Package Information
HDMP-0482 Thermal Characteristics,
T
C
= 0°C to 85°C, V
CC
= 3.15V to 3.45V
Symbol
θ
jc
Parameter
Thermal Resistance, Junction to Case
Unit
°C/W
Typ.
9.5
Max.
—
Note:
Based on independent testing by Agilent.
θ
ja
for these devices is 39.4°C/W for the HDMP-0482.
θ
ja
is measured on a standard 3x3” FR4 PCB in a still air environment. To determine the actual
junction temperature in a given application, use the following equation: T
j
= T
C
+ (θ
jc
x P
D
), where T
C
is the case temperature measured on the top center of the package, and P
D
is the power being
dissipated.
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Skew
Lead Coplanarity
(Seating Plane Method)
Details
Plastic
85% Tin, 15% Lead
300 – 800 micro-inches
0.20 mm max.
0.10 mm max.
PIN #1 ID
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
1
47
2
46
3
45
4
44
5
43
6
42
7
HDMP-0482
41
8
40
9
TOP VIEW
39
10
38
11
37
12
36
13
35
14
34
15
33
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
E1
E
c
b
D1
e
D
A2
L
G
A
Figure 10. HDMP-0482 Package Drawing.
A1
Mechanical Dimensions of HDMP-0482
Dimensional Parameter
(in millmeters)
HDMP-0482
Tolerance
D1/E1
14.00
±0.10
D/E
17.20
±0.25
b
0.35
±0.05
e
0.80
Basic
L
0.88
+0.15/
-0.10
c
0.17
Max
G
0.25
Gage
Plane
A2
2.00
+0.10/
-0.05
A1
0.25
Max
A
2.35
Max
11
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
