SEMICONDUCTOR
RoHS
12PT Series
RoHS
Fig.13 On-state characteristics (maximum
values)
Fig.14 Thermal resistance junction to ambient
versus copper surface under tab (D²PAK)
I
TM
(A)
200
100
Tjmax
V
t0
=0.85V
Rd=30mΩ
R
th
(j-a)(
°
C/W)
100
80
60
DPAK
Epoxy printed circuit board FR4
copper thickness = 35µm
Tj=max
10
Tj=25
°
C
40
D²PAK
20
1
0.0 0.5
1.0
1.5
2.0
V
TM
(V)
2.5
3.0 3.5
4.0
4.5 5.0
0
0
2
4
6
8
S(cm²)
10
12
14
16
18
20
Case Style
TO-220AB
10.54 (0.415) MAX.
9.40 (0.370)
9.14 (0.360)
3.91 (0.154)
3.74 (0.148)
2.87 (0.113)
2.62 (0.103)
3.68 (0.145)
3.43 (0.135)
16.13 (0.635)
15.87 (0.625)
3
15.32 (0.603)
14.55 (0.573)
8.89 (0.350)
8.38 (0.330)
29.16 (1.148)
28.40 (1.118)
2.79 (0.110)
2.54 (0.100)
14.22 (0.560)
13.46 (0.530)
0.90 (0.035)
0.70 (0.028)
5.20 (0.205)
4.95 (0.195)
0.56 (0.022)
0.36 (0.014)
4.70 (0.185)
4.44 (0.1754)
1.39 (0.055)
1.14 (0.045)
1
4.06 (0.160)
3.56 (0.140)
1.45 (0.057)
1.14 (0.045)
2.67 (0.105)
2.41 (0.095)
2.65 (0.104)
2.45 (0.096)
PIN
2
TO-251
(I-PAK)
5.4(0.212)
5.2(0.204)
6.6(0.26)
6.4(0.52)
1.5(0.059)
1.37(0.054)
2.4(0.095)
2.2(0.086)
0.62(0.024)
0.48(0.019)
4T
16.3(0.641)
15.9(0.626)
1.9(0.075)
1.8(0.071)
6.2(0.244)
6(0.236)
9.4(0.37)
9(0.354)
0.85(0.033)
0.76(0.03)
4.6(0.181)
4.4(0.173)
0.65(0.026)
0.55(0.021)
0.62(0.024)
0.45(0.017)
2
(A2)
(G)3
1(A1)
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