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W24257A

32K ´ 8 HIGH SPEED CMOS STATIC RAM

GENERAL DESCRIPTION

The W24257A is a high speed, low power CMOS static RAM organized as 32768 ´ 8 bits that

operates on a single 5-volt power supply. This device is manufactured using Winbond's high

performance CMOS technology.

FEATURES

· High speed access time: 10/12/15/20 nS (max.) · All inputs and outputs directly TTL compatible

· Low power consumption:

- Active: 400 mW (typ.)

· Single +5V power supply

· Three-state outputs

· Available packages: 28-pin 300 mil SOJ, 330

mil SOP, skinny DIP and standard type one

TSOP (8 mm ´ 13.4 mm)

· Fully static operation

PIN CONFIGURATIONS

BLOCK DIAGRAM

VDD

VSS

A0

A14

A12

A7

1

28

27

26

25

24

23

22

21

20

19

18

17

16

15

V

DD

.

2

WE

A13

A8

DECODER

.

CORE

ARRAY

3

A6

A5

A14

4

5

A9

A4

A11

OE

6

A3

7

28-pin

DIP

A2

8

A10

CS

I/O1

A1

9

.

CONTROL

OE

DATA I/O

A0

10

11

12

13

14

I/O8

I/O7

I/O6

I/O5

I/O4

.

I/O8

I/O1

I/O2

I/O3

WE

V

SS

PIN DESCRIPTION

SYMBOL

DESCRIPTION

A10

CS

OE

1

28

27

26

25

24

23

22

21

20

19

18

17

16

15

2

A11

A9

3

I/O8

I/O7

I/O6

I/O5

I/O4

Address Inputs

A0- A14

4

A8

A13

WE

5

6

Data Inputs/Outputs

Chip Select Input

Write Enable Input

Output Enable Input

Power Supply

I/O1- I/O8

28-pin

TSOP

V

7

DD

8

A14

A12

A7

V

SS

9

I/O3

I/O2

I/O1

A0

CS

10

11

12

13

14

A6

A5

WE

A4

A1

A2

A3

OE

VDD

VSS

Ground

Publication Release Date: May 1997

Revision A14

- 1 -

W24257A

DC CHARACTERISTICS

Absolute Maximum Ratings

PARAMETER

Supply Voltage to VSS Potential

Input/Output to VSS Potential

Allowable Power Dissipation

Storage Temperature

RATING

-0.5 to +7.0

-0.5 to VDD +0.5

1.0

UNIT

V

W

-65 to +150

0 to +70

°C

Operating Temperature

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the

device.

TRUTH TABLE

CS

H

L

OE

X

WE

X

MODE

Not Selected

Output Disable

Read

VDD CURRENT

I/O1- I/O8

High Z

ISB, ISB1

IDD

H

High Z

L

H

Data Out

Data In

IDD

L

X

L

Write

IDD

OPERATING CHARACTERISTICS

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

PARAMETER

Input Low Voltage

Input High Voltage

Input Leakage Current

SYM.

VIL

TEST CONDITIONS

MIN. TYP.

MAX.

+0.8

UNIT

V

-

-0.5

+2.2

-10

-

VIH

ILI

-

VDD +0.5

+10

V

VIN = VSS to VDD

mA

Output Leakage

Current

ILO

-10

+10

VI/O = VSS to VDD, CS = VIH

or OE = VIH or WE = VIL

IOL = +8.0 mA

Output Low Voltage

Output High Voltage

VOL

-

2.4

-

0.4

-

V

VOH IOH = -4.0 mA

IDD

10

170

mA

CS = VIL, I/O = 0 mA

Cycle = MIN

Operating Power

Supply Current

12

15

20

-

160

150

140

30

mA

Duty = 100%

-

Standby Power

Supply Current

ISB

CS = VIH

Cycle = MIN, Duty = 100%

ISB1

-

10

mA

CS ³ VDD -0.2V

Note: Typical characteristics are at VDD = 5V, TA = 25° C.

- 2 -

W24257A

CAPACITANCE

(VDD = 5V, TA = 25° C, f = 1 MHz)

PARAMETER

Input Capacitance

SYM.

CIN

CONDITIONS

VIN = 0V

MAX.

8

UNIT

pF

Input/Output Capacitance

CI/O

VOUT = 0V

10

pF

Note: These parameters are sampled but not 100% tested.

THERMAL RESISTANCE

PARAMETER

SYM

CONDITIONS

MAX. UNIT

.

Junction to Case Thermal Resistance

20

60

A. F. R. = 1m/sec, TA = 25° C

°C/W

qJC

qJA

Junction to Ambient Thermal

Resistance

Note: These parameters are only applied to "TSOP" and "SOJ" package types.

AC TEST CONDITIONS

PARAMETER

CONDITIONS

Input Pulse Levels

0V to 3V

5 nS

Input Rise and Fall Times

Input and Output Timing Reference Level

Output Load

1.5V

CL = 30 pF, IOH/IOL = -4 mA/8 mA

Publication Release Date: May 1997

Revision A14

- 3 -

W24257A

AC TEST LOADS AND WAVEFORM

R1 480 ohm

5 pF

5V

R1 480 ohm

5V

OUTPUT

R2

255 ohm

30 pF

R2

255 ohm

Including

Jig and

Scope

Including

Jig and

Scope

,

OHZ

WHZ

,

T

(For TCLZ TOLZ TCHZ, T

,

OW

T

)

,

3.0V

0V

90%

10%

5 nS

- 4 -

W24257A

AC CHARACTERISTICS

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

Read Cycle

PARAMETER

SYM.

W24257A-10

W24257A-12

W24257A-15

W24257A-20

UNIT

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

Read Cycle Time

TRC

10

-

10

5

12

-

12

6

15

-

15

7

20

-

nS

Address Access Time

TAA

20

10

-

Chip Select Access Time

Output Enable to Output Valid

Chip Selection to Output in Low Z

TACS

TAOE

-

3

-

3

-

3

-

3

*

TCLZ

Output Enable to Output in Low Z

Chip Deselection to Output in High Z

Output Disable to Output in High Z

Output Hold from Address Change

0

-

5

-

0

-

6

-

0

-

7

-

0

-

nS

*

TOLZ

10

-

TCHZ

-

*

TOHZ

TOH

3

* These parameters are sampled but not 100% tested.

Write Cycle

PARAMETER

SYM.

W24257A-10

W24257A-12

W24257A-15

W24257A-20

UNIT

MIN. MAX. MIN.

MAX.

MIN.

15

13

0

MAX.

MIN.

20

17

0

MAX.

Write Cycle Time

TWC

TCW

TAW

TAS

10

9

-

12

10

0

-

nS

Chip Selection to End of Write

Address Valid to End of Write

Address Setup Time

9

0

Write Pulse Width

TWP

TWR

9

10

0

10

0

12

0

Write Recovery Time

0

CS , WE

Data Valid to End of Write

Data Hold from End of Write

Write to Output in High Z

TDW

TDH

6

0

-

7

0

-

9

0

-

10

0

-

nS

6

7

8

-

10

*

TWHZ

Output Disable to Output in High Z

Output Active from End of Write

-

6

-

7

-

8

-

10

-

nS

*

TOHZ

TOW

0

* These parameters are sampled but not 100% tested.

Publication Release Date: May 1997

Revision A14

- 5 -

W24257A

TIMING WAVEFORMS

Read Cycle 1

(Address Controlled)

T

RC

Address

DOUT

TAA

T

OH

T

OH

Read Cycle 2

(Chip Select Controlled)

CS

T

ACS

T

CHZ

D

OUT

T

CLZ

Read Cycle 3

(Output Enable Controlled)

RC

T

Address

OE

T

AA

TOH

AOE

T

OLZ

CS

TOHZ

TACS

TCLZ

CHZ

T

D

OUT

- 6 -

W24257A

Timing Waveforms, continued

Write Cycle 1

(OE Clock)

WC

T

Address

OE

WR

T

CW

T

CS

AW

T

WP

T

WE

TAS

OHZ

T

(1, 4)

D

OUT

DIN

DW

T

DH

T

Write Cycle 2

(OE = VIL Fixed)

T

WC

Address

T

WR

T

CW

CS

TAW

WE

T

OH

WP

T

AS

(2)

(3)

T

WHZ

T

OW

(1, 4)

D

OUT

DIN

T

DW

TDH

Notes:

1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.

2. The data output from DOUT are the same as the data written to DIN during the write cycle.

3. DOUT provides the read data for the next address.

4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.

Publication Release Date: May 1997

- 7 -

Revision A14

W24257A

ORDERING INFORMATION

PART NO.

ACCESS

TIME

OPERATING

CURRENT

MAX. (mA)

STANDBY

CURRENT

MAX. (mA)

PACKAGE

(nS)

W24257AK-10

W24257AK-12

W24257AK-15

W24257AK-20

W24257AJ-10

W24257AJ-12

W24257AJ-15

W24257AJ-20

W24257AS-10

W24257AS-12

W24257AS-15

W24257AS-20

W24257AQ-10

W24257AQ-12

W24257AQ-15

W24257AQ-20

10

12

15

20

10

12

15

20

10

12

15

20

10

12

15

20

170

160

150

140

170

160

150

140

170

160

150

140

170

160

150

140

10

300 mil skinny DIP

300 mil SOJ

330 mil SOP

Standard type one TSOP

Notes:

1. Winbond reserves the right to make changes to its products without prior notice.

2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in

applications where personal injury might occur as a consequence of product failure.

- 8 -

W24257A

PACKAGE DIMENSIONS

28-pin P-DIP Skinny

Dimension in Inches

Dimension in mm

Symbol

A

Min. Nom. Max. Min. Nom. Max.

4.45

0.175

0.010

0.125

0.25

3.18

0.41

1.47

0.20

A

1

0.130

0.135

0.022

0.064

0.014

1.400

3.30

0.46

1.52

0.25

35.26

7.87

3.43

0.56

1.63

0.36

2

0.016 0.018

B

c

D

E

D

0.060

0.010

1.388

0.058

0.008

28

15

1

35.56

8.13

E1

0.300

0.310 0.320

7.62

7.19

2.29

3.05

0.293

0.110

7.32

2.54

3.30

7.44

2.79

3.56

0.283 0.288

0.090 0.100

e ₁

1

14

0.140

0.120 0.130

L

a

°

0

°

15

°

0

°

15

0.330

0.370

0.055

8.38

9.40

1.40

0.350

8.89

e

S

A

Notes:

1. Dimensions D Max. & S include mold flash or

tie bar burrs.

2. Dimension E1 does not include interlead flash.

3. Dimensions D & E1 include mold mismatch and

are determined at the mold parting line.

E

S

c

Base Plane

A A2

A1

4. Dimension B1 does not include dambar

protrusion/intrusion.

5. Controlling dimension: Inches.

6. General appearance spec. should be based on

final visual inspection spec.

L

Mounting Plane

B

e₁

e_A

a

B₁

28-pin Small Outline J Band

Dimension in Inches

Min. Nom. Max. Min. Nom. Max.

Dimension in mm

Symbol

A

3.56

0.140

28

15

0.027

0.095 0.100 0.105

0.028 0.032

0.69

2.41

0.66

0.41

0.20

1

A

2.54

0.71

2.67

0.81

0.56

0.36

18.54

7.75

1.42

A

b

c

D

E

e

2

0.026

0.016 0.018

1

0.46

0.022

0.014

0.730

E

HE

0.010

0.710

0.25

0.008

18.03

7.49

1.12

0.300

0.050

0.305

0.056

7.62

1.27

0.295

0.044

1

14

0.285

0.245 0.265

6.22

8.31

6.73

8.56

7.24

8.81

e

1

0.327 0.337 0.347

H_E

L

0.097

0.045

0.004

1.96

0

2.21

0.077 0.087

2.46

1.14

0.10

S

y

q

D

10

0

c

Notes:

2

A

1. Dimensions D Max. & S include mold flash

or tie bar burrs.

2. Dimension b does not include dambar

protrusion/intrusion.

L

£c

b

s

e

1

e

A

1

3. Dimensions D & E include mold mismatch

and are determined at the mold parting line.

Seating Plane

y

4. Controlling dimension: Inches.

5. General appearance spec. should be based

on final visual inspection spec.

Publication Release Date: May 1997

Revision A14

- 9 -

W24257A

Package Dimensions, continued

28-pin SO Wide Body

Dimension in mm

Dimension in Inches

Symbol

A

Nom.

Min.

Max. Min.

0.112

Max.

2.85

28

15

0.004

0.093

0.014

0.10

2.36

0.36

0.20

1

A

e₁

0.098 0.103

2.49

0.41

0.25

2.62

0.51

0.36

18.62

8.53

1.42

A

b

c

2

0.016

0.020

0.014

0.008 0.010

E

0.713 0.733

0.326 0.331 0.336

0.044 0.050 0.056

18.11

8.41

1.27

HE

D

E

e

8.28

1.12

q

0.453 0.465 0.477 11.51 11.81 12.12

H

L

S

y

q

E

L

0.044

0.028 0.036

0.059

0.91

1.70

1.12

0.71

1.50

Detail F

14

1

0.075

0.047

0.067

1.91

1.19

E

b

0.10

10

0.004

10

0

Notes:

1. Dimensions D Max. & S include mold flash

or tie bar burrs.

e₁

D

2. Dimension b does not include dambar

protrusion/intrusion.

c

2

A

3. Dimensions D & E include mold mismatch

.

and are determined at the mold parting line.

1

A

S

e

L _E

y

4. Controlling dimension: Inches.

5. General appearance spec should be based

on final visual inspection spec.

See Detail F

Seating Plane

28-pin Standard Type One TSOP

D

H

Dimension in Inches Dimension in mm

Symbol

A

Max.

1.20

Min. Nom. Max. Min. Nom.

D

0.047

c

0.006

0.041

0.05

0.002

0.035

0.15

1

A

0.040

0.95

0.17

1.00

0.20

1.05

0.27

2

A

b

c

D

E

e

0.007 0.008 0.011

0.10

0.004

0.461

0.008

0.465 0.469

0.15

11.80

8.00

0.21

0.006

E

11.70

11.90

0.311 0.315 0.319

0.520 0.528 0.536

0.022

8.10

7.90

b

13.60

13.40

13.20

H

e

L

D

0.55

0.60

0.25

0.50

0.70

0.020

0.028

0.024

0.010

L₁

Y

q

0.000

0

0.10

5

0.004

5

0.00

0

3

q

Note: Controlling dimension: Millimeters

1

A

L

Y

2

A

1

L

- 10 -

W24257A

Winbond Electronics (H.K.) Ltd.

Winbond Electronics North America Corp.

Winbond Memory Lab.

Winbond Microelectronics Corp.

Winbond Systems Lab.

Headquarters

No. 4, Creation Rd. III,

Science-Based Industrial Park,

Hsinchu, Taiwan

TEL: 886-3-5770066

FAX: 886-3-5792647

http://www.winbond.com.tw/

Voice & Fax-on-demand: 886-2-7197006

Rm. 803, World Trade Square, Tower II,

123 Hoi Bun Rd., Kwun Tong,

Kowloon, Hong Kong

TEL: 852-27513100

FAX: 852-27552064

2730 Orchard Parkway, San Jose,

CA 95134, U.S.A.

TEL: 1-408-9436666

FAX: 1-408-9436668

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.,

Taipei, Taiwan

TEL: 886-2-7190505

FAX: 886-2-7197502

Note: All data and specifications are subject to change without notice.

Publication Release Date: May 1997

Revision A14

- 11 -

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