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    • HIN237CB-T图

    • 深圳市硅诺电子科技有限公司

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    • HIN237CB-T
    • 数量64121 
    • 厂家HIN 
    • 封装SOP-24 
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    • 原厂指定分销商，有意请来电或QQ洽谈
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    • 深圳市毅创腾电子科技有限公司

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    • HIN237CB-T
    • 数量18900 
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    • ★只做原装★正品现货★原盒原标★
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    • HIN237CB-T图

    • 集好芯城

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    • HIN237CB-T
    • 数量1068 
    • 厂家Renesas Electronics America Inc 
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    • HIN237CB-T图

    • 深圳市华芯盛世科技有限公司

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    • HIN237CB-T
    • 数量853500 
    • 厂家ISSI 
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    • 一级代理,原装特价现货！
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    • HIN237CB-T图

    • 北京元坤伟业科技有限公司

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    • HIN237CB-T
    • 数量5000 
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    • 百分百原装正品，现货库存
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    • HIN237CB-T图

    • 深圳市顺鑫诚电子科技有限公司

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    • HIN237CB-T
    • 数量5000 
    • 厂家INTELRSIL 
    • 封装SOIC 
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    • HIN237CB-T图

    • 万三科技(深圳)有限公司

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    • HIN237CB-T
    • 数量660000 
    • 厂家RENESAS（瑞萨电子） 
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    • HIN237CB-T图

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    • HIN237CB-T
    • 数量6500000 
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    • HIN237CB-T图

    • 深圳市一线半导体有限公司

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    • HIN237CB-T
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    • HIN237CB-T图

    • 深圳市科雨电子有限公司

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    • HIN237CB-T
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    产品型号HIN237CB-T的概述

    HIN237CB-T芯片概述 HIN237CB-T是一款高性能的数字信号隔离器，广泛应用于工业控制、数据采集和其他需要信号隔离的场合。该芯片的设计旨在提供高效的数据传输，同时保持电气隔离性，以保护下游电路免受高电压和噪声干扰。HIN237CB-T通过其集成的光电隔离技术，实现了极高的信号传输速率，适合于多种通信协议的应用。 在现代电子系统中，信号隔离成为了设计中不可或缺的一部分。对于那些需要在高电压环境下安全工作的系统而言，信号隔离可以有效防止电击和电气干扰。HIN237CB-T凭借其优异的性能，成为信号隔离技术中的一颗重要芯片。 HIN237CB-T的详细参数 HIN237CB-T的主要参数包括： - 工作电压：该芯片支持广泛的供电电压范围，通常在3.3V至5V之间工作，确保在各种应用场合下的兼容性。 - 信号传输速率：其信号传输速率可达到1Mbps，适合快速数据传输应用。 - 引脚...

    产品型号HIN237CB-T的Datasheet PDF文件预览

    HIN232, HIN236, HIN237,HIN238,  
    HIN239, HIN240, HIN241  
    ®
    Data Sheet  
    May 2002  
    FN3138.11  
    +5V Powered RS-232  
    Features  
    Transmitters/Receivers  
    • Meets All RS-232E and V.28 Specifications  
    The HIN232-HIN241 family of RS-232 transmitters/receivers  
    interface circuits meet all ElA RS-232E and V.28 specifications,  
    and are particularly suited for those applications where ±12V is  
    not available. They require a single +5V power supply (except  
    HIN239) and feature onboard charge pump voltage converters  
    which generate +10V and -10V supplies from the 5V supply.  
    The family of devices offer a wide variety of RS-232  
    • Requires Only Single +5V Power Supply  
    - (+5V and +12V - HIN239)  
    • High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps  
    • Onboard Voltage Doubler/Inverter  
    • Low Power Consumption  
    transmitter/receiver combinations to accommodate various  
    applications (see Selection Table).  
    • Low Power Shutdown Function  
    • Three-State TTL/CMOS Receiver Outputs  
    The drivers feature true TTL/CMOS input compatibility, slew-  
    rate-limited output, and 300Ω power-off source impedance.  
    The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ  
    input impedance. The receivers also feature hysteresis to  
    greatly improve noise rejection.  
    • Multiple Drivers  
    - ±10V Output Swing for 5V lnput  
    - 300Ω Power-Off Source Impedance  
    - Output Current Limiting  
    - TTL/CMOS Compatible  
    - 30V/µs Maximum Slew Rate  
    • Multiple Receivers  
    - ±30V Input Voltage Range  
    - 3kΩ to 7kΩ Input Impedance  
    - 0.5V Hysteresis to Improve Noise Rejection  
    Applications  
    • Any System Requiring RS-232 Communication Ports  
    - Computer - Portable, Mainframe, Laptop  
    - Peripheral - Printers and Terminals  
    - Instrumentation  
    - Modems  
    Selection Table  
    NUMBER OF  
    RS-232  
    DRIVERS  
    NUMBER OF  
    RS-232  
    RECEIVERS  
    LOW POWER  
    SHUTDOWN/TTL  
    THREE-STATE  
    PART  
    NUMBER  
    POWER SUPPLY  
    VOLTAGE  
    EXTERNAL  
    COMPONENTS  
    NUMBER OF  
    LEADS  
    HIN232  
    +5V  
    2
    4
    5
    4
    3
    5
    4
    2
    3
    3
    4
    5
    5
    5
    4 Capacitors  
    4 Capacitors  
    4 Capacitors  
    4 Capacitors  
    2 Capacitors  
    4 Capacitors  
    4 Capacitors  
    NO/NO  
    YES/YES  
    NO/NO  
    16  
    24  
    24  
    24  
    24  
    44  
    28  
    HIN236  
    HIN237  
    HIN238  
    HIN239  
    HIN240  
    HIN241  
    +5V  
    +5V  
    +5V  
    NO/NO  
    +5V and +7.5V to 13.2V  
    NO/YES  
    YES/YES  
    YES/YES  
    +5V  
    +5V  
    CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
    1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.  
    Copyright © Intersil Americas Inc. 2002. All Rights Reserved  
    1
    HIN232 thru HIN241  
    Ordering Information (Continued)  
    Ordering Information  
    PART  
    NUMBER  
    TEMP.  
    RANGE ( C)  
    PART  
    NUMBER  
    TEMP.  
    RANGE ( C)  
    o
    o
    PACKAGE  
    Tape and Reel  
    24 Ld PDIP  
    24 Ld SOIC  
    24 Ld SOIC  
    Tape and Reel  
    24 Ld PDIP  
    24 Ld SOIC  
    44 Ld MQFP  
    28 Ld SSOP  
    28 Ld SOIC  
    28 Ld SOIC  
    PKG. NO.  
    PACKAGE  
    16 Ld SOIC  
    PKG. NO.  
    M16.3  
    HIN238CB-T  
    HIN238CP  
    HIN238IB  
    0 to 70  
    HIN232CB  
    0 to 70  
    0 to 70  
    E24.3  
    HIN232CB-T  
    HIN232CP  
    HIN232IB  
    0 to 70  
    Tape and Reel  
    16 Ld PDIP  
    16 Ld SOIC  
    16 Ld PDIP  
    24 Ld SOIC  
    24 Ld PDIP  
    24 Ld SOIC  
    24 Ld SOIC  
    Tape and Reel  
    24 Ld SOIC  
    -40 to 85  
    0 to 70  
    M24.3  
    M24.3  
    0 to 70  
    E16.3  
    M16.3  
    E16.3  
    M24.3  
    E24.3  
    M24.3  
    M24.3  
    HIN239CB  
    HIN239CB-T  
    HIN239CP  
    HIN239IB  
    -40 to 85  
    -40 to 85  
    0 to 70  
    0 to 70  
    HIN232IP  
    0 to 70  
    E24.3  
    HIN236CB  
    HIN236CP  
    HIN236IB  
    -40 to 85  
    0 to 70  
    M24.3  
    0 to 70  
    HIN240CN  
    HIN241CA  
    HIN241CB  
    HIN241IB  
    Q44.10X10  
    M28.209  
    M28.3  
    -40 to 85  
    0 to 70  
    0 to 70  
    HIN237CB  
    HIN237CB-T  
    HIN238CB  
    0 to 70  
    0 to 70  
    -40 to 85  
    M28.3  
    0 to 70  
    M24.3  
    Pin Descriptions  
    PIN  
    FUNCTION  
    V
    Power Supply Input 5V ±10%.  
    CC  
    V+  
    Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.  
    Internally generated negative supply (-10V nominal).  
    Ground lead. Connect to 0V.  
    V-  
    GND  
    C1+  
    C1-  
    External capacitor (+ terminal) is connected to this lead.  
    External capacitor (- terminal) is connected to this lead.  
    External capacitor (+ terminal) is connected to this lead.  
    External capacitor (- terminal) is connected to this lead.  
    C2+  
    C2-  
    T
    Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead.  
    Transmitter Outputs. These are RS-232 levels (nominally ±10V).  
    IN  
    T
    OUT  
    R
    Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.  
    Receiver Outputs. These are TTL/CMOS levels.  
    IN  
    R
    OUT  
    EN  
    SHUTDOWN  
    NC  
    Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the outputs are placed in a high  
    impedance state.  
    Shutdown Input. With SHUTDOWN = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state  
    and the transmitters are shut off.  
    No Connect. No connections are made to these leads.  
    2
    HIN232 thru HIN241  
    Pinouts  
    HIN232 (PDIP, SOIC)  
    HIN236 (PDIP, SOIC)  
    TOP VIEW  
    TOP VIEW  
    24  
    T4  
    1
    2
    T3  
    T1  
    T2  
    1
    2
    3
    4
    5
    6
    7
    8
    16  
    15  
    14  
    13  
    12  
    V
    C1+  
    V+  
    OUT  
    OUT  
    OUT  
    OUT  
    CC  
    23  
    22  
    21  
    20  
    19  
    18  
    17  
    R2  
    IN  
    GND  
    T1  
    3
    R2  
    OUT  
    C1-  
    C2+  
    C2-  
    V-  
    OUT  
    4
    R1  
    SHUTDOWN  
    EN  
    IN  
    R1  
    R1  
    T1  
    IN  
    5
    R1  
    OUT  
    OUT  
    6
    T2  
    IN  
    T4  
    IN  
    IN  
    11  
    10  
    9
    IN  
    IN  
    7
    T3  
    T1  
    IN  
    T2  
    R2  
    T2  
    OUT  
    8
    R3  
    GND  
    OUT  
    IN  
    R2  
    IN  
    OUT  
    9
    16 R3  
    V
    CC  
    10  
    11  
    12  
    15  
    14  
    13  
    V-  
    C1+  
    V+  
    C2-  
    C2+  
    C1-  
    +5V  
    +5V  
    +
    1µF  
    9
    16  
    1µF  
    1µF  
    10  
    +
    12  
    V
    +
    +
    C1+  
    CC  
    11  
    1µF  
    V+  
    V-  
    +5V TO 10V  
    VOLTAGE DOUBLER  
    V
    CC  
    C1-  
    1
    NOTE 1  
    C1+  
    13  
    +
    14  
    +
    +
    +
    +
    2
    +5V TO 10V  
    VOLTAGE DOUBLER  
    C2+  
    NOTE 1  
    NOTE 1  
    V+  
    3
    4
    +10V TO -10V  
    VOLTAGE INVERTER  
    15  
    2
    1µF  
    C1-  
    C2-  
    C2+  
    +5V  
    T1  
    +10V TO -10V  
    VOLTAGE INVERTER  
    6
    V-  
    400kΩ  
    7
    5
    T1  
    T1  
    OUT  
    OUT  
    IN  
    C2-  
    NOTE 1  
    +5V  
    +5V  
    +5V  
    T2  
    +5V  
    T1  
    400kΩ  
    400kΩ  
    400kΩ  
    6
    3
    1
    T2  
    T2  
    IN  
    14  
    400kΩ  
    11  
    T1  
    T1  
    IN  
    OUT  
    T3  
    T4  
    18  
    +5V  
    T2  
    T3  
    T4  
    T3  
    IN  
    OUT  
    OUT  
    400kΩ  
    10  
    12  
    7
    T2  
    T2  
    IN  
    OUT  
    19  
    5
    24  
    4
    T4  
    IN  
    13  
    R1  
    IN  
    R1  
    OUT  
    R1  
    R1  
    IN  
    OUT  
    5kΩ  
    5kΩ  
    R1  
    5kΩ  
    5kΩ  
    R1  
    9
    8
    22  
    23  
    R2  
    R2  
    IN  
    R2  
    OUT  
    R2  
    OUT  
    IN  
    R2  
    R2  
    R3  
    17  
    20  
    16  
    21  
    R3  
    R3  
    15  
    IN  
    OUT  
    5kΩ  
    EN  
    SHUTDOWN  
    NOTE:  
    1. Either 0.1µF or 1µF capacitors may be used. The V+ capacitor  
    8
    may be terminated to V  
    or to GND.  
    CC  
    3
    HIN232 thru HIN241  
    Pinouts (Continued)  
    HIN237 (SOIC)  
    HIN238 (PDIP, SOIC)  
    TOP VIEW  
    TOP VIEW  
    T3  
    T1  
    T2  
    1
    2
    3
    4
    5
    6
    7
    8
    9
    24 T4  
    OUT  
    OUT  
    OUT  
    OUT  
    T2  
    T1  
    T3  
    24  
    23  
    22  
    21  
    20  
    19  
    18  
    17  
    16  
    15  
    14  
    13  
    1
    2
    OUT  
    OUT  
    R2  
    R2  
    T5  
    23  
    22  
    21  
    20  
    19  
    18  
    17  
    16  
    15  
    14  
    IN  
    R3  
    R3  
    T4  
    OUT  
    IN  
    OUT  
    R2  
    3
    IN  
    OUT  
    R1  
    IN  
    IN  
    R2  
    4
    OUT  
    IN  
    R1  
    T5  
    T4  
    T3  
    OUT  
    OUT  
    IN  
    T1  
    IN  
    T4  
    T3  
    T2  
    5
    OUT  
    T2  
    IN  
    R1  
    6
    OUT  
    IN  
    T1  
    IN  
    IN  
    R1  
    IN  
    7
    IN  
    R3  
    R3  
    V-  
    GND  
    OUT  
    IN  
    R4  
    R4  
    V-  
    GND  
    8
    OUT  
    IN  
    V
    CC  
    V
    9
    CC  
    C1+ 10  
    V+  
    C1+  
    V+  
    10  
    11  
    12  
    11  
    C1- 12  
    C2-  
    C2-  
    13 C2+  
    C1-  
    C2+  
    +5V  
    9
    +5V  
    9
    1µF  
    10  
    +
    12  
    1µF  
    1µF  
    V
    10  
    +
    12  
    +
    CC  
    C1+  
    V
    +
    +
    CC  
    C1+  
    11  
    11  
    V+  
    1µF  
    1µF  
    +5V TO 10V  
    VOLTAGE DOUBLER  
    V+  
    V-  
    1µF  
    1µF  
    +5V TO 10V  
    VOLTAGE DOUBLER  
    C1-  
    C1-  
    13  
    +
    14  
    13  
    +
    14  
    C2+  
    C2+  
    +10V TO -10V  
    VOLTAGE INVERTER  
    15  
    V-  
    +10V TO -10V  
    VOLTAGE INVERTER  
    15  
    2
    C2-  
    1µF  
    C2-  
    +
    +5V  
    T1  
    +5V  
    T1  
    T2  
    2
    3
    400kΩ  
    7
    400kΩ  
    5
    T1  
    T1  
    IN  
    OUT  
    T1  
    T1  
    T2  
    OUT  
    OUT  
    IN  
    +5V  
    T2  
    +5V  
    400kΩ  
    6
    T2  
    400kΩ  
    18  
    19  
    1
    T2  
    IN  
    OUT  
    T2  
    IN  
    +5V  
    +5V  
    +5V  
    T3  
    T4  
    T5  
    +5V  
    T3  
    T4  
    400kΩ  
    400kΩ  
    400kΩ  
    18  
    19  
    1
    400kΩ  
    400kΩ  
    24  
    T3  
    T4  
    T5  
    T3  
    IN  
    OUT  
    OUT  
    OUT  
    T3  
    T4  
    T3  
    T4  
    OUT  
    OUT  
    IN  
    +5V  
    24  
    21  
    6
    20  
    7
    T4  
    IN  
    IN  
    21  
    5
    20  
    4
    R1  
    R1  
    IN  
    OUT  
    T5  
    IN  
    5kΩ  
    R1  
    R1  
    R1  
    IN  
    OUT  
    4
    22  
    17  
    3
    5kΩ  
    5kΩ  
    R1  
    R2  
    R3  
    R4  
    R2  
    R3  
    R4  
    IN  
    IN  
    IN  
    OUT  
    OUT  
    OUT  
    5kΩ  
    5kΩ  
    5kΩ  
    R2  
    R3  
    R4  
    22  
    17  
    23  
    16  
    R2  
    R2  
    R3  
    IN  
    OUT  
    23  
    16  
    R2  
    R3  
    R3  
    IN  
    OUT  
    5kΩ  
    8
    8
    4
    HIN232 thru HIN241  
    Pinouts (Continued)  
    HIN239 (PDIP, SOIC)  
    HIN240 (MQFP)  
    TOP VIEW  
    R1  
    OUT  
    T1  
    T2  
    24  
    23  
    22  
    21  
    1
    2
    IN  
    R1  
    IN  
    IN  
    44 43 42 41 40 39 38 37 36 35 34  
    R2  
    R2  
    3
    GND  
    OUT  
    IN  
    NC  
    1
    NC  
    NC  
    NC  
    V-  
    33  
    32  
    31  
    30  
    29  
    V
    4
    T5  
    IN  
    CC  
    2
    3
    4
    5
    6
    7
    8
    9
    20 T2  
    5
    V+  
    C1+  
    C1-  
    V-  
    R3  
    OUT  
    OUT  
    OUT  
    R3  
    IN  
    T1  
    6
    19  
    18  
    T4  
    R3  
    7
    C2-  
    C2+  
    C1-  
    V+  
    OUT  
    IN  
    T3  
    OUT  
    28  
    27  
    26  
    25  
    24  
    23  
    8
    17 R3  
    OUT  
    T1  
    OUT  
    T3  
    R5  
    IN  
    9
    16  
    15  
    14  
    IN  
    T2  
    OUT  
    R5  
    10  
    11  
    12  
    NC  
    EN  
    OUT  
    OUT  
    NC  
    C1+  
    NC  
    NC  
    R4  
    R2  
    IN  
    10  
    11  
    R4  
    IN  
    13 T3  
    OUT  
    NC  
    12 13 14 15 16 17 18 19 20 21 22  
    +5V  
    +7.5V TO +13.2V (NOTE)  
    19  
    +5V  
    4
    25  
    1µF  
    V
    C1+  
    CC  
    +
    26  
    30  
    +
    27  
    1µF  
    1µF  
    V+  
    V-  
    6
    7
    +5V TO 10V  
    VOLTAGE DOUBLER  
    V
    CC  
    C1+  
    C1-  
    C1-  
    5
    +
    V+  
    1µF  
    28  
    +10V TO -10V  
    VOLTAGE INVERTER  
    C2+  
    8
    +10V TO -10V  
    VOLTAGE INVERTER  
    +
    29  
    (NOTE)  
    V-  
    1µF  
    C2-  
    1µF  
    T1  
    +
    +5V  
    +5V  
    T1  
    T1  
    7
    19  
    20  
    400kΩ  
    400kΩ  
    15  
    24  
    23  
    T1  
    T1  
    IN  
    T1  
    IN  
    OUT  
    OUT  
    OUT  
    OUT  
    +5V  
    +5V  
    +5V  
    +5V  
    T2  
    +5V  
    T2  
    T3  
    14  
    37  
    38  
    400kΩ  
    400kΩ  
    400kΩ  
    400kΩ  
    8
    6
    5
    400kΩ  
    400kΩ  
    T2  
    T2  
    IN  
    OUT  
    T2  
    T3  
    T2  
    IN  
    T3  
    T4  
    T5  
    +5V  
    16  
    1
    13  
    2
    T3  
    T4  
    T5  
    T3  
    IN  
    OUT  
    OUT  
    OUT  
    T3  
    IN  
    R1  
    R1  
    IN  
    OUT  
    T4  
    IN  
    5kΩ  
    R1  
    2
    41  
    17  
    T5  
    IN  
    22  
    17  
    11  
    21  
    18  
    12  
    R2  
    R3  
    R4  
    R5  
    R2  
    16  
    IN  
    IN  
    IN  
    OUT  
    R1  
    R1  
    IN  
    OUT  
    5kΩ  
    5kΩ  
    5kΩ  
    5kΩ  
    R2  
    R3  
    R4  
    R5  
    5kΩ  
    5kΩ  
    5kΩ  
    5kΩ  
    5kΩ  
    R1  
    13  
    3
    10  
    4
    R3  
    OUT  
    R2  
    R3  
    R4  
    R5  
    R2  
    R3  
    R4  
    R5  
    IN  
    IN  
    IN  
    IN  
    OUT  
    OUT  
    OUT  
    R2  
    R3  
    R4  
    R5  
    R4  
    OUT  
    39  
    40  
    10  
    14  
    9
    R5  
    IN  
    OUT  
    36  
    42  
    35  
    43  
    EN  
    OUT  
    3
    EN  
    SHUTDOWN  
    18  
    NOTE: For V+ > 11V, use C ≤ 0.1µF.  
    1
    5
    HIN232 thru HIN241  
    Pinouts (Continued)  
    HIN241 (SOIC, SSOP)  
    TOP VIEW  
    T3  
    T1  
    T2  
    1
    2
    3
    4
    5
    6
    7
    8
    9
    28 T4  
    OUT  
    OUT  
    OUT  
    OUT  
    27 R3  
    26 R3  
    IN  
    OUT  
    25 SHUTDOWN  
    24 EN  
    R2  
    IN  
    R2  
    OUT  
    23 R4  
    IN  
    T2  
    T1  
    IN  
    IN  
    R4  
    22  
    21 T4  
    20  
    OUT  
    R1  
    IN  
    OUT  
    R1  
    IN  
    T3  
    IN  
    GND 10  
    11  
    19 R5  
    18 R5  
    17 V-  
    OUT  
    IN  
    V
    CC  
    C1+ 12  
    V+ 13  
    16 C2-  
    15 C2+  
    C1- 14  
    +5V  
    11  
    1µF  
    1µF  
    12  
    V
    +
    +
    CC  
    C1+  
    13  
    +
    V+  
    1µF  
    1µF  
    +5V TO 10V  
    VOLTAGE DOUBLER  
    14  
    15  
    C1-  
    C2+  
    +
    16  
    +10V TO -10V  
    VOLTAGE INVERTER  
    17  
    V-  
    C2-  
    +5V  
    T1  
    2
    3
    1
    400kΩ  
    7
    6
    T1  
    T1  
    IN  
    OUT  
    OUT  
    +5V  
    +5V  
    +5V  
    T2  
    T3  
    T4  
    400kΩ  
    400kΩ  
    400kΩ  
    T2  
    T3  
    T4  
    T2  
    IN  
    20  
    T3  
    IN  
    OUT  
    OUT  
    21  
    8
    28  
    9
    T4  
    IN  
    R1  
    R1  
    IN  
    OUT  
    5kΩ  
    R1  
    5
    26  
    22  
    4
    R2  
    R3  
    R4  
    R5  
    R2  
    R3  
    R4  
    IN  
    IN  
    IN  
    OUT  
    OUT  
    OUT  
    5kΩ  
    5kΩ  
    5kΩ  
    5kΩ  
    R2  
    R3  
    R4  
    R5  
    27  
    23  
    19  
    24  
    18  
    25  
    R5  
    IN  
    OUT  
    EN  
    SHUTDOWN  
    10  
    6
    HIN232 thru HIN241  
    Absolute Maximum Ratings  
    Thermal Information  
    o
    V
    to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V  
    < 6V  
    Thermal Resistance (Typical, Note 3)  
    θ
    ( C/W)  
    CC  
    V+ to Ground (Note 2) . . . . . . . . . . . . . . . (V  
    CC  
    -0.3V) < V+ < 13.2V  
    JA  
    CC  
    16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .  
    24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .  
    16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .  
    24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
    28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
    28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .  
    44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .  
    90  
    70  
    V- to Ground . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)  
    V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V  
    Input Voltages  
    100  
    75  
    T
    R
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)  
    IN  
    IN  
    70  
    95  
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V  
    IN  
    Output Voltages  
    80  
    o
    T
    R
    . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V  
    . . . . . . . . . . . . . . . . . (GND -0.3V) < V  
    < (V+ +0.3V)  
    < (V+ +0.3V)  
    OUT  
    TXOUT  
    RXOUT  
    Maximum Junction Temperature (Plastic Package) . . . . . . . .150 C  
    Maximum Storage Temperature Range . . . . . . . . . -65 C to 150 C  
    Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300 C  
    o
    o
    OUT  
    o
    Short Circuit Duration  
    T
    R
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous  
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous  
    OUT  
    (SOIC, SSOP, MQFP - Lead Tips Only)  
    OUT  
    Operating Conditions  
    Temperature Range  
    HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C  
    HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C  
    o
    o
    o
    o
    CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
    device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
    NOTE:  
    2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.  
    3. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
    JA  
    Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range  
    CC  
    A
    PARAMETER  
    SUPPLY CURRENTS  
    Power Supply Current, I  
    TEST CONDITIONS  
    MIN  
    TYP  
    MAX  
    UNITS  
    No Load,  
    o
    HIN232  
    -
    -
    -
    -
    5
    10  
    15  
    1
    mA  
    mA  
    mA  
    mA  
    CC  
    T
    = 25 C  
    A
    HIN236-238, HIN240-241  
    HIN239  
    7
    0.4  
    5.0  
    V+ Power Supply Current, I  
    CC  
    No Load,  
    HIN239  
    15  
    o
    o
    No Load, T = 25 C  
    T
    = 25 C  
    A
    A
    o
    Shutdown Supply Current, I (SD)  
    CC  
    T
    = 25 C  
    -
    1
    10  
    µA  
    A
    LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS  
    Input Logic Low, V  
    lL  
    T
    T
    , EN, Shutdown  
    -
    2.0  
    2.4  
    -
    -
    -
    0.8  
    -
    V
    V
    IN  
    Input Logic High, V  
    lH  
    IN  
    EN, Shutdown  
    = 0V  
    -
    -
    V
    Transmitter Input Pullup Current, I  
    T
    15  
    0.1  
    4.6  
    200  
    0.4  
    -
    µA  
    V
    P
    IN  
    TTL/CMOS Receiver Output Voltage Low, V  
    I
    = 1.6mA  
    = -1.0mA  
    -
    OL  
    OUT  
    OUT  
    TTL/CMOS Receiver Output Voltage High, V  
    I
    3.5  
    V
    OH  
    RECEIVER INPUTS  
    RS-232 Input Voltage Range V  
    -30  
    3.0  
    0.8  
    -
    -
    +30  
    7.0  
    -
    V
    kΩ  
    V
    IN  
    Receiver Input Impedance R  
    V
    V
    V
    = ±3V  
    5.0  
    1.2  
    1.7  
    0.5  
    IN  
    IN  
    o
    Receiver Input Low Threshold, V (H-L)  
    = 5V, T = 25 C  
    A
    lN  
    Receiver Input High Threshold, V (L-H)  
    CC  
    CC  
    o
    = 5V, T = 25 C  
    2.4  
    1.0  
    V
    IN  
    A
    Receiver Input Hysteresis V  
    0.2  
    V
    HYST  
    TIMING CHARACTERISTICS  
    Baud Rate (1 Transmitter Switching)  
    R
    = 3kΩ  
    120  
    -
    -
    kbps  
    L
    7
    HIN232 thru HIN241  
    Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range (Continued)  
    CC  
    A
    PARAMETER  
    Output Enable Time, t  
    TEST CONDITIONS  
    MIN  
    TYP  
    400  
    250  
    0.5  
    -
    MAX  
    UNITS  
    ns  
    HIN236, 239, 240, 241  
    HIN236, 239, 240, 241  
    RS-232 to TTL  
    -
    -
    -
    -
    -
    -
    -
    EN  
    Output Disable Time, t  
    ns  
    DIS  
    Propagation Delay, t  
    -
    µs  
    PD  
    o
    Instantaneous Slew Rate SR  
    C
    = 10pF, R = 3kΩ, T = 25 C (Note 4)  
    30  
    -
    V/µs  
    V/µs  
    L
    L
    A
    Transition Region Slew Rate, SR  
    R = 3kΩ, C = 2500pF Measured from +3V to -3V or  
    3
    T
    L
    L
    -3V to +3V, 1 Transmitter Switching  
    TRANSMITTER OUTPUTS  
    Output Voltage Swing, T  
    Transmitter Outputs, 3kΩ to Ground  
    ±5  
    300  
    -
    ±9  
    -
    ±10  
    V
    Ω
    OUT  
    Output Resistance, R  
    V
    = V+ = V- = 0V, V  
    OUT  
    = ±2V  
    -
    -
    OUT  
    CC  
    RS-232 Output Short Circuit Current, I  
    T
    shorted to GND  
    ±10  
    mA  
    SC  
    OUT  
    NOTE:  
    4. Guaranteed by design.  
    VOLTAGE DOUBLER  
    VOLTAGE INVERTER  
    +
    +
    S2  
    S5  
    S1  
    S3  
    C2  
    C1  
    V+ = 2V  
    CC  
    S6  
    V
    GND  
    CC  
    +
    +
    -
    +
    -
    +
    C4  
    -
    C3  
    C2  
    C1  
    -
    V
    GND  
    CC  
    V- = -(V+)  
    GND  
    -
    C1-  
    S4  
    C2  
    S7  
    S8  
    RC  
    OSCILLATOR  
    FIGURE 1. CHARGE PUMP  
    application uses 1µF capacitors for C1-C4, however, the value  
    is not critical. Increasing the values of C1 and C2 will lower the  
    output impedance of the voltage doubler and inverter,  
    increasing the values of the reservoir capacitors, C3 and C4,  
    lowers the ripple on the V+ and V- supplies.  
    Detailed Description  
    The HIN232 thru HIN241 family of RS-232  
    transmitters/receivers are powered by a single +5V power  
    supply (except HIN239), feature low power consumption, and  
    meet all ElA RS-232C and V.28 specifications. The circuit is  
    divided into three sections: The charge pump, transmitter, and  
    receiver.  
    During shutdown mode (HIN236, 240 and 241),  
    SHUTDOWN control line set to logic “1”, the charge pump is  
    turned off, V+ is pulled down to V , V- is pulled up to GND,  
    CC  
    Charge Pump  
    and the supply current is reduced to less than 10µA. The  
    transmitter outputs are disabled and the receiver outputs are  
    placed in the high impedance state.  
    An equivalent circuit of the charge pump is illustrated in Figure  
    1. The charge pump contains two sections: the voltage  
    doubler and the voltage inverter. Each section is driven by a  
    two phase, internally generated clock to generate +10V and  
    -10V. The nominal clock frequency is 16kHz. During phase  
    Transmitters  
    The transmitters are TTL/CMOS compatible inverters which  
    translate the inputs to RS-232 outputs. The input logic threshold  
    one of the clock, capacitor C1 is charged to V . During  
    CC  
    phase two, the voltage on C1 is added to V , producing a  
    CC  
    is about 26% of V , or 1.3V for V  
    = 5V. A logic 1 at the  
    CC CC  
    signal across C3 equal to twice V . During phase one, C2 is  
    also charged to 2V , and then during phase two, it is  
    CC  
    inverted with respect to ground to produce a signal across C4  
    input results in a voltage of between -5V and V- at the output,  
    and a logic 0 results in a voltage between +5V and (V+ -0.6V).  
    Each transmitter input has an internal 400kΩ pullup resistor so  
    any unused input can be left unconnected and its output  
    remains in its low state. The output voltage swing meets the  
    RS-232C specifications of ±5V minimum with the worst case  
    conditions of: all transmitters driving 3kΩ minimum load  
    CC  
    equal to -2V . The charge pump accepts input voltages up  
    CC  
    to 5.5V. The output impedance of the voltage doubler section  
    (V+) is approximately 200Ω, and the output impedance of the  
    voltage inverter section (V-) is approximately 450Ω. A typical  
    8
    HIN232 thru HIN241  
    impedance, V  
    = 4.5V, and maximum allowable operating  
    (V  
    = 0V). The receivers have a typical input threshold of  
    CC  
    CC  
    temperature. The transmitters have an internally limited output  
    slew rate which is less than 30V/µs. The outputs are short  
    circuit protected and can be shorted to ground indefinitely. The  
    powered down output impedance is a minimum of 300Ω with  
    1.3V which is within the ±3V limits, known as the transition  
    region, of the RS-232 specifications. The receiver output is  
    0V to V . The output will be low whenever the input is  
    CC  
    greater than 2.4V and high whenever the input is floating or  
    driven between +0.8V and -30V. The receivers feature 0.5V  
    hysteresis to improve noise rejection. The receiver Enable  
    line EN, when set to logic “1”, (HIN236, 239, 240, and 241)  
    disables the receiver outputs, placing them in the high  
    impedance mode. The receiver outputs are also placed in  
    the high impedance state when in shutdown mode.  
    ±2V applied to the outputs and V  
    = 0V.  
    CC  
    V+  
    V
    CC  
    400kΩ  
    300Ω  
    T
    XIN  
    T
    OUT  
    GND < T  
    < V  
    CC  
    XIN  
    V- < V  
    TOUT  
    < V+  
    V
    CC  
    V-  
    R
    XIN  
    R
    OUT  
    FIGURE 2. TRANSMITTER  
    -30V < R  
    < +30V  
    XIN  
    GND < V  
    < V  
    CC  
    5kΩ  
    ROUT  
    Receivers  
    GND  
    The receiver inputs accept up to ±30V while presenting the  
    required 3kΩ to 7kΩ input impedance even if the power is off  
    FIGURE 3. RECEIVER  
    T
    IN  
    OR  
    R
    IN  
    T
    OUT  
    OR  
    V
    V
    OL  
    OL  
    R
    OUT  
    t
    t
    PLH  
    PHL  
    t
    t
    PHL + PLH  
    2
    Average Propagation Delay =  
    FIGURE 4. PROPAGATION DELAY DEFINITION  
    Typical Performance Curves  
    o
    T
    = 25 C  
    A
    12  
    10  
    8
    12  
    TRANSMITTER OUTPUTS  
    OPEN CIRCUIT  
    1µF  
    10  
    8
    0.47µF  
    V+ (V  
    = 5V)  
    CC  
    0.10µF  
    6
    6
    V+ (V  
    = 4.5V)  
    CC  
    V- (V  
    CC  
    = 4.5V)  
    4
    4
    V- (V  
    CC  
    = 5V)  
    2
    2
    0
    0
    3.0  
    4.0  
    4.5  
    5.0  
    5.5  
    6.0  
    3.5  
    0
    5
    10  
    15  
    |I  
    20  
    | (mA)  
    25  
    30  
    35  
    V
    CC  
    LOAD  
    FIGURE 5. V- SUPPLY VOLTAGE vs V , VARYING  
    CC  
    FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)  
    CAPACITORS  
    9
    HIN232 thru HIN241  
    Test Circuits (HIN232)  
    +4.5V TO  
    +5.5V INPUT  
    C1+  
    V+  
    1
    2
    3
    4
    5
    6
    7
    8
    16  
    15  
    14  
    13  
    12  
    11  
    10  
    9
    V
    CC  
    -
    +
    1µF  
    C3  
    GND  
    V
    C1+  
    V+  
    1
    2
    3
    4
    5
    6
    7
    8
    16  
    CC  
    C1-  
    C2+  
    C2-  
    T1  
    OUT  
    +
    3kΩ  
    1µF  
    C1  
    GND 15  
    R1  
    IN  
    -
    T1  
    C1-  
    C2+  
    C2-  
    V-  
    14  
    13  
    12  
    11  
    10  
    9
    T1 OUTPUT  
    OUT  
    R1  
    OUT  
    R1  
    IN  
    RS-232 ±30V INPUT  
    TTL/CMOS OUTPUT  
    TTL/CMOS INPUT  
    +
    1µF  
    C2  
    T1  
    IN  
    V-  
    -
    R1  
    OUT  
    T2  
    -
    +
    T2  
    IN  
    OUT  
    T1  
    IN  
    R2  
    R2  
    IN  
    OUT  
    1µF C4  
    T2  
    TTL/CMOS INPUT  
    3kΩ  
    T2  
    IN  
    OUT  
    R2  
    TTL/CMOS OUTPUT  
    R2  
    IN  
    R
    = V /1T2  
    IN  
    OUT  
    OUT  
    OUT  
    T2  
    OUTPUT  
    T1  
    A
    OUT  
    V
    = ±2V  
    IN  
    RS-232  
    ±30V INPUT  
    FIGURE 7. GENERAL TEST CIRCUIT  
    FIGURE 8. POWER-OFF SOURCE RESISTANCE  
    CONFIGURATION  
    Applications  
    +5V  
    -
    The HIN2XX may be used for all RS-232 data terminal and  
    communication links. It is particularly useful in applications  
    where ±12V power supplies are not available for  
    conventional RS-232 interface circuits. The applications  
    presented represent typical interface configurations.  
    +
    16  
    DTR (20) DATA  
    TERMINAL READY  
    1
    +
    C1  
    1µF  
    2
    3
    4
    DSRS (24) DATA  
    SIGNALING RATE  
    SELECT  
    -
    HIN232  
    6
    +
    -
    +
    C2  
    1µF  
    RS-232  
    INPUTS AND OUTPUTS  
    5
    -
    A simple duplex RS-232 port with CTS/RTS handshaking is  
    illustrated in Figure 9. Fixed output signals such as DTR  
    (data terminal ready) and DSRS (data signaling rate select)  
    is generated by driving them through a 5kΩ resistor  
    connected to V+.  
    T1  
    11  
    14  
    TD  
    TD (2) TRANSMIT DATA  
    T2  
    10  
    12  
    7
    RTS (4) REQUEST TO SEND  
    RD (3) RECEIVE DATA  
    TTL/CMOS RTS  
    INPUTS AND  
    13  
    RD  
    OUTPUTS  
    R2  
    R1  
    9
    8
    CTS  
    CTS (5) CLEAR TO SEND  
    In applications requiring four RS-232 inputs and outputs  
    (Figure 10), note that each circuit requires two charge pump  
    capacitors (C1 and C2) but can share common reservoir  
    capacitors (C3 and C4). The benefit of sharing common  
    reservoir capacitors is the elimination of two capacitors and  
    the reduction of the charge pump source impedance which  
    effectively increases the output swing of the transmitters.  
    15  
    SIGNAL GROUND (7)  
    FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS  
    HANDSHAKING  
    10  
    HIN232 thru HIN241  
    1
    4
    +
    +
    C1  
    C2  
    HIN232  
    5
    1µF  
    3
    1µF  
    -
    -
    T1  
    11  
    14  
    TD  
    RTS  
    RD  
    TD (2) TRANSMIT DATA  
    T2  
    10  
    12  
    7
    TTL/CMOS  
    INPUTS AND  
    OUTPUTS  
    RTS (4) REQUEST TO SEND  
    13  
    RD (3) RECEIVE DATA  
    R2  
    R1  
    9
    8
    CTS  
    CTS (5) CLEAR TO SEND  
    15  
    16  
    6
    6
    2
    2
    C4  
    C3  
    +5V  
    -
    -
    V- V+  
    RS-232  
    INPUTS AND OUTPUTS  
    2µF  
    2µF  
    16  
    4
    HIN232  
    T1  
    1
    +
    +
    C1  
    1µF  
    C2  
    1µF  
    5
    3
    -
    -
    11  
    14  
    DTR  
    DSRS  
    DCD  
    R1  
    DTR (20) DATA TERMINAL READY  
    T2  
    10  
    12  
    7
    DSRS (24) DATA SIGNALING RATE SELECT  
    TTL/CMOS  
    INPUTS AND  
    OUTPUTS  
    13  
    DCD (8) DATA CARRIER DETECT  
    R1 (22) RING INDICATOR  
    R2  
    R1  
    9
    8
    15  
    SIGNAL GROUND (7)  
    FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS  
    11  
    HIN232 thru HIN241  
    Die Characteristics  
    DIE DIMENSIONS  
    PASSIVATION  
    160 mils x 140 mils  
    Type: Nitride over Silox  
    Nitride Thickness: 8kÅ  
    Silox Thickness: 7kÅ  
    METALLIZATION  
    Type: Al  
    Thickness: 10kÅ ±1kÅ  
    TRANSISTOR COUNT  
    238  
    SUBSTRATE POTENTIAL  
    PROCESS  
    V+  
    CMOS Metal Gate  
    Metallization Mask Layout  
    HIN240  
    T2  
    T1  
    OUT  
    T3  
    T4  
    R3  
    IN  
    R3  
    OUT  
    T5  
    IN  
    OUT  
    OUT OUT  
    R2  
    IN  
    SHUTDOWN  
    R2  
    OUT  
    EN  
    T2  
    T1  
    IN  
    T5  
    OUT  
    IN  
    R4  
    R1  
    OUT  
    IN  
    R4  
    R1  
    IN  
    OUT  
    T4  
    T3  
    IN  
    GND  
    IN  
    R5  
    OUT  
    V
    CC  
    R5  
    IN  
    C1+  
    V+  
    C1-  
    C2+  
    C2-  
    V-  
    12  
    HIN232 thru HIN241  
    Dual-In-Line Plastic Packages (PDIP)  
    E16.3 (JEDEC MS-001-BB ISSUE D)  
    N
    16 LEAD DUAL-IN-LINE PLASTIC PACKAGE  
    E1  
    INCHES  
    MILLIMETERS  
    INDEX  
    AREA  
    1
    2
    3
    N/2  
    SYMBOL  
    MIN  
    MAX  
    0.210  
    -
    MIN  
    -
    MAX  
    5.33  
    -
    NOTES  
    -B-  
    A
    A1  
    A2  
    B
    -
    4
    -A-  
    0.015  
    0.115  
    0.014  
    0.045  
    0.008  
    0.735  
    0.005  
    0.300  
    0.240  
    0.39  
    2.93  
    0.356  
    1.15  
    0.204  
    18.66  
    0.13  
    7.62  
    6.10  
    4
    D
    E
    BASE  
    PLANE  
    0.195  
    0.022  
    0.070  
    0.014  
    0.775  
    -
    4.95  
    0.558  
    1.77  
    0.355  
    19.68  
    -
    -
    A2  
    A
    -C-  
    -
    SEATING  
    PLANE  
    B1  
    C
    8, 10  
    L
    C
    L
    -
    D1  
    B1  
    eA  
    A1  
    A
    D1  
    e
    D
    5
    eC  
    B S  
    C
    B
    D1  
    E
    5
    eB  
    0.010 (0.25) M  
    C
    0.325  
    0.280  
    8.25  
    7.11  
    6
    NOTES:  
    E1  
    e
    5
    1. Controlling Dimensions: INCH. In case of conflict between English and  
    Metric dimensions, the inch dimensions control.  
    0.100 BSC  
    0.300 BSC  
    2.54 BSC  
    7.62 BSC  
    -
    e
    A
    6
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
    Publication No. 95.  
    e
    -
    0.430  
    0.150  
    -
    10.92  
    3.81  
    7
    B
    L
    0.115  
    2.93  
    4
    9
    4. Dimensions A, A1 and L are measured with the package seated in JE-  
    N
    16  
    16  
    DEC seating plane gauge GS-3.  
    Rev. 0 12/93  
    5. D, D1, and E1 dimensions do not include mold flash or protrusions.  
    Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).  
    e
    6. E and  
    are measured with the leads constrained to be perpendic-  
    A
    -C-  
    ular to datum  
    .
    7. e and e are measured at the lead tips with the leads unconstrained.  
    B
    C
    e
    must be zero or greater.  
    C
    8. B1 maximum dimensions do not include dambar protrusions. Dambar  
    protrusions shall not exceed 0.010 inch (0.25mm).  
    9. N is the maximum number of terminal positions.  
    10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,  
    E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).  
    13  
    HIN232 thru HIN241  
    Dual-In-Line Plastic Packages (PDIP)  
    E24.3 (JEDEC MS-001-AF ISSUE D)  
    24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC  
    PACKAGE  
    N
    E1  
    INDEX  
    AREA  
    1
    2
    3
    N/2  
    INCHES  
    MILLIMETERS  
    -B-  
    SYMBOL  
    MIN  
    MAX  
    0.210  
    -
    MIN  
    -
    MAX  
    5.33  
    -
    NOTES  
    -A-  
    A
    A1  
    A2  
    B
    -
    4
    D
    E
    0.015  
    0.115  
    0.014  
    0.045  
    0.008  
    1.230  
    0.005  
    0.300  
    0.240  
    0.39  
    2.93  
    0.356  
    1.15  
    0.204  
    31.24  
    0.13  
    7.62  
    6.10  
    4
    BASE  
    PLANE  
    A2  
    A
    0.195  
    0.022  
    0.070  
    0.014  
    1.280  
    -
    4.95  
    0.558  
    1.77  
    0.355  
    32.51  
    -
    -
    -C-  
    SEATING  
    PLANE  
    -
    L
    C
    L
    B1  
    C
    8
    D1  
    B1  
    eA  
    A1  
    A
    D1  
    -
    e
    eC  
    B S  
    C
    B
    D
    5
    eB  
    0.010 (0.25) M  
    C
    D1  
    E
    5
    0.325  
    0.280  
    8.25  
    7.11  
    6
    NOTES:  
    1. Controlling Dimensions: INCH. In case of conflict between English and  
    Metric dimensions, the inch dimensions control.  
    E1  
    e
    5
    0.100 BSC  
    0.300 BSC  
    2.54 BSC  
    7.62 BSC  
    -
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    e
    e
    6
    A
    3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
    Publication No. 95.  
    -
    0.430  
    0.150  
    -
    10.92  
    3.81  
    7
    B
    4. Dimensions A, A1 and L are measured with the package seated in  
    L
    0.115  
    2.93  
    4
    9
    JEDEC seating plane gauge GS-3.  
    N
    24  
    24  
    5. D, D1, and E1 dimensions do not include mold flash or protrusions.  
    Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).  
    Rev. 0 12/93  
    e
    6. E and  
    are measured with the leads constrained to be perpendic-  
    A
    -C-  
    ular to datum  
    .
    7. e and e are measured at the lead tips with the leads unconstrained.  
    B
    C
    e
    must be zero or greater.  
    C
    8. B1 maximum dimensions do not include dambar protrusions. Dambar  
    protrusions shall not exceed 0.010 inch (0.25mm).  
    9. N is the maximum number of terminal positions.  
    10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,  
    E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).  
    14  
    HIN232 thru HIN241  
    Small Outline Plastic Packages (SOIC)  
    M16.3 (JEDEC MS-013-AA ISSUE C)  
    N
    16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
    INDEX  
    AREA  
    0.25(0.010)  
    M
    B M  
    H
    INCHES  
    MILLIMETERS  
    E
    SYMBOL  
    MIN  
    MAX  
    MIN  
    2.35  
    0.10  
    0.33  
    0.23  
    MAX  
    2.65  
    0.30  
    0.51  
    0.32  
    10.50  
    7.60  
    NOTES  
    -B-  
    A
    A1  
    B
    C
    D
    E
    e
    0.0926  
    0.0040  
    0.013  
    0.1043  
    0.0118  
    0.0200  
    0.0125  
    -
    -
    1
    2
    3
    L
    9
    SEATING PLANE  
    A
    0.0091  
    0.3977  
    0.2914  
    -
    -A-  
    o
    0.4133 10.10  
    3
    h x 45  
    D
    0.2992  
    7.40  
    4
    -C-  
    0.050 BSC  
    1.27 BSC  
    -
    α
    µ
    H
    h
    0.394  
    0.010  
    0.016  
    0.419  
    0.029  
    0.050  
    10.00  
    0.25  
    0.40  
    10.65  
    0.75  
    1.27  
    -
    e
    A1  
    C
    5
    B
    0.10(0.004)  
    L
    6
    0.25(0.010) M  
    C A M B S  
    N
    α
    16  
    16  
    7
    o
    0
    o
    8
    o
    0
    o
    8
    -
    NOTES:  
    Rev. 0 12/93  
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
    Publication Number 95.  
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
    Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
    inch) per side.  
    4. Dimension “E” does not include interlead flash or protrusions. Interlead  
    flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.  
    5. The chamfer on the body is optional. If it is not present, a visual index  
    feature must be located within the crosshatched area.  
    6. “L” is the length of terminal for soldering to a substrate.  
    7. “N” is the number of terminal positions.  
    8. Terminal numbers are shown for reference only.  
    9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above  
    the seating plane, shall not exceed a maximum value of 0.61mm (0.024  
    inch)  
    10. Controlling dimension: MILLIMETER. Converted inch dimensions are  
    not necessarily exact.  
    15  
    HIN232 thru HIN241  
    Small Outline Plastic Packages (SOIC)  
    M24.3 (JEDEC MS-013-AD ISSUE C)  
    N
    24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
    INDEX  
    AREA  
    0.25(0.010)  
    M
    B M  
    H
    INCHES  
    MILLIMETERS  
    E
    SYMBOL  
    MIN  
    MAX  
    MIN  
    2.35  
    0.10  
    0.33  
    0.23  
    MAX  
    2.65  
    0.30  
    0.51  
    0.32  
    15.60  
    7.60  
    NOTES  
    -B-  
    A
    A1  
    B
    C
    D
    E
    e
    0.0926  
    0.0040  
    0.013  
    0.1043  
    0.0118  
    0.020  
    -
    -
    1
    2
    3
    L
    9
    SEATING PLANE  
    A
    0.0091  
    0.5985  
    0.2914  
    0.0125  
    -
    -A-  
    o
    0.6141 15.20  
    3
    h x 45  
    D
    0.2992  
    7.40  
    4
    -C-  
    0.05 BSC  
    1.27 BSC  
    -
    α
    µ
    H
    h
    0.394  
    0.010  
    0.016  
    0.419  
    0.029  
    0.050  
    10.00  
    0.25  
    0.40  
    10.65  
    0.75  
    1.27  
    -
    e
    A1  
    C
    5
    B
    0.10(0.004)  
    L
    6
    0.25(0.010) M  
    C A M B S  
    N
    α
    24  
    24  
    7
    o
    0
    o
    8
    o
    0
    o
    8
    -
    NOTES:  
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
    Publication Number 95.  
    Rev. 0 12/93  
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
    Mold flash, protrusion and gate burrs shall not exceed 0.15mm  
    (0.006 inch) per side.  
    4. Dimension “E” does not include interlead flash or protrusions. Inter-  
    lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
    side.  
    5. The chamfer on the body is optional. If it is not present, a visual index  
    feature must be located within the crosshatched area.  
    6. “L” is the length of terminal for soldering to a substrate.  
    7. “N” is the number of terminal positions.  
    8. Terminal numbers are shown for reference only.  
    9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
    above the seating plane, shall not exceed a maximum value of  
    0.61mm (0.024 inch)  
    10. Controlling dimension: MILLIMETER. Converted inch dimensions  
    are not necessarily exact.  
    16  
    HIN232 thru HIN241  
    Small Outline Plastic Packages (SOIC)  
    M28.3 (JEDEC MS-013-AE ISSUE C)  
    N
    28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
    INDEX  
    AREA  
    0.25(0.010)  
    M
    B M  
    H
    INCHES  
    MILLIMETERS  
    E
    SYMBOL  
    MIN  
    MAX  
    MIN  
    2.35  
    0.10  
    0.33  
    0.23  
    17.70  
    7.40  
    MAX  
    2.65  
    0.30  
    0.51  
    0.32  
    18.10  
    7.60  
    NOTES  
    -B-  
    A
    A1  
    B
    C
    D
    E
    e
    0.0926  
    0.0040  
    0.013  
    0.1043  
    0.0118  
    0.0200  
    0.0125  
    0.7125  
    0.2992  
    -
    -
    1
    2
    3
    L
    9
    SEATING PLANE  
    A
    0.0091  
    0.6969  
    0.2914  
    -
    3
    -A-  
    o
    h x 45  
    D
    4
    0.05 BSC  
    1.27 BSC  
    -
    -C-  
    α
    µ
    H
    h
    0.394  
    0.01  
    0.419  
    0.029  
    0.050  
    10.00  
    0.25  
    0.40  
    10.65  
    0.75  
    1.27  
    -
    e
    A1  
    C
    5
    B
    0.10(0.004)  
    L
    0.016  
    6
    0.25(0.010) M  
    C A M B S  
    N
    α
    28  
    28  
    7
    o
    0
    o
    8
    o
    0
    o
    8
    -
    NOTES:  
    Rev. 0 12/93  
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2  
    of Publication Number 95.  
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Dimension “D” does not include mold flash, protrusions or gate  
    burrs. Mold flash, protrusion and gate burrs shall not exceed  
    0.15mm (0.006 inch) per side.  
    4. Dimension “E” does not include interlead flash or protrusions. In-  
    terlead flash and protrusions shall not exceed 0.25mm (0.010  
    inch) per side.  
    5. The chamfer on the body is optional. If it is not present, a visual  
    index feature must be located within the crosshatched area.  
    6. “L” is the length of terminal for soldering to a substrate.  
    7. “N” is the number of terminal positions.  
    8. Terminal numbers are shown for reference only.  
    9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
    above the seating plane, shall not exceed a maximum value of  
    0.61mm (0.024 inch)  
    10. Controlling dimension: MILLIMETER. Converted inch dimen-  
    sions are not necessarily exact.  
    17  
    HIN232 thru HIN241  
    Shrink Small Outline Plastic Packages (SSOP)  
    M28.209 (JEDEC MO-150-AH ISSUE B)  
    N
    28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE  
    INDEX  
    AREA  
    0.25(0.010)  
    M
    B M  
    H
    INCHES  
    MILLIMETERS  
    E
    GAUGE  
    PLANE  
    SYMBOL  
    MIN  
    MAX  
    0.078  
    -
    MIN  
    -
    MAX  
    2.00  
    -
    NOTES  
    -B-  
    A
    A1  
    A2  
    B
    -
    -
    0.002  
    0.065  
    0.009  
    0.004  
    0.390  
    0.197  
    0.05  
    1.65  
    0.22  
    0.09  
    9.90  
    5.00  
    -
    1
    2
    3
    0.072  
    0.014  
    0.009  
    0.413  
    0.220  
    1.85  
    0.38  
    0.25  
    10.50  
    5.60  
    -
    L
    0.25  
    0.010  
    SEATING PLANE  
    A
    9
    -A-  
    C
    D
    E
    -
    D
    3
    -C-  
    4
    α
    µ
    e
    0.026 BSC  
    0.65 BSC  
    -
    A2  
    e
    A1  
    C
    H
    L
    0.292  
    0.022  
    0.322  
    0.037  
    7.40  
    0.55  
    8.20  
    0.95  
    -
    B
    0.10(0.004)  
    6
    0.25(0.010) M  
    C A M B S  
    N
    α
    28  
    28  
    7
    o
    0
    o
    8
    o
    0
    o
    8
    NOTES:  
    -
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2  
    of Publication Number 95.  
    Rev. 1 3/95  
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Dimension “D” does not include mold flash, protrusions or gate  
    burrs. Mold flash, protrusion and gate burrs shall not exceed  
    0.20mm (0.0078 inch) per side.  
    4. Dimension “E” does not include interlead flash or protrusions. Inter-  
    lead flash and protrusions shall not exceed 0.20mm (0.0078 inch)  
    per side.  
    5. The chamfer on the body is optional. If it is not present, a visual in-  
    dex feature must be located within the crosshatched area.  
    6. “L” is the length of terminal for soldering to a substrate.  
    7. “N” is the number of terminal positions.  
    8. Terminal numbers are shown for reference only.  
    9. Dimension “B” does not include dambar protrusion. Allowable dam-  
    bar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”  
    dimension at maximum material condition.  
    10. Controlling dimension: MILLIMETER. Converted inch dimensions  
    are not necessarily exact.  
    18  
    HIN232 thru HIN241  
    Metric Plastic Quad Flatpack Packages (MQFP)  
    D
    Q44.10x10 (JEDEC MS-022AB ISSUE B)  
    44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE  
    D1  
    -D-  
    INCHES  
    MILLIMETERS  
    SYMBOL  
    MIN  
    MAX  
    MIN  
    -
    MAX  
    2.45  
    NOTES  
    A
    A1  
    A2  
    b
    -
    0.096  
    0.010  
    0.083  
    0.018  
    0.016  
    0.524  
    0.399  
    0.523  
    0.398  
    0.040  
    -
    0.004  
    0.077  
    0.012  
    0.012  
    0.515  
    0.389  
    0.516  
    0.390  
    0.029  
    0.10  
    1.95  
    0.30  
    0.30  
    13.08  
    9.88  
    13.10  
    9.90  
    0.73  
    0.25  
    -
    2.10  
    -
    -A-  
    -B-  
    0.45  
    6
    E
    E1  
    b1  
    D
    0.40  
    -
    13.32  
    10.12  
    13.30  
    10.10  
    1.03  
    3
    D1  
    E
    4, 5  
    3
    E1  
    L
    4, 5  
    e
    -
    N
    44  
    0.032 BSC  
    44  
    0.80 BSC  
    7
    PIN 1  
    e
    -
    SEATING  
    PLANE  
    Rev. 2 4/99  
    -H-  
    A
    NOTES:  
    1. Controlling dimension: MILLIMETER. Converted inch  
    dimensions are not necessarily exact.  
    0.076  
    0.003  
    o
    o
    -C-  
    12 -16  
    2. All dimensions and tolerances per ANSI Y14.5M-1982.  
    3. Dimensions D and E to be determined at seating plane -C- .  
    0.40  
    0.016  
    o
    0.20  
    0.008  
    MIN  
    M
    C
    A-B S D S  
    4. Dimensions D1 and E1 to be determined at datum plane  
    -H- .  
    0
    MIN  
    b
    A2  
    o
    A1  
    o
    o
    b1  
    0 -7  
    5. Dimensions D1 and E1 do not include mold protrusion.  
    Allowable protrusion is 0.25mm (0.010 inch) per side.  
    0.13/0.17  
    0.005/0.007  
    6. Dimension b does not include dambar protrusion. Allowable  
    dambar protrusion shall be 0.08mm (0.003 inch) total.  
    o
    12 -16  
    L
    7. “N” is the number of terminal positions.  
    BASE METAL  
    WITH PLATING  
    0.13/0.23  
    0.005/0.009  
    All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
    Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/quality/iso.asp.  
    Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.  
    Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-  
    ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use.  
    No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
    For information regarding Intersil Corporation and its products, see web site www.intersil.com  
    19  
    配单直通车
    HIN237CB-T产品参数
    型号:HIN237CB-T
    是否Rohs认证： 不符合
    生命周期：Obsolete
    IHS 制造商：INTERSIL CORP
    零件包装代码：SOIC
    包装说明：SOP, SOP24,.4
    针数：24
    Reach Compliance Code：not_compliant
    ECCN代码：EAR99
    HTS代码：8542.39.00.01
    风险等级：5.28
    差分输出：NO
    驱动器位数：5
    输入特性：SCHMITT TRIGGER
    接口集成电路类型：LINE TRANSCEIVER
    接口标准：V.28; EIA-232-E
    JESD-30 代码：R-PDSO-G24
    JESD-609代码：e0
    长度：15.4 mm
    湿度敏感等级：1
    功能数量：3
    端子数量：24
    最高工作温度：70 °C
    最低工作温度：
    最小输出摆幅：10 V
    最大输出低电流：0.0016 A
    封装主体材料：PLASTIC/EPOXY
    封装代码：SOP
    封装等效代码：SOP24,.4
    封装形状：RECTANGULAR
    封装形式：SMALL OUTLINE
    峰值回流温度（摄氏度）：240
    电源：5 V
    认证状态：Not Qualified
    最大接收延迟：
    接收器位数：3
    座面最大高度：2.65 mm
    子类别：Line Driver or Receivers
    最大压摆率：15 mA
    最大供电电压：5.5 V
    最小供电电压：4.5 V
    标称供电电压：5 V
    表面贴装：YES
    技术：CMOS
    温度等级：COMMERCIAL
    端子面层：Tin/Lead (Sn/Pb)
    端子形式：GULL WING
    端子节距：1.27 mm
    端子位置：DUAL
    处于峰值回流温度下的最长时间：NOT SPECIFIED
    宽度：7.5 mm
    •  
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