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产品型号XCV100E-8CS144C的Datasheet PDF文件预览

Virtex™-E 1.8 V

Field Programmable Gate Arrays

DS022-1 (v2.2) November 9, 2001

Preliminary Product Specification

Features

•

Fast, High-Density 1.8 V FPGA Family

•

High-Performance Built-In Clock Management Circuitry

Densities from 58 k to 4 M system gates

Eight fully digital Delay-Locked Loops (DLLs)

130 MHz internal performance (four LUT levels)

Designed for low-power operation

Digitally-Synthesized 50% duty cycle for Double

Data Rate (DDR) Applications

Clock Multiply and Divide

PCI compliant 3.3 V, 32/64-bit, 33/ 66-MHz

Zero-delay conversion of high-speed LVPECL/LVDS

clocks to any I/O standard

•

Highly Flexible SelectI/O+™ Technology

Supports 20 high-performance interface standards

•

Flexible Architecture Balances Speed and Density

Up to 804 singled-ended I/Os or 344 differential I/O

pairs for an aggregate bandwidth of > 100 Gb/s

Dedicated carry logic for high-speed arithmetic

Dedicated multiplier support

Differential Signalling Support

Cascade chain for wide-input function

LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL

Differential I/O signals can be input, output, or I/O

Compatible with standard differential devices

Abundant registers/latches with clock enable, and

dual synchronous/asynchronous set and reset

Internal 3-state bussing

LVPECL and LVDS clock inputs for 300+ MHz

clocks

IEEE 1149.1 boundary-scan logic

Die-temperature sensor diode

•

Proprietary High-Performance SelectLink™

Technology

•

Supported by Xilinx Foundation™ and Alliance Series™

Development Systems

Double Data Rate (DDR) to Virtex-E link

Web-based HDL generation methodology

Further compile time reduction of 50%

Internet Team Design (ITD) tool ideal for

million-plus gate density designs

Sophisticated SelectRAM+™ Memory Hierarchy

1 Mb of internal configurable distributed RAM

Up to 832 Kb of synchronous internal block RAM

True Dual-Port™ BlockRAM capability

Wide selection of PC and workstation platforms

•

SRAM-Based In-System Configuration

Unlimited re-programmability

Advanced Packaging Options

Memory bandwidth up to 1.66 Tb/s (equivalent

bandwidth of over 100 RAMBUS channels)

0.8 mm Chip-scale

1.0 mm BGA

1.27 mm BGA

HQ/PQ

Designed for high-performance Interfaces to

External Memories

200 MHz ZBT* SRAMs

200 Mb/s DDR SDRAMs

Supported by free Synthesizable reference design

•

0.18 m 6-Layer Metal Process

100% Factory Tested

* ZBT is a trademark of Integrated Device Technology, Inc.

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

DS022-1 (v2.2) November 9, 2001

Preliminary Product Specification

www.xilinx.com

1-800-255-7778

Module 1 of 4

Virtex™-E 1.8 V Field Programmable Gate Arrays

Table 1: Virtex-E Field-Programmable Gate Array Family Members

System

Gates

Logic

Gates

CLB

Array

Logic

Cells

Differential

I/O Pairs

User

I/O

BlockRAM Distributed

Device

Bits

RAM Bits

XCV50E

71,693

128,236

20,736

32,400

16 x 24

20 x 30

28 x 42

32 x 48

40 x 60

48 x 72

64 x 96

72 x 108

80 x 120

92 x 138

104 x 156

1,728

2,700

176

196

284

316

404

512

660

724

804

65,536

24,576

XCV100E

XCV200E

XCV300E

XCV400E

XCV600E

XCV1000E

XCV1600E

XCV2000E

XCV2600E

XCV3200E

81,920

38,400

306,393

63,504

5,292

119

137

183

247

281

344

114,688

131,072

163,840

294,912

393,216

589,824

655,360

753,664

851,968

75,264

411,955

82,944

6,912

98,304

569,952

129,600

186,624

331,776

419,904

518,400

685,584

876,096

10,800

15,552

27,648

34,992

43,200

57,132

73,008

153,600

221,184

393,216

497,664

614,400

812,544

1,038,336

985,882

1,569,178

2,188,742

2,541,952

3,263,755

4,074,387

The Virtex-E family is not bitstream-compatible with the Vir-

tex family, but Virtex designs can be compiled into equiva-

lent Virtex-E devices.

Virtex-E Compared to Virtex Devices

The Virtex-E family offers up to 43,200 logic cells in devices

up to 30% faster than the Virtex family.

The same device in the same package for the Virtex-E and

Virtex families are pin-compatible with some minor excep-

tions. See the data sheet pinout section for details.

I/O performance is increased to 622 Mb/s using Source

Synchronous data transmission architectures and synchro-

nous system performance up to 240 MHz using sin-

gled-ended SelectI/O technology. Additional I/O standards

are supported, notably LVPECL, LVDS, and BLVDS, which

use two pins per signal. Almost all signal pins can be used

for these new standards.

General Description

The Virtex-E FPGA family delivers high-performance,

high-capacity programmable logic solutions. Dramatic

increases in silicon efficiency result from optimizing the new

architecture for place-and-route efficiency and exploiting an

aggressive 6-layer metal 0.18 m CMOS process. These

advances make Virtex-E FPGAs powerful and flexible alter-

natives to mask-programmed gate arrays. The Virtex-E fam-

ily includes the nine members in Table 1.

Virtex-E devices have up to 640 Kb of faster (250 MHz)

block SelectRAM, but the individual RAMs are the same

size and structure as in the Virtex family. They also have

eight DLLs instead of the four in Virtex devices. Each indi-

vidual DLL is slightly improved with easier clock mirroring

and 4x frequency multiplication.

Building on experience gained from Virtex FPGAs, the

Virtex-E family is an evolutionary step forward in program-

mable logic design. Combining a wide variety of program-

mable system features, a rich hierarchy of fast, flexible

interconnect resources, and advanced process technology,

the Virtex-E family delivers a high-speed and high-capacity

programmable logic solution that enhances design flexibility

while reducing time-to-market.

V_CCINT, the supply voltage for the internal logic and mem-

ory, is 1.8 V, instead of 2.5 V for Virtex devices. Advanced

processing and 0.18 m design rules have resulted in

smaller dice, faster speed, and lower power consumption.

I/O pins are 3 V tolerant, and can be 5 V tolerant with an

external 100 resistor. PCI 5 V is not supported. With the

addition of appropriate external resistors, any pin can toler-

ate any voltage desired.

Banking rules are different. With Virtex devices, all input

buffers are powered by V_CCINT. With Virtex-E devices, the

LVTTL, LVCMOS2, and PCI input buffers are powered by

Virtex-E Architecture

Virtex-E devices feature a flexible, regular architecture that

comprises an array of configurable logic blocks (CLBs) sur-

rounded by programmable input/output blocks (IOBs), all

interconnected by a rich hierarchy of fast, versatile routing

the I/O supply voltage V_CCO

Module 1 of 4

www.xilinx.com

1-800-255-7778

DS022-1 (v2.2) November 9, 2001

Preliminary Product Specification

Virtex™-E 1.8 V Field Programmable Gate Arrays

Table 2: Performance for Common Circuit Functions

resources. The abundance of routing resources permits the

Virtex-E family to accommodate even the largest and most

complex designs.

Function

Adder

Bits

Virtex-E (-7)

Virtex-E FPGAs are SRAM-based, and are customized by

loading configuration data into internal memory cells. Con-

figuration data can be read from an external SPROM (mas-

ter serial mode), or can be written into the FPGA

(SelectMAP™, slave serial, and JTAG modes).

4.3 ns

6.3 ns

Pipelined Multiplier

Address Decoder

8 x 8

4.4 ns

5.1 ns

The standard Xilinx Foundation Series™ and Alliance

Series™ Development systems deliver complete design

support for Virtex-E, covering every aspect from behavioral

and schematic entry, through simulation, automatic design

translation and implementation, to the creation and down-

loading of a configuration bit stream.

16 x 16

3.8 ns

5.5 ns

16:1 Multiplexer

Parity Tree

4.6 ns

3.5 ns

4.3 ns

5.9 ns

Higher Performance

Virtex-E devices provide better performance than previous

generations of FPGAs. Designs can achieve synchronous

system clock rates up to 240 MHz including I/O or 622 Mb/s

using Source Synchronous data transmission architech-

tures. Virtex-E I/Os comply fully with 3.3 V PCI specifica-

tions, and interfaces can be implemented that operate at

33 MHz or 66 MHz.

Chip-to-Chip

HSTL Class IV

LVTTL,16mA, fast slew

LVDS

While performance is design-dependent, many designs

operate internally at speeds in excess of 133 MHz and can

achieve over 311 MHz. Table 2 shows performance data for

representative circuits, using worst-case timing parameters.

LVPECL

Virtex-E Device/Package Combinations and Maximum I/O

Table 3: Virtex-E Family Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)

XCV

50E

XCV

100E

XCV

200E

XCV

300E

XCV

400E

XCV

600E

XCV

1000E

XCV

1600E

XCV

2000E

XCV

2600E

XCV

3200E

CS144

PQ240

HQ240

BG352

BG432

BG560

FG256

FG456

FG676

FG680

FG860

FG900

FG1156

158

404

196

176

260

316

404

316

404

176

284

176

312

404

444

512

660

512

660

700

724

512

660

512

804

DS022-1 (v2.2) November 9, 2001

Preliminary Product Specification

www.xilinx.com

1-800-255-7778

Module 1 of 4

Virtex™-E 1.8 V Field Programmable Gate Arrays

Virtex-E Ordering Information

Example: XCV300E-6PQ240C

Device Type

Temperature Range

C = Commercial (Tj = 0 C to +85 C)

I = Industrial (Tj = -40 C to +100 C)

Speed Grade

(-6, -7, -8)

Number of Pins

Package Type

BG = Ball Grid Array

FG = Fine Pitch Ball Grid Array

HQ = High Heat Dissipation

DS022_043_072000

Figure 1: Ordering Information

Revision History

The following table shows the revision history for this document.

Date

Version

1.0

Revision

12/7/99

1/10/00

Initial Xilinx release.

1.1

Re-released with spd.txt v. 1.18, FG860/900/1156 package information, and additional DLL,

Select RAM and SelectI/O information.

1/28/00

1.2

Added Delay Measurement Methodology table, updated SelectI/O section, Figures 30, 54,

& 55, text explaining Table 5, T_BYPvalues, buffered Hex Line info, p. 8, I/O Timing

Measurement notes, notes for Tables 15, 16, and corrected F1156 pinout table footnote

references.

2/29/00

5/23/00

7/10/00

1.3

1.4

1.5

Updated pinout tables, V_CCpage 20, and corrected Figure 20.

Correction to table on p. 22.

•

Numerous minor edits.

•

Data sheet upgraded to Preliminary.

Preview -8 numbers added to Virtex-E Electrical Characteristics tables.

Reformatted entire document to follow new style guidelines.

Changed speed grade values in tables on pages 35-37.

Min values added to Virtex-E Electrical Characteristics tables.

8/1/00

1.6

1.7

9/20/00

XCV2600E and XCV3200E numbers added to Virtex-E Electrical Characteristics

tables (Module 3).

•

Corrected user I/O count for XCV100E device in Table 1 (Module 1).

Changed several pins to “No Connect in the XCV100E“ and removed duplicate V_CCINT

pins in Table ~ (Module 4).

•

Changed pin J10 to “No connect in XCV600E” in Table 74 (Module 4).

Changed pin J30 to “VREF option only in the XCV600E” in Table 74 (Module 4).

Corrected pair 18 in Table 75 (Module 4) to be “AO in the XCV1000E, XCV1600E“.

Module 1 of 4

www.xilinx.com

1-800-255-7778

DS022-1 (v2.2) November 9, 2001

Preliminary Product Specification

Virtex™-E 1.8 V Field Programmable Gate Arrays

Date

Version

Revision

•

Upgraded speed grade -8 numbers in Virtex-E Electrical Characteristics tables to

Preliminary.

11/20/00

1.8

•

Updated minimums in Table 13 and added notes to Table 14.

Added to note 2 to Absolute Maximum Ratings.

Changed speed grade -8 numbers for T_SHCKO32, T_REG, T_BCCS, and T_ICKOF

•

Changed all minimum hold times to –0.4 under Global Clock Setup and Hold for

LVTTL Standard, with DLL.

•

Revised maximum T_DLLPWin -6 speed grade for DLL Timing Parameters.

Changed GCLK0 to BA22 for FG860 package in Table 46.

Revised footnote for Table 14.

•

2/12/01

1.9

2.0

Added numbers to Virtex-E Electrical Characteristics tables for XCV1000E and

XCV2000E devices.

•

Updated Table 27 and Table 78 to include values for XCV400E and XCV600E devices.

Revised Table 62 to include pinout information for the XCV400E and XCV600E devices

in the BG560 package.

•

Updated footnotes 1 and 2 for Table 76 to include XCV2600E and XCV3200E devices.

Updated numerous values in Virtex-E Switching Characteristics tables.

4/2/01

Converted data sheet to modularized format. See the Virtex-E Data Sheet section.

Updated the Virtex-E Device/Package Combinations and Maximum I/O table to

show XCV3200E in the FG1156 package.

10/25/01

11/09/01

2.1

2.2

•

Minor edits.

Virtex-E Data Sheet

The Virtex-E Data Sheet contains the following modules:

•

DS022-1, Virtex-E 1.8V FPGAs:

Introduction and Ordering Information (Module 1)

•

DS022-3, Virtex-E 1.8V FPGAs:

DC and Switching Characteristics (Module 3)

•

DS022-2, Virtex-E 1.8V FPGAs:

DS022-4, Virtex-E 1.8V FPGAs:

Functional Description (Module 2)

Pinout Tables (Module 4)

DS022-1 (v2.2) November 9, 2001

Preliminary Product Specification

www.xilinx.com

1-800-255-7778

Module 1 of 4

型号:	XCV100E-8CS144C
是否无铅：	含铅
是否Rohs认证：	不符合
生命周期：	Obsolete
IHS 制造商：	XILINX INC
零件包装代码：	BGA
包装说明：	CSP-144
针数：	144
Reach Compliance Code：	not_compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	5.83
Is Samacsys：	N
最大时钟频率：	416 MHz
CLB-Max的组合延迟：	0.4 ns
JESD-30 代码：	S-PBGA-B144
JESD-609代码：	e0
长度：	12 mm
湿度敏感等级：	3
可配置逻辑块数量：	600
等效关口数量：	32400
输入次数：	94
逻辑单元数量：	2700
输出次数：	94
端子数量：	144
最高工作温度：	85 °C
最低工作温度：
组织：	600 CLBS, 32400 GATES
封装主体材料：	PLASTIC/EPOXY
封装代码：	TFBGA
封装等效代码：	BGA144,13X13,32
封装形状：	SQUARE
封装形式：	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	240
电源：	1.2/3.6,1.8 V
可编程逻辑类型：	FIELD PROGRAMMABLE GATE ARRAY
认证状态：	Not Qualified
座面最大高度：	1.2 mm
子类别：	Field Programmable Gate Arrays
最大供电电压：	1.89 V
最小供电电压：	1.71 V
标称供电电压：	1.8 V
表面贴装：	YES
技术：	CMOS
温度等级：	OTHER
端子面层：	Tin/Lead (Sn63Pb37)
端子形式：	BALL
端子节距：	0.8 mm
端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	30
宽度：	12 mm
Base Number Matches：	1

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