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RF3266 参数 Datasheet PDF下载

RF3266图片预览
型号: RF3266
PDF下载: 下载PDF文件 查看货源
内容描述: 3V W- CDMA线性功率放大器模块 [3V W-CDMA LINEAR PA MODULE]
分类和应用: 放大器功率放大器
文件页数/大小: 10 页 / 191 K
品牌: RFMD [ RF MICRO DEVICES ]
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RF3266
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch
to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 0.78 x 0.64 (mm)
D = 0.64 x 1.28 (mm)
E = 1.50 (mm) Sq.
Dimensions in mm.
1.50 Typ.
0.75 Typ.
Pin 16
B
Pin 1
C
B
0.50 Typ.
A
A
A
A
E
D
0.75 1.00 Typ.
Typ.
A
B
B
B
B
Pin 8
0.55 Typ.
0.55 Typ.
0.75 Typ.
Figure 1. PCB Metal Land Pattern (Top View)
8 of 10
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A0 DS070529