this document is subject to change without notice. Before using this document, please

confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for availability

and additional information.

Document No. P10871EJ3V0DS00 (3rd edition)

Date Published October 1999 N CP(K)

Printed in Japan

The mark

shows major revised points.

1996, 1999

©

µPB1502GR, 1502GR(1)

PIN ASSIGNMENT

(Top View)

IN

V

CC

V

PS

SW

M

OUT

GND

INTERNAL BLOCK DIAGRAM

(2) VCC

(7) VPS

(5) GND

D

Q

D

Q

D

Q

CK

M(6)

DFF1

DFF²

DFF³

(8)IN

(1)IN

OR

T

Q

T

Q

T

Q

T

Q

T

Q

SW

TFF¹

TFF2

TFF3

TFF4

TFF5

OUT(4)

AMP

SW(3)

: pin

( ) : pin No.

2

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

ABSOLUTE MAXIMUM RATINGS

PARAMETER

Supply voltage

SYMBOL

VCC

RATINGS

–0.5 to +6

UNIT

CONDITION

V

TA = +25 °C

Input voltage

VIN

–0.5 to VCC +0.5

TA = +25 °C

Mounted on double sided copper clad 50 ×

50 × 1.6 mm epoxy glass PWB (TA = +85 °C)

Total power dissipation

PD

250

mW

Operating temperature

Storage temperature

Topt

Tstg

–40 to +85

°C

–65 to +150

RECOMMENDED OPERATING RANGE

PARAMETER

Supply voltage

Operating temperature

SYMBOL

MIN.

2.7

TYP.

MAX.

UNIT

V

VCC

Topt

3.0

3.3

–40

+25

+85

°C

ELECTRICAL CHARACTERISTICS (TA = –40 to +85 °C, VCC = 2.7 to 3.3 V)

µPB1502GR

TYP. MAX.

µPB1502GR(1)

PARAMETER

SYMBOL

UNIT

CONDITION

MIN.

0.5

MIN.

TYP.

MAX.

Response frequency

fin

1.7

0.5

3.2

2.0

GHz

mA

Pin = –10 dBm

VPSH level,

No input signal

Circuit current

ICC

3.2

6.7

11.0

6.7

11.0

Input power sensitivity 1

Pin1

Pin2

Pin3

Pin4

VIH1

VIL1

VIH2

VIL2

VOUT

tset

–11

–15

—

0

–11

–15

–14

2.5

—

0

dBm

V

fin = 0.5 to 0.8 GHz

fin = 0.8 to 1.5 GHz

fin = 1.5 to 1.7 GHz

fin = 1.7 to 2.0 GHz

Input power sensitivity 2

Input power sensitivity 3

—

–6

—

–1

–9

—

Input power sensitivity 4

—

Modulus control input high (M)

Modulus control input low (M)

Divide ratio control input high (SW)

Divide ratio control input low (SW)

Output voltage swing

2.5

—

0.8

VCC

—

0.8

VCC

V

VCC

V

OPEN OPEN OPEN OPEN OPEN OPEN

V

0.8

—

11

VCC

—

0.8

—

11

VCC

—

VP–P

ns

CL = 8 pF

finMAX.

Modulus set up time

Power-save input high

VPSH

VinL

IPS

VCC

—

VCC

0.8

20

VCC

—

VCC

0.8

20

V

Power-save input low

V

VPSL level

*

Circuit current on power-save mode

—

5

—

5

µA

* Standard reference value on power-save mode.

3

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

PIN DESCRIPTIONS

Functions and Explanation

Pin No.

1

Symbol

IN

Assignment

Input frequency from an external VCO output.

Frequency input pin

Must be coupled with capacitor (e.g. 1 000 pF) for DC cut.

Supply voltage 3.0 ± 0.3 V for operation. Must be connected bypass

capacitor (e.g. 1 000 pF) to minimize ground impedance.

2

3

6

V^CC

SW

M

Power supply pin

Divided ratio and modulus control can be governed by following input

data to these pins.

Divided ratio

control input pin

M

Modulus

control input pin

H

L

H

L

1/64

1/128

1/65

1/129

SW

This frequency output can be interfaced to CMOS PLL.

Must be coupled with capacitor (e.g. 1 000 pF) for DC cut.

4

5

OUT

GND

Divided frequency

output pin

Must be connected to the system ground with minimum inductance.

Ground pattern on the board should be formed as wide as possible.

(Track length should be kept as short as possible).

Ground pin

ON/OFF-operation control can be governed by following input data to

this pin.

7

V^PS

Power-save

function pin

Operation

H

L

ON

VPS

OFF

Must be connected bypass capacitor (e.g. 1 000 pF) to minimize

ground impedance.

8

IN

Frequency-input

bypass pin

4

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

TEST CIRCUIT

1 000 pF

C1

1 000 pF

C8

IN

V^PS

50 Ω

V^CC

SW

OUT

1 000 pF

2.7 to 3.0 V

C2

1 000 pF

C7

S.G.

2.7 to 3.0 V

M

1 000 pF C3

C6

3.0 to 0 V

1 000

GND

pF

1 000 pF

1 MΩ

C4

Oscillo-

Scope

3 pF

C5

5 pF

M

H

L

H

L

1/64

1/128

1/65

1/129

SW

APPLICATION CIRCUIT FOR REFERENCE

1 000 pF

MIX

1 000 pF

( PB1502GR)

µ

1 000 pF

IN

VCO

1 000 pF

V

CC

V

PS

1 000

pF

1 000 pF

SW

M

VT

OUT GND

TCXO

REF

1 000 pF

Buffer Amp.

2SC4093

M

EN

f

IN

µ

( PC2745T)

PLL

DATA

CPU

CLOCK

CP

GND

V

CC

LPF

1 000 pF

The application circuits and their parameters are for references only and are not intended for use in actual design-in's.

To know the real application circuits, please refer to PLL synthesizer LSI's documentations (e.g.µPD3160GS).

5

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

TIMING DIAGRAM

Divided by 64/65 SW ’H’

(Divided by 128/129 SW ’L’)

64 clocks

(128)

65 clocks

(129)

IN

32 clocks

(64)

32 clocks

(64)

32 clocks

(64)

33 clocks

(65)

OUT

32

(64)

32

(64)

32

(64)

32

(64)

32

(64)

32

(64)

32

(64)

32

(64)

33

(65)

32

(64)

33

(65)

33

(65)

Hi

M

t

set

LO

t

set = The minimum time required between ‘Modulus Control’ going low and next output rising edge, in order to ensure a P+1

modulus change.

6

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

IN

C8

1pin

VCC

VPS

M

SW

GND

OUT

Component List

Note

(1) 50 × 50 × 0.4 mm double copper clad polyimide board.

(2) Back side: GND pattern

No.

C1 to 4

C5

Value

1 000 pF

8 pF

(3) Solder plated on pattern

(4)

: Through holes

C6 to 8

1 000 pF

77

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

TYPICAL CHARACTERISTICS (TA = +25 °C)

— µPB1502GR, µPB1502GR(1) in common —

CIRCUIT CURRENT vs. SUPPLY VOLTAGE

14

µ

PB1502GR

µ

PB1502GR(1)

: T

A

: TA

= +85 °C

= +25 °C

= –40 °C

12

10

8

6

4

2

0

2

4

6

Supply Voltage V^CC(V)

OUTPUT VOLTAGE SWING

vs. SUPPLY VOLTAGE

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

µ

PB1502GR

PB1502GR(1)

µ

: T

A

= +85 °C

= +25 °C

= –40 °C

2.4

2.6

2.8

3.0

3.2

3.4

3.6

Supply Voltage VCC (V)

S11 vs. f

V

CC = 3.0 V, ICC = 6.7 mA, Z = 50 W

O

0.5 GHz

2.0 GHz

1.0 GHz

8

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

<

>

<

>

—

µ

PB1502GR — Left line

—

µ

PB1502GR(1) — Right line

INPUT POWER vs. FREQUENCY

+60

+40

+20

0

+60

+40

+20

0

µ

PB1502GR

µ

PB1502GR(1)

T

A

= +25 °C

T

A

= +25 °C

: VCC = 2.7 V

: V^CC= 3.0 V

: VCC = 3.3 V

: VCC = 2.7 V

: V^CC= 3.0 V

: VCC = 3.3 V

*

–20

–40

–60

–20

–40

–60

0.2

0.6

1.2

1.6

2.0

2.4

0.2

0.6

1.2

1.6

2.0

2.4

Input Frequency f (GHz)

INPUT POWER vs. FREQUENCY

+60

+40

+20

0

+60

+40

+20

0

µ

T

PB1502GR

= +85 °C

: VCC = 2.7 V

: VCC = 3.0 V

: VCC = 3.3 V

µ

T

PB1502GR(1)

= +85 °C

: VCC = 2.7 V

: VCC = 3.0 V

: VCC = 3.3 V

A

*

–20

–40

–60

–20

–40

–60

0.6

1.2

1.6

2.0

2.4

0.6

1.2

1.6

2.0

2.4

Input Frequency f (GHz)

INPUT POWER vs. FREQUENCY

+60

+40

+20

0

+60

+40

+20

0

µ

T

PB1502GR

= –40 °C

: VCC = 2.7 V

: VCC = 3.0 V

: VCC = 3.3 V

µ

T

PB1502GR(1)

= –40 °C

: VCC = 2.7 V

: VCC = 3.0 V

: VCC = 3.3 V

A

*

–20

–40

–60

–20

–40

–60

0.6

1.2

1.6

2.0

2.4

0.6

1.2

1.6

2.0

2.4

Input Frequency f (GHz)

*

Guaranteed Operating Window

9

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

TYPICAL SYSTEM APPLICATION

Digital Cellular System Block Diagram

Low Noise Tr

Downconverter

I

RX

DEMO.

Q

µ

PD3160

PLL

V

CC

÷N

PLL

SW

µ

PB1502

I

0°

φ

TX

90°

PA

Driver

Q

Other applicable systems

1.9 GHz digital cordless telephone, hand-held radio.

10

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

PACKAGE DIMENSIONS

8 PIN PLASTIC SOP (225 mil) (UNIT: mm)

8

5

detail of lead end

+7°

3°

−3°

1

4

5.2 ± 0.2

6.5 ± 0.3

4.4 ± 0.15

1.57 ± 0.2

1.1 ± 0.2

1.49

0.85 MAX.

0.6 ± 0.2

0.10

+0.08

−0.07

1.27

0.17

+0.08

−0.07

0.42

M

0.12

0.1 ± 0.1

Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.

NOTE

11

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent abnormal operation).

(3) Keep the wiring length of the ground pins as short as possible.

(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V^CCpin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and conditions than

the recommended conditions are to be consulted with our sales representatives.

µPB1502GR, 1502GR(1)

Recommended

Soldering method

Infrared ray reflow

Soldering conditions

Package peak temperature: 235 °C,

condition symbol

Hour: within 30 s. (more than 210 °C),

Time: 3 times, Limited days: no.*

IR35–00-3

VPS

Package peak temperature: 215 °C,

Hour: within 40 s. (more than 200 °C),

Time: 3 times, Limited days: no.*

VP15–00-3

WS60–00-1

Wave soldering

Pin part heating

Soldering tub temperature: less than 260 °C,

Hour: within 10 s.

Time: 1 time, Limited days: no.

Pin area temperature: less than 300 °C,

Hour: within 3 s./pin

Limited days: no.*

*: It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.

Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).

Fordetailsofrecommendedsolderingconditionsforsurfacemounting,refertoinformationdocumentSEMICONDUCTOR

DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

12

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

[MEMO]

13

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

[MEMO]

14

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

[MEMO]

15

Data Sheet P10871EJ3V0DS00

µPB1502GR, 1502GR(1)

ATTENTION

OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

SENSITIVE

DEVICES

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

• The information in this document is subject to change without notice. Before using this document, please

confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written

consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in

this document.

• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property

rights of third parties by or arising from use of a device described herein or any other liability arising from use

of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other

intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these circuits,

software, and information in the design of the customer's equipment shall be done under the full responsibility

of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third

parties arising from the use of these circuits, software, and information.

• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,

the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or

property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety

measures in its design, such as redundancy, fire-containment, and anti-failure features.

• NEC devices are classified into the following three quality grades:

"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a

customer designated “quality assurance program“ for a specific application. The recommended applications of

a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device

before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,

audio and visual equipment, home electronic appliances, machine tools, personal electronic

equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems or medical equipment for life support, etc.

The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.

If customers intend to use NEC devices for applications other than those specified for Standard quality grade,

they should contact an NEC sales representative in advance.

M7 98.8

型号:	UPB1502GR
生命周期：	Obsolete
包装说明：	SOIC-8
Reach Compliance Code：	unknown
风险等级：	5.83
Is Samacsys：	N
系列：	UPB15
JESD-30 代码：	R-PDSO-G8
逻辑集成电路类型：	PRESCALER
功能数量：	1
端子数量：	8
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
认证状态：	Not Qualified
座面最大高度：	1.8 mm
标称供电电压 (Vsup)：	3 V
表面贴装：	YES
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
宽度：	4.4 mm
Base Number Matches：	1

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