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产品型号UC2909MDWREP的概述

UC2909MDWREP芯片概述 UC2909MDWREP是一种高度集成的电池充电管理器，专为锂离子和镍氢电池充电应用而设计。该芯片具有多种保护功能和控制算法，确保电池在充电过程中的安全性与效率。UC2909MDWREP的设计旨在实现快速、高效的充电，同时最大限度地延长电池的使用寿命。该芯片的广泛应用包括智能手机、笔记本电脑、平板电脑和其他便携式电子设备。 UC2909 MDWREP采用现代的电路设计，集成了充电控制、监测反馈、温度保护及其他重要功能。这种高度集成的特性使得设计师能够减少外部元件的数量，降低了系统的复杂性和成本。其工作原理是通过对电池电压和电流的精确监测，动态调整充电参数，以适应不同的负载和环境条件。 UC2909MDWREP的详细参数 UC2909MDWREP的主要参数包括： - 电源电压范围：适用于4.5V至36V的电源输入 - 充电电流范围：可提供高达3A的充电电...

产品型号UC2909MDWREP的Datasheet PDF文件预览

UC2909-EP

www.ti.com

SLUSA72 –JULY 2010

SWITCHMODE LEAD-ACID BATTERY CHARGER

Check for Samples: UC2909-EP

FEATURES

SUPPORTS DEFENSE, AEROSPACE,

AND MEDICAL APPLICATIONS

•

Accurate and Efficient Control of Battery

Charging

•

Controlled Baseline

One Assembly/Test Site

One Fabrication Site

Available in Military (–55°C/125°C)

Temperature Range⁽¹⁾

•

Average Current Mode Control from Trickle to

Overcharge

•

Resistor Programmable Charge Currents

Thermistor Interface Tracks Battery

Requirements Over Temperature

•

Extended Product Life Cycle

Extended Product-Change Notification

Product Traceability

Not to Exceed 185.35-KHz Oscillation

Frequency at 125°C

•

Output Status Bits Report on Four Internal

Charge States

Undervoltage Lockout Monitors VCC and

VREF

(1) Additional temperature ranges available - contact factory

DESCRIPTION

The UC2909 controls lead acid battery charging with a highly efficient average current mode control loop. This

chip combines charge state logic with average current PWM control circuitry. Charge state logic commands

current or voltage control depending on the charge state. The chip includes undervoltage lockout circuitry to

insure sufficient supply voltage is present before output switching starts. Additional circuit blocks include a

differential current sense amplifier, a 1.5% voltage reference, a –3.9-mV/°C thermistor linearization circuit,

voltage and current error amplifiers, a PWM oscillator, a PWM comparator, a PWM latch, charge state decode

bits, and a 100-mA open collector output driver.

FUNCTION BLOCK DIAGRAM

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

UC2909-EP

SLUSA72 –JULY 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION⁽¹⁾

ORDERABLE PART

T_A

PACKAGE⁽²⁾

TOP-SIDE MARKING

NUMBER

-55°C to 125°C

UC2909MDWREP

UC2909EP

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

ABSOLUTE MAXIMUM RATINGS^{(1) (2)}

over operating free-air temperature range unless otherwise noted

UNITS

VCC

Supply voltage

OUT, STAT0, STAT1

0.1

Output current sink

CS+, CS-

(3)

–0.4 to V_CC

–0.3 to 9

Remaining pin voltages

Storage temperature

Junction temperature range

T_stg

T_J

-55 to 150

300

°C

Lead temperature (soldering, 10 seconds)

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage

values are with respect to the network ground terminal unless otherwise noted.

(2) All currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and

considerations of packages.

(3) Voltages more negative than -0.4 V can be tolerated if current is limited to 50 mA.

DW PACKAGE

(TOP VIEW)

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SLUSA72 –JULY 2010

ELECTRICAL CHARACTERISTICS

T_A= –55°C to 125°C; C_T= 430 pF, R_SET= 11.5 KΩ, R10 = 10 KΩ, R_THM= 10 KΩ, V_CC= 15 V, Output no load,

R_STAT0= R_STAT1= 10 KΩ, CHGENB = OVCTAP = VLOGIC, T_A= T_J(unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

CURRENT SENSE AMPLIFIER (CSA) (V_ID= CS+ - CS-)

CS- = 0 V, CS+ = -50 mV;

CS+ = –200 mV

4.8

5.7

V/V

5.1

DC gain

CS+ = 0 V, CS- = 50 mV;

CS- = 250 mV

V_OFFSET

CMRR

Offset voltage (V_CSO- V_CAO

)

CS+ = CS- = 2.3 V, CAO = CA-

V_CM= -0.2 V to V_CC- 2,

8.8 V < V_CC< 14 V

V_CM= -0.2 V to V_CC

14 V < V_CC< 35 V

V_ID= -550 mV,

V_OL

-0.2 V < V_CM< V_CC- 2,

I_O= 500 µA

0.3

5.7

0.6

V_ID= 700 mV,

-0.2 V < V_CM< V_CC- 2,

I_O= -250 µA

V_OH

5.2

6.2

Output source current

Output sink current

3dB bandwidth⁽¹⁾

V_ID= 700 mV, CSO = 4 V

V_ID= -55 0mV, CSO = 1 V

V_ID= 90 mV, V_CM= 0 V

-1

4.5

-0.5

200

KHz

CURRENT ERROR AMPLIFIER (CEA)

8.8 V < V_CC< 35 V,

V_CHGENB= V_LOGIC

I_B

0.1

0.8

µA

(2)

V_IO

8.8 V < V_CC< 35 V, CAO = CA-

1 V < V_AO< 4 V

T_J= 25°C, f = 100 KHz

I_O= 250 µA

1.5

0.4

MHz

A_VO

GBW

V_OL

0.6

-12

V_OH

I_O= –5 mA

4.5

Output source current

Output sink current

CAO = 4 V

-25

CAO = 1 V

I_CA-

I_{TRCK_CONTRO}

V_CHGENB= GND

8.5

11.5

µA

VOLTAGE AMPLIFIER (CEA)

I_B

Total bias current; regulating level

0.1

1.2

µA

8.8 V < V_CC< 35 V,

V_CM= 2.3 V,

(2)

V_IO

V_AO= V_A-

A_VO

GBW

V_OL

1 V < CAO < 4 V

T_J= 25°C, f = 100 KHz

I_O= 500 µA

0.5

0.4

MHz

0.25

0.6

V_OH

I_O= -500 µA

4.75

-2

5.25

Output source current

Output sink current

CAO = 4 V

-1

CAO = 1 V

2.5

V_CHGENB= GND,

STAT0 = 0 and STAT1 = 0,

V_AO= 2.3 V

VAO leakage: high impedance

state

-1

µA

(1) Not tested in production.

(2) V_IOis measured prior to packaging with internal probe pad.

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ELECTRICAL CHARACTERISTICS (continued)

T_A= –55°C to 125°C; C_T= 430 pF, R_SET= 11.5 KΩ, R10 = 10 KΩ, R_THM= 10 KΩ, V_CC= 15 V, Output no load,

R_STAT0= R_STAT1= 10 KΩ, CHGENB = OVCTAP = VLOGIC, T_A= T_J(unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

PULSE WIDTH MODULATOR

Maximum duty cycle

CAO = 0.6 V

100

%/V

Modulator gain

OSC peak

CAO = 2.5 V, 3.2 V

OSC valley

OSCILLATOR

Frequency

8.8 V < V_CC< 35 V

151.65

2.250

168.50

185.35

2.350

KHz

THERMISTOR DERIVED (V_ID= V_RTHM- V_R10

)

Initial accuracy,

V_AO(R_THM= 10 KΩ)

V_ID= 0 V, R10 = R_THM= 10 KΩ⁽³⁾

2.300

Line regulation

V_CC= 8.8 V to 35 V

2.495

2.398

2.066

2.545

2.446

2.107

R_THM= 138 KΩ, R10 = 10 KΩ

R_THM= 33.63 KΩ, R10 = 10 KΩ

R_THM= 1.014 KΩ, R10 = 10 KΩ

2.435

2.340

2.015

V_AO

CHARGE ENABLE COMPARATOR (CEC)

Threshold voltage

As a function of V_A-

CHGENB = 2.3 V

0.99

-0.5

1.01

V/V

µA

Input bias current

-0.1

VOLTAGE SENSE COMPARATOR (VSC)

STAT0 = 0, STAT1 = 0, Function of V_REF

STAT0 = 1, STAT1 = 0, Function of V_REF

0.944

0.895

0.95

0.9

0.955

0.905

Threshold voltage

V/V

OVER CHARGE TAPER CURRENT COMPARATOR (OCTIC)

Threshold voltage

Input bias current

Function of 2.3 V REF, CA- = CAO

0.99

-0.5

1.01

V/V

µA

OVCTAP = 2.3 V

-0.1

LOGIC 5 V (VLOGIC)

VLOGIC

V_CC= 15 V

4.875

5.125

Line regulation

Load regulation

8.8 V < V_CC< 35 V

0 A < I_O< 10 mA

Reference comparator turn-on

threshold

4.3

4.85

Short circuit current

V_REF= 0 V

OUTPUT STAGE

I_SINK

continuous

I_PEAK

V_OL

100

I_O= 50 mA

1.4

Leakage current

V_OUT= 35 V

µA

(3) Thermistor initial accuracy is measured and trimmed with respect to V_AO; V_AO= V_A-

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UC2909-EP

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SLUSA72 –JULY 2010

ELECTRICAL CHARACTERISTICS (continued)

T_A= –55°C to 125°C; C_T= 430 pF, R_SET= 11.5 KΩ, R10 = 10 KΩ, R_THM= 10 KΩ, V_CC= 15 V, Output no load,

R_STAT0= R_STAT1= 10 KΩ, CHGENB = OVCTAP = VLOGIC, T_A= T_J(unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

STAT0 AND STAT1 OPEN COLLECTOR OUTPUTS

Maximum sink current

Saturation voltage

Leakage current

STATLV OPEN COLLECTOR OUTPUTS

Maximum sink current

Saturation voltage

Leakage current

UVLO

V_OUT= 8.8 V

I_OUT= 5 mA

V_OUT= 35 V

0.1

0.45

µA

V_OUT= 5 V

I_OUT= 2 mA

V_OUT= 5 V

0.1

0.45

µA

Turn-on Threshold

Hysteresis

6.8

7.8

8.8

100

300

500

I_CC

I_CC(run)

See Figure 1

V_CC= 6.5 V

I_CC(off)

-40

-20

100

Figure 1. I_CCvs Temperature

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SLUSA72 –JULY 2010

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1000.0

100.0

10.0

1.0

Wirebond Voiding

Fail Mode

Electromigration Fail Mode

0.1

100

110

120

130

140

150

160

170

180

Continuous T_J(°C)

Notes:

1. See datasheet for absolute maximum and minimum recommended operating conditions.

2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life).

3. Enhanced plastic product disclaimer applies.

Figure 2. UC2909-EP Operating Life Derating Chart

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SLUSA72 –JULY 2010

DEVICE INFORMATION

TERMINAL FUNCTIONS

TERMINAL

DESCRIPTION

NAME

NO.

CA-

The inverting input to the current error amplifier.

The output of the current error amplifier which is internally clamped to approximately 4 V. It is internally

connected to the inverting input of the PWM comparator.

CAO

The inverting and non-inverting inputs to the current sense amplifier. This amplifier has a fixed gain of five

CS-, CS+

CSO

17, 16

and a common-mode voltage range of from –250 mV to V_CC

The output of the current sense amplifier which is internally clamped to approximately 5.7 V.

The input to a comparator that detects when battery voltage is low and places the charger in a trickle charge

state. The charge enable comparator makes the output of the voltage error amplifier a high impedance while

forcing a fixed 10 mA into CA- to set the trickle charge current.

CHGENB

The reference point for the internal reference, all thresholds, and the return for the remainder of the device.

The output sink transistor is wired directly to this pin.

GND

The overcharge current taper pin detects when the output current has tapered to the float threshold in the

overcharge state.

OVCTAP

The oscillator ramp pin which has a capacitor (C_T) to ground. The ramp oscillates between approximately

1 V to 3 V and the frequency is approximated by:

OSC

frequency =

1.2 · C_T· R_SET

(1)

The output of the PWM driver which consists of an open collector output transistor with 100-mA sink

capability.

OUT

R10

Input used to establish a differential voltage corresponding to the temperature of the thermistor. Connect a

10-KΩ resistor to ground from this point.

A resistor to ground programs the oscillator charge current and the trickle control current for the oscillator

ramp.

The oscillator charge current is approximately:

1.75

R_SET

RSET

(2)

The trickle control current (I_{TRCK_CONTROL}) is approximately:

0.115

R_SET

(3)

A 10-KΩ thermistor is connected to ground and is thermally connected to the battery. The resistance will

vary exponentially over temperature and its change is used to vary the internal 2.3-V reference by -3.9

mV/°C. The recommended thermistor for this function is part number L1005-5744-103-D1, Keystone Carbon

Company, St. Marys, PA.

RTHM

STAT0

STAT1

STATLV

VA-

This open collector pin is the first decode bit used to decode the charge states.

This open collector pin is the second decode bit used to decode the charge states.

This bit is high when the charger is in the float state.

The inverting input to the voltage error amplifier.

VAO

The output of the voltage error amplifier. The upper output clamp voltage of this amplifier is 5 V.

The input voltage to the chip. The chip is operational between 7.5 V and 40 V and should be bypassed with

a 1-µF capacitor. A typical I_CCvs. temperature is shown in Figure 1.

VCC

VLOGIC

The precision reference voltage. It should be bypassed with a 0.1-µF capacitor.

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CHARGE STATE DECODE CHART

STAT0 and STAT1 are open collector outputs. The output is approximately 0.2 V for a logic 0.

STAT1

STAT0

Trickle charge

Bulk charge

Over charge

Float charge

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APPLICATION INFORMATION

A block diagram of the UC2909 is shown on the first page, while a typical application circuit is shown in Figure 3.

The circuit in Figure 3 requires a DC input voltage between 12 V and 40 V.

The UC2909 uses a voltage control loop with average current limiting to precisely control the charge rate of a

lead-acid battery. The small increase in complexity of average current limiting is offset by the relative simplicity of

the control loop design.

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Figure 3. Typical Application Circuit

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Control Loop

Current Sense Amplifier

This amplifier measures the voltage across the sense resistor RS with a fixed gain of five and an offset voltage of

2.3 V. This voltage is proportional to the battery current. The most positive voltage end of RS is connected to

CSensuring the correct polarity going into the PWM comparator.

CSO = 2.3 V when there is zero battery current.

RS is chosen by dividing 350 mV by the maximum allowable load current. A smaller value for RS can be chosen

to reduce power dissipation.

Maximum charge current, I_bulk, is set by knowing the maximum voltage error amplifier output, V_OH= 5 V, the

maximum allowable drop across RS, and setting the resistors RG1 and RG2 such that:

5 · V_RS

VLOGIC - CA-

5 · V_RS

5 V - 2.3 V

5 · V

2.7 V

RG1

RG2

^RS= 1.852 · I_BULK· RS

(4)

The maximum allowable drop across RS is specified to limit the maximum swing at CSO to approximately 2 V to

keep the CSO amplifier output from saturating.

No charge/load current: V_CSO= 2.3 V

Max charge/load current: V_max(CSO)= 2.3 V - 2 V = 0.3 V

Voltage Error Amplifier

The voltage error amplifier (VEA) senses the battery voltage and compares it to the 2.3-V - 3.9-mV/°C thermistor

generated reference. Its output becomes the current command signal and is summed with the current sense

amplifier output. A 5-V voltage error amplifier upper clamp limits maximum load current. During the trickle charge

state, the voltage amplifier output is opened (high impedance output) by the charge enable comparator. A trickle

bias current is summed into the CA- input which sets the maximum trickle charge current.

The VEA, V_OH= 5 V clamp saturates the voltage loop and consequently limits the charge current as stated in

Equation 4.

During the trickle bias state the maximum allowable charge current (ITC) is similarly determined:

I_{TRCK_CONTROL}· RG1

ITC =

RS · 5

(5)

I_{TRCK_CONTROL}is the fixed control current into CA-. I_{TRCK_CONTROL}is 10 µA when R_SET= 11.5 KΩ. See RSET pin

description for equation.

Current Error Amplifier

The current error amplifier (CA) compares the output of the current sense amplifier to the output of the voltage

error amplifier. The output of the CA forces a PWM duty cycle which results in the correct average battery

current. With integral compensation, the CA will have a very high DC current gain, resulting in effectively no

average DC current error. For stability purposes, the high frequency gain of the CA must be designed such that

the magnitude of the down slope of the CA output signal is less than or equal to the magnitude of the up slope of

the PWM ramp.

Charge Algorithm

Trickle Charge State

STAT0 = STAT1 = STATLV = logic 0

When CHGNB is less than VREF (2.3 V - 3.9 mV/°C), STATLV is forced low. This decreases the sense voltage

divider ratio, forcing the battery to overcharge (V_OC).

(RS1 + RS2 + RS3

(RS3

RS4)

V_OC= (V_REF) ·

RS4)

(6)

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During the trickle charge state, the output of the voltage error amplifier is high impedance. The trickle control

current is directed into the CA- pin setting the maximum trickle charge current. The trickle charge current is

defined in Equation 5.

Bulk Charge State

STAT1 = STATLV = logic 0, STAT0 = logic 1

As the battery charges, the UC2909 will transition from trickle to bulk charge when CHGENB becomes greater

than 2.3 V. The transition equation is:

(RS1 + RS2 + RS3

(RS2 + RS3 RS4)

RS4)

V_T= (V_REF) ·

(7)

STATLV is still driven low.

During the bulk charge state, the voltage error amplifier is now operational and is commanding maximum charge

current (I_BULK) set by Equation 4. The voltage loop attempts to force the battery to VOC.

Overcharge State

STAT0 = STATLV = logic 0, STAT1 = logic 1

The battery voltage surpasses 95% of VOC indicating the UC2909 is in its overcharge state.

During the overcharge charge state, the voltage loop becomes stable and the charge current begins to taper off.

As the charge current tapers off, the voltage at CSO increases toward its null point of 2.3 V. The center

connection of the two resistors between CSO and VLOGIC sets the overcurrent taper threshold (OVCTAP).

Knowing the desired overcharge terminate current (I_OCT), the resistors R_OVC1and R_OVC2can be calculated by

choosing a value of R_OVC2and using the following equation:

R_OVC1= (1.8518) · I_OCT· RS · R_OVC2

(8)

Float State

STAT0 = STAT1 = STATLV = logic 1

The battery charge current tapers below its OVCTAP threshold, and forces STATLV high increasing the voltage

sense divider ratio. The voltage loop now forces the battery charger to regulate at its float state voltage (V_F).

(RS1 + RS2 + RS3)

V_F= (V_REF) ·

RS3

(9)

If the load drains the battery to less than 90% of V_F, the charger goes back to the bulk charge state, STATE 1.

Off Line Applications

For off line charge applications, either Figure 4 or Figure 5 can be used as a baseline. Figure 4 has the

advantage of high frequency operation resulting in a small isolation transformer. Figure 5 is a simpler design, but

at the expense of larger magnetics.

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UC2909

Figure 4. Off Line Charger With Primary Side PWM

Figure 5. Isolated Off Line Charger

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PACKAGE OPTION ADDENDUM

www.ti.com

4-Aug-2012

PACKAGING INFORMATION

Status ⁽¹⁾

Eco Plan ⁽²⁾

MSL Peak Temp ⁽³⁾

Samples

Orderable Device

Package Type Package

Drawing

Pins

Package Qty

Lead/

Ball Finish

(Requires Login)

UC2909MDWREP

ACTIVE

SOIC

2000

Green (RoHS

& no Sb/Br)

Call TI

Level-2-260C-1 YEAR

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF UC2909-EP :

Catalog: UC2909

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

UC2909MDWREP

SOIC

2000

330.0

24.4

10.8

13.0

2.7

12.0

24.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SOIC DW 20

SPQ

Length (mm) Width (mm) Height (mm)

367.0 367.0 45.0

UC2909MDWREP

2000

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All

semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time

of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

Products

Audio

Applications

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

www.ti.com/consumer-apps

www.ti.com/energy

dsp.ti.com

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/industrial

www.ti.com/medical

www.ti.com/security

Medical

Logic

Security

Power Mgmt

Microcontrollers

RFID

power.ti.com

Space, Avionics and Defense www.ti.com/space-avionics-defense

microcontroller.ti.com

www.ti-rfid.com

Video and Imaging

www.ti.com/video

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community

e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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UC2909MDWREP产品参数

型号:	UC2909MDWREP
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
零件包装代码：	SOIC
包装说明：	SOP, SOP20,.4
针数：	20
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	1.7
Samacsys Confidence：	3
Samacsys Status：	Released
Samacsys PartID：	380688
Samacsys Pin Count：	20
Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	Small Outline Packages
Samacsys Footprint Name：	DW
Samacsys Released Date：	2019-04-16 09:58:51
Is Samacsys：	N
模拟集成电路 - 其他类型：	BATTERY CHARGE CONTROLLER
控制模式：	CURRENT-MODE
控制技术：	PULSE WIDTH MODULATION
最大输入电压：	35 V
最小输入电压：	8.5 V
标称输入电压：	15 V
JESD-30 代码：	R-PDSO-G20
JESD-609代码：	e4
长度：	12.8 mm
湿度敏感等级：	2
功能数量：	1
端子数量：	20
最高工作温度：	125 °C
最低工作温度：	-55 °C
标称输出电压：	5 V
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP20,.4
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
电源：	15 V
认证状态：	Not Qualified
座面最大高度：	2.35 mm
子类别：	Power Management Circuits
最大供电电流 (Isup)：	19 mA
标称供电电压 (Vsup)：	15 V
表面贴装：	YES
切换器配置：	PUSH-PULL
最大切换频率：	185.35 kHz
技术：	BICMOS
温度等级：	MILITARY
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7.5 mm
Base Number Matches：	1

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