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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • TD62783APG(O,S,HZN)
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  • QQ:857273081QQ:857273081 复制
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  • TD62783APG(O,S,HZN)图
  • 深圳市奥伟斯科技有限公司

     该会员已使用本站7年以上
  • TD62783APG(O,S,HZN)
  • 数量5000 
  • 厂家Toshiba 
  • 封装SOP18 
  • 批号12+ 
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产品型号TD62783APG(O,S,M)的Datasheet PDF文件预览

TD62783APG/AFG  
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic  
TD62783APG,TD62783AFG  
8 ch High-Voltage Source Driver  
The TD62783APG/AFG Series are comprised of eight source  
current Transistor Array.  
TD62783APG  
These drivers are specifically designed for fluorescent display  
applications.  
Applications include relay, hammer and lamp drivers.  
Features  
High output voltage: V  
= 50 V (min)  
CC  
Output current (single output): I  
= −500 mA (max)  
OUT  
TD62783AFG  
Output clamp diodes  
Single supply voltage  
Input compatible with various types of logic  
Package type-APG: DIP-18 pin  
Package type-AFG: SOP-18 pin  
Designation: TTL, 5V CMOS  
Pin Assignment (top view)  
Weight  
DIP18-P-300-2.54D : 1.47 g (typ.)  
SOP18-P-375-1.27 : 0.41 g (typ.)  
O1 O2 O3 O4 O5 O6 O7 O8 GND  
18 17 16 15 14 13 12 11 10  
1
2
3
4
5
6
7
8
9
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
V
CC  
Schematics (each driver)  
V
CC  
10 kΩ  
Input  
Output  
GND  
5 kΩ  
Note: The input and output parasitic diodes cannot be used as clamp diodes.  
1
2011-02-23  
TD62783APG/AFG  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Supply voltage  
Symbol  
Rating  
Unit  
V
50  
500  
15  
V
mA/ch  
V
CC  
Output current  
I
OUT  
Input voltage  
V
IN  
Clamp diode reverse voltage  
Clamp diode forward current  
V
50  
V
R
I
500  
mA  
F
APG  
AFG  
1.47  
Power dissipation  
P
(Note)  
W
D
0.96  
Operating temperature  
Storage temperature  
T
40 to 85  
55 to 150  
°C  
°C  
opr  
T
stg  
Note: Derated above 25°C in the proportion of 11.7 mW/°C (APG type), 7.7 mW/°C (AFG type)  
Operating Ranges (Ta = −40 to 80°C)  
Characteristics  
Supply voltage  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
V
2.0  
0
5.0  
50  
260  
59  
180  
38  
12  
CC  
Duty = 10% 8 circuits  
Ta = 85°C,  
Duty = 50% 8 circuits  
Output current  
I
mA/ch  
T = 120°C,  
OUT  
j
Duty = 10% 8 circuits  
t
= 25 ms  
pw  
AFG  
Duty = 50% 8 circuits  
Input voltage  
Input voltage  
V
V
V
IN  
Output ON  
V
15  
IN (ON)  
Output OFF  
V
0.8  
IN (OFF)  
Clamp diode reverse voltage  
Clamp diode forward current  
V
R
50  
V
I
400  
0.52  
0.35  
mA  
F
APG  
AFG  
Power dissipation  
P
W
D
2
2011-02-23  
TD62783APG/AFG  
Electrical Characteristics (Ta = 25°C)  
Test  
Circuit  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
100  
Unit  
V
= V  
max V = 0.4 V  
CC CC IN  
Ta = 25°C  
Output leakage current  
I
1
μA  
CEX  
V
= V  
,
IN  
IN (ON)  
= −350 mA  
2.0  
1.9  
1.8  
I
OUT  
V
= V  
IN (ON)  
= −225 mA  
,
IN  
Output saturation voltage  
V
2
V
CE (sat)  
I
OUT  
V
= V  
= −100 mA  
,
IN (ON)  
IN  
I
OUT  
V
V
V
= 2.4 V  
0.8  
36  
180  
52  
260  
2.0  
IN  
IN  
Input current  
Input voltage  
I
3
4
μA  
IN (ON)  
= 3.85 V  
V
= 2.0 V, I  
= −350 mA  
IN (ON)  
CE  
OUT  
OUT  
= −500 μA  
, V  
V
V
I
IN (OFF)  
CC (ON)  
Supply current  
I
3
5
6
V
V
= V  
= 50 V  
2.5  
50  
mA/ch  
μA  
IN  
R
IN (ON) CC  
Clamp diode reverse current  
Clamp diode forward voltage  
I
= 50 V  
R
V
I
F
= 350 mA  
2.0  
V
F
V
C
= V  
= 15 pF  
max R = 125 Ω  
L
CC  
CC  
Turn-ON delay  
Turn-OFF delay  
t
7
7
0.15  
1.8  
μs  
μs  
ON  
L
V
C
= V  
= 15 pF  
max R = 125 Ω  
CC L  
CC  
t
OFF  
L
3
2011-02-23  
TD62783APG/AFG  
Test Circuit  
1. I  
2. V  
3. I , I  
IN (ON) CC  
CEX  
CE (sat)  
V
V
V
CC  
CC  
CC  
V
CE (sat)  
I
IN (ON)  
I
OUT  
V
V
V
IN  
IN  
IN  
I
CEX  
4. V  
, V  
5. I  
R
6. V  
IN (ON) IN (OFF)  
F
V
V
Open  
CC  
CC  
V
CE  
V
, V  
IN (ON) IN (OFF)  
I
V
V
I
F
R
R
F
I
OUT  
7. t , t  
ON OFF  
V
0
IH  
V
Input  
CC  
Input  
50%  
50%  
Pulse  
generator  
50 μs  
t
t
OFF  
ON  
R
L
C
L
(Note 2)  
V
V
V
(Note 1)  
IN  
OH  
OL  
50%  
50%  
Output  
Note 1: Pulse Width 50 μs, Duty Cycle 10%  
Output Impedance 50 Ω, t 5 ns, t 10 ns  
r
f
Note 2: C includes probe and jig capacitance.  
L
Precautions for Using  
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.  
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that  
excess current or voltage will not be applied to the IC.  
Utmost care is necessary in the design of the output line, V  
and GND line since IC may be destroyed due to  
CC  
short-circuit between outputs, air contamination fault, or fault by improper grounding.  
4
2011-02-23  
TD62783APG/AFG  
I
– V  
I
– V  
IN IN  
OUT  
IN  
500  
400  
300  
200  
100  
0
1.6  
1.2  
0.8  
0.4  
0
Ta = 25°C typ.  
Ta = 25°C typ.  
0
0.4  
0.8  
1.2  
1.6  
2.0  
0
4
8
12  
16  
Input voltage  
V
(V)  
Input voltage  
V
(V)  
IN  
IN  
I
– V  
I
– V  
F
OUT  
CE (sat)  
F
0.6  
0.4  
0.2  
0
0.6  
0.4  
0.2  
0
Ta = 25°C  
Ta = 25°C typ.  
|V  
V | > 5 V  
EE  
CC  
0
0.8  
1.6  
2.4  
CE (sat)  
3.2  
0
0.4  
0.8  
1.2  
1.6  
Output saturation voltage  
V
(V)  
Diode forward voltage  
V
F
(V)  
P
Ta  
D
2.0  
1.5  
1.0  
0.5  
0
(1) Type-APG free air  
(2) Type-AFG free air  
(1)  
(2)  
0
50  
100  
150  
200  
Ambient temperature Ta (°C)  
5
2011-02-23  
TD62783APG/AFG  
Package Dimensions  
Weight: 1.47 g (typ.)  
6
2011-02-23  
TD62783APG/AFG  
Package Dimensions  
Weight: 0.41 g (typ.)  
7
2011-02-23  
TD62783APG/AFG  
Notes on Contents  
1. Equivalent Circuits  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory  
purposes.  
2. Test Circuits  
Components in the test circuits are used only to obtain and confirm the device characteristics. These  
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the  
application equipment.  
IC Usage Considerations  
Notes on Handling of ICs  
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be  
exceeded, even for a moment. Do not exceed any of these ratings.  
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result  
injury by explosion or combustion.  
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in  
case of over current and/or IC failure. The IC will fully break down when used under conditions that  
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal  
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the  
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of  
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are  
required.  
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the  
design to prevent device malfunction or breakdown caused by the current resulting from the inrush  
current at power ON or the negative current resulting from the back electromotive force at power OFF.  
IC breakdown may cause injury, smoke or ignition.  
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,  
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,  
smoke or ignition.  
(4) Do not insert devices in the wrong orientation or incorrectly.  
Make sure that the positive and negative terminals of power supplies are connected properly.  
Otherwise, the current or power consumption may exceed the absolute maximum rating, and  
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result  
injury by explosion or combustion.  
In addition, do not use any device that is applied the current with inserting in the wrong orientation  
or incorrectly even just one time.  
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load  
components (such as speakers), for example, power amp and regulator.  
If there is a large amount of leakage current such as input or negative feedback condenser, the IC  
output DC voltage will increase. If this output voltage is connected to a speaker with low input  
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause  
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied  
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.  
8
2011-02-23  
TD62783APG/AFG  
Points to Remember on Handling of ICs  
(1) Heat Radiation Design  
In using an IC with large current flow such as power amp, regulator or driver, please design the  
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at  
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat  
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In  
addition, please design the device taking into considerate the effect of IC heat radiation with  
peripheral components.  
(2) Back-EMF  
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to  
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power  
supply is small, the device’s motor power supply and output pins might be exposed to conditions  
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into  
consideration in system design.  
About solderability, following conditions were confirmed  
Solderability  
(1) Use of Sn-37Pb solder Bath  
· solder bath temperature = 230°C  
· dipping time = 5 seconds  
· the number of times = once  
· use of R-type flux  
(2) Use of Sn-3.0Ag-0.5Cu solder Bath  
· solder bath temperature = 245°C  
· dipping time = 5 seconds  
· the number of times = once  
· use of R-type flux  
9
2011-02-23  
TD62783APG/AFG  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the  
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of  
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes  
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the  
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their  
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such  
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,  
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating  
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR  
APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious  
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used  
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without  
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile  
technology products (mass destruction weapons). Product and related software and technology may be controlled under the  
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product  
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
10  
2011-02-23  
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TD62783APG(O,S,M)产品参数
型号:TD62783APG(O,S,M)
是否Rohs认证: 符合
生命周期:Contact Manufacturer
Reach Compliance Code:unknown
风险等级:5.74
Base Number Matches:1
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