RF3266
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pkg
Base
Function
RF IN
NC
VMODE
VREG
VDET
NC
NC
NC
RF OUT
VCC2
VCC2
VCC2
VCC2L
IM
VCC1
VCCBIAS
GND
Description
AC-coupled RF input internally matched to 50Ω.
This pin must remain floating.
Digital control voltage input for switching the PA from low power mode to high power mode and vice versa. A
“low” on this pin operates the PA in the specified high power mode. A “high” on this pin operates the PA in the
specified low power mode.
Regulated voltage input required for operation of PA bias circuitry. This pin also functions as the PA enable/dis-
able control.
An external load resistor (RDET) is required on this pin. A lowpass filter of averaging functionality is also required
to reduce voltage ripple (due to modulation) to an acceptable amount. An isolator is required on the PA output
for proper operation of PDET when the PA operates into a non-50Ω load impedance.
This pin must remain floating.
This pin must remain floating.
This pin must remain floating.
AC-coupled RF output internally matched to 50Ω.
Power supply input for the collector voltage on Q2 RF output amplification stage. A low frequency decoupling
capacitor (4.7μF) is required on this line. The voltage on this pin may be controlled by a DC converter.
Same as pin 10.
Same as pin 10.
Power supply input for the collector voltage on LPM Q2 RF output amplification stage. A low frequency decou-
pling capacitor (4.7μF) is required on this line. The voltage on this pin may be controlled by a DC-DC converter.
Interstage matching.
Power supply input for the collector voltage on Q1 RF output amplification stage. A low frequency decoupling
capacitor (4.7μF) is required on this line. The voltage on this pin may be controlled by a DC-DC converter. Pin 15
is connected internally to pin 14, and should be connected together on the PCB.
Power supply input for the DC bias circuitry. The voltage on this pin must be 3.1V or greater for specified opera-
tion. Low frequency decoupling capacitors (4.7μF and 1nF) are recommended on this line.
Ground connection. The package backside should be soldered to a topside ground pad connecting to the PCB
ground plane with multiple vias. The pad should have a low thermal resistance and low electrical impedance to
the ground plane.
Package Drawing
3.00
Pin 1 ID
A
1.45
Pin 1 ID
3.00
1.45
0.28
TYP
0.18
0.05
0.15 C
2 PLCS
B
0.15 C
2 PLCS
0.40
TYP
0.20
0.10 M C A B
0.50 TYP
Dimensions in mm.
Shaded areas represent pin 1.
0.203 REF
0.08 C
0.08 C
0.925
0.775
0.102 REF
C
6 of 10
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A0 DS070529
RFMD [ RF MICRO DEVICES ]
