Spartan-3 FPGA Family: Introduction and Ordering Information
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Ordering Information
Spartan-3 FPGAs are available in both standard and Pb-free packaging options for all device/package combinations. The
Pb-free packages include a special ‘G’ character in the ordering code.
Standard Packaging
Example: XC3S50 -4 PQ 208 C
Device Type
Speed Grade
Package Type
Temperature Range:
C = Commercial (T
J
= 0
˚
C to 85
˚
C)
I = Industrial (T
J
= -40
˚
C to 100
˚
C)
Number of Pins
DS099-1_02a_071304
Pb-Free Packaging
For additional information on Pb-free packaging, see
: "Implementation and Solder Reflow Guidelines for Pb-Free
Packages".
Example: XC3S50 -4 PQ G 208 C
Device Type
Speed Grade
Package Type
Temperature Range:
C = Commercial (T
J
= 0
˚
C to 85
˚
C)
I = Industrial (T
J
= -40
˚
C to 100
˚
C)
Number of Pins
Pb-free
DS099-1_02b_071304
Device
XC3S50
XC3S200
XC3S400
XC3S1000
XC3S1500
XC3S2000
XC3S4000
XC3S5000
Speed Grade
-4 Standard Performance
-5 High Performance
(1)
VQ(G)100
CP(G)132
TQ(G)144
PQ(G)208
FT(G)256
FG(G)320
FG(G)456
FG(G)676
FG(G)900
Package Type / Number of Pins
100-pin Very Thin Quad Flat Pack (VQFP)
132-pin Chip-Scale Package (CSP)
144-pin Thin Quad Flat Pack (TQFP)
208-pin Plastic Quad Flat Pack (PQFP)
256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
320-ball Fine-Pitch Ball Grid Array (FBGA)
456-ball Fine-Pitch Ball Grid Array (FBGA)
676-ball Fine-Pitch Ball Grid Array (FBGA)
900-ball Fine-Pitch Ball Grid Array (FBGA)
Temperature Range (T
J
)
C Commercial (0°C to 85°C)
I Industrial (–40°C to 100°C)
FG(G)1156
(2)
1156-ball Fine-Pitch Ball Grid Array (FBGA)
Notes:
1. The -5 speed grade is exclusively available in the Commercial temperature range.
2. The FG(G)1156 package is being discontinued and is not recommended for new designs.
See
for the latest updates.
8
DS099-1 (v2.4) June 25, 2008
Product Specification
XILINX [ XILINX, INC ]
