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XC4013E-4PQ208C 芯片概述 XC4013E-4PQ208C 是一种来自赛灵思（Xilinx）公司的 FPGA（现场可编程门阵列）器件。该芯片归属于 Xilinx XC4000 系列，主要为数字逻辑设计提供灵活的解决方案。由于其可编程性，XC4013E 被广泛应用于各种嵌入式系统、通信设备、工业自动化和消费电子产品中。 FPGA 的主要优势在于其高并行性和灵活性，可以根据用户的需求进行配置和编程，从而实现各种功能。特别是在系统设计中，FPGA 可以更快速地迭代和验证，而无须依赖于传统硬件的制造周期。因此，XC4013E-4PQ208C 在设计周期短、性能要求高的场合非常受欢迎。详细参数 XC4013E-4PQ208C 的主要参数如下： - 逻辑单元数量：8600 - 输入/输出引脚数：208 - 最大工作频率：最高可达 100 MHz - 最大供电电压：3.3V - 功耗...

产品型号XC4013E-4PQ208C的Datasheet PDF文件预览

XC4000E

Logic Cell Array Family

Product Preview

Features

Description

The XC4000E family of Field-Programmable Gate Arrays

(FPGAs) provides the benefits of custom CMOS VLSI,

while avoiding the initial cost, time delay, and inherent risk

of a conventional masked gate array.

• Third Generation Field-Programmable Gate Arrays

– On-chip ultra-fast RAM with synchronous write option

– Dual-port RAM option

– Fully PCI compliant

– Abundant flip-flops

The XC4000E family provides a regular, flexible, pro-

grammable architecture of Configurable Logic Blocks

(CLBs), interconnected by a powerful hierarchy of versa-

tile routing resources, and surrounded by a perimeter of

programmable Input/Output Blocks (IOBs).

– Flexible function generators

– Dedicated high-speed carry-propagation circuit

– Wide edge decoders (four per edge)

– Hierarchy of interconnect lines

– Internal 3-state bus capability

XC4000E devices have generous routing resources to

accommodate the most complex interconnect patterns.

They are customized by loading configuration data into

the internal memory cells. The FPGA can either actively

read its configuration data out of external serial or byte-

parallel PROM (master modes), or the configuration data

can be written into the FPGA (slave and peripheral

modes).

– 8 global low-skew clock or signal distribution network

• Flexible Array Architecture

– Programmable logic blocks and I/O blocks

– Programmable interconnects and wide decoders

• Sub-micron CMOS Process

– High-speed logic and Interconnect

– Low power consumption

• Systems-Oriented Features

The XC4000E family is supported by powerful and sophis-

ticated software, covering every aspect of design: from

schematic entry, to simulation, to automatic block place-

ment and routing of interconnects, and finally the creation

of the configuration bit stream.

– IEEE 1149.1-compatible boundary-scan logic support

– Programmable output slew rate (2 modes)

– Programmable input pull-up or pull-down resistors

– 12-mA sink current per output

– 24-mA sink current per output pair

FPGAs are ideal for shortening the design and develop-

ment cycle, but they also offer a cost-effective solution for

production rates well beyond 1,000 systems per month.

• Configured by Loading Binary File

– Unlimited reprogrammability

– Six programming modes

The XC4000E family is a superset of the popular XC4000

family. For a detailed description of the device architec-

ture, configuration methods, pin functionality, package

pin-outs and dimensions, see the Xilinx Programmable

Logic Data Book.

• XACT Development System runs on ’386/’486/

Pentium-type PC, Apollo, Sun-4, and Hewlett-Packard

700 series

– Interfaces to popular design environments like

Viewlogic, Mentor Graphics and OrCAD

– Fully automatic partitioning, placement and routing

– Interactive design editor for design optimization

– 288 macros, 34 hard macros, RAM/ROM compiler

The following pages describes the new features of the

XC4000E family and list electrical and timing parameters.

Table 1. The XC4000E Family of Field-Programmable Gate Arrays

Device

XC4003E XC4005E

XC4006E

XC4008E XC4010E

XC4013E

XC4020E XC4025E

Appr. Gate Count

CLB Matrix

Number of CLBs

Number of Flip-Flops

Max Decode Inputs (per side)

Max RAM Bits

3,000

10 x 10

100

360

5,000

14 x 14

196

616

6,000

16 x 16

256

768

8,000

18 x 18

324

936

10,000

20 x 20

400

1,120

13,000

24 x 24

576

1,536

20,000

28 x 28

784

2,016

25,000

32 x 32

1,024

2,560

3,200

6,272

112

8,192

128

10,368

144

12,800

160

18,432

192

25,088

224

32,768

256

Number of IOBs

XC4000E Logic Cell Array Family

XC4000E compared to XC4000

IOB Clock Enable

AnyXC4000Edeviceisa100%compatiblesupersetofthe

equivalent XC4000 device, not only functionally, but also

electrically, and in pin-out and configuration bitstream.

Thetwoflip-flopsineachIOBhaveacommonclockenable

input,which through configuration can be activated indi-

vidually for the input or output flip-flop or both. This clock

enable operates exactly like the EC pin on the XC4000

CLB. This makes the IOBs more versatile, and avoids the

need for clock gating.

The XC4000E devices have the following additional func-

tions, most of which are invoked through options in the

configuration bitstream:

Output Drivers

Synchronous RAM

The output pull-up structure can be globally configured to

be either a TTL-like totem-pole (n-channel pull-up transis-

tor, pulling to a voltage one threshold below Vcc, just like

XC4000) or to be CMOS (p-channel pull-up transistor

pulling to Vcc). Also, the configurable pull-up resistor in

XC4000E is a p-channel transistor that pulls to Vcc,

whereas in XC4000 it is an n-channel transistor that pulls

to a voltage one threshold below Vcc.

ThetwoRAMsinanyCLBcanbechangedtosynchronous

write operation. In this synchronous mode, the internal

write operation is controlled by the same clock that drives

the flip-flops. The clock polarity is programmable for the

RAM (both F and G function generators together), but is

independent of the chosen flip-flop polarity. Address,

Data, and WE inputs are latched by this rising or falling

clock edge, and a short internal write pulse is generated

right after the clock edge. This self-timed write operation is

thus effectively edge-triggered.

Input Thresholds

The input thresholds can be globally configured for either

TTL ( 1.2 V threshold) or CMOS ( 2.5 V threshold ), just like

XC2000 and XC3000 inputs. Note that the two global

adjustments of input threshold and output level are inde-

pendent of each other.

The read operation is not affected by this change to a

synchronous write.

Dual-Port RAM

A separate option converts the 16 x 2 RAM in any CLB into

a 16 x 1 dual-port RAM. In this mode, any operation that

writesintotheF-RAM, automaticallyalsowritesintotheG-

RAM, using the F address. The G-address can, therefore,

not be used to write into the G-RAM.

Global Signal Access to Logic

There is additional access from global clocks to the F and

G function generator inputs.

Mode-Pin Pull-Up Resistors

During configuration, the three mode pins, M0, M1, and

M2, have weak pull-up resistors. For the most popular

configuration mode, Slave Serial, the mode pins can thus

be left unconnected.

The CLB can thus be used as an asymmetrical dual-port

RAM, withFbeingthereadaddressfortheF-RAMandthe

write address for both F- and G-RAM, while G is the read

address for the G-RAM. Note that F and G can still be

independent read addresses, as they are in XC4000. The

two RAMs together have one read/write port using the F

address, and one read-only port using the G address.

For user mode, the three mode inputs can individually be

configured with or without weak pull-up or pull-down

resistors

The PROGRAM input pin has a permanent weak pull-up.

Each CLB can be configured as function generators either

asynchronous single-port, synchronous single-port, or

synchronous dual-port.

Soft Startup

Like XC3000A, the XC4000E family has “Soft Startup”.

When the configuration process is finished and the device

starts up in user mode, the first activation of the outputs is

automatically slew-rate limited. This avoids the potential

ground bounce when all outputs are turned on simulta-

neously. After start-up, the slew rate of the individual

outputs is, as in the XC4000 family, determined by the

individual configuration option.

H-Function Generator

In XC4000E, the H function generator is more versatile. Its

inputs can come not only from the F and G function

generators but also from up to three control input lines.

The H function generator can be totally or partially inde-

pendent of the other two function generators.

IOB Switching Characteristic Guidelines

Testing of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100%

functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark timing

patterns. The following guidelines reflect worst-case values over the recommended operating conditions. For more detailed, more

precise, and more up-to-date timing information, use the values provided by the XACT timing calculator and used in the simulator.

Speed Grade

-4

-3

-2

Description

Symbol Min Max

Min Max Min Max Units

Input

Propagation Delays

Pad to I1, I2

T_PID

T_PLI

T_PDLI

T_IKRI

T_IKLI

2.5

3.6

7.1

2.8

3.0

Pad to I1, I2, via transparent latch (no delay)

Pad to I1, I2, via transparent latch (with delay)

Clock (IK) toI1, I2, (flip-flop)

Clock (IK) to I1, I2 (latch enable, active Low)

Set-up Time (Note 3)

Pad to Clock (IK), no delay

Pad to Clock (IK) with delay

T_PICK

T_PICKD

4.7

8.3

Hold Time (Note 3)

Pad to Clock (IK), no delay

Pad to Clock (IK) with delay

T_IKPI

T_IKPID

Output

Propagation Delays

Clock (OK) to Pad

same

Output (O) to Pad

same

3-state to Pad begin hi-Z (slew-rate independent)

3-state to Pad active and valid (fast)

(fast)

(slew rate limited)

(fast)

T_OKPOF

T_OKPOS

T_OPF

4.6

11.2

5.8

12.4

4.2

(slew-rate limited)

T_OPS

T_TSHZ

T_TSONF

T_TSONS

8.1

14.7

same

(slew -rate limited)

Set-up and Hold Times

Output (O) to clock (OK) set-up time

Output (O) to clock (OK) hold time

T_OOK

T_OKO

3.7

Clock

Clock High or Low time

T_CH/T_CL

4.0

Global Set/Reset

Delay from GSR net through Q to I1, I2

Delay from GSR net to Pad

GSR width*

T_RRI

T_RPO

T_MRW

7.2

18.9

* Timing is based on the XC4005E. For other devices see XACT timing calculator.

** See preceding page

Notes: 1. Timing is measured at pin threshold, with 50 pF external capacitive loads (incl. test fixture). Slew rate limited output

rise/fall times are approximately two times longer than fast output rise/fall times. For the effect of capacitive loads on

ground bounce, see pages 8-8 through 8-10.

2. Voltage levels of unused (bonded and unbonded) pads must be valid logic levels. Each can be configured with the

internal pull-up or pull-down resistor or alternatively configured as a driven output or be driven from an external source.

3. Input pad setup times and hold times are specified with respect to the internal clock (IK). To calculate system setup time,

subtract clock delay (clock pad to IK) from the specified input pad setup time value, but do not subtract below zero.

Negative hold time means that the delay in the input data is adequate for the external system hold time to be zero,

provided the input clock uses the Global signal distribution from pad to IK.

XC4000E Logic Cell Array Family

CLB Switching Characteristic Guidelines

Testing of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100%

functionally tested. Since many internal timing parameters cannot be measured directly, they are derived from benchmark timing

patterns. The following guidelines reflect worst-case values over the recommended operating conditions. For more detailed, more

precise, and more up-to-date timing information, use the values provided by the XACT timing calculator and used in the simulator.

Speed Grade

Symbol

-4

-3

-2

Description

Min Max Min Max Min Max Units

Combinatorial Delays

F/G inputs to X/Y outputs

F/G inputs via H’ to X/Y outputs

C inputs via H’ to X/Y outputs

T_ILO

T_IHO

T_HHO

2.0

3.6

2.9

CLB Fast Carry Logic

Operand inputs (F1,F2,G1,G4) to C^OUT

Add/Subtract input (F3) to C^OUT

Initialization inputs (F1,F3) to C^OUT

C_INthrough function generators to X/Y outputs

C_INto C_OUT, bypass function generators.

T_OPCY

T_ASCY

T_INCY

T_SUM

T_BYP

2.6

4.4

1.7

3.3

0.7

Sequential Delays

Clock K to outputs Q

T_CKO

2.4

Set-up Time before Clock K

F/G inputs

T_ICK

2.3

4.0

3.3

1.9

2.6

1.7

F/G inputs via H’

C inputs via H1

C inputs via DIN

C inputs via EC

C inputs via S/R, going Low (inactive)

C_INinput via F'/G'

C_INinput via F'/G' and H'

T_IHCK

T_HHCK

T_DICK

T_ECCK

T_RCK

T_CCK

T_CHCK

Hold Time after Clock K

F/G inputs

T_CKI

F/G inputs via H’

C inputs via H1

C inputs via DIN

C inputs via EC

T_CKIH

T_CKHH

T_CKDI

T_CKEC

T_CKR

C inputs via S/R, going Low (inactive)

Clock

Clock High time

Clock Low time

T_CH

T_CL

4.0

Set/Reset Direct

Width (High)

Delay from C inputs via S/R, going High to Q

T_RPW

T_RIO

4.0

Master Set/Reset*

Width (High or Low)

Delay from Global Set/Reset net to Q

T_MRW

T_MRQ

18.9

14.4

Timing is based on the XC4005E. For other devices see XACT timing calculator.

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XC4013E-4PQ208I产品参数

型号:	XC4013E-4PQ208I
是否无铅：	含铅
是否Rohs认证：	不符合
生命周期：	Obsolete
IHS 制造商：	XILINX INC
零件包装代码：	QFP
包装说明：	PLASTIC, QFP-208
针数：	208
Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01
风险等级：	5.8
其他特性：	MAX USABLE 13000 LOGIC GATES
最大时钟频率：	111 MHz
CLB-Max的组合延迟：	2.7 ns
JESD-30 代码：	S-PQFP-G208
JESD-609代码：	e0
长度：	28 mm
湿度敏感等级：	3
可配置逻辑块数量：	576
等效关口数量：	10000
输入次数：	192
逻辑单元数量：	576
输出次数：	192
端子数量：	208
组织：	576 CLBS, 10000 GATES
封装主体材料：	PLASTIC/EPOXY
封装代码：	FQFP
封装等效代码：	QFP208,1.2SQ,20
封装形状：	SQUARE
封装形式：	FLATPACK, FINE PITCH
峰值回流温度（摄氏度）：	225
电源：	5 V
可编程逻辑类型：	FIELD PROGRAMMABLE GATE ARRAY
认证状态：	Not Qualified
座面最大高度：	4.1 mm
子类别：	Field Programmable Gate Arrays
最大供电电压：	5.5 V
最小供电电压：	4.5 V
标称供电电压：	5 V
表面贴装：	YES
技术：	CMOS
端子面层：	Tin/Lead (Sn85Pb15)
端子形式：	GULL WING
端子节距：	0.5 mm
端子位置：	QUAD
处于峰值回流温度下的最长时间：	30
宽度：	28 mm
Base Number Matches：	1

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