W25X80AVSSIG全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

W25X10A, W25X20A, W25X40A, W25X80A

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT

SERIAL FLASH MEMORY WITH

4KB SECTORS AND DUAL OUTPUT SPI

Publication Release Date: February 27, 2008

Revision B

- 1 -

W25X10A, W25X20A, W25X40A, W25X80A

Table of Contents

1.

2.

3.

4.

5.

6.

7.

GENERAL DESCRIPTION ......................................................................................................... 4

FEATURES................................................................................................................................. 4

PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5

PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5

PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5

PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6

PIN DESCRIPTION..................................................................................................................... 6

7.1

7.2

7.3

7.4

7.5

7.6

7.7

Package Types............................................................................................................... 7

Chip Select (/CS)............................................................................................................ 7

Serial Data Output (DO) ................................................................................................. 7

Write Protect (/WP)......................................................................................................... 7

HOLD (/HOLD) ............................................................................................................... 7

Serial Clock (CLK) .......................................................................................................... 7

Serial Data Input / Output (DIO) ..................................................................................... 7

8.

9.

BLOCK DIAGRAM ...................................................................................................................... 8

FUNCTIONAL DESCRIPTION ................................................................................................... 9

9.1

SPI OPERATIONS ......................................................................................................... 9

9.1.1 SPI Modes........................................................................................................................9

9.1.2 Dual Output SPI................................................................................................................9

9.1.3 Hold Function ...................................................................................................................9

9.2

WRITE PROTECTION.................................................................................................. 10

9.2.1 Write Protect Features....................................................................................................10

10.

CONTROL AND STATUS REGISTERS................................................................................... 11

10.1 STATUS REGISTER .................................................................................................... 11

10.1.1 BUSY............................................................................................................................11

10.1.2 Write Enable Latch (WEL) ............................................................................................11

10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................11

10.1.4 Top/Bottom Block Protect (TB).....................................................................................11

10.1.5 Reserved Bits ...............................................................................................................11

10.1.6 Status Register Protect (SRP)......................................................................................12

10.1.7 Status Register Memory Protection..............................................................................13

10.2 INSTRUCTIONS........................................................................................................... 14

10.2.1 Manufacturer and Device Identification.........................................................................14

10.2.2 Instruction Set...............................................................................................................15

10.2.3 Write Enable (06h)........................................................................................................16

10.2.4 Write Disable (04h).......................................................................................................16

10.2.5 Read Status Register (05h) ..........................................................................................17

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W25X10A, W25X20A, W25X40A, W25X80A

10.2.6 Write Status Register (01h) ..........................................................................................18

10.2.7 Read Data (03h)...........................................................................................................19

10.2.8 Fast Read (0Bh) ...........................................................................................................20

10.2.9 Fast Read Dual Output (3Bh) .......................................................................................21

10.2.10 Page Program (02h)...................................................................................................22

10.2.11 Sector Erase (20h) .....................................................................................................23

10.2.12 Block Erase (D8h) ......................................................................................................24

10.2.13 Chip Erase (C7h)........................................................................................................25

10.2.14 Power-down (B9h)......................................................................................................26

10.2.15 Release Power-down / Device ID (ABh).....................................................................27

10.2.16 Read Manufacturer / Device ID (90h).........................................................................29

10.2.17 JEDEC ID (9Fh)..........................................................................................................30

11.

ELECTRICAL CHARACTERISTICS......................................................................................... 31

11.1 Absolute Maximum Ratings.......................................................................................... 31

11.2 Operating Ranges......................................................................................................... 31

11.3 Endurance and Data Retention .................................................................................... 32

11.4 Power-up Timing and Write Inhibit Threshold .............................................................. 32

11.5 DC Electrical Characteristics........................................................................................ 33

11.6 AC Measurement Conditions........................................................................................ 34

11.7 AC Electrical Characteristics ........................................................................................ 35

11.8 AC Electrical Characteristics (cont’d) ........................................................................... 36

11.9 Serial Output Timing..................................................................................................... 37

11.10 Input Timing................................................................................................................. 37

11.11 Hold Timing ................................................................................................................. 37

PACKAGE SPECIFICATION.................................................................................................... 38

12.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38

12.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39

12.3 8-Pin PDIP 300-mil (Package Code DA)...................................................................... 40

12.4 8-Pad WSON 6x5mm (Package Code ZP) .................................................................. 41

12.5 8-Pad WSON 6x5mm Cont’d........................................................................................ 42

ORDERING INFORMATION .................................................................................................... 43

REVISION HISTORY................................................................................................................ 45

12.

13.

14.

Publication Release Date: February 27, 2008

- 3 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

1. GENERAL DESCRIPTION

The W25X10A (1M-bit), W25X20A (2M-bit), W25X40A (4M-bit) and W25X80A (8M-bit) Serial Flash

memories provide a storage solution for systems with limited space, pins and power. The 25X series

offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code

download applications as well as storing voice, text and data. The devices operate on a single 2.7V to

3.6V power supply with current consumption as low as 5mA active and 1µA for power-down. All

devices are offered in space-saving packages.

The W25X10A/20A/40A/80A array is organized into 512/1024/2048/4096 programmable pages of

256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction.

Pages can be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip

(chip erase). The W25X10A/20A/40A/80A has 32/64/128/256 erasable sectors and 2/4/8/16 erasable

blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data

and parameter storage. (See figure 2.)

The W25X10A/20A/40A/80A supports the standard Serial Peripheral Interface (SPI), and a high

performance dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial

Data Out. SPI clock frequencies of up to 100MHz are supported allowing equivalent clock rates of

200MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to

those of 8 and 16-bit Parallel Flash memories.

A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control

features, provide further control flexibility. Additionally, the device supports JEDEC standard

manufacturer and device identification.

2. FEATURES

• Family of Serial Flash Memories

• Flexible Architecture with 4KB sectors

– Sector Erase (4K-bytes)

– Block Erase (64K-byte)

– Page program up to 256 bytes <2ms

– Up to 100,000 erase/write cycles

– 20-year retention

– W25X10A: 1M-bit / 128K-byte (131,072)

– W25X20A: 2M-bit / 256K-byte (262,144)

– W25X40A: 4M-bit / 512K-byte (524,288)

– W25X80A: 8M-bit / 1M-byte (1,048,576)

– 256-bytes per programmable page

– Uniform 4K-byte Sectors / 64K-byte Blocks

• Low Power Consumption, Wide

Temperature Range

– Single 2.7 to 3.6V supply

– 5mA active current, 1µA Power-down (typ)

– -40° to +85°C operating range

• SPI with Single or Dual Outputs

– Clock, Chip Select, Data I/O, Data Out

– Optional Hold function for SPI flexibility

• Data Transfer up to 200M-bits / second

– Clock operation to 100MHz

– Fast Read Dual Output instruction

– Auto-increment Read capability

• Software and Hardware Write Protection

– Write-Protect all or portion of memory

– Enable/Disable protection with /WP pin

– Top or bottom array protection

• Space Efficient Packaging

– 8-pin SOIC 150-mil

– 8-pin SOIC 208-mil (W25X40A/80A)

– 8-pin PDIP 300-mil

– 8-pad WSON 6x5-mm

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W25X10A, W25X20A, W25X40A, W25X80A

3. PIN CONFIGURATION SOIC 150-MIL

Figure 1a. W25X10A, W25X20A, W25X40A and W25X80A Pin Assignments, 8-pin SOIC (Package Code SN)

4. PIN CONFIGURATION SOIC 208-MIL

Figure 1b. W25X40A and W25X80A Pin Assignments, 8-pin SOIC (Package Code SS)

5. PIN CONFIGURATION PDIP 300-MIL

Figure 1c. W25X10A, W25X20A, W25X40A and W25X80A Pin Assignments, 8-pin PDIP (Package Code DA)

Publication Release Date: February 27, 2008

- 5 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

6. PAD CONFIGURATION WSON 6X5-MM

Figure 1d. W25X10A, W25X20A, W25X40A and W25X80A Pad Assignments, 8-pad WSON (Package Code ZP)

7. PIN DESCRIPTION

SOIC 150-mil, SOIC 208-mil, PDIP 300-mil, and WSON 6x5-mm

PIN NO.

PIN NAME

/CS

I/O

I

FUNCTION

1

2

3

4

5

6

7

8

Chip Select Input

Data Output

DO

O

I

/WP

Write Protect Input

Ground

GND

DIO

I/O

Data Input / Output

Serial Clock Input

Hold Input

CLK

I

/HOLD

VCC

Power Supply

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W25X10A, W25X20A, W25X40A, W25X80A

7.1 Package Types

At the time this datasheet was published not all package types had been finalized. Contact Winbond

to confirm availability of these packages before designing to this specification. All parts are offered in

an 8-pin plastic 150-mil width SOIC (package code SN) as shown in figure 1a. The W25X40A and

W25X80A are offered in an 8-pin plastic 208-mil width SOIC (package code SS) as shown in figure

1b. All parts will also be offered in an 8-pin 300-mil DIP (package code DA) and an 8-pad 6x5-mm

WSON (package code ZP) as shown in figure 1c, and 1d respectively. Package diagrams and

dimensions are illustrated at the end of this datasheet.

7.2 Chip Select (/CS)

The SPI Chip Select (/CS) pin enables and disables device operation. When /CS is high the device is

deselected and the Serial Data Output (DO) pin is at high impedance. When deselected, the devices

power consumption will be at standby levels unless an internal erase, program or status register cycle

is in progress. When /CS is brought low the device will be selected, power consumption will increase

to active levels and instructions can be written to and data read from the device. After power-up, /CS

must transition from high to low before a new instruction will be accepted. The /CS input must track

the VCC supply level at power-up (see “Write Protection” and figure 20). If needed a pull-up resister

on /CS can be used to accomplish this.

7.3 Serial Data Output (DO)

The SPI Serial Data Output (DO) pin provides a means for data and status to be serially read from

(shifted out of) the device. Data is shifted out on the falling edge of the Serial Clock (CLK) input pin.

7.4 Write Protect (/WP)

The Write Protect (/WP) pin can be used to prevent the Status Register from being written. Used in

conjunction with the Status Register’s Block Protect (BP2, BP1, and BP0) bits and Status Register

Protect (SRP) bit, a portion or the entire memory array can be hardware protected. The /WP pin is

active low.

7.5 HOLD (/HOLD)

The Hold (/HOLD) pin allows the device to be paused while it is actively selected. When /HOLD is

brought low, while /CS is low, the DO pin will be at high impedance and signals on the DIO and CLK

pins will be ignored (don’t care). When /HOLD is brought high, device operation can resume. The

/HOLD function can be useful when multiple devices are sharing the same SPI signals. (“See Hold

function”)

7.6 Serial Clock (CLK)

The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. (“See

SPI Operations”)

7.7 Serial Data Input / Output (DIO)

The SPI Serial Data Input/Output (DIO) pin provides a means for instructions, addresses and data to

be serially written to (shifted into) the device. Data is latched on the rising edge of the Serial Clock

(CLK) input pin. The DIO pin is also used as an output when the Fast Read Dual Output instruction is

executed.

Publication Release Date: February 27, 2008

- 7 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

8. BLOCK DIAGRAM

Figure 2. W25X10A, W25X20A, W25X40A and W25X80A Block Diagram

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W25X10A, W25X20A, W25X40A, W25X80A

9. FUNCTIONAL DESCRIPTION

9.1 SPI OPERATIONS

9.1.1 SPI Modes

The W25X10A/20A/40A/80A is accessed through an SPI compatible bus consisting of four signals:

Serial Clock (CLK), Chip Select (/CS), Serial Data Input/Output (DIO) and Serial Data Output (DO).

Both SPI bus operation Modes 0 (0,0) and 3 (1,1) are supported. The primary difference between

Mode 0 and Mode 3 concerns the normal state of the CLK signal when the SPI bus master is in

standby and data is not being transferred to the Serial Flash. For Mode 0 the CLK signal is normally

low. For Mode 3 the CLK signal is normally high. In either case data input on the DIO pin is sampled

on the rising edge of the CLK. Data on the DO and DIO pins are clocked out on the falling edge of

CLK.

9.1.2 Dual Output SPI

The W25X10A/20A/40A/80A supports Dual output operation when using the “Fast Read with Dual

Output” (3B hex) instruction. This feature allows data to be transferred from the Serial Flash memory

at twice the rate possible with the standard SPI. This instruction is ideal for quickly downloading code

from Flash to RAM upon power-up (code-shadowing) or for applications that cache code-segments to

RAM for execution. The Dual output feature simply allows the SPI input pin to also serve as an output

during this instruction. All other operations use the standard SPI interface with single output signal.

9.1.3 Hold Function

The /HOLD signal allows the W25X10A/20A/40A/80A operation to be paused while it is actively

selected (when /CS is low). The /HOLD function may be useful in cases where the SPI data and clock

signals are shared with other devices. For example, consider if the page buffer was only partially

written when a priority interrupt requires use of the SPI bus. In this case the /HOLD function can save

the state of the instruction and the data in the buffer so programming can resume where it left off once

the bus is available again.

To initiate a /HOLD condition, the device must be selected with /CS low. A /HOLD condition will

activate on the falling edge of the /HOLD signal if the CLK signal is already low. If the CLK is not

already low the /HOLD condition will activate after the next falling edge of CLK. The /HOLD condition

will terminate on the rising edge of the /HOLD signal if the CLK signal is already low. If the CLK is not

already low the /HOLD condition will terminate after the next falling edge of CLK.

During a /HOLD condition, the Serial Data Output (DO) is high impedance, and Serial Data

Input/Output (DIO) and Serial Clock (CLK) are ignored. The Chip Select (/CS) signal should be kept

active (low) for the full duration of the /HOLD operation to avoid resetting the internal logic state of the

device.

Publication Release Date: February 27, 2008

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Revision B

W25X10A, W25X20A, W25X40A, W25X80A

9.2 WRITE PROTECTION

Applications that use non-volatile memory must take into consideration the possibility of noise and

other adverse system conditions that may compromise data integrity. To address this concern the

W25X10A/20A/40A/80A provides several means to protect data from inadvertent writes.

9.2.1 Write Protect Features

•

Device resets when VCC is below threshold.

Time delay write disable after Power-up.

Write enable/disable instructions.

Automatic write disable after program and erase.

Software write protection using Status Register.

Hardware write protection using Status Register and /WP pin.

Write Protection using Power-down instruction.

Upon power-up or at power-down the W25X10A/20A/40A/80A will maintain a reset condition while

VCC is below the threshold value of VWI, (See Power-up Timing and Voltage Levels and Figure 20).

While reset, all operations are disabled and no instructions are recognized. During power-up and after

the VCC voltage exceeds VWI, all program and erase related instructions are further disabled for a

time delay of tPUW. This includes the Write Enable, Page Program, Sector Erase, Block Erase, Chip

Erase and the Write Status Register instructions. Note that the chip select pin (/CS) must track the

VCC supply level at power-up until the VCC-min level and tVSL time delay is reached. If needed a pull-

up resister on /CS can be used to accomplish this.

After power-up the device is automatically placed in a write-disabled state with the Status Register

Write Enable Latch (WEL) set to a 0. A Write Enable instruction must be issued before a Page

Program, Sector Erase, Chip Erase or Write Status Register instruction will be accepted. After

completing a program, erase or write instruction the Write Enable Latch (WEL) is automatically

cleared to a write-disabled state of 0.

Software controlled write protection is facilitated using the Write Status Register instruction and setting

the Status Register Protect (SRP) and Block Protect (TB, BP2, BP1, and BP0) bits. These Status

Register bits allow a portion or all of the memory to be configured as read only. Used in conjunction

with the Write Protect (/WP) pin, changes to the Status Register can be enabled or disabled under

hardware control. See Status Register for further information.

Additionally, the Power-down instruction offers an extra level of write protection as all instructions are

ignored except for the Release Power-down instruction.

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W25X10A, W25X20A, W25X40A, W25X80A

10. CONTROL AND STATUS REGISTERS

The Read Status Register instruction can be used to provide status on the availability of the Flash

memory array, if the device is write enabled or disabled, and the state of write protection. The Write

Status Register instruction can be used to configure the device write protection features. See Figure 3.

10.1 STATUS REGISTER

10.1.1 BUSY

BUSY is a read only bit in the status register (S0) that is set to a 1 state when the device is executing

a Page Program, Sector Erase, Block Erase, Chip Erase or Write Status Register instruction. During

this time the device will ignore further instructions except for the Read Status Register instruction (see

tW, tPP, tSE, tBE, and tCE in AC Characteristics). When the program, erase or write status register

instruction has completed, the BUSY bit will be cleared to a 0 state indicating the device is ready for

further instructions.

10.1.2 Write Enable Latch (WEL)

Write Enable Latch (WEL) is a read only bit in the status register (S1) that is set to a 1 after executing

a Write Enable Instruction. The WEL status bit is cleared to a 0 when the device is write disabled. A

write disable state occurs upon power-up or after any of the following instructions: Write Disable, Page

Program, Sector Erase, Block Erase, Chip Erase and Write Status Register.

10.1.3 Block Protect Bits (BP2, BP1, BP0)

The Block Protect Bits (BP2, BP1, and BP0) are non-volatile read/write bits in the status register (S4,

S3, and S2) that provide Write Protection control and status. Block Protect bits can be set using the

Write Status Register Instruction (see tW in AC characteristics). All, none or a portion of the memory

array can be protected from Program and Erase instructions (see Status Register Memory Protection

table). The factory default setting for the Block Protection Bits is 0, none of the array protected. The

Block Protect bits can not be written to if the Status Register Protect (SRP) bit is set to 1 and the Write

Protect (/WP) pin is low.

10.1.4 Top/Bottom Block Protect (TB)

The Top/Bottom bit (TB) controls if the Block Protect Bits (BP2, BP1, BP0) protect from the Top

(TB=0) or the Bottom (TB=1) of the array as shown in the Status Register Memory Protection table.

The TB bit is non-volatile and the factory default setting is TB=0. The TB bit can be set with the Write

Status Register Instruction provided that the Write Enable instruction has been issued. The TB bit can

not be written to if the Status Register Protect (SRP) bit is set to 1 and the Write Protect (/WP) pin is

low.

10.1.5 Reserved Bits

Status register bit location S6 is reserved for future use. Current devices will read 0 for this bit

location. It is recommended to mask out the reserved bit when testing the Status Register. Doing this

will ensure compatibility with future devices.

Publication Release Date: February 27, 2008

- 11 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

10.1.6 Status Register Protect (SRP)

The Status Register Protect (SRP) bit is a non-volatile read/write bit in status register (S7) that can be

used in conjunction with the Write Protect (/WP) pin to disable writes to status register. When the SRP

bit is set to a 0 state (factory default) the /WP pin has no control over status register. When the SRP

pin is set to a 1, the Write Status Register instruction is locked out while the /WP pin is low. When the

/WP pin is high the Write Status Register instruction is allowed.

Figure 3. Status Register Bit Locations

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W25X10A, W25X20A, W25X40A, W25X80A

10.1.7 Status Register Memory Protection

STATUS REGISTER⁽¹⁾

W25X80A (8M-BIT) MEMORY PROTECTION

TB BP2

BP1

0

1

0

1

BP0

0

1

0

1

0

1

0

1

BLOCK(S)

NONE

ADDRESSES

DENSITY

NONE

64KB

128KB

256KB

512KB

64KB

128KB

256KB

512KB

1MB

PORTION

NONE

x

0

1

x

0

1

0

1

NONE

15

0F0000h - 0FFFFFh

0E0000h - 0FFFFFh

0C0000h - 0FFFFFh

080000h - 0FFFFFh

000000h - 00FFFFh

000000h - 01FFFFh

000000h - 03FFFFh

000000h - 07FFFFh

000000h - 0FFFFFh

Upper 1/16

Upper 1/8

Upper 1/4

Upper 1/2

Lower 1/16

Lower 1/8

Lower 1/4

Lower 1/2

ALL

14 and 15

12 thru 15

8 thru 15

0

0 and 1

0 thru 3

0 thru 7

0 thru 15

0

1

0

1

x

1MB

ALL

STATUS REGISTER⁽¹⁾

W25X40A (4M-BIT) MEMORY PROTECTION

TB BP2

BP1

0

1

0

1

x

BP0

0

1

0

1

0

1

x

BLOCK(S)

NONE

7

6 and 7

4 thru 7

0

0 and 1

0 thru 3

0 thru 7

ADDRESSES

NONE

DENSITY

NONE

64KB

128KB

256KB

64KB

128KB

256KB

512KB

PORTION

NONE

x

0

1

x

0

1

070000h - 07FFFFh

060000h - 07FFFFh

040000h - 07FFFFh

000000h - 00FFFFh

000000h - 01FFFFh

000000h - 03FFFFh

000000h - 07FFFFh

Upper 1/8

Upper 1/4

Upper 1/2

Lower 1/8

Lower 1/4

Lower 1/2

ALL

STATUS REGISTER⁽¹⁾

W25X20A (2M-BIT) MEMORY PROTECTION

TB BP2

BP1

0

1

0

BP0

0

1

0

1

BLOCK(S)

NONE

3

2 and 3

0

ADDRESSES

NONE

DENSITY

NONE

64KB

128KB

64KB

PORTION

NONE

x

0

1

x

030000h - 03FFFFh

020000h - 03FFFFh

000000h - 00FFFFh

000000h - 01FFFFh

000000h - 03FFFFh

Upper 1/4

Upper 1/2

Lower 1/4

Lower 1/2

ALL

1

0

1

0 and 1

0 thru 3

128KB

256KB

STATUS REGISTER⁽¹⁾

W25X10A (1M-BIT) MEMORY PROTECTION

TB BP2

BP1

0

1

BP0

0

1

x

BLOCK(S)

NONE

ADDRESSES

NONE

010000h - 01FFFFh

000000h - 00FFFFh

000000h - 01FFFFh

DENSITY

NONE

64KB

128KB

PORTION

NONE

Upper 1/2

Lower 1/2

ALL

x

0

1

0

x

0 and 1

Note:

1. x = don’t care

Publication Release Date: February 27, 2008

Revision B

- 13 -

W25X10A, W25X20A, W25X40A, W25X80A

10.2 INSTRUCTIONS

The instruction set of the W25X10A/20A/40A/80A consists of fifteen basic instructions that are fully

controlled through the SPI bus (see Instruction Set table). Instructions are initiated with the falling

edge of Chip Select (/CS). The first byte of data clocked into the DIO input provides the instruction

code. Data on the DIO input is sampled on the rising edge of clock with most significant bit (MSB) first.

Instructions vary in length from a single byte to several bytes and may be followed by address bytes,

data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed

with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in

figures 4 through 19. All read instructions can be completed after any clocked bit. However, all

instructions that Write, Program or Erase must complete on a byte boundary (CS driven high after a

full 8-bits have been clocked) otherwise the instruction will be terminated. This feature further protects

the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or

when the Status Register is being written, all instructions except for Read Status Register will be

ignored until the program or erase cycle has completed.

10.2.1 Manufacturer and Device Identification

MANUFACTURER ID

(M7-M0)

Winbond Serial Flash

EFh

(ID15-ID0)

9Fh

Device ID

Instruction

W25X10A

W25X20A

W25X40A

W25X80A

(ID7-ID0)

ABh, 90h

10h

3011h

3012h

3013h

3014h

11h

12h

13h

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W25X10A, W25X20A, W25X40A, W25X80A

10.2.2 Instruction Set ⁽¹⁾

INSTRUCTION

NAME

BYTE 1

CODE

BYTE 2

BYTE 3

BYTE 4 BYTE 5

BYTE 6

N-BYTES

Write Enable

06h

04h

Write Disable

Read Status

Register

(2)

05h

(S7–S0)⁽¹⁾

Write Status

Register

01h

03h

0Bh

S7–S0

Read Data

A23–A16

A15–A8 A7–A0

(D7–D0)

dummy

(Next byte)

(D7–D0)

continuous

(Next Byte)

continuous

Fast Read

I/O =

(D6,D4,D2,D0)

O =

(one byte

per 4 clocks,

continuous)

Fast Read Dual

Output

3Bh

A23–A16

A15–A8 A7–A0

dummy

(D7,D5,D3,D1)

Up to 256

bytes

Page Program

02h

D8h

20h

A23–A16

A15–A8 A7–A0

(D7–D0)

(Next byte)

Block Erase

(64KB)

Sector Erase

(4KB)

Chip Erase

Power-down

Release Power-

down / Device ID

Manufacturer/

Device ID ⁽³⁾

C7h/60h

B9h

ABh

90h

dummy

00h

(ID7-ID0)⁽⁴⁾

(M7-M0)

(ID7-ID0)

(ID15-

ID8)

(M7-M0)

(ID7-ID0)

JEDEC ID

9Fh

Manufacturer Memory Capacity

Type

Notes:

1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data being

read from the device on the DO pin.

2. The Status Register contents will repeat continuously until /CS terminates the instruction.

3. See Manufacturer and Device Identification table for Device ID information.

4. The Device ID will repeat continuously until /CS terminates the instruction.

Publication Release Date: February 27, 2008

- 15 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

10.2.3 Write Enable (06h)

The Write Enable instruction (Figure 4) sets the Write Enable Latch (WEL) bit in the Status Register to

a 1. The WEL bit must be set prior to every Page Program, Sector Erase, Block Erase, Chip Erase

and Write Status Register instruction. The Write Enable instruction is entered by driving /CS low,

shifting the instruction code “06h” into the Data Input (DI) pin on the rising edge of CLK, and then

driving /CS high.

Figure 4. Write Enable Instruction Sequence Diagram

10.2.4 Write Disable (04h)

The Write Disable instruction (Figure 5) resets the Write Enable Latch (WEL) bit in the Status Register

to a 0. The Write Disable instruction is entered by driving /CS low, shifting the instruction code “04h”

into the DIO pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up

and upon completion of the Write Status Register, Page Program, Sector Erase, Block Erase and

Chip Erase instructions.

Figure 5. Write Disable Instruction Sequence Diagram

- 16 -

W25X10A, W25X20A, W25X40A, W25X80A

10.2.5 Read Status Register (05h)

The Read Status Register instruction allows the 8-bit Status Register to be read. The instruction is

entered by driving /CS low and shifting the instruction code “05h” into the DIO pin on the rising edge of

CLK. The status register bits are then shifted out on the DO pin at the falling edge of CLK with most

significant bit (MSB) first as shown in figure 6. The Status Register bits are shown in figure 3 and

include the BUSY, WEL, BP2-BP0, TB and SRP bits (see description of the Status Register earlier in

this datasheet).

The Status Register instruction may be used at any time, even while a Program, Erase or Write Status

Register cycle is in progress. This allows the BUSY status bit to be checked to determine when the

cycle is complete and if the device can accept another instruction. The Status Register can be read

continuously, as shown in Figure 6. The instruction is completed by driving /CS high.

Figure 6. Read Status Register Instruction Sequence Diagram

Publication Release Date: February 27, 2008

- 17 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

10.2.6 Write Status Register (01h)

The Write Status Register instruction allows the Status Register to be written. A Write Enable

instruction must previously have been executed for the device to accept the Write Status Register

Instruction (Status Register bit WEL must equal 1). Once write enabled, the instruction is entered by

driving /CS low, sending the instruction code “01h”, and then writing the status register data byte as

illustrated in figure 7. The Status Register bits are shown in figure 3 and described earlier in this

datasheet.

Only non-volatile Status Register bits SRP, TB, BP2, BP1 and BP0 (bits 7, 5, 4, 3 and 2) can be

written to. All other Status Register bit locations are read-only and will not be affected by the Write

Status Register instruction.

The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not

done the Write Status Register instruction will not be executed. After /CS is driven high, the self-timed

Write Status Register cycle will commence for a time duration of tW (See AC Characteristics). While

the Write Status Register cycle is in progress, the Read Status Register instruction may still accessed

to check the status of the BUSY bit. The BUSY bit is a 1 during the Write Status Register cycle and a

0 when the cycle is finished and ready to accept other instructions again. After the Write Register

cycle has finished the Write Enable Latch (WEL) bit in the Status Register will be cleared to 0.

The Write Status Register instruction allows the Block Protect bits (TB, BP2, BP1 and BP0) to be set

for protecting all, a portion, or none of the memory from erase and program instructions. Protected

areas become read-only (see Status Register Memory Protection table). The Write Status Register

instruction also allows the Status Register Protect bit (SRP) to be set. This bit is used in conjunction

with the Write Protect (/WP) pin to disable writes to the status register. When the SRP bit is set to a 0

state (factory default) the /WP pin has no control over the status register. When the SRP pin is set to a

1, the Write Status Register instruction is locked out while the /WP pin is low. When the /WP pin is

high the Write Status Register instruction is allowed.

Figure 7. Write Status Register Instruction Sequence Diagram

- 18 -

W25X10A, W25X20A, W25X40A, W25X80A

10.2.7 Read Data (03h)

The Read Data instruction allows one more data bytes to be sequentially read from the memory. The

instruction is initiated by driving the /CS pin low and then shifting the instruction code “03h” followed

by a 24-bit address (A23-A0) into the DIO pin. The code and address bits are latched on the rising

edge of the CLK pin. After the address is received, the data byte of the addressed memory location

will be shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first. The

address is automatically incremented to the next higher address after each byte of data is shifted out

allowing for a continuous stream of data. This means that the entire memory can be accessed with a

single instruction as long as the clock continues. The instruction is completed by driving /CS high. The

Read Data instruction sequence is shown in figure 8. If a Read Data instruction is issued while an

Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any

effects on the current cycle. The Read Data instruction allows clock rates from D.C. to a maximum of

fR (see AC Electrical Characteristics).

Figure 8. Read Data Instruction Sequence Diagram

Publication Release Date: February 27, 2008

- 19 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

10.2.8 Fast Read (0Bh)

The Fast Read instruction is similar to the Read Data instruction except that it can operate at the

highest possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding

eight “dummy” clocks after the 24-bit address as shown in figure 9. The dummy clocks allow the

devices internal circuits additional time for setting up the initial address. During the dummy clocks the

data value on the DIO pin is a “don’t care”.

Figure 9. Fast Read Instruction Sequence Diagram

- 20 -

W25X10A, W25X20A, W25X40A, W25X80A

10.2.9 Fast Read Dual Output (3Bh)

The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction

except that data is output on two pins, DO and DIO, instead of just DO. This allows data to be

transferred from the W25X10A/20A/40A/80A at twice the rate of standard SPI devices. The Fast Read

Dual Output instruction is ideal for quickly downloading code from Flash to RAM upon power-up or for

applications that cache code-segments to RAM for execution.

Similar to the Fast Read instruction, the Fast Read Dual Output instruction can operate at the highest

possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight

“dummy” clocks after the 24-bit address as shown in figure 10. The dummy clocks allow the device's

internal circuits additional time for setting up the initial address. The input data during the dummy

clocks is “don’t care”. However, the DIO pin should be high-impedance prior to the falling edge of the

first data out clock.

Figure 10. Fast Read Dual Output Instruction Sequence Diagram

Publication Release Date: February 27, 2008

- 21 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

10.2.10 Page Program (02h)

The Page Program instruction allows up to 256 bytes of data to be programmed at previously erased

to all 1s (FFh) memory locations. A Write Enable instruction must be executed before the device will

accept the Page Program Instruction (Status Register bit WEL must equal 1). The instruction is

initiated by driving the /CS pin low then shifting the instruction code “02h” followed by a 24-bit address

(A23-A0) and at least one data byte, into the DIO pin. The /CS pin must be held low for the entire

length of the instruction while data is being sent to the device.

If an entire 256 byte page is to be programmed, the last address byte (the 8 least significant address

bits) should be set to 0. If the last address byte is not zero, and the number of clocks exceed the

remaining page length, the addressing will wrap to the beginning of the page. In some cases, less

than 256 bytes (a partial page) can be programmed without having any effect on other bytes within the

same page. One condition to perform a partial page program is that the number of clocks can not

exceed the remaining page length. If more than 256 bytes are sent to the device the addressing will

wrap to the beginning of the page and overwrite previously sent data.

As with the write and erase instructions, the /CS pin must be driven high after the eighth bit of the last

byte has been latched. If this is not done the Page Program instruction will not be executed. After /CS

is driven high, the self-timed Page Program instruction will commence for a time duration of tpp (See

AC Characteristics). While the Page Program cycle is in progress, the Read Status Register

instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during

the Page Program cycle and becomes a 0 when the cycle is finished and the device is ready to accept

other instructions again. After the Page Program cycle has finished the Write Enable Latch (WEL) bit

in the Status Register is cleared to 0. The Page Program instruction will not be executed if the

addressed page is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register

Memory Protection table).

Figure 11. Page Program Instruction Sequence Diagram

- 22 -

W25X10A, W25X20A, W25X40A, W25X80A

10.2.11 Sector Erase (20h)

The Sector Erase instruction sets all memory within a specified sector (4K-bytes) to the erased state

of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Sector

Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS

pin low and shifting the instruction code “20h” followed a 24-bit sector address (A23-A0) (see Figure

2). The Sector Erase instruction sequence is shown in figure 12.

The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not

done the Sector Erase instruction will not be executed. After /CS is driven high, the self-timed Sector

Erase instruction will commence for a time duration of tSE (See AC Characteristics). While the Sector

Erase cycle is in progress, the Read Status Register instruction may still be accessed for checking the

status of the BUSY bit. The BUSY bit is a 1 during the Sector Erase cycle and becomes a 0 when the

cycle is finished and the device is ready to accept other instructions again. After the Sector Erase

cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Sector

Erase instruction will not be executed if the addressed page is protected by the Block Protect (TB,

BP2, BP1, and BP0) bits (see Status Register Memory Protection table).

Figure 12. Sector Erase Instruction Sequence Diagram

Publication Release Date: February 27, 2008

- 23 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

10.2.12 Block Erase (D8h)

The Block Erase instruction sets all memory within a specified block (64K-bytes) to the erased state of

all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Block

Erase Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS

pin low and shifting the instruction code “D8h” followed a 24-bit block address (A23-A0) (see Figure

2). The Block Erase instruction sequence is shown in figure 13.

The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not

done the Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block

Erase instruction will commence for a time duration of tBE (See AC Characteristics). While the Block

Erase cycle is in progress, the Read Status Register instruction may still be accessed for checking the

status of the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the

cycle is finished and the device is ready to accept other instructions again. After the Block Erase cycle

has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase

instruction will not be executed if the addressed page is protected by the Block Protect (TB, BP2, BP1,

and BP0) bits (see Status Register Memory Protection table).

Figure 13. Block Erase Instruction Sequence Diagram

- 24 -

W25X10A, W25X20A, W25X40A, W25X80A

10.2.13 Chip Erase (C7h or 60h)

The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A

Write Enable instruction must be executed before the device will accept the Chip Erase Instruction

(Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and

shifting the instruction code “C7h” or “60h”. The Chip Erase instruction sequence is shown in figure

14.

The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Chip

Erase instruction will not be executed. After /CS is driven high, the self-timed Chip Erase instruction

will commence for a time duration of tCE (See AC Characteristics). While the Chip Erase cycle is in

progress, the Read Status Register instruction may still be accessed to check the status of the BUSY

bit. The BUSY bit is a 1 during the Chip Erase cycle and becomes a 0 when finished and the device is

ready to accept other instructions again. After the Chip Erase cycle has finished the Write Enable

Latch (WEL) bit in the Status Register is cleared to 0. The Chip Erase instruction will not be executed

if any page is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register Memory

Protection table).

Figure 14. Chip Erase Instruction Sequence Diagram

Publication Release Date: February 27, 2008

- 25 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

10.2.14 Power-down (B9h)

Although the standby current during normal operation is relatively low, standby current can be further

reduced with the Power-down instruction. The lower power consumption makes the Power-down

instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC

Characteristics). The instruction is initiated by driving the /CS pin low and shifting the instruction code

“B9h” as shown in figure 15.

The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Power-

down instruction will not be executed. After /CS is driven high, the power-down state will entered

within the time duration of tDP (See AC Characteristics). While in the power-down state only the

Release from Power-down / Device ID instruction, which restores the device to normal operation, will

be recognized. All other instructions are ignored. This includes the Read Status Register instruction,

which is always available during normal operation. Ignoring all but one instruction makes the Power

Down state a useful condition for securing maximum write protection. The device always powers-up in

the normal operation with the standby current of ICC1.

Figure 15. Deep Power-down Instruction Sequence Diagram

- 26 -

W25X10A, W25X20A, W25X40A, W25X80A

10.2.15 Release Power-down / Device ID (ABh)

The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to

release the device from the power-down state, obtain the devices electronic identification (ID) number

or do both.

When used only to release the device from the power-down state, the instruction is issued by driving

the /CS pin low, shifting the instruction code “ABh” and driving /CS high as shown in figure 16. After

the time duration of tRES1 (See AC Characteristics) the device will resume normal operation and other

instructions will be accepted. The /CS pin must remain high during the tRES1 time duration.

When used only to obtain the Device ID while not in the power-down state, the instruction is initiated

by driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The

Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as

shown in figure 17. The Device ID values for the W25X10A, W25X20A, W25X40A and W25X80A are

listed in Manufacturer and Device Identification table. The Device ID can be read continuously. The

instruction is completed by driving /CS high.

When used to release the device from the power-down state and obtain the Device ID, the instruction

is the same as previously described, and shown in figure 17, except that after /CS is driven high it

must remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the

device will resume normal operation and other instructions will be accepted.

If the Release from Power-down / Device ID instruction is issued while an Erase, Program or Write

cycle is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on

the current cycle

Figure 16. Release Power-down Instruction Sequence

Publication Release Date: February 27, 2008

- 27 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

Figure 17. Release Power-down / Device ID Instruction Sequence Diagram

- 28 -

W25X10A, W25X20A, W25X40A, W25X80A

10.2.16 Read Manufacturer / Device ID (90h)

The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down/

Device ID instruction that provides both JEDEC assigned manufacturer ID and the specific device ID.

The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device

ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code

“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond

(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first

as shown in figure 18. The Device ID values for the W25X10A, W25X20A, W25X40A and W25X80A

are listed in Manufacturer and Device Identification table. If the 24-bit address is initially set to

000001h the Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer

and Device IDs can be read continuously, alternating from one to the other. The instruction is

completed by driving /CS high.

Figure 18. Read Manufacturer / Device ID Diagram

Publication Release Date: February 27, 2008

- 29 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

10.2.17 JEDEC ID (9Fh)

For compatibility reasons, the W25X10A/20A/40A/80A provides several instructions to electronically

determine the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC

standard for SPI compatible serial memories that was adopted in 2003.

The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The

JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type

(ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant

bit (MSB) first as shown in figure 19. For memory type and capacity values refer to Manufacturer and

Device Identification table.

Figure 19. Read JEDEC ID

- 30 -

W25X10A, W25X20A, W25X40A, W25X80A

11. ELECTRICAL CHARACTERISTICS⁽¹⁾

(2)

11.1 Absolute Maximum Ratings

PARAMETERS

SYMBOL

VCC

CONDITIONS

RANGE

UNIT

V

Supply Voltage

–0.6 to +4.0

–0.6 to VCC +0.4

Voltage Applied to Any Pin

VIO

Relative to Ground

V

<20nS Transient

Relative to Ground

Transient Voltage on any Pin

VIOT

–2.0V to VCC+2.0V

V

Storage Temperature

TSTG

TLEAD

VESD

–65 to +150

See Note ⁽³⁾

°C

V

Lead Temperature

Electrostatic Discharge Voltage

Human Body Model⁽⁴⁾–2000 to +2000

Notes:

1. Specification for W25X10A, W25X20A, W25X40A and W25X80A is preliminary. See preliminary

designation at the end of this document.

2. This device has been designed and tested for the specified operation ranges. Proper operation

outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device

reliability. Exposure beyond absolute maximum ratings may cause permanent damage.

3. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly

and the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.

4. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 ohms, R2=500 ohms).

11.2 Operating Ranges

SPEC

PARAMETER

SYMBOL CONDITIONS

UNIT

V

MIN

2.7

3.0

0

MAX

3.6

F_R0= 75MHz, fR = 50MHz

Supply Voltage⁽¹⁾

VCC

TA

F_R1= 100MHz, fR = 50MHz

Commercial ⁽²⁾

3.6

+70

+85

Ambient Temperature,

Operating

°C

Industrial

–40

Note:

1. VCC voltage during Read can operate across the min and max range but should not exceed ±10%

of the programming (erase/write) voltage.

2. Commercial temperature only applies to Fast Read (F_R1) and 100K cycles endurance for 4K byte

sectors . Industrial temperature applies to all other parameters.

Publication Release Date: February 27, 2008

- 31 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

11.3 Endurance and Data Retention

PARAMETER

Erase/Program Cycles 4KB sector, 64KB block or full chip.

Data Retention 55°C

CONDITIONS

MIN

MAX

UNIT

100,000

cycles

years

20

11.4 Power-up Timing and Write Inhibit Threshold

SPEC

PARAMETER

SYMBOL

UNIT

MIN

10

1

MAX

VCC (min) to /CS Low

tVSL⁽¹⁾

tPUW⁽¹⁾

VWI⁽¹⁾

µs

ms

V

Time Delay Before Write Instruction

Write Inhibit Threshold Voltage

10

2

1

Note:

1. These parameters are characterized only.

Figure 20. Power-up Timing and Voltage Levels

- 32 -

W25X10A, W25X20A, W25X40A, W25X80A

11.5 DC Electrical Characteristics

SPEC

TYP

PARAMETER

SYMBOL CONDITIONS

UNIT

MIN

MAX

6

Input Capacitance

Output Capacitance

Input Leakage

CIN⁽¹⁾

Cout⁽¹⁾

ILI

VIN = 0V⁽²⁾

pF

µA

VOUT = 0V⁽²⁾

8

±2

I/O Leakage

ILO

/CS = VCC,

VIN = GND or VCC

Standby Current

ICC1

ICC2

ICC3

25

<1

50

10

µA

/CS = VCC,

VIN = GND or VCC

Power-down Current

Current Read Data /

Dual Output 1MHz⁽²⁾

C = 0.1 VCC / 0.9 VCC

DO = Open

4/5

6/7.5

9/10

mA

Current Read Data /

Dual Output 33MHz⁽²⁾

C = 0.1 VCC / 0.9 VCC

DO = Open

6/7

Current Read Data /

Dual Output 50MHz⁽²⁾

C = 0.1 VCC / 0.9 VCC

DO = Open

7/8

10/12

15/16.5

Current Read Data /

Dual Output 75MHz⁽²⁾

C = 0.1 VCC / 0.9 VCC

DO = Open

10/11

Current Read Data /

C = 0.1 VCC / 0.9 VCC

DO = Open

12/13

20

17/18

25

mA

Dual Output 100MHz⁽²⁾

Current Page Program ICC4

/CS = VCC

Current Write Status

ICC5

/CS = VCC

8

12

Register

Current Sector/Block

Erase

ICC6

/CS = VCC

20

25

mA

Current Chip Erase

Input Low Voltage

Input High Voltage

Output Low Voltage

Output High Voltage

ICC7

VIL

25

mA

V

–0.5

VCCx0.3

VCC+0.4

0.4

VIH

VCCx0.7

V

VOL

VOH

IOL = 1.6 mA

V

IOH = –100 µA

VCC–0.2

V

Notes:

1. Tested on sample basis and specified through design and characterization data. TA=25°C, VCC=3V.

2. Checker Board Pattern.

Publication Release Date: February 27, 2008

Revision B

- 33 -

W25X10A, W25X20A, W25X40A, W25X80A

11.6 AC Measurement Conditions

SPEC

PARAMETER

SYMBOL

UNIT

MIN

MAX

30

15

5

Load Capacitance

CL

pF

Load Capacitance for F_R1only

Input Rise and Fall Times

Input Pulse Voltages

TR, TF

VIN

ns

V

0.2 VCC to 0.8 VCC

0.3 VCC to 0.7 VCC

0.5 VCC to 0.5 VCC

Input Timing Reference Voltages

Output Timing Reference Voltages

IN

V

OUT

V

Note:

1. Output Hi-Z is defined as the point where data out is no longer driven.

Figure 21. AC Measurement I/O Waveform

- 34 -

W25X10A, W25X20A, W25X40A, W25X80A

11.7 AC Electrical Characteristics

SPEC

TYP

DESCRIPTION

SYMBOL ALT

UNIT

MIN

MAX

Clock frequency

for all instructions, except Read Data (03h)

F_R0

f_C0

D.C.

75

MHz

2.7V-3.6V VCC & Industrial Temperature

Clock frequency, for Fast Read (0Bh, 3Bh) only

3.0V-3.6V VCC & Commercial Temperature

(4)

F_R1

f_C1

D.C.

100

50

Clock freq. Read Data instruction 03h

fR

D.C.

4.5

MHz

ns

Clock High, Low Time, for Fast Read (0Bh, 3Bh) /

other instructions except Read Data (03h)

tCLH,

(1)

tCLL

Clock High, Low Time for Read Data (03h)

instruction

tCRLH,

tCRLL

8

ns

(1)

(2)

Clock Rise Time peak to peak

Clock Fall Time peak to peak

/CS Active Setup Time relative to CLK

/CS Not Active Hold Time relative to CLK

Data In Setup Time

tCLCH

0.1

5

V/ns

ns

(2)

tCHCL

tSLCH

tCHSL

tDVCH

tCHDX

tCHSH

tSHCH

tSHSL

tCSS

5

ns

tDSU

tDH

2

ns

Data In Hold Time

5

ns

/CS Active Hold Time relative to CLK

/CS Not Active Setup Time relative to CLK

5

ns

5

ns

/CS Deselect Time (for Array ReadÆArray Read /

Erase or Program Æ Read Status Register)

tCSH 50/100

ns

(2)

Output Disable Time

Clock Low to Output Valid

Output Hold Time

tSHQZ

tDIS

tV

7

ns

tCLQV

tCLQX

tHO

0

Continued – next page

Publication Release Date: February 27, 2008

Revision B

- 35 -

W25X10A, W25X20A, W25X40A, W25X80A

11.8 AC Electrical Characteristics (cont’d)

SPEC

TYP

DESCRIPTION

SYMBOL ALT

UNIT

MIN

5

MAX

/HOLD Active Setup Time relative to CLK

/HOLD Active Hold Time relative to CLK

/HOLD Not Active Setup Time relative to CLK

/HOLD Not Active Hold Time relative to CLK

/HOLD to Output Low-Z

tHLCH

tCHHH

tHHCH

ns

µs

5

tCHHL

5

(2)

tHHQX

tLZ

7

(2)

/HOLD to Output High-Z

tHLQZ

tWHSL

tSHWL

tHZ

12

(3)

Write Protect Setup Time Before /CS Low

Write Protect Hold Time After /CS High

/CS High to Power-down Mode

20

100

(2)

tDP

3

/CS High to Standby Mode without Electronic

Signature Read

tRES1⁽²⁾

tRES2⁽²⁾

/CS High to Standby Mode with Electronic

Signature Read

1.8

µs

Write Status Register Time

tW

t_BP1

t_BP2

tPP

tSE

tBE

tCE

10

30

15

50

12

3

ms

µs

ms

s

Byte Program Time (First Byte) ⁽⁵⁾

Additional Byte Program Time (After First Byte) ⁽⁵⁾

Page Program Time

6

1.5

120

0.4

Sector Erase Time (4KB)

250

1

Block Erase Time (64KB)

Chip Erase Time W25X10A / W25X20A

Chip Erase Time W25X40A

Chip Erase Time W25X80A

1.5

3

6

3

5

10

s

Notes:

1. Clock high + Clock low must be less than or equal to 1/fC.

2. Value guaranteed by design and/or characterization, not 100% tested in production.

3. Only applicable as a constraint for a Write Status Register instruction when Sector Protect Bit is set to 1.

4. Commercial temperature only applies to Fast Read (F_R1). Industrial temperature applies to all other parameters.

5. For multiple bytes after first byte within a page, t_BPN= t_{BP1 +}t_{BP2 * N}(typical) and t_BPN= t_{BP1 +}t_{BP2 * N}(max), where N

= number of bytes programmed.

- 36 -

W25X10A, W25X20A, W25X40A, W25X80A

11.9 Serial Output Timing

11.10 Input Timing

11.11 Hold Timing

Publication Release Date: February 27, 2008

Revision B

- 37 -

W25X10A, W25X20A, W25X40A, W25X80A

12. PACKAGE SPECIFICATION

12.1 8-Pin SOIC 150-mil (Package Code SN)

MILLIMETERS

SYMBOL

INCHES

TYP.

0.063

---

MIN

1.47

0.10

---

TYP.

1.60

---

MAX

1.72

0.24

---

MIN

0.058

0.004

---

MAX

0.068

0.009

---

A

A1

A2

b

1.45

0.41

0.20

4.85

6.00

3.90

1.27 BSC

0.71

---

0.057

0.016

0.008

0.191

0.236

0.154

0.050 BSC

0.028

---

0.33

0.19

4.80

5.80

3.80

0.50

0.25

4.95

6.19

4.00

0.013

0.0075

0.189

0.228

0.150

0.020

0.0098

0.195

0.244

0.157

C

(3)

D

E

(3)

E1

(2)

e

L

0.40

1.27

0.015

0.050

o

0

o

8

o

0

o

8

θ

CP

---

0.10

---

0.004

Notes:

1. Controlling dimensions: inches, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the

package.

4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.

- 38 -

W25X10A, W25X20A, W25X40A, W25X80A

12.2 8-Pin SOIC 208-mil (Package Code SS)

MILLIMETERS

INCHES

MIN

SYMBOL

MIN

1.75

0.05

1.70

0.35

0.19

5.18

7.70

5.18

MAX

2.16

0.25

1.91

0.48

0.25

5.38

8.10

5.38

MAX

0.085

0.010

0.075

0.019

0.010

0.212

0.319

0.212

A

A1

A2

b

0.069

0.002

0.067

0.014

0.007

0.204

0.303

0.204

C

(3)

D

E

(3)

E1

(2)

e

1.27 BSC

0.050 BSC

L

θ

y

0.50

0.80

0.020

0.031

o

0

o

8

o

0

o

8

---

0.10

---

0.004

Notes:

1. Controlling dimensions: inches, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the

package.

4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.

Publication Release Date: February 27, 2008

- 39 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

12.3 8-Pin PDIP 300-mil (Package Code DA)

B1

Seating Plane Base Plane

8

5

4

A2

A

E1

L

A1

e1

1

S

B

D

E

C

e_A

α

MILLIMETERS

INCHES

TYP.

---

SYMBOL

MIN

---

TYP.

---

MAX

4.45

---

MIN

---

MAX

0.175

---

A

A1

A2

B

0.25

3.18

0.41

1.47

0.20

---

0.010

0.125

0.016

0.058

0.008

---

3.30

0.46

1.52

0.25

9.14

7.62

6.35

2.54

3.30

---

3.43

0.56

1.63

0.36

9.65

7.87

6.48

2.79

3.56

15

0.130

0.018

0.060

0.010

0.360

0.300

0.250

0.100

0.130

---

0.135

0.022

0.064

0.014

0.380

0.310

0.255

0.110

0.140

15

B1

c

D

E

7.37

6.22

2.29

3.05

0

0.290

0.245

0.090

0.120

0

E1

e1

L

α

e_A

S

8.51

---

9.02

---

9.53

1.14

0.335

---

0.355

---

0.375

0.045

- 40 -

W25X10A, W25X20A, W25X40A, W25X80A

12.4 8-Pad WSON 6x5mm (Package Code ZP)

MILLIMETERS

INCHES

SYMBOL

MIN

0.70

0.00

TYP.

0.75

0.02

0.55

.0.20

0.40

6.00

3.40

5.00

4.30

MAX

0.80

0.05

MIN

TYP.

MAX

A

A1

A2

A3

b

0.0276

0.0000

0.0295

0.0008

0.0126

0.0080

0.0157

0.2360

0.1338

0.1970

0.1692

0.0315

0.0019

0.19

0.36

5.90

3.30

4.90

4.20

0.25

0.48

6.10

3.50

5.10

4.40

0.0075

0.0138

0.2320

0.1299

0.1930

0.1653

0.0098

0.0190

0.2400

0.1377

0.2010

0.1732

(3)

D

D1

E

(3)

E1

(2)

e

1.27 BSC

0.0500 BSC

K

L

0.20

0.50

0.0080

0.0197

0.60

0.75

0.0236

0.0295

Publication Release Date: February 27, 2008

Revision B

- 41 -

W25X10A, W25X20A, W25X40A, W25X80A

12.5 8-Pad WSON 6x5mm Cont’d.

MILLIMETERS

INCHES

TYP.

SYMBOL

MIN

TYP.

MAX

MIN

MAX

SOLDER PATTERN

M

N

P

3.40

4.30

6.00

0.50

0.75

0.1338

0.1692

0.2360

0.0196

0.0255

Q

R

Notes:

1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the

package.

4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid

placement of exposed PCB vias under the pad.

- 42 -

W25X10A, W25X20A, W25X40A, W25X80A

13. ORDERING INFORMATION⁽¹⁾

W 25X xxA V xx⁽²⁾

W

=

Winbond

25X

=

spiFlash Serial Flash Memory with 4KB sectors, Dual Outputs

10A

20A

40A

80A

=

1M-bit

2M-bit

4M-bit

8M-bit

V

=

2.7V to 3.6V

SN

SS

=

8-pin SOIC 150-mil

8-pin SOIC 208-mil

ZP

DA

=

8-pad WSON 6x5mm

8-pin PDIP 300-mil

=

I

=

Industrial (-40°C to +85°C)

(Blank) Standard

G

Z

=

Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb₂O₃)

Lead Free (Lead-free, RoHS Compliant)

Notes:

1a. The Winbond W25X10A, W25X20A, W25X40A and W25X80A are fully compatible with the previous Winbond W25X10,

W25X20, W25X40 and W25X80 Serial Flash Memories.

1b. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel

(shape T), when placing orders.

1c. The “W” prefix is not included on the part marking.

2. Only the 2^ndletter is used for the part marking; WSON package type ZP is not used for the part marking.

Publication Release Date: February 27, 2008

- 43 -

Revision B

W25X10A, W25X20A, W25X40A, W25X80A

Valid Part Numbers and Top Side Marking:

The following table provides the valid part numbers for the 25X10A/20A/40A/80A SpiFlash Memories.

Please contact Winbond for specific availability by density and package type. Winbond SpiFlash

memories use an 12-digit Product Number for ordering. However, due to limited space, the Top Side

Marking on all packages use an abbreviated 10-digit number.

PACKAGE TYPE

DENSITY

1M-bit

2M-bit

4M-bit

8M-bit

4M-bit

8M-bit

1M-bit

2M-bit

4M-bit

8M-bit

1M-bit

PRODUCT NUMBER

W25X10AVSNIG

W25X20AVSNIG

W25X40AVSNIG

W25X80AVSNIG

W25X40AVSSIG

W25X80AVSSIG

W25X10AVZPIG

W25X20AVZPIG

W25X40AVZPIG

W25X80AVZPIG

W25X10AVDAIZ

TOP SIDE MARKING

25X10AVNIG

25X20AVNIG

25X40AVNIG

25X80AVNIG

25X40AVSIG

25X80AVSIG

25X10AVIG

SN

SOIC-8 150mil

SS

SOIC-8 208mil

ZP⁽¹⁾

WSON-8 6x5mm

25X20AVIG

25X40AVIG

25X80AVIG

25X10AVAIZ

2M-bit

4M-bit

8M-bit

W25X20AVDAIZ

W25X40AVDAIZ

W25X80AVDAIZ

25X20AVAIZ

25X40AVAIZ

25X80AVAIZ

DA

PDIP-8 300mil

Note:

1. For WSON packages, the package type ZP is not used in the top side marking.

- 44 -

W25X10A, W25X20A, W25X40A, W25X80A

14. REVISION HISTORY

VERSION

DATE

PAGE

DESCRIPTION

A

B

01/09/08

02/27/08

New Create

Added note for WSON top side marking

43 & 44

Preliminary Designation

The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully

characterized. The specifications are subject to change and are not guaranteed. Winbond or an

authorized sales representative should be consulted for current information before using this

product.

Trademarks

Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.

All other marks are the property of their respective owner.

Important Notice

Winbond products are not designed, intended, authorized or warranted for use as components

in systems or equipment intended for surgical implantation, atomic energy control

instruments, airplane or spaceship instruments, transportation instruments, traffic signal

instruments, combustion control instruments, or for other applications intended to support or

sustain life. Further more, Winbond products are not intended for applications wherein failure

of Winbond products could result or lead to a situation wherein personal injury, death or

severe property or environmental damage could occur. Winbond customers using or selling

these products for use in such applications do so at their own risk and agree to fully indemnify

Winbond for any damages resulting from such improper use or sales.

Information in this document is provided solely in connection with Winbond products.

Winbond reserves the right to make changes, corrections, modifications or improvements to

this document and the products and services decribed herein at any time, without notice.

Publication Release Date: February 27, 2008

- 45 -

Revision B

型号:	W25X80AVSSIG
是否Rohs认证：	符合
生命周期：	Obsolete
零件包装代码：	SOIC
包装说明：	SOIC-8
针数：	8
Reach Compliance Code：	unknown
ECCN代码：	EAR99
HTS代码：	8542.32.00.51
风险等级：	5.73
最大时钟频率 (fCLK)：	75 MHz
数据保留时间-最小值：	20
耐久性：	100000 Write/Erase Cycles
JESD-30 代码：	S-PDSO-G8
长度：	5.28 mm
内存密度：	8388608 bit
内存集成电路类型：	FLASH
内存宽度：	8
功能数量：	1
端子数量：	8
字数：	1048576 words
字数代码：	1000000
工作模式：	SYNCHRONOUS
最高工作温度：	85 °C
最低工作温度：	-40 °C
组织：	1MX8
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP8,.3
封装形状：	SQUARE
封装形式：	SMALL OUTLINE
并行/串行：	SERIAL
电源：	3/3.3 V
编程电压：	2.7 V
认证状态：	Not Qualified
座面最大高度：	2.16 mm
串行总线类型：	SPI
最大待机电流：	0.00001 A
子类别：	Flash Memories
最大压摆率：	0.025 mA
最大供电电压 (Vsup)：	3.6 V
最小供电电压 (Vsup)：	2.7 V
标称供电电压 (Vsup)：	3 V
表面贴装：	YES
技术：	CMOS
温度等级：	INDUSTRIAL
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
类型：	NOR TYPE
宽度：	5.28 mm
写保护：	HARDWARE/SOFTWARE
Base Number Matches：	1

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