TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 11
Figure 4. Program Operation ......................................................... 27
Write Operation Status . . . . . . . . . . . . . . . . . . . . 30
Table 4. Bottom Boot Sector Addresses (Am29LV320DB) .............15
RY/BY#: Ready/Busy# ............................................................ 31
DQ6: Toggle Bit I .................................................................... 31
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Autoselect Mode ..................................................................... 16
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Automatic Sleep Currents) ............................................................. 36
Figure 11. Typical I
CC1
vs. Frequency ............................................ 36
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Word/Byte Configuration (BYTE#) ............................................. 40
Erase and Program Operations ................................................. 41
Figure 21. Toggle Bit Timings (During Embedded Algorithms)......
45
Common Flash Memory Interface (CFI) . . . . . . . 21
Temporary Sector Unprotect ..................................................... 46
Alternate CE# Controlled Erase and Program Operations ........ 48
(Erase/Program) Operation Timings .............................................. 49
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25
Command Sequence .............................................................. 26
Byte/Word Program Command Sequence ............................. 26
Erase And Programming Performance . . . . . . . 50
Latchup Characteristics . . . . . . . . . . . . . . . . . . . 50
TSOP and BGA Package Capacitance . . . . . . . . 50
Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 51
FBD048—48-ball Fine-Pitch Ball Grid Array (FBGA)
6 x 12 mm package ................................................................... 51
TS 048—48-Pin Standard TSOP ............................................... 52
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53
5
November 15, 2004
Am29LV320D