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512Mbit (16Mx32bit) Mobile SDR Memory
H55S5122DFR Series / H55S5132DFR Series
INFORMATION for Hynix KNOWN GOOD DIE
With the advent of Multi-Chip package (MCPs), Package on Package (PoP) and system in a package (SiP) applications,
customer demand for Known Good Die (KGD) has increased.
Requirements for smaller form factors and higher memory densities are fueling the need for Wafer-level memory solu-
tions due to their superior flexibility. Hynix Known Good Die (KGD) products can be used in packaging technologies
such as systems-in-a-package (SIPs) and multi-chip packages (MCPs) to reduce the board area required, making them
ideal for hand-held PCs, and many other portable digital applications.
Hynix Mobile DRAM will be able to continue its constant effort of enabling the Advanced package products of all appli-
cation customers.
- Please Contact Hynix Office for Hynix KGD product availability and informations.
Rev 1.5 / Jan. 2009
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HYNIX [ HYNIX SEMICONDUCTOR ]
