APM4953
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
(IR/Convection or VPR Reflow)
Reflow Condition
temperature
Peak temperature
183
°
C
Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/
Convection
Average ramp-up rate(183°C to Peak)
3°C/second max.
120 seconds max
Preheat temperature 125 ± 25°C)
60 150 seconds
Temperature maintained above 183°C
Time within 5°C of actual peak temperature 10 20 seconds
Peak temperature range
220 +5/-0°C or 235 +5/-0°C
Ramp-down rate
6
°C
/second max.
6 minutes max.
Time 25°C to peak temperature
VPR
10
°C
/second max.
60 seconds
215-219°C or 235 +5/-0°C
10
°C
/second max.
Package Reflow Conditions
pkg. thickness
≥
2.5mm
and all bgas
Convection 220 +5/-0
°C
VPR 215-219
°C
IR/Convection 220 +5/-0
°C
pkg. thickness < 2.5mm and
pkg. volume
≥
350 mm³
pkg. thickness < 2.5mm and pkg.
volume < 350mm³
Convection 235 +5/-0
°C
VPR 235 +5/-0
°C
IR/Convection 235 +5/-0
°C
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Copyright
ANPEC Electronics Corp.
Rev. A.2 - Feb., 2003
7
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
