ATmega329/3290/649/6490
Figure 2.
Pinout ATmega329/649
PF5 (ADC5/TMS)
PF6 (ADC6/TDO)
PF4 (ADC4/TCK)
PF7 (ADC7/TDI)
PA0 (COM0)
PA1 (COM1)
50
61
60
59
58
57
56
55
54
53
52
51
64
63
62
49
PA2 (COM2)
PF0 (ADC0)
PF1 (ADC1)
PF2 (ADC2)
PF3 (ADC3)
AVCC
AREF
GND
GND
VCC
LCDCAP
(RXD/PCINT0) PE0
(TXD/PCINT1) PE1
(XCK/AIN0/PCINT2) PE2
(AIN1/PCINT3) PE3
(USCK/SCL/PCINT4) PE4
(DI/SDA/PCINT5) PE5
(DO/PCINT6) PE6
(CLKO/PCINT7) PE7
(SS/PCINT8) PB0
(SCK/PCINT9) PB1
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(OC0A/PCINT12) PB4
(OC1A/PCINT13) PB5
(OC1B/PCINT14) PB6
1
2
INDEX CORNER
3
4
5
6
7
8
9
10
11
12
13
14
15
16
22
23
24
25
26
27
28
(OC2A/PCINT15) PB7 17
(T1/SEG24) PG3 18
(T0/SEG23) PG4 19
RESET/PG5 20
VCC 21
29
(SEG17) PD5 30
(SEG16) PD6 31
(SEG15) PD7 32
48 PA3 (COM3)
47 PA4 (SEG0)
46 PA5 (SEG1)
45 PA6 (SEG2)
44 PA7 (SEG3)
43 PG2 (SEG4)
42 PC7 (SEG5)
ATmega329/649
41 PC6 (SEG6)
40 PC5 (SEG7)
39 PC4 (SEG8)
38 PC3 (SEG9)
37 PC2 (SEG10)
36 PC1 (SEG11)
35 PC0 (SEG12)
34 PG1 (SEG13)
33 PG0 (SEG14)
(INT0/SEG21) PD1
(SEG19) PD3
(TOSC2) XTAL2
(TOSC1) XTAL1
(ICP1/SEG22) PD0
Note:
The large center pad underneath the QFN/MLF packages is made of metal and internally
connected to GND. It should be soldered or glued to the board to ensure good mechani-
cal stability. If the center pad is left unconnected, the package might loosen from the
board.
Disclaimer
Typical values contained in this datasheet are based on simulations and characteriza-
tion of other AVR microcontrollers manufactured on the same process technology. Min
and Max values will be available after the device is characterized.
(SEG20) PD2
(SEG18) PD4
GND
3
2552HS–AVR–11/06
ATMEL [ ATMEL CORPORATION ]
