IDT6116SA/LA
CMOS STATIC RAM 16K (2K x 8-BIT)
MILITARY AND COMMERCIAL TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS
(V
CC
= 5V
±
10%, All Temperature Ranges)
6116SA15
(1)
6116LA15
(1)
Symbol
t
RC
t
AA
t
ACS
t
CLZ
(3)
t
OE
t
OLZ
(3)
t
CHZ
(3)
t
OHZ
(3)
t
OH
t
PU
(3)
t
PD
(3)
Parameter
Read Cycle Time
Address Access Time
Chip Select Access Time
Chip Select to Output in
Low-Z
Output Enable to Output
Valid
Output Enable to Output
in Low-Z
Chip Deselect to Output
in High-Z
Output Disable to Output
in High-Z
Output Hold from
Address Change
Chip Select to Power-Up
Time
Chip Deselect to Power-
Down Time
Min.
15
—
—
5
—
0
—
—
5
0
—
Max.
—
15
15
—
10
—
10
8
—
—
15
READ CYCLE
20
—
—
5
—
0
—
—
5
0
—
—
19
20
—
10
—
11
8
—
—
20
25
—
—
5
—
5
—
—
5
0
—
—
25
25
—
13
—
12
10
—
—
25
35
—
—
5
—
5
—
—
5
0
—
—
35
35
—
20
—
15
13
—
—
35
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
3089 tbl 12
6116SA20
6116LA20
Min.
Max.
6116SA25
6116LA25
Min.
Max.
6116SA35
6116LA35
Min.
Max.
Unit
AC ELECTRICAL CHARACTERISTICS
(V
CC
= 5V
±
10%, All Temperature Ranges) (Continued)
6116SA45
6116LA45
Symbol
READ CYCLE
t
RC
t
AA
t
ACS
t
CLZ
(3)
t
OE
t
OLZ
(3)
t
CHZ
(3)
t
OHZ
(3)
t
OH
Read Cycle Time
Address Access Time
Chip Select Access Time
Chip Select to Output in
Low-Z
Output Enable to Output
Valid
Output Enable to Output
in Low-Z
Chip Deselect to Output
in High-Z
Output Disable to Output
in High-Z
Output Hold from
Address Change
45
—
—
5
—
5
—
—
5
—
45
45
—
25
—
20
15
—
55
—
—
5
—
5
—
—
5
—
55
50
—
40
—
30
30
—
70
—
—
5
—
5
—
—
5
—
70
65
—
50
—
35
35
—
90
—
—
5
—
5
—
—
5
—
90
90
—
60
—
40
40
—
120
—
—
5
—
5
—
—
5
—
120
120
—
80
—
40
40
—
150
—
—
5
—
5
—
—
5
—
150
150
—
100
—
40
40
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
3089 tbl 13
6116SA55
(2)
6116LA55
(2)
Min.
Max.
6116SA70
(2)
6116SA90
(2)
6116LA70
(2)
6116LA90
(2)
Min.
Max.
Min.
6116SA120
(2)
6116SA150
(2)
6116LA120
(2)
6116LA150
(2)
Max.
Min.
Max. Unit
Parameter
Min.
Max.
Max. Min.
NOTES:
1. 0°C to + 70°C temperature range only.
2. –55°C to + 125°C temperature range only.
3. This parameter guaranteed with the AC Load (Figure 2) by device characterization, but is not production tested.
5.1
6