Qualpack TSC87251G2D
1. General Information........................................................................................................................... 3
1.1 Product Description............................................................................................................................ 3
2. Technology Information..................................................................................................................... 4
2.1 Wafer Process Technology ................................................................................................................. 4
2.1.1 SCMOS3 0.5um ROM Process ................................................................................................... 4
2.1.2 SCMOS3 NV 0.5um EPROM Process ......................................................................................... 6
2.2 Product Design .................................................................................................................................. 6
2.3 Package Technology .......................................................................................................................... 6
2.3.1 Package description ................................................................................................................... 6
2.3.2 Other available packages ............................................................................................................ 7
2.4 Test .................................................................................................................................................. 7
2.5 Device Cross Section ......................................................................................................................... 8
2.6 Wafer Process Control........................................................................................................................ 9
3. Qualification .................................................................................................................................... 10
3.1 Change Procedure ........................................................................................................................... 11
3.2 Qualification Flow............................................................................................................................. 12
3.3 Wafer Process Qualification.............................................................................................................. 13
3.3.1 Process Module Reliability ........................................................................................................ 13
3.3.1.1 Hot carrier qualification.............................................................................................................................................. 13
3.3.1.2 Electromigration.......................................................................................................................................................... 15
3.3.1.3 Time Dependent Dielectric Breakdown .................................................................................................................. 16
3.3.2 Z92 Wafer Process Qualification Results ................................................................................... 18
3.3.3 Z94 Wafer Process Qualification Results ................................................................................... 19
3.4 Package Qualification....................................................................................................................... 20
3.5 Device Qualification.......................................................................................................................... 20
3.5.1 Failure Mechanisms and Corrective Actions ............................................................................... 21
3.5.2 Qualification status ................................................................................................................... 21
3.6 Outgoing Quality and Reliability ........................................................................................................ 22
3.6.1 AOQ (Average Outgoing Quality)............................................................................................... 22
3.6.2 EFR (Early Failure Rate) ........................................................................................................... 22
3.6.3 LFR (Latent Failure Rate).......................................................................................................... 23
4. User Information .............................................................................................................................. 24
4.1 Soldering Recommendations ............................................................................................................ 24
4.2 DRY PACK Ordering rules ................................................................................................................ 24
4.3 ESD caution..................................................................................................................................... 24
5. Environmental Information .............................................................................................................. 25
6. Other Data........................................................................................................................................ 26
6.1 ISO9001 Approval Certificate............................................................................................................ 26
6.2 Databook Reference ........................................................................................................................ 27
6.3 Address Reference........................................................................................................................... 27
7. Revision History............................................................................................................................... 28
2
Rev 0 – October 1999
TEMIC [ TEMIC SEMICONDUCTORS ]
