AM29LV640MH112RPCI 参数 Datasheet PDF下载

型号：	AM29LV640MH112RPCI
PDF下载：	下载PDF文件查看货源
内容描述：	64兆位（4M ×16位/ 8的M× 8位）的MirrorBit 3.0伏特，只有统一部门快闪记忆体与VersatileI / O控制 [64 Megabit (4 M x 16-Bit/8 M x 8-Bit) MirrorBit 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control]
分类和应用：	闪存内存集成电路
文件页数/大小：	62 页 / 1108 K
品牌：	SPANSION [ SPANSION ]

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D A T A S H E E T

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Device Bus Operations .....................................................10

Erase Suspend/Erase Resume Commands ........................... 32

Command Definitions ............................................................. 33

Command Definitions (x16 Mode, BYTE# = V

) ............................ 33

Command Definitions (x8 Mode, BYTE# = V

)............................... 34

Write Operation Status . . . . . . . . . . . . . . . . . . . . 35

DQ7: Data# Polling ................................................................. 35

Figure 8. Data# Polling Algorithm .................................................. 36

Word/Byte Configuration ........................................................ 11

VersatileIO™ (V

) Control ..................................................... 11

Requirements for Reading Array Data ................................... 11

Page Mode Read .................................................................... 11

Writing Commands/Command Sequences ............................ 11

Write Buffer ............................................................................. 11

Accelerated Program Operation ............................................. 11

Autoselect Functions .............................................................. 12

Standby Mode ........................................................................ 12

Automatic Sleep Mode ........................................................... 12

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 12

Autoselect Mode ..................................................................... 16

Table 2. Autoselect Codes, (High Voltage Method) .......................16

RY/BY#: Ready/Busy# ............................................................ 37

DQ6: Toggle Bit I .................................................................... 37

Figure 9. Toggle Bit Algorithm........................................................ 38

DQ2: Toggle Bit II ................................................................... 38

Reading Toggle Bits DQ6/DQ2 ............................................... 39

DQ5: Exceeded Timing Limits ................................................ 39

DQ3: Sector Erase Timer ....................................................... 39

DQ1: Write-to-Buffer Abort ..................................................... 39

Table 10. Write Operation Status ................................................... 40

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 41

Figure 10. Maximum Negative Overshoot Waveform .................... 41

Figure 11. Maximum Positive

Overshoot Waveform ..................................................................... 41

Sector Group Protection and Unprotection ............................. 16

Table 3. Sector Group Protection/Unprotection Address Table ......16

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 41

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 42

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Figure 12. Test Setup..................................................................... 43

Table 1. Test Specifications ........................................................... 43

Write Protect (WP#) ................................................................ 18

Temporary Sector Group Unprotect ....................................... 18

Figure 1. Temporary Sector Group Unprotect Operation................ 18

Figure 2. In-System Sector Group

Protect/Unprotect Algorithms .......................................................... 19

Key to Switching Waveforms. . . . . . . . . . . . . . . . 43

Figure 13. Input Waveforms and

Measurement Levels...................................................................... 43

SecSi (Secured Silicon) Sector Flash Memory Region .......... 20

Figure 3. SecSi Sector Protect Verify.............................................. 21

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 44

Read-Only Operations ........................................................... 44

Figure 14. Read Operation Timings ............................................... 44

Figure 15. Page Read Timings ...................................................... 45

Hardware Data Protection ...................................................... 21

Low VCC Write Inhibit ............................................................ 21

Write Pulse “Glitch” Protection ............................................... 21

Logical Inhibit .......................................................................... 21

Power-Up Write Inhibit ............................................................ 21

Common Flash Memory Interface (CFI) . . . . . . . 21

CFI Query Identification String........................................................ 22

System Interface String................................................................... 22

Table 6. Device Geometry Definition .............................................. 23

Table 7. Primary Vendor-Specific Extended Query ........................ 24

Hardware Reset (RESET#) .................................................... 46

Figure 16. Reset Timings ............................................................... 46

Erase and Program Operations .............................................. 47

Figure 17. Program Operation Timings..........................................

Figure 18. Accelerated Program Timing Diagram..........................

Figure 19. Chip/Sector Erase Operation Timings ..........................

Figure 20. Data# Polling Timings

(During Embedded Algorithms)......................................................

Figure 21. Toggle Bit Timings (During Embedded Algorithms)......

Figure 22. DQ2 vs. DQ6.................................................................

Command Definitions . . . . . . . . . . . . . . . . . . . . . 24

Reading Array Data ................................................................ 24

Reset Command ..................................................................... 25

Autoselect Command Sequence ............................................ 25

Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 25

Word/Byte Program Command Sequence ............................. 25

Unlock Bypass Command Sequence ..................................... 26

Write Buffer Programming ...................................................... 26

Accelerated Program .............................................................. 27

Figure 4. Write Buffer Programming Operation............................... 28

Figure 5. Program Operation .......................................................... 29

Temporary Sector Unprotect .................................................. 52

Figure 23. Temporary Sector Group Unprotect Timing Diagram ... 52

Figure 24. Sector Group Protect and Unprotect Timing Diagram .. 53

Alternate CE# Controlled Erase and Program Operations ..... 54

Figure 25. Alternate CE# Controlled Write (Erase/Program)

Operation Timings.......................................................................... 55

Program Suspend/Program Resume Command Sequence ... 29

Figure 6. Program Suspend/Program Resume............................... 30

Chip Erase Command Sequence ........................................... 30

Sector Erase Command Sequence ........................................ 30

Figure 7. Erase Operation............................................................... 31

Erase And Programming Performance . . . . . . . 56

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 56

TSOP Pin and BGA Package Capacitance . . . . . 56

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 57

TS056/TSR056—56-Pin Standard and Reverse Pinout

Thin Small Outline Package (TSOP) ...................................... 57

LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm

Package .................................................................................. 58

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 59

Am29LV640MH/L

December 14, 2005

电子百科

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AM29LV640MH112RPCI 参数 Datasheet PDF下载

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