XC2C256-7TQG144C全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

0

R

XC2C256 CoolRunner-II CPLD

0

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

Features

Description

•

Optimized for 1.8V systems

The CoolRunner™-II 256-macrocell device is designed for

both high performance and low power applications. This

lends power savings to high-end communication equipment

and high speed to battery operated devices. Due to the low

power stand-by and dynamic operation, overall system reli-

ability is improved

-

As fast as 5.7 ns pin-to-pin delays

As low as 13 µA quiescent current

•

Industry’s best 0.18 micron CMOS CPLD

-

Optimized architecture for effective logic synthesis.

Refer to the CoolRunner™-II family data sheet for

architecture description.

This device consists of sixteen Function Blocks inter-con-

nected by a low power Advanced Interconnect Matrix (AIM).

The AIM feeds 40 true and complement inputs to each

Function Block. The Function Blocks consist of a 40 by 56

P-term PLA and 16 macrocells which contain numerous

configuration bits that allow for combinational or registered

modes of operation.

-

Multi-voltage I/O operation — 1.5V to 3.3V

•

Available in multiple package options

-

100-pin VQFP with 80 user I/O

144-pin TQFP with 118 user I/O

132-ball CP (0.5mm) BGA with 106 user I/O

208-pin PQFP with 173 user I/O

256-ball FT (1.0mm) BGA with 184 user I/O

Pb-free available for all packages

Additionally, these registers can be globally reset or preset

and configured as a D or T flip-flop or as a D latch. There

are also multiple clock signals, both global and local product

term types, configured on a per macrocell basis. Output pin

configurations include slew rate limit, bus hold, pull-up,

open drain and programmable grounds. A Schmitt-trigger

input is available on a per input pin basis. In addition to stor-

ing macrocell output states, the macrocell registers may be

configured as "direct input" registers to store signals directly

from input pins.

Advanced system features

-

Fastest in system programming

1.8V ISP using IEEE 1532 (JTAG) interface

·

-

IEEE1149.1 JTAG Boundary Scan Test

Optional Schmitt-trigger input (per pin)

Unsurpassed low power management

·

DataGATE enable (DGE) signal control

-

Two separate I/O banks

RealDigital 100% CMOS product term generation

Flexible clocking modes

Clocking is available on a global or Function Block basis.

Three global clocks are available for all Function Blocks as

a synchronous clock source. Macrocell registers can be

individually configured to power up to the zero or one state.

A global set/reset control line is also available to asynchro-

nously set or reset selected registers during operation.

Additional local clock, synchronous clock-enable, asynchro-

nous set/reset and output enable signals can be formed

using product terms on a per-macrocell or per-Function

Block basis.

·

Optional DualEDGE triggered registers

Clock divider (divide by 2,4,6,8,10,12,14,16)

CoolCLOCK

-

Global signal options with macrocell control

·

Multiple global clocks with phase selection per

macrocell

·

Multiple global output enables

Global set/reset

-

Advanced design security

PLA architecture

A DualEDGE flip-flop feature is also available on a per mac-

rocell basis. This feature allows high performance synchro-

nous operation based on lower frequency clocking to help

reduce the total power consumption of the device.

·

Superior pinout retention

100% product term routability across function

block

-

Open-drain output option for Wired-OR and LED

drive

Optional bus-hold, 3-state or weak pull-up on

selected I/O pins

Optional configurable grounds on unused I/Os

Mixed I/O voltages compatible with 1.5V, 1.8V,

2.5V, and 3.3V logic levels

Circuitry has also been included to divide one externally

supplied global clock (GCK2) by eight different selections.

This yields divide by even and odd clock frequencies.

The use of the clock divide (division by 2) and DualEDGE

flip-flop gives the resultant CoolCLOCK feature.

-

DataGATE is a method to selectively disable inputs of the

CPLD that are not of interest during certain points in time.

·

SSTL2-1, SSTL3-1, and HSTL-1 I/O compatibility

-

Hot pluggable

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

1

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

By mapping a signal to the DataGATE function, lower power

can be achieved due to reduction in signal switching.

for I/O standard voltages. The LVTTL I/O standard is a gen-

eral purpose EIA/JEDEC standard for 3.3V applications that

use an LVTTL input buffer and Push-Pull output buffer. The

LVCMOS standard is used in 3.3V, 2.5V, 1.8V applications.

Both HSTL and SSTL I/O standards make use of a V_REFpin

for JEDEC compliance. CoolRunner-II CPLDs are also 1.5V

I/O compatible with the use of Schmitt-trigger inputs

Another feature that eases voltage translation is I/O bank-

ing. Two I/O banks are available on the CoolRunner-II 256

macrocell device that permit easy interfacing to 3.3V, 2.5V,

1.8V, and 1.5V devices.

The CoolRunner-II 256 macrocell CPLD is I/O compatible

with various I/O standards (see Table 1). This device is also

1.5V I/O compatible with the use of Schmitt-trigger inputs.

Table 1: I/O Standards for XC2C256⁽¹⁾

Board

IOSTANDARD Output Input Input Termination

RealDigital Design Technology

Attribute

V_CCIO

V_CCIOV_REFVoltage V_TT

Xilinx CoolRunner-II CPLDs are fabricated on a 0.18 micron

process technology which is derived from leading edge

FPGA product development. CoolRunner-II CPLDs employ

RealDigital, a design technique that makes use of CMOS

technology in both the fabrication and design methodology.

RealDigital design technology employs a cascade of CMOS

gates to implement sum of products instead of traditional

sense amplifier methodology. Due to this technology, Xilinx

CoolRunner-II CPLDs achieve both high-performance and

low power operation.

LVTTL

3.3

2.5

1.8

1.5

2.5

3.3

N/A

0.75

1.25

1.5

N/A

0.75

1.25

1.5

LVCMOS33

LVCMOS25

LVCMOS18

LVCMOS15 ⁽²⁾

HSTL_1

3.3

2.5

1.8

1.5

SSTL2_1

2.5

SSTL3_1

3.3

(1)For information on Vref, see XAPP399.

(2) LVCMOS15 requires Schmitt-trigger inputs.

Supported I/O Standards

The CoolRunner-II 256 macrocell features LVCMOS,

LVTTL, SSTL and HSTL I/O implementations. See Table 1

100

75

50

25

0

50

100

150

200

250

0

Frequency (MHz)

Figure 1: I_CCvs Frequency

Table 2: I_CCvs Frequency (LVCMOS 1.8V T_A= 25°C)⁽¹⁾

Frequency (MHz)

100 120 150

0.021 11.68 19.40 27.01 38.18 45.54 56.32 63.37 70.40 80.90 88.03

0

30

50

70

170

190

220

240

Typical I_CC(mA)

Notes:

1. 16-bit up/down, resettable binary counter (one counter per function block).

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Absolute Maximum Ratings

Symbol

Description

Supply voltage relative to ground

Supply voltage for output drivers

Value

Units

V

V_CC

–0.5 to 2.0

–0.5 to 4.0

–65 to +150

+150

V_CCIO

V

(2)

V_JTAG

V_AUX

JTAG input voltage limits

V

JTAG input supply voltage

Input voltage relative to ground

Voltage applied to 3-state output

Storage Temperature (ambient)

Junction Temperature

V

(1)

V_IN

V

(1)

V_TS

V

(3)

T_STG

T_J

°C

Notes:

1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easiest to achieve. During transitions,

the device pins may undershoot to –2.0v or overshoot to +4.5V, provided this over or undershoot lasts less than 10 ns and with the

forcing current being limited to 200 mA.

2. Valid over commercial temperature range.

3. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. For Pb free

packages, see XAPP427.

Recommended Operating Conditions

Symbol

Parameter

Supply voltage for internal logic

and input buffers

Min

1.7

3.0

2.3

1.7

1.4

1.7

Max

1.9

3.6

2.7

1.9

1.6

3.6

Units

V_CC

Commercial T_A= 0°C to +70°C

Industrial T_A= –40°C to +85°C

V

V_CCIO

Supply voltage for output drivers @ 3.3V operation

Supply voltage for output drivers @ 2.5V operation

Supply voltage for output drivers @ 1.8V operation

Supply voltage for output drivers @ 1.5V operation

JTAG programming

V_AUX

DC Electrical Characteristics ^{(Over Recommended Operating Conditions)}

Symbol

I_CCSB

I_CC

Parameter

Standby current Commercial

Standby current Industrial

Dynamic current

Test Conditions

V_CC= 1.9V, V_CCIO= 3.6V

f = 1 MHz

Typical

Max.

Units

µA

33

54

-

150

300

410

27

µA

f = 50 MHz

-

mA

pF

C_JTAG

C_CLK

C_IO

JTAG input capacitance

Global clock input capacitance

I/O capacitance

f = 1 MHz

-

10

f = 1 MHz

-

12

pF

f = 1 MHz

-

10

pF

(2)

I_IL

Input leakage current

I/O High-Z leakage

V_IN= 0V or V_CCIOto 3.9V

-

+/–1

µA

(2)

I_IH

-

µA

Notes:

1. 16-bit up/down, resettable binary counter (one counter per function block) tested at V_CC= V_CCIO= 1.9V

2. See Quality and Reliability section of the CoolRunner-II family data sheet

3

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

LVCMOS 3.3V and LVTTL 3.3V DC Voltage Specifications

Symbol

V_CCIO

V_IH

Parameter

Input source voltage

Test Conditions

Min.

Max.

3.6

3.9

0.8

-

Units

-

3.0

V

High level input voltage

Low level input voltage

High level output voltage

-

2

V_IL

-

–0.3

V_OH

I_OH= –8 mA, V_CCIO= 3V

_OH= –0.1 mA, V_CCIO= 3V

I_OL= 8 mA, V_CCIO= 3V

I_OL= 0.1 mA, V_CCIO= 3V

V_CCIO– 0.4V

I

V_CCIO– 0.2V

-

V_OL

Low level output voltage

-

0.4

0.2

LVCMOS 2.5V DC Voltage Specifications

Symbol

V_CCIO

V_IH

Parameter

Input source voltage

Test Conditions

Min.

2.3

Max.

2.7

3.9

0.7

-

Units

-

V

High level input voltage

Low level input voltage

High level output voltage

-

1.7

V_IL

-

–0.3

V_OH

I_OH= –8 mA, V_CCIO= 2.3V

V_CCIO– 0.4V

I

_OH= –0.1 mA, V_CCIO= 2.3V V_CCIO– 0.2V

-

V_OL

Low level output voltage

I_OL= 8 mA, V_CCIO= 2.3V

I_OL= 0.1 mA, V_CCIO= 2.3V

-

0.4

0.2

LVCMOS 1.8V DC Voltage Specifications

Symbol

V_CCIO

V_IH

Parameter

Input source voltage

Test Conditions

Min.

Max.

Units

-

1.7

1.9

V

High level input voltage

Low level input voltage

High level output voltage

-

0.65 x V_CCIO

3.9

V_IL

-

–0.3

0.35 x V_CCIO

V_OH

I_OH= –8 mA, V_CCIO= 1.7V

_OH= –0.1 mA, V_CCIO= 1.7V

I_OL= 8 mA, V_CCIO= 1.7V

V_CCIO– 0.45

-

I

V_CCIO– 0.2

V_OL

Low level output voltage

-

0.45

0.2

I

_OL= 0.1 mA, V_CCIO= 1.7V

(1)

LVCMOS 1.5V DC Voltage Specifications

Symbol

V_CCIO

V_T+

Parameter

Test Conditions

Min.

Max.

Units

Input source voltage

-

1.4

1.6

V

Input hysteresis threshold voltage

-

0.5 x V_CCIO

0.2 x V_CCIO

V_CCIO– 0.45

V_CCIO– 0.2

0.8 x V_CCIO

V_T-

-

0.5 x V_CCIO

V_OH

High level output voltage

I_OH= –8 mA, V_CCIO= 1.4V

_OH= –0.1 mA, V_CCIO= 1.4V

-

I

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Symbol

V_OL

Parameter

Test Conditions

Min.

Max.

0.4

Units

Low level output voltage

I_OL= 8 mA, V_CCIO= 1.4V

_OL= 0.1 mA, V_CCIO= 1.4V

-

V

I

0.2

Notes:

1. Hysteresis used on 1.5V inputs.

Schmitt Trigger Input DC Voltage Specifications

Symbol

V_CCIO

V_T+

Parameter

Test Conditions

Min.

1.4

Max.

3.9

Units

Input source voltage

-

V

Input hysteresis threshold voltage

0.5 x V_CCIO

0.2 x V_CCIO

0.8 x V_CCIO

0.5 x V_CCIO

V_T-

SSTL2-1 DC Voltage Specifications

Symbol

Parameter

Test Conditions

Min.

2.3

Typ

Max.

Units

V_CCIO

Input source voltage

Input reference voltage

Termination voltage

-

2.5

2.7

1.35

V

(1)

V_REF

-

1.15

1.25

(2)

V_TT

-

V_REF– 0.04

V_REF+ 0.18

–0.3

1.25

V_REF+ 0.04

3.9

V_IH

V_IL

High level input voltage

Low level input voltage

High level output voltage

Low level output voltage

-

V_REF– 0.18

-

V_OH

V_OL

Notes:

I_OH= –8 mA, V_CCIO= 2.3V

I_OL= 8 mA, V_CCIO= 2.3V

V_CCIO– 0.62

-

0.54

1.

V_REFshould track the variations in V_CCIO, also peak to peak AC noise on V_REFmay not exceed ± 2% V_REF

2. V_TTof transmitting device must track V_REFof receiving devices

5

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

SSTL3-1 DC Voltage Specifications

Symbol

Parameter

Test Conditions

Min.

3.0

Typ

3.3

1.5

-

Max.

3.6

Units

V_CCIO

Input source voltage

Input reference voltage

Termination voltage

-

V

(1)

V_REF

-

1.3

1.7

(2)

V_TT

-

V_REF– 0.05

V_REF+ 0.2

–0.3

V_REF+ 0.05

V_CCIO+ 0.3

V_REF– 0.2

-

V_IH

V_IL

High level input voltage

Low level input voltage

High level output voltage

Low level output voltage

-

V_OH

V_OL

Notes:

I_OH= –8 mA, V_CCIO= 3V

I_OL= 8 mA, V_CCIO= 3V

V_CCIO– 1.1

-

0.7

1. V_REFshould track the variations in V_CCIO, also peak to peak AC noise on V_REFmay not exceed ± 2% V_REF

2. V_TTof transmitting device must track V_REFof receiving devices

HSTL1 DC Voltage Specifications

Symbol

Parameter

Test Conditions

Min.

1.4

Typ

Max.

Units

V_CCIO

Input source voltage

Input reference voltage

Termination voltage

-

1.5

1.6

V

(1)

V_REF

0.68

0.75

0.90

(2)

V_TT

-

V_CCIOx 0.5

-

V_IH

V_IL

High level input voltage

Low level input voltage

High level output voltage

Low level output voltage

V_REF+ 0.1

–0.3

-

1.9

V_REF– 0.1

V_OH

V_OL

Notes:

I_OH= –8 mA, V_CCIO= 1.7V V_CCIO– 0.4

I_OL= 8 mA, V_CCIO= 1.7V

-

0.4

1. V_REFshould track the variations in V_CCIO, also peak-to-peak AC noise on V_REFmay not exceed ± 2% V_REF

2. V_TTof transmitting device must track V_REFof receiving devices

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

AC Electrical Characteristics Over Recommended Operating Conditions

-6

-7

Symbol

T_PD1

Parameter

Propagation delay single p-term

Min.

-

Max.

Min. Max. Units

5.7

-

6.7

ns

T_PD2

T_SUD

T_SU1

T_SU2

T_HD

Propagation delay OR array

-

6.0

7.5

Direct input register clock setup time

Setup time (single p-term)

2.6

2.4

2.7

0

-

3.0

2.8

3.3

0

-

ns

-

ns

Setup time (OR array)

-

ns

Direct input register hold time

P-term hold time

-

ns

T_H

0

-

4.5

450

256

238

145

139

-

0

-

6.0

300

152

141

114

108

-

ns

T_CO

Clock to output

-

ns

(1)

F_TOGGLE

Internal toggle rate

-

MHz

ns

(2)

F_SYSTEM1

F_SYSTEM2

Maximum system frequency

-

Maximum system frequency

-

(3)

F_EXT1

Maximum external frequency

Direct input register p-term clock setup time

P-term clock setup time (single p-term)

P-term clock setup time (OR array)

Direct input register p-term clock hold time

P-term clock hold

-

(3)

F_EXT2

-

T_PSUD

T_PSU1

T_PSU2

T_PHD

T_PH

0.9

0.7

1.0

0.9

0.7

-

1.7

1.5

2.0

1.2

1.0

-

ns

-

ns

-

ns

-

ns

T_PCO

P-term clock to output

6.2

5.6

7.0

7.4

7.0

5.5

-

7.3

7.0

8.0

9.9

8.1

7.6

-

ns

T_OE/T_OD

Global OE to output enable/disable

P-term OE to output enable/disable

Macrocell driven OE to output enable/disable

P-term set/reset to output valid

Global set/reset to output valid

Register clock enable setup time

Register clock enable hold time

Global clock pulse width High or Low

P-term pulse width High or Low

Asynchronous preset/reset pulse width (High or Low)

Set-up before DataGATE latch assertion

Hold to DataGATE latch assertion

DataGATE recovery to new data

DataGATE low pulse width

-

ns

T_POE/T_POD

T_MOE/T_MOD

T_PAO

-

ns

-

ns

-

ns

T_AO

-

ns

T_SUEC

T_HEC

2.5

0

3.1

0

ns

-

ns

T_CW

1.4

6.0

0

-

2.2

7.5

0

-

ns

T_PCW

-

ns

T_APRPW

T_DGSU

T_DGH

-

ns

-

ns

4.0

-

6.0

-

ns

T_DGR

8.2

-

9.0

-

ns

T_DGW

2.5

1.3

3.5

2.0

ns

T_CDRSU

CDRST setup time before falling edge GCLK2

-

ns

7

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Symbol

-6

-7

Parameter

Min.

0

Max.

Min. Max. Units

T_CDRH

T_CONFIG

Notes:

Hold time CDRST after falling edge GCLK2

Configuration time

-

0

-

ns

(4)

150

µs

1. F_TOGGLEis the maximum clock frequency to which a T-Flip Flop can reliably toggle (see the CoolRunner-II family data sheet for more

information).

2.

F

_SYSTEM1(1/T_CYCLE) is the internal operating frequency for a device fully populated with one 16-bit counter through one p-term per

macrocell while F_SYSTEM2is through the OR array.

3. F_EXT1(1/T_SU1+T_CO) is the maximum external frequency using one p-term while F_EXT2is through the OR array.

4. Typical configuration current during T_CONFIGis approximately 7.7 mA.

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

(

Internal Timing Parameters

-6

-7

Symbol

Buffer Delays

T_IN

Parameter⁽²⁾

Min.

Max.

Min.

Max.

Units

Input buffer delay

-

2.4

3.1

1.8

2.0

2.1

2.3

3.5

-

2.6

3.9

2.7

3.5

3.0

2.6

4.0

ns

T_DIN

Direct data register input delay

Global Clock buffer delay

Global set/reset buffer delay

Global 3-state buffer delay

Output buffer delay

T_GCK

T_GSR

T_GTS

T_OUT

T_EN

Output buffer enable/disable delay

P-term Delays

T_CT

Control term delay

-

1.1

0.5

0.3

-

1.4

1.1

0.5

ns

T_LOGI1

T_LOGI2

Macrocell Delay

T_PDI

Single P-term delay adder

Multiple P-term delay adder

Input to output valid

Setup before clock

Hold after clock

-

1.3

0

0.5

-

1.8

0

0.7

ns

T_SUI

-

T_HI

T_ECSU

T_ECHO

T_COI

Enable clock setup time

Enable clock hold time

Clock to output valid

Set/reset to output valid

Clock doubler delay

0.8

0

-

1.8

0

-

0.4

1.2

0

-

0.7

1.5

0

T_AOI

-

T_CDBL

-

Feedback Delays

T_F

Feedback delay

-

1.7

-

3.0

2.5

ns

T_OEM

Macrocell to global OE delay

I/O Standard Time Adder Delays 1.5V CMOS

T_IN15

Standard input adder

Hysteresis input adder

Output adder

-

0.8

3.0

0.8

4.0

-

1.0

4.0

1.0

5.0

ns

T_HYS15

T_OUT15

T_SLEW15

Output slew rate adder

I/O Standard Time Adder Delays 1.8V CMOS

T_HYS18

T_OUT18

T_SLEW

Hysteresis input adder

Output adder

-

2.0

0

-

3.0

0

ns

Output slew rate adder

2.0

4.0

9

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Internal Timing Parameters (Continued)

-6

-7

Symbol

I/O Standard Time Adder Delays 2.5V CMOS

Parameter⁽²⁾

Min.

Max.

Min.

Max.

Units

T_IN25

Standard input adder

Hysteresis input adder

Output adder

-

0.6

1.5

0.8

3.0

-

1.0

3.0

2.0

4.0

ns

T_HYS25

T_OUT25

T_SLEW25

Output slew rate adder

I/O Standard Time Adder Delays 3.3V CMOS/TTL

T_IN33

Standard input adder

Hysteresis input adder

Output adder

-

0.5

1.2

3.0

-

2.0

3.0

4.0

ns

T_HYS33

T_OUT33

T_SLEW33

Output slew rate adder

I/O Standard Time Adder Delays HSTL, SSTL

-

SSTL2-1

SSTL3-1

HSTL-1

Notes:

Input adder to T_IN, T_DIN, T_GCK, T_GSR,T_GTS

0.4

-0.5

0.4

-0.5

0.6

0

1.0

0.0

1.0

0.0

1.0

0

ns

Output adder to T_OUT

Input adder to T_IN, T_DIN, T_GCK, T_GSR,T_GTS

Output adder to T_OUT

Input adder to T_IN, T_DIN, T_GCK, T_GSR,T_GTS

Output adder to T_OUT

1. 1.5 ns input pin signal rise/fall.

Switching Characteristics

AC Test Circuit

V

CC

V_CC= V_CCIO= 1.8V, T = 25^oC

5.5

R

1

Device

Under Test

Test Point

5.0

4.5

4.0

R

C

L

2

Output Type

LVTTL33

R

C

L

1

2

268Ω

275Ω

188Ω

235Ω

275Ω

35 pF

35pF

LVCMOS33

LVCMOS25

LVCMOS18

LVCMOS15

188Ω

112.5Ω

150Ω

112.5Ω

150Ω

3.5

3.0

C

includes test fixtures and probe capacitance.

L

1.5 nsec maximum rise/fall times on inputs.

1

2

4

8

16

DS_ACT_08_14_02

Figure 3: AC Load Circuit

Number of Outputs Switching

DS092_02_092302

Figure 2: Derating Curve for T_PD

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

3.3V

2.5V

60

50

40

30

20

10

0

1.8V

Iol

1.5V

0

.5

1.0

1.5

2.0

2.5

3.0

3.5

VO (Output Volts)

XC256_VoIo_all_020703

Figure 4: Typical I/V Curve for XC2C256

11

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

11

Pin Descriptions (Continued)

Function Macro-

Pin Descriptions

Function Macro-

I/O

Block

cell

VQ100 CP132 TQ144 PQ208 FT256 Bank

Block

cell

VQ100 CP132 TQ144 PQ208 FT256 Bank

3

1

-

B5

-

136

135

134

-

196

195

194

193

192

191

-

A6

D7

B7

E9

A7

D8

-

2

-

1

-

2

208

206

205

203

202

-

B3

B4

C4

A2

A3

A4

-

2

-

3

2

1

2

-

3

-

1(GSR)

3

99

-

A3

-

143

3

4

-

A5

-

1

4

142

3

5

93

133

1

5

-

3

6

C6

-

1

6

97

-

B4

-

140

3

7

-

1

7

-

3

8

-

1

8

-

3

9

-

1

9

-

3

10

11

12

13

14

15

16

1

-

1

10

11

12

13

14

15

16

1

-

3

-

1

-

3

92

-

189

188

187

186

185

15

16

17

18

19

20

-

B8

C8

A8

E11

E10

F2

F3

G4

G3

F5

G5

-

2

-

1

96

95

94

-

139

201

200

199

198

197

3

B5

A5

E8

B6

C7

D3

C3

E3

B2

D4

D2

-

2

-

3

B6

A6

C7

B7

E3

-

1

-

138

3

91

-

132

-

1

A4

-

137

-

3

1

3

90

8

9

10

-

131

11

12

13

14

15

16

-

1

-

C5

A1

-

4

2(GTS2)

1

-

2

-

4

2

4

3

E2

E1

F3

F2

-

2(GTS3)

3

2

-

B2

B1

C3

-

3

4

5

-

5

4

2

4

6

4

5

11

12

-

2(GTS0)

5

3

-

7

4

6

2

6

8

4

7

2

7

-

4

8

-

2

8

-

4

9

-

2

9

-

4

10

11

12

13

14

15

16

-

2

10

11

12

13

14

15

16

-

4

-

2

-

4

-

F1

G1

-

17

-

21

22

23

-

H2

H4

H3

H1

H5

2

2(GTS1)

4

-

C2

C1

D2

-

6

7

9

10

-

9

E5

B1

E4

C1

E2

2

4

13

-

2

10

12

14

-

4

18

-

6

7

-

4

-

4

-

25

D1

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Pin Descriptions (Continued)

Function Macro-

I/O

Function Macro-

I/O

Block

cell

VQ100 CP132 TQ144 PQ208 FT256 Bank

Block

cell

VQ100 CP132 TQ144 PQ208 FT256 Bank

5

1

-

L3

-

33

-

49

48

47

46

45

44

-

R1

N4

N2

M3

P1

M2

-

1

-

7

1

-

37

36

35

34

32

31

-

K4

L2

K3

L1

K5

K2

-

1

-

5

2

-

7

2

5

3

-

7

3

-

5(GCK1)

4

23

L2

L1

K3

-

32

31

30

-

7

4

-

5

7

5

19

18

-

J2

J1

-

26

25

-

5(GCK0)

6

22

-

7

6

5

6

7

8

-

7

8

-

9

-

7

9

-

10

11

12

13

14

15

16

1

-

7

10

11

12

13

14

15

16

1

-

7

17

16

15

14

-

H3

H2

H1

G3

G2

-

24

23

22

21

20

19

44

45

46

-

30

29

28

27

-

J4

K1

J3

J2

J5

J1

R6

N6

R3

M6

T3

P6

-

1

-

43

41

40

39

38

50

51

L3

N1

L4

M1

L5

N3

P2

1

7

-

7

-

28

-

7

-

7

-

K1

M1

M2

-

7

-

34

35

8

-

N4

-

64

65

66

67

69

70

-

6

2

24

8

2

-

(CDRST)

8

3

-

6

3

4

-

27

-

N2

-

38

-

54

55

56

57

-

P4

P5

R2

T1

-

1

-

8

4

-

6(GCK2)

8

5

-

48

49

-

6

5

8

6

32

-

6

-

8

7

-

6

7

-

8

-

6

8

-

8

9

-

6

9

-

8

10

11

12

13

14

15

16

-

6

10

11

12

13

14

15

16

-

8

33

34

35

36

37

-

M5

N5

P5

M6

N6

-

50

51

52

-

71

72

73

74

75

76

T4

P7

T5

N7

R7

M7

1

6

-

8

6(DGE)

28

-

P2

M3

N3

P3

M4

39

40

41

42

43

58

60

61

62

63

T2

N5

R4

M5

R5

1

8

6

8

29

-

8

-

8

-

30

13

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Pin Descriptions (Continued)

Function Macro-

I/O

Function Macro-

I/O

Block

cell

VQ100 CP132 TQ144 PQ208 FT256 Bank

Block

11

12

cell

VQ100 CP132 TQ144 PQ208 FT256 Bank

9

1

78

79

-

C12

B12

-

112

113

-

160

161

162

163

164

165

-

B13

B14

C13

A15

C12

B12

-

2

-

1

-

B10

-

B11

D11

A11

D10

B10

E12

-

2

-

9

2

-

173

174

175

-

9

3

-

A10

-

9

4

80

A12

114

4

-

120

121

-

9

5

-

C9

9

6

81

-

C11

115

-

6

-

9

7

-

7

-

9

8

-

8

-

9

-

9

-

9

10

11

12

13

14

15

16

1

-

10

11

12

13

14

15

16

1

-

9

-

166

167

168

169

170

171

159

158

155

154

153

152

-

D13

A14

E13

A13

C11

A12

A16

B15

C14

G11

B16

D15

-

2

-

85

86

87

89

-

A8

124

125

126

128

129

130

-

178

179

180

182

183

184

145

144

143

142

140

139

-

F12

B9

2

-

9

82

-

B11

-

116

117

118

119

-

B8

9

C8

C9

C10

A9

9

-

A11

-

9

-

9

-

C10

A13

B13

C13

C14

D12

D13

-

D9

F15

G14

E16

H12

F16

H16

-

10

77

76

74

73

72

71

-

111

110

107

106

105

104

-

2

-

100

-

3

-

4

-

5

-

F12

-

6

-

F13

-

7

-

8

-

8

-

9

-

9

-

10

11

12

13

14

15

16

-

10

11

12

13

14

15

16

-

F14

G12

G13

-

151

150

149

148

147

146

E14

C16

F14

F13

E15

G13

2

68

-

98

97

96

95

94

-

138

137

136

135

134

-

G15

H13

G16

H14

H15

J12

2

70

-

D14

-

103

-

67

66

65

-

E12

-

102

-

E13

101

-

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Pin Descriptions (Continued)

Function Macro-

I/O

Function Macro-

I/O

Block

13

14

cell

VQ100 CP132 TQ144 PQ208 FT256 Bank

Block

cell

VQ100 CP132 TQ144 PQ208 FT256 Bank

1

-

53

-

N13

75

76

77

-

107

108

109

110

111

112

-

R15

T16

N14

R16

N15

M15

-

1

-

15

1

-

83

-

118

119

120

121

122

123

-

L15

L13

M12

M16

K14

L16

-

1

-

2

N14

15

2

L14

3

M12

15

3

-

4

54

-

15

4

-

5

M13

78

79

-

15

5

-

6

55

-

15

6

-

7

-

15

7

-

8

-

15

8

-

9

-

15

9

-

10

11

12

13

14

15

16

1

-

15

10

11

12

13

14

15

16

1

-

15

58

59

60

61

63

64

-

K13

K14

J12

J13

H13

H12

-

85

86

87

88

91

92

-

125

126

127

128

-

K15

L12

K16

J14

J15

J13

P10

R10

T10

R9

N9

M8

-

1

-

M14

80

81

82

-

113

114

115

116

117

106

103

102

101

100

-

M13

P16

N16

L14

M14

P15

P14

P13

R13

N13

R14

-

1

-

15

56

-

15

L12

15

-

15

-

L13

-

15

131

90

89

88

87

86

85

-

52

-

P14

74

71

70

69

-

16

2

-

16

2

-

3

50

-

P12

16

3

-

M8

-

4

M11

16

4

-

5

49

-

N11

16

5

43

42

-

N8

-

60

59

-

6

P11

68

-

16

6

7

-

16

7

-

8

-

16

8

-

9

-

16

9

-

10

11

12

13

14

15

16

-

16

10

11

12

13

14

15

16

-

16

41

40

39

-

P8

M7

N7

-

58

57

56

-

84

83

82

80

78

77

T8

P8

R8

T7

N8

T6

1

-

99

97

95

-

T15

R12

N11

M11

N10

1

16

-

66

64

-

16

46

44

-

P10

-

16

-

54

53

P9

61

91

16

-

P6

Notes:

1. GTS = global output enable, GSR = global reset/set, GCK =

global clock, CDRST = clock divide reset, DGE = DataGATE

enable.

15

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

XC2C256 JTAG, Power/Ground, No Connect Pins and Total User I/O

Pin Type

VQ100

CP132

M10

TQ144

PQ208

FT256

TCK

TDI

48

67

98

94

P12

45

83

M9

63

R11

TDO

TMS

B9

122

176

A10

47

N10

65

8

96

N12

F4

V_AUX(JTAG supply voltage)

Power internal (V_CC

5

D3

11

)

26, 57

20, 38, 51

P1, K12, A2

1, 37, 84

27, 55, 73, 93

1, 53, 124

P3, K13, D12, D5

Power Bank 1 I/O (V_CCIO1

Power Bank 2 I/O (V_CCIO2

Ground

)

J3, P7,

G14, P13

33, 59, 79, 92,

105, 132

J6, K6, L7, L8, J11,

K11, L10, L9

)

88, 98

A14, C4, A7 109, 127, 141

26, 133, 157,

172, 181, 204

F7, F8, G6, H6, F10,

F9, H11

21, 25, 31,

62, 69, 75,

84, 100

K2, N1, P4, 29, 36, 47, 62,

13, 24, 42, 52,

F11, F6, G10, G7, G8,

G9, H10, H7, H8, H9,

J10, J7, J8, J9, K10,

K7, K8, K9, L11, L6

N9, N12,

J14, H14,

E14, B14,

A9, B3

72, 89, 90, 99, 68, 81, 93, 104,

108, 123, 144

129, 130, 141,

156, 177, 190,

207

No connects

Total user I/O

-

A1, C2, E6, D1, E1, G2,

F1, G1, M4, T9, P9,

M9, M10, T11, T12,

T13, P11, T14, J16,

K12, D16, G12, C15,

D14, D6, C6, E7, C5

80

106

118

173

184

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Ordering Information

Commercia

l (C)

Pin/Ball

Spacing (C/Watt) (C/Watt)

θ_JA

θ_JC

10.9

Package Body

Dimensions

Industrial

(I)⁽¹⁾

Part Number

Package Type

I/O

XC2C256-6VQ100C

0.5mm

43.1

Very Thin Quad Flat

Pack

14mm x 14mm

80

C

XC2C256-7VQ100C

0.5mm

Very Thin Quad Flat

Pack

14mm x 14mm

80

C

XC2C256-6CP132C

XC2C256-7CP132C

XC2C256-6TQ144C

XC2C256-7TQ144C

XC2C256-6PQ208C

0.5mm

65.0

37.2

36.9

15.0

7.2

Chip Scale Package

Thin Quad Flat Pack

8mm x 8mm

106

118

C

20mm x 20mm

7.2

9.7

Plastic Quad Flat

Pack

28mm x 28mm 173

XC2C256-7PQ208C

0.5mm

36.9

9.7

Plastic Quad Flat

Pack

28mm x 28mm 173

C

XC2C256-6FT256C

XC2C256-7FT256C

1.0mm

34.6

6.1

Fine Pitch Thin BGA

17mm x 17mm 184

C

XC2C256-6VQG100C

XC2C256-7VQG100C

XC2C256-6CPG132C

XC2C256-7CPG132C

XC2C256-6TQG144C

XC2C256-7TQG144C

XC2C256-6PQG208C

XC2C256-7PQG208C

XC2C256-6FTG256C

XC2C256-7FTG256C

0.5mm

1.0mm

43.1

65.0

37.2

36.9

34.6

10.9

15.0

7.2

Very Thin Quad Flat

Pack; Pb-free

14mm x 14mm

8mm x 8mm

80

C

Very Thin Quad Flat

Pack; Pb-free

Chip Scale Package;

Pb-free

106

118

Chip Scale Package;

Pb-free

8mm x 8mm

Thin Quad Flat Pack;

Pb-free

20mm x 20mm

7.2

Thin Quad Flat Pack;

Pb-free

9.7

Plastic Quad Flat

Pack; Pb-free

28mm x 28mm 173

17mm x 17mm 184

9.7

Plastic Quad Flat

Pack; Pb-free

6.1

Fine Pitch Thin BGA;

Pb-free

6.1

Fine Pitch Thin BGA;

Pb-free

XC2C256-7VQ100I

0.5mm

43.1

10.9

Very Thin Quad Flat

Pack

14mm x 14mm

80

I

XC2C256-7CP132I

XC2C256-7TQ144I

XC2C256-7PQ208I

0.5mm

65.0

37.2

36.9

15.0

7.2

Chip Scale Package

Thin Quad Flat Pack

8mm x 8mm

106

118

I

20mm x 20mm

9.7

Plastic Quad Flat

Pack

28mm x 28mm 173

XC2C256-7FT256I

1.0mm

34.6

6.1

Fine Pitch Thin BGA

17mm x 17mm 184

I

17

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Commercia

l (C)

Pin/Ball

Spacing (C/Watt) (C/Watt)

θ_JA

θ_JC

10.9

15.0

7.2

Package Body

Dimensions

Industrial

(I)⁽¹⁾

Part Number

Package Type

I/O

XC2C256-7VQG100I

0.5mm

1.0mm

43.1

65.0

37.2

36.9

34.6

Very Thin Quad Flat

Pack; Pb-free

14mm x 14mm

80

I

XC2C256-7CPG132I

XC2C256-7TQG144I

XC2C256-7PQG208I

XC2C256-7FTG256I

Notes:

Chip Scale Package;

Pb-free

8mm x 8mm

106

118

Thin Quad Flat Pack;

Pb-free

20mm x 20mm

9.7

Plastic Quad Flat

Pack; Pb-free

28mm x 28mm 173

17mm x 17mm 184

6.1

Fine Pitch Thin BGA;

Pb-free

1. C = Commercial (T_A= 0°C to +70°C); I = Industrial (T_A= –40°C to +85°C).

Pb-

XC2C128 -6 TQ

G

144

C

Free Example:

Standard Example: XC2C128 -6 TQ 144

C

Device

Speed Grade

Package Type

Speed Grade

Package Type

Number of Pins

Temperature Range

-Free

Pb

Number of Pins

Temperature Range

Device Part Marking

R

Device Type

Package

XC2Cxxx

TQ144

This line not

related to device

part number

Speed

7C

Operating Range

Part marking for non-chip scale package

Figure 5: Sample Package with Part Marking

Note: Due to the small size of chip scale packages, the complete ordering part number cannot be included on the package

marking. Part marking on chip scale packages by line are:

•

Line 1 = X (Xilinx logo) then truncated part number

Line 2 = Not related to device part number

Line 3 = Not related to device part number

1. Line 4 = Package code, speed, operating temperature,

three digits not related to device part number. Package

codes: C5 = CP132, C6 = CPG132.

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

(1)

1

2

3

4

5

6

7

8

GND

I/O

GND

I/O

GND

I/O

VCC

I/O

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

I/O

V

AUX

I/O

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

VQ100

Top View

VCCIO1

GND

I/O

(2)

I/O

(2)

I/O

(4)

I/O

VCCIO1

GND

(1) - Global Output Enable

(2) - Global Clock

(3) - Global Set/Reset

(4) - Clock Divide Reset

(5) - Data Gate

Figure 6: VQ100 Very Thin Quad Flat Pack

19

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

VCCIO1

I/O

VCCIO1

I/O

VCC

GND

I/O

I/O(5)

I/O(2)

I/O(4)

I/O

GND

I/O

GND

TDI

I/O

GND

I/O

P

N

M

L

TMS

TCK

I/O

I/O(2)

GND

I/O

I/O(2)

VCC

K

J

I/O

VCCIO1

I/O

GND

H

G

F

CP132

Bottom View

I/O

VCCIO1

I/O

GND

E

D

C

B

A

I/O

VAUX

I/O

I/O(1)

I/O(1) VCCIO2

I/O

I/O(1)

VCC

GND

I/O

TDO

GND

I/O

GND

VCCIO2

I/O

I/O(1)

I/O(3)

VCCIO2

(1) - Global Output Enable

(2) - Global Clock

(3) - Global Set/Reset

(4) - Clock Divide Reset

(5) - DataGATE Enable

Figure 7: CP132 Chip Scale Package

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

V

I/O

CC

(1)

1

2

3

4

5

6

7

8

GND

108

I/O

107

106

105

104

I/O

(1)

I/O

103

I/O

GND

I/O

V

I/O

GND

I/O

V

102

101

100

99

98

97

96

95

94

93

92

91

90

89

88

87

86

85

84

83

82

81

80

79

78

77

76

75

74

73

AUX

I/O

9

I/O

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

CCIO1

TQ144

Top View

I/O

V

CC

I/O

V

CCIO1

I/O

GND

(2)

I/O

(2)

I/O

(4)

I/O

GND

V

CCIO1

(1) - Global Output Enable

(2) - Global Clock

(3) - Global Set/Reset

(4) - Clock Divide Reset

(5) - DataGATE Enable

Figure 8: TQ144 Thin Quad Flat Pack

21

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

VCC

I/O

I/O(1)

I/O

I/O(1)

I/O

I/O(1)

I/O

I/O(1)

I/O

VAUX

I/O

GND

I/O

1

2

3

4

5

6

7

8

GND

I/O

GND

I/O

156

155

154

153

152

151

150

149

148

147

146

145

144

143

142

141

140

139

138

137

136

135

134

133

132

131

130

129

128

127

126

125

124

123

122

121

120

119

118

117

116

115

114

113

112

111

110

109

108

107

106

105

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

I/O

GND

I/O

VCCIO2

I/O

VCCIO2

VCCIO1

I/O

GND

I/O

VCC

I/O

PQ208

Top View

I/O

VCCIO1

I/O

GND

I/O

I/O(2)

I/O

I/O(2)

I/O

I/O(4)

GND

I/O

VCCIO1

(1) - Global Output Enable

(2) - Global Clock

(3) - Global Set/Reset

(4) - Clock Divide Reset

(5) - DataGATE Enable

Figure 9: PQ208 Quad Flat Package

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

TDO

I/O

NC

I/O

NC

I/O

NC

I/O

NC

I/O

NC

I/O

A

B

C

D

E

F

I/O

I/O(3)

I/O

I/O(1)

I/O

NC

I/O

NC

I/O

VCC

I/O

NC

VCC

I/O(1)

I/O

I/O(1)

I/O

NC

VCCIO2

VCCIO2 VCCIO2 VCCIO2 GND

VAUX

I/O

GND

I/O

NC

I/O

NC

I/O

NC

I/O

NC

I/O

GND

GND VCCIO2

GND VCCIO1

I/O

NC

I/O

G

H

J

VCCIO2

VCCIO1

GND

I/O

GND

VCC

I/O

K

L

VCCIO1

VCCIO1 VCCIO1 VCCIO1 GND

NC

I/O

NC

I/O

I/O(2)

I/O

NC

I/O

NC

I/O

TMS

TCK

I/O

NC

TDI

NC

I/O

NC

I/O

NC

I/O

I/O(2)

I/O

M

N

P

R

T

I/O(4)

I/O

I/O(2)

I/O

VCC

I/O

I/O(5)

NC

I/O

FT256 Bottom View

(1) - Global Output Enable

(2) - Global Clock

(3) - Global Set/Reset

(4) - Clock Divide Reset

(5) - DataGATE Enable

Figure 10: FT256 Fine Pitch Thin BGA

Additional Information

CoolRunner-II Data Sheets and Application Notes

Device Packages

23

Preliminary Product Specification

R

XC2C256 CoolRunner-II CPLD

Revision History

The following table shows the revision history for this document.

Date

Version

1.0

Revision

05/09/02

05/13/02

10/31/02

03/17/03

04/02/03

01/26/04

02/26/04

08/03/04

08/19/04

10/01/04

03/07/05

Initial Xilinx release.

1.1

Updated AC Electrical Characteristics and added new parameters.

Corrected package user I/O, added Voltage Referenced DC tables.

Added Characterization numbers for product release and device part marking

Updated T_SOLmax from 260 to 220. Changed I_CCSBunits from mA to µA.

Updated Device Part Marking. Updated links and Tsol.

1.2

2.0

2.1

2.2

2.3

Corrected Theta JC value on XC2C256-7TQ144.

2.4

Pb-free documentation

2.5

Changes to I_CCSBmaximum specifications in DC Electrical Characteristics table, on page 3.

Add Asynchronous Preset/Reset Pulse Width specification to AC Electrical Characteristics.

Removed -5 speed grade. Changes to Table 1, I/O Standards.

2.6

2.7

DS094 (v2.7) March 7, 2005

Preliminary Product Specification

型号:	XC2C256-7TQG144C
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	XILINX INC
零件包装代码：	QFP
包装说明：	LFQFP, QFP144,.87SQ,20
针数：	144
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	12 weeks
风险等级：	0.94
Samacsys Confidence：	4
Samacsys Status：	Released
Samacsys PartID：	664810
Samacsys Pin Count：	144
Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	Quad Flat Packages
Samacsys Footprint Name：	TQFP (TQ144/TQG144)
Samacsys Released Date：	2018-07-03 14:42:34
Is Samacsys：	N
其他特性：	REAL DIGITAL DESIGN TECHNOLOGY
系统内可编程：	YES
JESD-30 代码：	S-PQFP-G144
JESD-609代码：	e3
JTAG BST：	YES
长度：	20 mm
湿度敏感等级：	3
专用输入次数：
I/O 线路数量：	118
宏单元数：	256
端子数量：	144
最高工作温度：	70 °C
最低工作温度：
组织：	0 DEDICATED INPUTS, 118 I/O
输出函数：	MACROCELL
封装主体材料：	PLASTIC/EPOXY
封装代码：	LFQFP
封装等效代码：	QFP144,.87SQ,20
封装形状：	SQUARE
封装形式：	FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	260
电源：	1.5/3.3,1.8 V
可编程逻辑类型：	FLASH PLD
传播延迟：	7.5 ns
认证状态：	Not Qualified
座面最大高度：	1.6 mm
子类别：	Programmable Logic Devices
最大供电电压：	1.9 V
最小供电电压：	1.7 V
标称供电电压：	1.8 V
表面贴装：	YES
技术：	CMOS
温度等级：	COMMERCIAL
端子面层：	Matte Tin (Sn)
端子形式：	GULL WING
端子节距：	0.5 mm
端子位置：	QUAD
处于峰值回流温度下的最长时间：	30
宽度：	20 mm
Base Number Matches：	1

电子百科

产品导航

产品型号XC2C256-7TQG144C的概述

产品型号XC2C256-7TQG144C的Datasheet PDF文件预览

XC2C256-7TQG144C相关产品

XC2C256-7TQG144C相关文章

IC37:专业IC行业平台