AS1910 - AS1915
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
Section 5 Electrical
Characteristics on page 3
is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
V
CC
, V
CC2
to GND
Open-Drain RESETN
Push/Pull RESET, RESETN
MRN, WDI, RESETIN to GND
Input Current (V
CC
)
Output Current (RESET, RESETN)
Continuous Power Dissipation
(T
AMB
= +70ºC)
Operating Temperature Range
Junction Temperature
Storage Temperature Range
-65
-40
Min
-0.3
-0.3
-0.3
-0.3
Max
+5.0
+7.0
V
CC
+
0.3
V
CC
+
0.3
20
20
696
+125
+150
+150
Units
V
V
V
V
mA
mA
mW
ºC
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Derate 8.7mW/ºC above +70ºC
Comments
Package Body Temperature
+260
ºC
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