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产品型号W24257AS-35的概述

芯片W24257AS-35的概述 W24257AS-35是一款由Winbond公司生产的静态随机存取存储器（SRAM），它采用的是高性能的CMOS工艺。它的容量为32Kb，具备较快的访问时间，适合于多种嵌入式系统和工业应用。由于其功能特点，W24257AS-35被广泛应用于多种电子设备中，例如计算机、网络设备、消费电子设备以及其他需要快速数据存取的系统中。此款芯片的设计旨在满足高密度集成和低功耗的需求，因而特备适合于对能耗敏感的应用场景。通过使用芯片的存储特性，用户可以在需要存储和读取小数据块的情况下，减少整体能耗。W24257AS-35支持多种工作模式，包括字节写入、字节读取及全存储器擦除，对于实现快速而灵活的数据操作具有重要意义。芯片W24257AS-35的详细参数 W24257AS-35的关键参数包括： - 存储容量：32Kb（4096 x 8位） - 工作电压：通常为3V至...

产品型号W24257AS-35的Datasheet PDF文件预览

W24257A

32K ´ 8 HIGH SPEED CMOS STATIC RAM

GENERAL DESCRIPTION

The W24257A is a high speed, low power CMOS static RAM organized as 32768 ´ 8 bits that

operates on a single 5-volt power supply. This device is manufactured using Winbond's high

performance CMOS technology.

FEATURES

· High speed access time: 35 nS (max.)

· Low power consumption:

- Active: 350 mW (max.)

· All inputs and outputs directly TTL compatible

· Three-state outputs

· Available packages: 28-pin 600 mil DIP,

330 mil SOP, 300 mil SOJ and standard type

one TSOP (8 mm ´ 13.4 mm)

· Single +5V power supply

· Fully static operation

PIN CONFIGURATIONS

BLOCK DIAGRAM

VDD

VSS

A14

A12

A13

DECODER

CORE

A14

ARRAY

A11

28-DIP

A10

I/O1

CONTROL

DATA I/O

I/O8

I/O7

I/O6

I/O5

I/O4

I/O8

I/O1

I/O2

I/O3

PIN DESCRIPTION

SYMBOL

DESCRIPTION

Address Inputs

A10

A0- A14

A11

I/O8

I/O7

I/O6

I/O5

I/O4

Data Inputs/Outputs

Chip Select Input

Write Enable Input

Output Enable Input

Power Supply

I/O1- I/O8

A13

28-pin

TSOP

A14

A12

I/O3

I/O2

I/O1

VDD

VSS

Ground

Publication Release Date: January 1998

Revision A6

- 1 -

W24257A

TRUTH TABLE

MODE

Not Selected

Output Disable

Read

VDD CURRENT

I/O1- I/O8

High Z

ISB, ISB1

IDD

High Z

Data Out

Data In

IDD

Write

IDD

DC CHARACTERISTICS

Absolute Maximum Ratings

PARAMETER

Supply Voltage to VSS Potential

Input/Output to VSS Potential

Allowable Power Dissipation

Storage Temperature

RATING

UNIT

-0.5 to +7.0

-0.5 to VDD +0.5

1.0

-65 to +150

0 to +70

°C

Operating Temperature

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the

device.

Operating Characteristics

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

PARAMETER

Input Low Voltage

Input High Voltage

SYM.

VIL

TEST CONDITIONS

MIN. TYP. MAX. UNIT

-0.5

+0.8

VIH

+2.2

VDD

+0.5

Input Leakage Current

ILI

VIN = VSS to VDD

-10

+10

Output Leakage

Current

ILO

VI/O = VSS to VDD, CS = VIH (min.)

or OE = VIH (min.) or WE = VIL

(max.)

Output Low Voltage

Output High Voltage

Operating Power

VOL

IOL = +8.0 mA

2.4

0.4

VOH IOH = -4.0 mA

f = fmax.

IDD

100

CS = VIL (max.), I/O

= 0 mA, Duty = 100%

f = 50 MHz

Supply Current

Standby Power

Supply Current

130

ISB

CS = VIH (min.)

Cycle = min., Duty = 100%

ISB1

CS ³ VDD -0.2V

Note: Typical characteristics are at VDD = 5V, TA = 25° C.

- 2 -

W24257A

CAPACITANCE

(VDD = 5V, TA = 25° C, f = 1 MHz)

PARAMETER

Input Capacitance

SYM.

CIN

CONDITIONS

VIN = 0V

MAX.

UNIT

Input/Output Capacitance

CI/O

VOUT = 0V

Note: These parameters are sampled but not 100% tested.

AC CHARACTERISTICS

AC Test Conditions

PARAMETER

Input Pulse Levels

CONDITIONS

0V to 3V

Input Rise and Fall Times

Input and Output Timing Reference Level

Output Load

5 nS

1.5V

CL = 30 pF, IOH/IOL = -4 mA/8 mA

AC Test Loads and Waveform

R1 480 ohm

OUTPUT

5 pF

OUTPUT

255 ohm

30 pF

255 ohm

Including

Jig and

Scope

Including

Jig and

Scope

WHZ

OHZ

T_OLZ,T_CHZ, T

(For T

CLZ

)

TOW

3.0V

90%

10%

5 nS

Publication Release Date: January 1998

Revision A6

- 3 -

W24257A

AC Characteristics, continued

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

Read Cycle

PARAMETER

SYMBOL

W24257A-35

MIN. MAX.

UNIT

Read Cycle Time

TRC

Address Access Time

TAA

Chip Select Access Time

Output Enable to Output Valid

Chip Selection to Output in Low Z

TACS

TAOE

TCLZ

Output Enable to Output in Low Z

Chip Deselection to Output in High Z

Output Disable to Output in High Z

Output Hold from Address Change

* These parameters are sampled but not 100% tested.

TOLZ

TCHZ

TOHZ

TOH

Write Cycle

PARAMETER

SYMBOL

W24257A-35

UNIT

MIN.

MAX.

Write Cycle Time

TWC

TCW

TAW

TAS

Chip Selection to End of Write

Address Valid to End of Write

Address Setup Time

Write Pulse Width

TWP

TWR

Write Recovery Time

CS, WE

Data Valid to End of Write

Data Hold from End of Write

Write to Output in High Z

TDW

TDH

TWHZ

Output Disable to Output in High Z

Output Active from End of Write

TOHZ

TOW

* These parameters are sampled but not 100% tested.

- 4 -

W24257A

TIMING WAVEFORMS

Read Cycle 1

(Address Controlled)

Address

DOUT

TAA

Read Cycle 2

(Chip Select Controlled)

ACS

CHZ

OUT

CLZ

Read Cycle 3

(Output Enable Controlled)

Address

TOH

AOE

TOLZ

TOHZ

TACS

TCLZ

CHZ

OUT

Publication Release Date: January 1998

Revision A6

- 5 -

W24257A

Timing Waveforms, continued

Write Cycle 1

(OE Clock)

Address

TAS

OHZ

(1, 4)

OUT

DIN

Write Cycle 2

(OE = VIL Fixed)

Address

TAW

(2)

(3)

WHZ

(1, 4)

OUT

DIN

TDH

Notes:

1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.

2. The data output from DOUT are the same as the data written to DIN during the write cycle.

3. DOUT provides the read data for the next address.

4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.

- 6 -

W24257A

ORDERING INFORMATION

ACCESS

TIME

OPERATING OPERATING

STANDBY

CURRENT

MAX. (mA)

PART NO.

CURRENT

MAX. (mA)

f = max.

CURRENT

MAX. (mA)

f = 50 MHz

PACKAGE

(nS)

W24257A-35

W24257AS-35

W24257AJ-35

W24257AQ-35

100

130

600 mil DIP

330 mil SOP

300 mil SOJ

Standard type one

TSOP

Notes:

1. Winbond reserves the right to make changes to its products without prior notice.

2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in

applications where personal injury might occur as a consequence of product failure.

Publication Release Date: January 1998

Revision A6

- 7 -

W24257A

PACKAGE DIMENSIONS

28-pin P-DIP

Dimension in Inches

Dimension in mm

Symbol

Nom.

Min.

Max. Min.

0.210

Max.

5.33

0.010

0.25

0.150 0.155 0.160

3.81

0.41

1.47

0.20

3.94

0.46

1.52

0.25

37.08

4.06

0.56

1.63

0.36

37.34

0.016 0.018

0.022

0.064

0.060

0.058

0.008

0.010 0.014

1.460 1.470

0.610

15.24 15.49

0.590 0.600

14.99

13.72 13.84 13.97

0.540 0.545 0.550

0.110

0.140

0.090 0.100

0.120 0.130

2.29

3.05

2.54

3.30

2.79

3.56

E ₁

17.02

0.630 0.650 0.670 16.00 16.51

0.090

2.29

Notes:

1. Dimensions D Max. & S include mold flash or

tie bar burrs.

2. Dimension E1 does not include interlead flash.

3. Dimensions D & E1 include mold mismatch and

are determined at the mold parting line.

Base Plane

4. Dimension B1 does not include dambar

protrusion/intrusion.

Seating Plane

5. Controlling dimension: Inches.

6. General appearance spec. should be based on

final visual inspection spec.

e ₁

e_A

B ₁

28-pin SO Wide Body

Dimension in mm

Dimension in Inches

Symbol

Nom.

Min.

Max. Min.

0.112

Max.

2.85

A ₁

0.004

0.093

0.014

0.10

0.098 0.103

2.36

0.36

0.20

2.49

0.41

0.25

2.62

0.51

0.36

0.016

0.020

0.014

0.008 0.010

0.713 0.733

18.11 18.62

e₁

8.28

1.12

8.53

1.42

0.326 0.331 0.336

0.044 0.050 0.056

8.41

1.27

0.477

0.044

0.453 0.465

0.028 0.036

11.51 11.81 12.12

H_E

L _E

H E

0.91

1.70

1.12

0.71

1.50

0.059

0.075

0.047

0.067

1.91

1.19

0.10

0.004

Detail F

Notes:

1. Dimensions D Max. & S include mold flash

or tie bar burrs.

2. Dimension b does not include dambar

protrusion/intrusion.

3. Dimensions D & E include mold mismatch

and determined at the mold parting line.

4. Controlling dimension: Inches.

5. General appearance spec should be based

on final visual inspection spec.

e₁

A₂

A₁

See Detail F

Seating Plane

- 8 -

W24257A

Package Dimensions, continued

28-pin Small Outline J Band

Dimension in Inches

Dimension in mm

Symbol

Min. Nom. Max. Min. Nom. Max.

3.56

0.140

0.027

0.095 0.100 0.105

0.028 0.032

0.69

2.41

0.66

0.41

0.20

2.54

0.71

0.46

0.25

18.03

2.67

0.81

0.026

0.016 0.018

0.56

0.022

0.014

0.730

0.010

0.710

0.008

0.36

18.54

7.49

1.12

7.75

1.42

0.300

0.050

0.305

0.056

7.62

1.27

0.295

0.044

0.285

0.245 0.265

6.22

8.31

6.73

8.56

7.24

8.81

0.327 0.337 0.347

0.097

0.045

0.004

1.96

2.21

0.077 0.087

2.46

1.14

0.10

Notes:

1. Dimensions D Max. & S include mold flash

or tie bar burrs.

2. Dimension b does not include dambar

protrusion/intrusion.

£c

3. Dimensions D & E include mold mismatch

and are determined at the mold parting line.

4. Controlling dimension: Inches.

Seating Plane

5. General appearance spec. should be based

on final visual inspection spec.

28-pin Standard Type One TSOP

H_D

Dimension In Inches

Dimension In mm

Symbol

Max.

1.20

Min. Nom. Max. Min. Nom.

0.047

0.05

A ₁

A 2

0.15

0.002

0.035

0.006

0.041

0.95

1.00

0.20

0.040

1.05

0.27

0.17

0.10

0.007 0.008 0.011

0.004 0.008

0.15

0.21

0.006

11.90

11.70

7.90

11.80

8.00

0.461 0.465 0.469

0.311 0.315 0.319

8.10

13.60

0.520 0.528 0.536 13.20 13.40

0.022

0.55

0.60

0.25

0.020

0.50

0.70

0.024 0.028

0.010

0.004

L₁

0.10

0.000

0.00

Controlling dimension: Millimeters

A₁

L₁

Publication Release Date: January 1998

Revision A6

- 9 -

W24257A

VERSION HISTORY

VERSION

DATE

PAGE

1, 7

DESCRIPTION

Mar. 1997

Add TSOP package

Modify IDD data

2, 7

Jan. 1998

2, 7

Winbond Electronics (H.K.) Ltd.

Winbond Electronics North America Corp.

Winbond Memory Lab.

Winbond Microelectronics Corp.

Winbond Systems Lab.

Headquarters

Rm. 803, World Trade Square, Tower II,

123 Hoi Bun Rd., Kwun Tong,

Kowloon, Hong Kong

TEL: 852-27513100

FAX: 852-27552064

No. 4, Creation Rd. III,

Science-Based Industrial Park,

Hsinchu, Taiwan

TEL: 886-3-5770066

FAX: 886-3-5796096

http://www.winbond.com.tw/

2727 N. First Street, San Jose,

CA 95134, U.S.A.

TEL: 408-9436666

Voice & Fax-on-demand: 886-2-27197006

FAX: 408-5441798

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.,

Taipei, Taiwan

TEL: 886-2-27190505

FAX: 886-2-27197502

Note: All data and specifications are subject to change without notice.

- 10 -

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W24257AS-35产品参数

型号:	W24257AS-35
是否Rohs认证：	不符合
生命周期：	Obsolete
零件包装代码：	SOIC
包装说明：	0.330 INCH, SOP-28
针数：	28
Reach Compliance Code：	not_compliant
ECCN代码：	EAR99
HTS代码：	8542.32.00.41
风险等级：	5.83
最长访问时间：	35 ns
I/O 类型：	COMMON
JESD-30 代码：	R-PDSO-G28
JESD-609代码：	e0
长度：	18.11 mm
内存密度：	262144 bit
内存集成电路类型：	STANDARD SRAM
内存宽度：	8
功能数量：	1
端口数量：	1
端子数量：	28
字数：	32768 words
字数代码：	32000
工作模式：	ASYNCHRONOUS
最高工作温度：	70 °C
最低工作温度：
组织：	32KX8
输出特性：	3-STATE
可输出：	YES
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP28,.45
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
并行/串行：	PARALLEL
峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	5 V
认证状态：	Not Qualified
座面最大高度：	2.85 mm
最大待机电流：	0.01 A
最小待机电流：	4.5 V
子类别：	SRAMs
最大压摆率：	0.13 mA
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	4.5 V
标称供电电压 (Vsup)：	5 V
表面贴装：	YES
技术：	CMOS
温度等级：	COMMERCIAL
端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	8.41 mm
Base Number Matches：	1

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产品型号W24257AS-35的概述

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