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产品型号XCF08PFSG48C的概述

芯片XCF08PFSG48C的概述 XCF08PFSG48C是一款由Xilinx公司开发的FPGA配置存储器。这款芯片主要用于支持Xilinx的FPGA设备,提供可靠的配置功能,并具备高性能以及高密度的特性。随着数字电路设计的复杂性和性能需求不断提升,XCF08PFSG48C作为一款高品质的配置存储解决方案,即便在苛刻的应用环境中也能确保稳定的操作。 该芯片采用FLASH技术,支持多种配置模式,广泛应用于通信、工业控制、医疗设备等领域。其高容量使得用户能够存储复杂的逻辑配置,而低功耗特性则简化了系统的热管理需求。 芯片XCF08PFSG48C的详细参数 以下是XCF08PFSG48C的主要技术参数: - 容量:8Mb - 封装类型:48引脚TQFP - 工作电压:3.3V - 工作温度范围:-40°C 到 +85°C - 访问速度:最高40MHz - 读取时序:9ns - 写入时序:1...

产品型号XCF08PFSG48C的Datasheet PDF文件预览

<BL Blue>  
Platform Flash In-System  
Programmable Configuration  
PROMS  
R
0
DS123 (v2.9) May 09, 2006  
Product Specification  
Features  
In-System Programmable PROMs for Configuration of  
Xilinx FPGAs  
XCF01S/XCF02S/XCF04S  
3.3V supply voltage  
Low-Power Advanced CMOS NOR FLASH Process  
Endurance of 20,000 Program/Erase Cycles  
Serial FPGA configuration interface (up to 33 MHz)  
Available in small-footprint VO20 and VOG20  
packages.  
Operation over Full Industrial Temperature Range  
(–40°C to +85°C)  
XCF08P/XCF16P/XCF32P  
IEEE Standard 1149.1/1532 Boundary-Scan (JTAG)  
Support for Programming, Prototyping, and Testing  
1.8V supply voltage  
Serial or parallel FPGA configuration interface  
(up to 33 MHz)  
JTAG Command Initiation of Standard FPGA  
Configuration  
Available in small-footprint VO48, VOG48, FS48,  
and FSG48 packages  
Cascadable for Storing Longer or Multiple Bitstreams  
Dedicated Boundary-Scan (JTAG) I/O Power Supply  
Design revision technology enables storing and  
accessing multiple design revisions for  
configuration  
(V  
)
CCJ  
I/O Pins Compatible with Voltage Levels Ranging From  
1.5V to 3.3V  
Built-in data decompressor compatible with Xilinx  
advanced compression technology  
Design Support Using the Xilinx Alliance ISE and  
Foundation ISE Series Software Packages  
Table 1: Platform Flash PROM Features  
Program  
In-system  
via JTAG  
Serial  
Parallel  
Design  
Density  
VCCINT VCCO Range VCCJ Range  
Packages  
Compression  
Device  
Config. Config. Revisioning  
XCF01S  
XCF02S  
XCF04S  
1 Mbit  
2 Mbit  
4 Mbit  
3.3V 1.8V – 3.3V 2.5V – 3.3V VO20/VOG20  
3.3V 1.8V – 3.3V 2.5V – 3.3V VO20/VOG20  
3.3V 1.8V – 3.3V 2.5V – 3.3V VO20/VOG20  
VO48/VOG48  
1.8V 1.5V – 3.3V 2.5V – 3.3V  
FS48/FSG48  
XCF08P  
8 Mbit  
VO48/VOG48  
1.8V 1.5V – 3.3V 2.5V – 3.3V  
FS48/FSG48  
XCF16P 16 Mbit  
XCF32P 32 Mbit  
VO48/VOG48  
1.8V 1.5V – 3.3V 2.5V – 3.3V  
FS48/FSG48  
Description  
Xilinx introduces the Platform Flash series of in-system  
programmable configuration PROMs. Available in 1 to 32  
Megabit (Mbit) densities, these PROMs provide an  
easy-to-use, cost-effective, and reprogrammable method  
for storing large Xilinx FPGA configuration bitstreams. The  
Platform Flash PROM series includes both the 3.3V  
XCFxxS PROM and the 1.8V XCFxxP PROM. The XCFxxS  
version includes 4-Mbit, 2-Mbit, and 1-Mbit PROMs that  
support Master Serial and Slave Serial FPGA configuration  
modes (Figure 1, page 2). The XCFxxP version includes  
32-Mbit, 16-Mbit, and 8-Mbit PROMs that support Master  
Serial, Slave Serial, Master SelectMAP, and Slave  
SelectMAP FPGA configuration modes (Figure 2, page 2).  
A summary of the Platform Flash PROM family members  
and supported features is shown in Table 1.  
© 2003-2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.  
PowerPC is a trademark of IBM, Inc. All other trademarks are the property of their respective owners. All specifications are subject to change without notice.  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
CLK CE  
OE/RESET  
TCK  
TMS  
TDI  
Data  
Control  
and  
JTAG  
CEO  
Serial  
Memory  
Interface  
Data  
DATA (D0)  
Serial Mode  
Address  
Interface  
TDO  
CF  
ds123_01_30603  
Figure 1: XCFxxS Platform Flash PROM Block Diagram  
FI  
CLK  
CE  
EN_EXT_SEL  
OE/RESET BUSY  
OSC  
CLKOUT  
CEO  
Decompressor  
Control  
and  
JTAG  
Serial  
or  
Parallel  
Interface  
TCK  
TMS  
TDI  
Data  
Memory  
DATA (D0)  
(Serial/Parallel Mode)  
Address  
TDO  
Interface  
Data  
D[1:7]  
(Parallel Mode)  
ds123_19_122105  
CF  
REV_SEL [1:0]  
Figure 2: XCFxxP Platform Flash PROM Block Diagram  
When the FPGA is in Master Serial mode, it generates a  
configuration clock that drives the PROM. With CF High, a  
short access time after CE and OE are enabled, data is  
available on the PROM DATA (D0) pin that is connected to  
the FPGA DIN pin. New data is available a short access  
time after each rising clock edge. The FPGA generates the  
appropriate number of clock pulses to complete the  
configuration.  
the PROMs DATA (D0-D7) pins. New data is available a  
short access time after each rising clock edge. The data is  
clocked into the FPGA on the following rising edge of the  
CCLK. A free-running oscillator can be used in the Slave  
Parallel /Slave SelecMAP mode.  
The XCFxxP version of the Platform Flash PROM provides  
additional advanced features. A built-in data decompressor  
supports utilizing compressed PROM files, and design  
revisioning allows multiple design revisions to be stored on  
a single PROM or stored across several PROMs. For design  
revisioning, external pins or internal control bits are used to  
select the active design revision.  
When the FPGA is in Slave Serial mode, the PROM and the  
FPGA are both clocked by an external clock source, or  
optionally, for the XCFxxP PROM only, the PROM can be  
used to drive the FPGA’s configuration clock.  
The XCFxxP version of the Platform Flash PROM also  
supports Master SelectMAP and Slave SelectMAP (or  
Slave Parallel) FPGA configuration modes. When the FPGA  
is in Master SelectMAP mode, the FPGA generates a  
configuration clock that drives the PROM. When the FPGA  
is in Slave SelectMAP Mode, either an external oscillator  
generates the configuration clock that drives the PROM and  
the FPGA, or optionally, the XCFxxP PROM can be used to  
drive the FPGA’s configuration clock. With BUSY Low and  
CF High, after CE and OE are enabled, data is available on  
Multiple Platform Flash PROM devices can be cascaded to  
support the larger configuration files required when  
targeting larger FPGA devices or targeting multiple FPGAs  
daisy chained together. When utilizing the advanced  
features for the XCFxxP Platform Flash PROM, such as  
design revisioning, programming files which span cascaded  
PROM devices can only be created for cascaded chains  
containing only XCFxxP PROMs. If the advanced XCFxxP  
features are not enabled, then the cascaded chain can  
include both XCFxxP and XCFxxS PROMs.  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
The Platform Flash PROMs are compatible with all of the existing FPGA device families. A reference list of Xilinx FPGAs and  
the respective compatible Platform Flash PROMs is given in Table 2. A list of Platform Flash PROMs and their capacities is  
given in Table 3, page 4.  
Table 2: Xilinx FPGAs and Compatible Platform Flash  
PROMs (Continued)  
Table 2: Xilinx FPGAs and Compatible Platform Flash  
PROMs  
Configuration  
Bitstream  
FPGA  
Platform Flash PROM(1)  
Configuration  
Bitstream  
FPGA  
Platform Flash PROM(1)  
Virtex-II (3)  
XC2V40  
Virtex-5 LX  
XC5VLX30  
XC5VLX50  
XC5VLX85  
XC5VLX110  
XC5VLX220  
XC5VLX330  
Virtex-4 LX  
XC4VLX15  
XC4VLX25  
XC4VLX40  
XC4VLX60  
XC4VLX80  
XC4VLX100  
XC4VLX160  
XC4VLX200  
Virtex-4 FX  
XC4VFX12  
XC4VFX20  
XC4VFX40  
XC4VFX60  
XC4VFX100  
XC4VFX140  
Virtex-4 SX  
XC4VSX25  
XC4VSX35  
XC4VSX55  
Virtex-II Pro X  
XC2VPX20  
XC2VPX70  
Virtex-II Pro  
XC2VP2  
360,096  
XCF01S  
XCF01S  
XCF02S  
XCF04S  
XCF04S  
XCF08P  
XCF08P  
XCF16P  
XCF16P  
XCF32P  
XCF32P  
8,374,016  
12,556,672  
21,845,632  
29,124,608  
53,139,456  
XCF08P  
XCF16P  
XC2V80  
635,296  
1,697,184  
2,761,888  
4,082,592  
5,659,296  
7,492,000  
10,494,368  
15,659,936  
21,849,504  
29,063,072  
XC2V250  
XC2V500  
XC2V1000  
XC2V1500  
XC2V2000  
XC2V3000  
XC2V4000  
XC2V6000  
XC2V8000  
Virtex-E  
XCF32P  
XCF32P  
XCF32P+XCF32P  
79,704,832 XCF32P+XCF32P+XCF16P  
4,765,568  
7,819,904  
XCF08P  
XCF08P  
12,259,712  
17,717,632  
23,291,008  
30,711,680  
40,347,008  
51,367,808  
XCF16P  
XCF32P  
XCF32P  
XCV50E  
630,048  
863,840  
XCF01S  
XCF01S  
XCF02S  
XCF02S  
XCF04S  
XCF04S  
XCF04S  
XCF08P  
XCF08P  
XCF08P  
XCF16P  
XCF16P  
XCF16P  
XCF32P  
XCV100E  
XCV200E  
XCV300E  
XCV400E  
XCV405E  
XCV600E  
XCV812E  
XCV1000E  
XCV1600E  
XCV2000E  
XCV2600E  
XCV3200E  
Virtex  
XCF32P+XCF08P  
XCF32P+XCF32P  
1,442,016  
1,875,648  
2,693,440  
3,430,400  
3,961,632  
6,519,648  
6,587,520  
8,308,992  
10,159,648  
12,922,336  
16,283,712  
4,765,568  
7,242,624  
XCF08P  
XCF08P  
14,936,192  
21,002,880  
33,065,408  
47,856,896  
XCF16P  
XCF32P  
XCF32P  
XCF32P+XCF16P  
9,147,648  
13,700,288  
22,749,184  
XCF16P  
XCF16P  
XCF32P  
XCV50  
559,200  
781,216  
XCF01S  
XCF01S  
XCF01S  
XCF02S  
XCF02S  
XCF04S  
XCF04S  
XCF08P  
XCF08P  
XCV100  
8,214,560  
XCF08P  
XCF32P  
XCV150  
1,040,096  
1,335,840  
1,751,808  
2,546,048  
3,607,968  
4,715,616  
6,127,744  
26,098,976  
XCV200  
XCV300  
1,305,376  
3,006,496  
4,485,408  
8,214,560  
11,589,920  
15,868,192  
19,021,344  
26,098,976  
34,292,768  
XCF02S  
XCF04S  
XCF08P  
XCF08P  
XCF16P  
XCF16P  
XCF32P  
XCF32P  
XCF32P(2)  
XCV400  
XC2VP4  
XCV600  
XC2VP7  
XCV800  
XC2VP20  
XCV1000  
Spartan-3E  
XC3S100E  
XC3S250E  
XC3S500E  
XC2VP30  
XC2VP40  
581,344  
1,352,192  
2,267,136  
XCF01S  
XCF02S  
XCF04S  
XC2VP50  
XC2VP70  
XC2VP100  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
Table 2: Xilinx FPGAs and Compatible Platform Flash  
PROMs (Continued)  
Programming  
Configuration  
In-System Programming  
FPGA  
Platform Flash PROM(1)  
Bitstream  
3,832,320  
5,957,760  
In-System Programmable PROMs can be programmed  
individually, or two or more can be daisy-chained together  
and programmed in-system via the standard 4-pin JTAG  
protocol as shown in Figure 3. In-system programming  
offers quick and efficient design iterations and eliminates  
unnecessary package handling or socketing of devices. The  
programming data sequence is delivered to the device  
using either Xilinx iMPACT software and a Xilinx download  
cable, a third-party JTAG development system, a  
JTAG-compatible board tester, or a simple microprocessor  
interface that emulates the JTAG instruction sequence. The  
iMPACT software also outputs serial vector format (SVF)  
files for use with any tools that accept SVF format, including  
automatic test equipment. During in-system programming,  
the CEO output is driven High. All other outputs are held in  
a high-impedance state or held at clamp levels during  
in-system programming. In-system programming is fully  
supported across the recommended operating voltage and  
temperature ranges.  
XC3S1200E  
XC3S1600E  
Spartan-3L  
XC3S1000L  
XC3S1500L  
XC3S5000L  
Spartan-3  
XC3S50  
XCF04S  
XCF08P  
3,223,488  
5,214,784  
13,271,936  
XCF04S  
XCF08P  
XCF16P  
439,264  
1,047,616  
1,699,136  
3,223,488  
5,214,784  
7,673,024  
11,316,864  
13,271,936  
XCF01S  
XCF01S  
XCF02S  
XCF04S  
XCF08P  
XCF08P  
XCF16P  
XCF16P  
XC3S200  
XC3S400  
XC3S1000  
XC3S1500  
XC3S2000  
XC3S4000  
XC3S5000  
Spartan-IIE  
XC2S50E  
XC2S100E  
XC2S150E  
XC2S200E  
XC2S300E  
XC2S400E  
XC2S600E  
Spartan-II  
XC2S15  
630,048  
863,840  
XCF01S  
XCF01S  
XCF02S  
XCF02S  
XCF02S  
XCF04S  
XCF04S  
1,134,496  
1,442,016  
1,875,648  
2,693,440  
3,961,632  
197,696  
336,768  
XCF01S  
XCF01S  
XCF01S  
XCF01S  
XCF01S  
XCF02S  
XC2S30  
(a)  
(b)  
XC2S50  
559,200  
DS026_02_082703  
XC2S100  
781,216  
Figure 3: JTAG In-System Programming Operation  
(a) Solder Device to PCB  
XC2S150  
1,040,096  
1,335,840  
(b) Program Using Download Cable  
XC2S200  
Notes:  
OE/RESET  
1. If design revisioning or other advanced feature support is  
required, the XCFxxP can be used as an alternative to the  
XCF01S, XCF02S, or XCF04S.  
The 1/2/4 Mbit XCFxxS Platform Flash PROMs in-system  
programming algorithm results in issuance of an internal  
device reset that causes OE/RESET to pulse Low.  
2. Assumes compression used.  
3. The largest possible Virtex-II bitstream sizes are specified. Refer  
to the Virtex-II User Guide for information on bitgen options  
which affect bitstream size.  
External Programming  
Xilinx reprogrammable PROMs can also be programmed by  
the Xilinx MultiPRO Desktop Tool or a third-party device  
programmer. This provides the added flexibility of using  
pre-programmed devices with an in-system programmable  
option for future enhancements and design changes.  
Table 3: Platform Flash PROM Capacity  
Platform  
Flash PROM  
Configuration  
Bits  
Platform  
Flash PROM  
Configuration  
Bits  
XCF01S  
XCF02S  
XCF04S  
1,048,576 XCF08P  
8,388,608  
16,777,216  
33,554,432  
2,097,152 XCF16P  
4,194,304 XCF32P  
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Platform Flash In-System Programmable Configuration PROMS  
operations. For the XCFxxS PROM, the read protect  
security bit is set for the entire device, and resetting the read  
protect security bit requires erasing the entire device. For  
the XCFxxP PROM the read protect security bit can be set  
for individual design revisions, and resetting the read  
protect bit requires erasing the particular design revision.  
Reliability and Endurance  
Xilinx in-system programmable products provide a  
guaranteed endurance level of 20,000 in-system  
program/erase cycles and a minimum data retention of 20  
years. Each device meets all functional, performance, and  
data retention specifications within this endurance limit.  
Write Protection  
Design Security  
The XCFxxP PROM device also allows the user to write  
protect (or lock) a particular design revision to prevent  
inadvertent erase or program operations. Once set, the  
write protect security bit for an individual design revision  
must be reset (using the UNLOCK command followed by  
ISC_ERASE command) before an erase or program  
operation can be performed.  
The Xilinx in-system programmable Platform Flash PROM  
devices incorporate advanced data security features to fully  
protect the FPGA programming data against unauthorized  
reading via JTAG. The XCFxxP PROMs can also be  
programmed to prevent inadvertent writing via JTAG.  
Table 4 and Table 5 show the security settings available for  
the XCFxxS PROM and XCFxxP PROM, respectively.  
Table 4: XCFxxS Device Data Security Options  
Read Protection  
Read/Verify  
Inhibited  
Program  
Inhibited  
Erase  
Inhibited  
Read Protect  
The read protect security bit can be set by the user to  
prevent the internal programming pattern from being read or  
copied via JTAG. Read protection does not prevent write  
Reset (default)  
Set  
Table 5: XCFxxP Design Revision Data Security Options  
Read/Verify  
Inhibited  
Read Protect  
Reset (default)  
Write Protect  
Program Inhibited  
Erase Inhibited  
Reset (default)  
Set  
Reset (default)  
Set  
Set  
Reset (default)  
Set  
Instruction Register  
IEEE 1149.1 Boundary-Scan (JTAG)  
The Instruction Register (IR) for the Platform Flash PROM  
is connected between TDI and TDO during an instruction  
scan sequence. In preparation for an instruction scan  
sequence, the instruction register is parallel loaded with a  
fixed instruction capture pattern. This pattern is shifted out  
onto TDO (LSB first), while an instruction is shifted into the  
instruction register from TDI.  
The Platform Flash PROM family is compatible with the IEEE  
1149.1 boundary-scan standard and the IEEE 1532  
in-system configuration standard. A Test Access Port (TAP)  
and registers are provided to support all required boundary  
scan instructions, as well as many of the optional  
instructions specified by IEEE Std. 1149.1. In addition, the  
JTAG interface is used to implement in-system programming  
(ISP) to facilitate configuration, erasure, and verification  
operations on the Platform Flash PROM device. Table 6,  
page 6 lists the required and optional boundary-scan  
instructions supported in the Platform Flash PROMs. Refer  
to the IEEE Std. 1149.1 specification for a complete  
description of boundary-scan architecture and the required  
and optional instructions.  
XCFxxS Instruction Register (8 bits wide)  
The Instruction Register (IR) for the XCFxxS PROM is eight  
bits wide and is connected between TDI and TDO during an  
instruction scan sequence. The detailed composition of the  
instruction capture pattern is illustrated in Table 7, page 6.  
The instruction capture pattern shifted out of the XCFxxS  
device includes IR[7:0]. IR[7:5] are reserved bits and are set  
to a logic 0. The ISC Status field, IR[4], contains logic 1 if  
the device is currently in In-System Configuration (ISC)  
mode; otherwise, it contains logic 0. The Security field,  
IR[3], contains logic 1 if the device has been programmed  
with the security option turned on; otherwise, it contains  
Caution! The XCFxxP JTAG TAP pause states are not fully compliant with  
the JTAG 1149.1 specification. If a temporary pause of a JTAG shift operation is  
required, then stop the JTAG TCK clock and maintain the JTAG TAP within the  
JTAG Shift-IR or Shift-DR TAP state. Do not transition the XCFxxP JTAG TAP  
through the JTAG Pause-IR or Pause-DR TAP state to temporarily pause a  
JTAG shift operation.  
DS123 (v2.9) May 09, 2006  
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5
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Platform Flash In-System Programmable Configuration PROMS  
logic 0. IR[2] is unused, and is set to '0'. The remaining bits  
IR[1:0] are set to '01' as defined by IEEE Std. 1149.1.  
Erase/Program (ER/PROG) Error field, IR[6:5], contains a  
10 when an erase or program operation is a success;  
otherwise a 01 when an erase or program operation fails.  
The Erase/Program (ER/PROG) Status field, IR[4], contains  
a logic 0 when the device is busy performing an erase or  
programming operation; otherwise, it contains a logic 1. The  
ISC Status field, IR[3], contains logic 1 if the device is  
currently in In-System Configuration (ISC) mode; otherwise,  
it contains logic 0. The DONE field, IR[2], contains logic 1 if  
the sampled design revision has been successfully  
programmed; otherwise, a logic 0 indicates incomplete  
programming. The remaining bits IR[1:0] are set to 01 as  
defined by IEEE Std. 1149.1.  
XCFxxP Instruction Register (16 bits wide)  
The Instruction Register (IR) for the XCFxxP PROM is sixteen  
bits wide and is connected between TDI and TDO during an  
instruction scan sequence. The detailed composition of the  
instruction capture pattern is illustrated in Table 8, page 6.  
The instruction capture pattern shifted out of the XCFxxP  
device includes IR[15:0]. IR[15:9] are reserved bits and are  
set to a logic 0. The ISC Error field, IR[8:7], contains a 10  
when an ISC operation is a success; otherwise a 01 when  
an In-System Configuration (ISC) operation fails. The  
Table 6: Platform Flash PROM Boundary Scan Instructions  
XCFxxS IR[7:0]  
(hex)  
XCFxxP IR[15:0]  
Boundary-Scan Command  
Instruction Description  
(hex)  
Required Instructions  
BYPASS  
FF  
01  
00  
FFFF  
0001  
0000  
Enables BYPASS  
SAMPLE/PRELOAD  
EXTEST  
Enables boundary-scan SAMPLE/PRELOAD operation  
Enables boundary-scan EXTEST operation  
Optional Instructions  
CLAMP  
HIGHZ  
FA  
FC  
00FA  
00FC  
Enables boundary-scan CLAMP operation  
Places all outputs in high-impedance state  
simultaneously  
IDCODE  
FE  
FD  
00FE  
00FD  
Enables shifting out 32-bit IDCODE  
USERCODE  
Enables shifting out 32-bit USERCODE  
Platform Flash PROM  
Specific Instructions  
Initiates FPGA configuration by pulsing CF pin Low  
once. (For the XCFxxP this command also resets the  
selected design revision based on either the external  
REV_SEL[1:0] pins or on the internal design revision  
selection bits.)(1)  
CONFIG  
EE  
00EE  
Notes:  
1. For more information see "Initiating FPGA Configuration," page 13.  
Table 7: XCFxxS Instruction Capture Values Loaded into IR as part of an Instruction Scan Sequence  
IR[7:5]  
IR[4]  
IR[3]  
IR[2]  
IR[1:0]  
TDI →  
TDO  
TDO  
Reserved  
ISC Status  
Security  
0
0 1  
Table 8: XCFxxP Instruction Capture Values Loaded into IR as part of an Instruction Scan Sequence  
IR[15:9]  
IR[8:7]  
IR[6:5]  
IR[4]  
IR[3]  
IR[2]  
IR[1:0]  
TDI →  
ER/PROG  
Error  
ER/PROG  
Status  
Reserved  
ISC Error  
ISC Status  
DONE  
0 1  
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Platform Flash In-System Programmable Configuration PROMS  
Boundary Scan Register  
The boundary-scan register is used to control and observe  
the state of the device pins during the EXTEST,  
The IDCODE register has the following binary format:  
vvvv:ffff:ffff:aaaa:aaaa:cccc:cccc:ccc1  
where  
SAMPLE/PRELOAD, and CLAMP instructions. Each output  
pin on the Platform Flash PROM has two register stages  
which contribute to the boundary-scan register, while each  
input pin has only one register stage. The bidirectional pins  
have a total of three register stages which contribute to the  
boundary-scan register. For each output pin, the register  
stage nearest to TDI controls and observes the output state,  
and the second stage closest to TDO controls and observes  
the High-Z enable state of the output pin. For each input pin,  
a single register stage controls and observes the input state  
of the pin. The bidirectional pin combines the three bits, the  
input stage bit is first, followed by the output stage bit and  
finally the output enable stage bit. The output enable stage  
bit is closest to TDO.  
v = the die version number  
f = the PROM family code  
a = the specific Platform Flash PROM product ID  
c = the Xilinx manufacturer's ID  
The LSB of the IDCODE register is always read as logic 1  
as defined by IEEE Std. 1149.1.  
USERCODE Register  
The USERCODE instruction gives access to a 32-bit user  
programmable scratch pad typically used to supply  
information about the device's programmed contents. By  
using the USERCODE instruction, a user-programmable  
identification code can be shifted out for examination. This  
code is loaded into the USERCODE register during  
programming of the Platform Flash PROM. If the device is  
blank or was not loaded during programming, the  
USERCODE register contains FFFFFFFFh.  
See the XCFxxS/XCFxxP Pin Names and Descriptions  
Tables in the "Pinouts and Pin Descriptions," page 37  
section for the boundary-scan bit order for all connected  
device pins, or see the appropriate BSDL file for the  
complete boundary-scan bit order description under the  
"attribute BOUNDARY_REGISTER" section in the BSDL  
file. The bit assigned to boundary-scan cell 0 is the LSB in  
the boundary-scan register, and is the register bit closest to  
TDO.  
Customer Code Register  
For the XCFxxP Platform Flash PROM, in addition to the  
USERCODE, a unique 32-byte Customer Code can be  
assigned to each design revision enabled for the PROM.  
The Customer Code is set during programming, and is  
typically used to supply information about the design  
revision contents. A private JTAG instruction is required to  
read the Customer Code. If the PROM is blank, or the  
Customer Code for the selected design revision was not  
loaded during programming, or if the particular design  
revision is erased, the Customer Code will contain all ones.  
Identification Registers  
IDCODE Register  
The IDCODE is a fixed, vendor-assigned value that is used  
to electrically identify the manufacturer and type of the  
device being addressed. The IDCODE register is 32 bits  
wide. The IDCODE register can be shifted out for  
examination by using the IDCODE instruction. The IDCODE  
is available to any other system component via JTAG.  
Table 9 lists the IDCODE register values for the Platform  
Flash PROMs.  
Platform Flash PROM TAP  
Characteristics  
Table 9: IDCODES Assigned to Platform Flash PROMs  
The Platform Flash PROM family performs both in-system  
programming and IEEE 1149.1 boundary-scan (JTAG)  
testing via a single 4-wire Test Access Port (TAP). This  
simplifies system designs and allows standard Automatic  
Test Equipment to perform both functions. The AC  
characteristics of the Platform Flash PROM TAP are  
described as follows.  
Device  
XCF01S  
XCF02S  
XCF04S  
XCF08P  
XCF16P  
XCF32P  
IDCODE(1) (hex)  
<v>5044093  
<v>5045093  
<v>5046093  
<v>5057093  
<v>5058093  
<v>5059093  
TAP Timing  
Figure 4, page 8 shows the timing relationships of the TAP  
signals. These TAP timing characteristics are identical for  
both boundary-scan and ISP operations.  
Notes:  
1. The <v> in the IDCODE field represents the device’s revision  
code (in hex) and may vary.  
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Platform Flash In-System Programmable Configuration PROMS  
T
CKMIN  
TCK  
TMS  
T
T
MSS  
MSH  
T
T
DIH  
DIS  
TDI  
T
DOV  
TDO  
DS026_04_020300  
Figure 4: Test Access Port Timing  
TAP AC Parameters  
Table 10 shows the timing parameters for the TAP waveforms shown in Figure 4.  
Table 10: Test Access Port Timing Parameters  
Symbol  
TCKMIN  
Description  
TCK minimum clock period when VCCJ = 2.5V or 3.3V  
TMS setup time when VCCJ = 2.5V or 3.3V  
TMS hold time when VCCJ = 2.5V or 3.3V  
TDI setup time when VCCJ = 2.5V or 3.3V  
TDI hold time when VCCJ = 2.5V or 3.3V  
TDO valid delay when VCCJ = 2.5V or 3.3V  
Min  
100  
10  
25  
10  
25  
Max  
Units  
ns  
TMSS  
TMSH  
TDIS  
ns  
ns  
ns  
TDIH  
ns  
TDOV  
30  
ns  
The CLKOUT signal is enabled during programming, and is  
active when CE is Low and OE/RESET is High. On CE  
rising edge transition, if OE/RESET is High and the PROM  
terminal count has not been reached, then CLKOUT  
remains active for an additional eights clock cycles before  
being disabled. On a OE/RESET falling edge transition,  
CLKOUT is immediately disabled. When disabled, the  
CLKOUT pin is put into a high-impedance state and should  
be pulled High externally to provide a known state.  
Additional Features for the XCFxxP  
Internal Oscillator  
The 8/16/32 Mbit XCFxxP Platform Flash PROMs include  
an optional internal oscillator which can be used to drive the  
CLKOUT and DATA pins on FPGA configuration interface.  
The internal oscillator can be enabled when programming  
the PROM, and the oscillator can be set to either the default  
frequency or to a slower frequency ("XCFxxP PROM as  
Configuration Master with Internal Oscillator as Clock  
Source," page 33).  
When cascading Platform Flash PROMs with CLKOUT  
enabled, after completing it's data transfer, the first PROM  
disables CLKOUT and drives the CEO pin enabling the next  
PROM in the PROM chain. The next PROM will begin  
driving the CLKOUT signal once that PROM is enabled and  
data is available for transfer.  
CLKOUT  
The 8/16/32 Mbit XCFxxP Platform Flash PROMs include  
the programmable option to enable the CLKOUT signal  
which allows the PROM to provide a source synchronous  
clock aligned to the data on the configuration interface. The  
CLKOUT signal is derived from one of two clock sources: the  
CLK input pin or the internal oscillator. The input clock source  
is selected during the PROM programming sequence.  
Output data is available on the rising edge of CLKOUT.  
During high-speed parallel configuration without  
compression, the FPGA drives the BUSY signal on the  
configuration interface. When BUSY is asserted High, the  
PROMs internal address counter stops incrementing, and  
the current data value is held on the data outputs. While  
BUSY is High, the PROM will continue driving the CLKOUT  
signal to the FPGA, clocking the FPGA’s configuration logic.  
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Platform Flash In-System Programmable Configuration PROMS  
When the FPGA deasserts BUSY, indicating that it is ready  
to receive additional configuration data, the PROM will  
begin driving new data onto the configuration interface.  
A single 32-Mbit PROM contains four 8-Mbit memory  
blocks, and can therefore store up to four separate  
design revisions: one 32-Mbit design revision, two  
16-Mbit design revisions, three 8-Mbit design revisions,  
four 8-Mbit design revisions, and so on.  
Decompression  
Because of the 8-Mbit minimum size requirement for  
each revision, a single 16-Mbit PROM can only store  
up to two separate design revisions: one 16-Mbit  
design revision, one 8-Mbit design revision, or two  
8-Mbit design revisions.  
The 8/16/32 Mbit XCFxxP Platform Flash PROMs include a  
built-in data decompressor compatible with Xilinx advanced  
compression technology. Compressed Platform Flash  
PROM files are created from the target FPGA bitstream(s)  
using the iMPACT software. Only Slave Serial and Slave  
SelectMAP (parallel) configuration modes are supported for  
FPGA configuration when using a XCFxxP PROM  
A single 8-Mbit PROM can store only one 8-Mbit  
design revision.  
Larger design revisions can be split over several cascaded  
PROMs. For example, two 32-Mbit PROMs can store up to  
four separate design revisions: one 64-Mbit design revision,  
two 32-Mbit design revisions, three 16-Mbit design revisions,  
four 16-Mbit design revisions, and so on. When cascading  
one 16-Mbit PROM and one 8-Mbit PROM, there are 24 Mbits  
of available space, and therefore up to three separate design  
revisions can be stored: one 24-Mbit design revision, two  
8-Mbit design revisions, or three 8-Mbit design revisions.  
programmed with a compressed bitstream. Compression  
rates will vary depending on several factors, including the  
target device family and the target design contents.  
The decompression option is enabled during the PROM  
programming sequence. The PROM decompresses the  
stored data before driving both clock and data onto the  
FPGA's configuration interface. If Decompression is  
enabled, then the Platform Flash clock output pin  
(CLKOUT) must be used as the clock signal for the  
configuration interface, driving the target FPGA's  
configuration clock input pin (CCLK). Either the PROM's  
CLK input pin or the internal oscillator must be selected as  
the source for CLKOUT. Any target FPGA connected to the  
PROM must operate as slave in the configuration chain,  
with the configuration mode set to Slave Serial mode or  
Slave SelectMap (parallel) mode.  
See Figure 5, page 10 for a few basic examples of how  
multiple revisions can be stored. The design revision  
partitioning is handled automatically during file generation  
in iMPACT.  
During the PROM file creation, each design revision is  
assigned a revision number:  
Revision 0 = '00'  
Revision 1 = '01'  
Revision 2 = '10'  
Revision 3 = '11'  
When decompression is enabled, the CLKOUT signal  
becomes a controlled clock output with a reduced maximum  
frequency. When decompressed data is not ready, the  
CLKOUT pin is put into a high-Z state and must be pulled  
High externally to provide a known state.  
After programming the Platform Flash PROM with a set of  
design revisions, a particular design revision can be  
selected using the external REV_SEL[1:0] pins or using the  
internal programmable design revision control bits. The  
EN_EXT_SEL pin determines if the external pins or internal  
bits are used to select the design revision. When  
The BUSY input is automatically disabled when  
decompression is enabled.  
Design Revisioning  
EN_EXT_SEL is Low, design revision selection is controlled  
by the external Revision Select pins, REV_SEL[1:0]. When  
EN_EXT_SEL is High, design revision selection is  
controlled by the internal programmable Revision Select  
control bits. During power up, the design revision selection  
inputs (pins or control bits) are sampled internally. After  
power up, the design revision selection inputs are sampled  
again when any of the following events occur:  
Design Revisioning allows the user to create up to four  
unique design revisions on a single PROM or stored across  
multiple cascaded PROMs. Design Revisioning is supported  
for the 8/16/32 Mbit XCFxxP Platform Flash PROMs in both  
serial and parallel modes. Design Revisioning can be used  
with compressed PROM files, and also when the CLKOUT  
feature is enabled. The PROM programming files along with  
the revision information files (.cfi) are created using the  
iMPACT software. The .cfi file is required to enable design  
revision programming in iMPACT.  
On the rising edge of CE  
On the falling edge of OE/RESET (when CE is Low)  
On the rising edge of CF (when CE is Low)  
A single design revision is composed of from 1 to n 8-Mbit  
memory blocks. If a single design revision contains less  
than 8 Mbits of data, then the remaining space is padded  
with all ones. A larger design revision can span several  
8-Mbit memory blocks, and any space remaining in the last  
8-Mbit memory block is padded with all ones.  
When reconfiguration is initiated by using the JTAG  
CONFIG instruction.  
The data from the selected design revision is then  
presented on the FPGA configuration interface.  
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Platform Flash In-System Programmable Configuration PROMS  
PROM 0  
PROM 0  
PROM 0  
PROM 0  
PROM 0  
REV 0  
REV 0  
REV 0  
(8 Mbits)  
(8 Mbits)  
(8 Mbits)  
REV 0  
(16 Mbits)  
REV 1  
REV 1  
(8 Mbits)  
(8 Mbits)  
REV 0  
(32 Mbits)  
REV 1  
REV 2  
(8 Mbits)  
(24 Mbits)  
REV 2  
REV 1  
(16 Mbits)  
(16 Mbits)  
REV 3  
(8 Mbits)  
4 Design Revisions 3 Design Revisions  
2 Design Revisions  
1 Design Revision  
PROM 0  
(a) Design Revision storage examples for a single XCF32P PROM  
PROM 0  
PROM 0  
PROM 0  
PROM 0  
REV 0  
REV 0  
REV 0  
(16 Mbits)  
(16 Mbits)  
(16 Mbits)  
REV 0  
REV 0  
(32 Mbits)  
(32 Mbits)  
REV 1  
REV 1  
REV 1  
(16 Mbits)  
(16 Mbits)  
(16 Mbits)  
PROM 1  
PROM 1  
PROM 1  
PROM 1  
PROM 1  
REV 2  
(16 Mbits)  
REV 2  
REV 1  
REV 1  
REV 0  
(32 Mbits)  
(32 Mbits)  
(32 Mbits)  
(32 Mbits)  
REV 3  
(16 Mbits)  
4 Design Revisions 3 Design Revisions  
2 Design Revisions  
1 Design Revision  
ds123_20_102103  
(b) Design Revision storage examples spanning two XCF32P PROMs  
Figure 5: Design Revision Storage Examples  
PROM to FPGA Configuration Mode and Connections Summary  
The FPGA's I/O, logical functions, and internal  
interconnections are established by the configuration data  
FPGA Master Serial Mode  
In Master Serial mode, the FPGA automatically loads the  
contained in the FPGA’s bitstream. The bitstream is loaded  
into the FPGA either automatically upon power up, or on  
command, depending on the state of the FPGA's mode  
pins. Xilinx Platform Flash PROMs are designed to  
download directly to the FPGA configuration interface.  
FPGA configuration modes which are supported by the  
XCFxxS Platform Flash PROMs include: Master Serial and  
Slave Serial. FPGA configuration modes which are  
supported by the XCFxxP Platform Flash PROMs include:  
Master Serial, Slave Serial, Master SelectMAP, and Slave  
SelectMAP. Below is a short summary of the supported  
FPGA configuration modes. See the respective FPGA data  
sheet for device configuration details, including which  
configuration modes are supported by the targeted FPGA  
device.  
configuration bitstream in bit-serial form from external  
memory synchronized by the configuration clock (CCLK)  
generated by the FPGA. Upon power-up or reconfiguration,  
the FPGA's mode select pins are used to select the Master  
Serial configuration mode. Master Serial Mode provides a  
simple configuration interface. Only a serial data line, a  
clock line, and two control lines (INIT and DONE) are  
required to configure an FPGA. Data from the PROM is  
read out sequentially on a single data line (DIN), accessed  
via the PROM's internal address counter which is  
incremented on every valid rising edge of CCLK. The serial  
bitstream data must be set up at the FPGA’s DIN input pin a  
short time before each rising edge of the FPGA's internally  
generated CCLK signal.  
Typically, a wide range of frequencies can be selected for  
the FPGA’s internally generated CCLK which always starts  
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Platform Flash In-System Programmable Configuration PROMS  
at a slow default frequency. The FPGA’s bitstream contains  
configuration bits which can switch CCLK to a higher  
frequency for the remainder of the Master Serial  
configuration sequence. The desired CCLK frequency is  
selected during bitstream generation.  
The CEO output of a PROM drives the CE input of the  
next PROM in a daisy chain (if any).  
The OE/RESET pins of all PROMs are connected to  
the INIT_B (or INIT) pins of all FPGA devices. This  
connection assures that the PROM address counter is  
reset before the start of any (re)configuration.  
Connecting the FPGA device to the configuration PROM for  
Master Serial Configuration Mode (Figure 6, page 14):  
The PROM CE input can be driven from the DONE pin.  
The CE input of the first (or only) PROM can be driven  
by the DONE output of all target FPGA devices,  
provided that DONE is not permanently grounded. CE  
can also be permanently tied Low, but this keeps the  
The DATA output of the PROM(s) drive the DIN input of  
the lead FPGA device.  
The Master FPGA CCLK output drives the CLK input(s)  
of the PROM(s)  
DATA output active and causes an unnecessary I  
active supply current ("DC Characteristics Over  
Operating Conditions," page 26).  
CC  
The CEO output of a PROM drives the CE input of the  
next PROM in a daisy chain (if any).  
The OE/RESET pins of all PROMs are connected to  
the INIT_B pins of all FPGA devices. This connection  
assures that the PROM address counter is reset before  
the start of any (re)configuration.  
The PROM CF pin is typically connected to the FPGA's  
PROG_B (or PROGRAM) input. For the XCFxxP only,  
the CF pin is a bidirectional pin. If the XCFxxP CF pin is  
not connected to the FPGA's PROG_B (or PROGRAM)  
input, then the pin should be tied High.  
The PROM CE input can be driven from the DONE pin.  
The CE input of the first (or only) PROM can be driven  
by the DONE output of all target FPGA devices,  
Serial Daisy Chain  
provided that DONE is not permanently grounded. CE  
can also be permanently tied Low, but this keeps the  
Multiple FPGAs can be daisy-chained for serial  
configuration from a single source. After a particular FPGA  
has been configured, the data for the next device is routed  
internally to the FPGA’s DOUT pin. Typically the data on the  
DOUT pin changes on the falling edge of CCLK, although  
for some devices the DOUT pin changes on the rising edge  
of CCLK. Consult the respective device data sheets for  
detailed information on a particular FPGA device. For  
clocking the daisy-chained configuration, either the first  
FPGA in the chain can be set to Master Serial, generating  
the CCLK, with the remaining devices set to Slave Serial  
(Figure 8, page 16), or all the FPGA devices can be set to  
Slave Serial and an externally generated clock can be used  
to drive the FPGA's configuration interface (Figure 7,  
page 15 or Figure 12, page 20).  
DATA output active and causes an unnecessary I  
CC  
active supply current ("DC Characteristics Over  
Operating Conditions," page 26).  
The PROM CF pin is typically connected to the FPGA's  
PROG_B (or PROGRAM) input. For the XCFxxP only,  
the CF pin is a bidirectional pin. If the XCFxxP CF pin is  
not connected to the FPGA's PROG_B (or PROGRAM)  
input, then the pin should be tied High.  
FPGA Slave Serial Mode  
In Slave Serial mode, the FPGA loads the configuration  
bitstream in bit-serial form from external memory  
synchronized by an externally supplied clock. Upon  
power-up or reconfiguration, the FPGA's mode select pins  
are used to select the Slave Serial configuration mode.  
Slave Serial Mode provides a simple configuration interface.  
Only a serial data line, a clock line, and two control lines  
(INIT and DONE) are required to configure an FPGA. Data  
from the PROM is read out sequentially on a single data line  
(DIN), accessed via the PROM's internal address counter  
which is incremented on every valid rising edge of CCLK.  
The serial bitstream data must be set up at the FPGA’s DIN  
input pin a short time before each rising edge of the  
externally provided CCLK.  
FPGA Master SelectMAP (Parallel) Mode  
(XCFxxP PROM Only)  
In Master SelectMAP mode, byte-wide data is written into  
the FPGA, typically with a BUSY flag controlling the flow of  
data, synchronized by the configuration clock (CCLK)  
generated by the FPGA. Upon power-up or reconfiguration,  
the FPGA's mode select pins are used to select the Master  
SelectMAP configuration mode. The configuration interface  
typically requires a parallel data bus, a clock line, and two  
control lines (INIT and DONE). In addition, the FPGA’s Chip  
Select, Write, and BUSY pins must be correctly controlled to  
enable SelectMAP configuration. The configuration data is  
read from the PROM byte by byte on pins [D0..D7],  
Connecting the FPGA device to the configuration PROM for  
Slave Serial Configuration Mode (Figure 7, page 15):  
The DATA output of the PROM(s) drive the DIN input of  
the lead FPGA device.  
accessed via the PROM's internal address counter which is  
incremented on every valid rising edge of CCLK. The  
bitstream data must be set up at the FPGA’s [D0..D7] input  
pins a short time before each rising edge of the FPGA's  
The PROM CLKOUT (for XCFxxP only) or an external  
clock source drives the FPGA's CCLK input.  
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Platform Flash In-System Programmable Configuration PROMS  
internally generated CCLK signal. If BUSY is asserted  
(High) by the FPGA, the configuration data must be held  
FPGA Slave SelectMAP (Parallel) Mode  
(XCFxxP PROM Only)  
until BUSY goes Low. An external data source or external  
pull-down resistors must be used to enable the FPGA's  
active Low Chip Select (CS or CS_B) and Write (WRITE or  
RDWR_B) signals to enable the FPGA's SelectMAP  
configuration process.  
In Slave SelectMAP mode, byte-wide data is written into the  
FPGA, typically with a BUSY flag controlling the flow of data,  
synchronized by an externally supplied configuration clock  
(CCLK). Upon power-up or reconfiguration, the FPGA's mode  
select pins are used to select the Slave SelectMAP  
configuration mode. The configuration interface typically  
requires a parallel data bus, a clock line, and two control lines  
(INIT and DONE). In addition, the FPGA’s Chip Select, Write,  
and BUSY pins must be correctly controlled to enable  
SelectMAP configuration. The configuration data is read from  
the PROM byte by byte on pins [D0..D7], accessed via the  
PROM's internal address counter which is incremented on  
every valid rising edge of CCLK. The bitstream data must be  
set up at the FPGA’s [D0..D7] input pins a short time before  
each rising edge of the provided CCLK. If BUSY is asserted  
(High) by the FPGA, the configuration data must be held until  
BUSY goes Low. An external data source or external  
pull-down resistors must be used to enable the FPGA's active  
Low Chip Select (CS or CS_B) and Write (WRITE or  
RDWR_B) signals to enable the FPGA's SelectMAP  
configuration process.  
The Master SelectMAP configuration interface is clocked by  
the FPGA’s internal oscillator. Typically, a wide range of  
frequencies can be selected for the internally generated  
CCLK which always starts at a slow default frequency. The  
FPGA’s bitstream contains configuration bits which can  
switch CCLK to a higher frequency for the remainder of the  
Master SelectMAP configuration sequence. The desired  
CCLK frequency is selected during bitstream generation.  
After configuration, the pins of the SelectMAP port can be  
used as additional user I/O. Alternatively, the port can be  
retained using the persist option.  
Connecting the FPGA device to the configuration PROM for  
Master SelectMAP (Parallel) Configuration Mode (Figure 9,  
page 17):  
The DATA outputs of the PROM(s) drive the [D0..D7]  
input of the lead FPGA device.  
After configuration, the pins of the SelectMAP port can be  
used as additional user I/O. Alternatively, the port can be  
retained using the persist option.  
The Master FPGA CCLK output drives the CLK input(s)  
of the PROM(s)  
The CEO output of a PROM drives the CE input of the  
next PROM in a daisy chain (if any).  
Connecting the FPGA device to the configuration PROM for  
Slave SelectMAP (Parallel) Configuration Mode (Figure 10,  
page 18):  
The OE/RESET pins of all PROMs are connected to  
the INIT_B pins of all FPGA devices. This connection  
assures that the PROM address counter is reset before  
the start of any (re)configuration.  
The DATA outputs of the PROM(s) drives the [D0..D7]  
inputs of the lead FPGA device.  
The PROM CLKOUT (for XCFxxP only) or an external  
clock source drives the FPGA's CCLK input.  
The PROM CE input can be driven from the DONE pin.  
The CE input of the first (or only) PROM can be driven  
by the DONE output of all target FPGA devices,  
The CEO output of a PROM drives the CE input of the  
next PROM in a daisy chain (if any).  
provided that DONE is not permanently grounded. CE  
can also be permanently tied Low, but this keeps the  
The OE/RESET pins of all PROMs are connected to  
the INIT_B pins of all FPGA devices. This connection  
assures that the PROM address counter is reset before  
the start of any (re)configuration.  
DATA output active and causes an unnecessary I  
active supply current ("DC Characteristics Over  
Operating Conditions," page 26).  
CC  
For high-frequency parallel configuration, the BUSY  
pins of all PROMs are connected to the FPGA's BUSY  
output. This connection assures that the next data  
transition for the PROM is delayed until the FPGA is  
ready for the next configuration data byte.  
The PROM CE input can be driven from the DONE pin.  
The CE input of the first (or only) PROM can be driven  
by the DONE output of all target FPGA devices,  
provided that DONE is not permanently grounded. CE  
can also be permanently tied Low, but this keeps the  
DATA output active and causes an unnecessary I  
The PROM CF pin is typically connected to the FPGA's  
PROG_B (or PROGRAM) input. For the XCFxxP only,  
the CF pin is a bidirectional pin. If the XCFxxP CF pin is  
not connected to the FPGA's PROG_B (or PROGRAM)  
input, then the pin should be tied High.  
CC  
active supply current ("DC Characteristics Over  
Operating Conditions," page 26).  
For high-frequency parallel configuration, the BUSY  
pins of all PROMs are connected to the FPGA's BUSY  
output. This connection assures that the next data  
transition for the PROM is delayed until the FPGA is  
ready for the next configuration data byte.  
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Platform Flash In-System Programmable Configuration PROMS  
The PROM CF pin is typically connected to the FPGA's  
PROG_B (or PROGRAM) input. For the XCFxxP only,  
the CF pin is a bidirectional pin. If the XCFxxP CF pin is  
not connected to the FPGA's PROG_B (or PROGRAM)  
input, then the pin should be tied High.  
PROMs in the chain are interconnected. After the last data  
from the first PROM is read, the first PROM asserts its CEO  
output Low and drives its outputs to a high-impedance  
state. The second PROM recognizes the Low level on its CE  
input and immediately enables its outputs.  
After configuration is complete, address counters of all  
cascaded PROMs are reset if the PROM OE/RESET pin  
goes Low or CE goes High.  
FPGA SelectMAP (Parallel) Device Chaining  
(XCFxxP PROM Only)  
When utilizing the advanced features for the XCFxxP  
Platform Flash PROM, including the clock output (CLKOUT)  
option, decompression option, or design revisioning,  
programming files which span cascaded PROM devices  
can only be created for cascaded chains containing only  
XCFxxP PROMs. If the advanced features are not used,  
then cascaded PROM chains can contain both XCFxxP and  
XCFxxS PROMs.  
Multiple Virtex-II FPGAs can be configured using the  
SelectMAP mode, and be made to start up simultaneously.  
To configure multiple devices in this way, wire the individual  
CCLK, DONE, INIT, Data ([D0..D7]), Write (WRITE or  
RDWR_B), and BUSY pins of all the devices in parallel. If all  
devices are to be configured with the same bitstream,  
readback is not being used, and the CCLK frequency  
selected does not require the use of the BUSY signal, the  
CS_B pins can be connected to a common line so all of the  
devices are configured simultaneously (Figure 10,  
page 18).  
Initiating FPGA Configuration  
The options for initiating FPGA configuration via the  
Platform Flash PROM include:  
With additional control logic, the individual devices can be  
loaded separately by asserting the CS_B pin of each device  
in turn and then enabling the appropriate configuration data.  
The PROM can also store the individual bitstreams for each  
FPGA for SelectMAP configuration in separate design  
revisions. When design revisioning is utilized, additional  
control logic can be used to select the appropriate bitstream  
by asserting the EN_EXT_SEL pin, and using the  
REV_SEL[1:0] pins to select the required bitstream, while  
asserting the CS_B pin for the FPGA the bitstream is  
targeting (Figure 13, page 21).  
Automatic configuration on power up  
Applying an external PROG_B (or PROGRAM) pulse  
Applying the JTAG CONFIG instruction  
Following the FPGA’s power-on sequence or the assertion  
of the PROG_B (or PROGRAM) pin the FPGA’s  
configuration memory is cleared, the configuration mode is  
selected, and the FPGA is ready to accept a new  
configuration bitstream. The FPGA’s PROG_B pin can be  
controlled by an external source, or alternatively, the  
Platform Flash PROMs incorporate a CF pin that can be  
tied to the FPGA’s PROG_B pin. Executing the CONFIG  
instruction through JTAG pulses the CF output Low once for  
300-500 ns, resetting the FPGA and initiating configuration.  
The iMPACT software can issue the JTAG CONFIG  
command to initiate FPGA configuration by setting the  
"Load FPGA" option.  
For clocking the parallel configuration chain, either the first  
FPGA in the chain can be set to Master SelectMAP,  
generating the CCLK, with the remaining devices set to  
Slave SelectMAP, or all the FPGA devices can be set to  
Slave SelectMAP and an externally generated clock can be  
used to drive the configuration interface. Again, the  
respective device data sheets should be consulted for  
detailed information on a particular FPGA device, including  
which configuration modes are supported by the targeted  
FPGA device.  
When using the XCFxxP Platform Flash PROM with design  
revisioning enabled, the CF pin should always be connected  
to the PROG_B (or PROGRAM) pin on the FPGA to ensure  
that the current design revision selection is sampled when  
the FPGA is reset. The XCFxxP PROM samples the current  
design revision selection from the external REV_SEL pins  
or the internal programmable Revision Select bits on the  
rising edge of CF. When the JTAG CONFIG command is  
executed, the XCFxxP will sample the new design revision  
selection before initiating the FPGA configuration  
Cascading Configuration PROMs  
When configuring multiple FPGAs in a serial daisy chain,  
configuring multiple FPGAs in a SelectMAP parallel chain,  
or configuring a single FPGA requiring a larger  
configuration bitstream, cascaded PROMs provide  
additional memory (Figure 8, page 16, Figure 11, page 19,  
Figure 12, page 20, and Figure 13, page 21). Multiple  
Platform Flash PROMs can be concatenated by using the  
CEO output to drive the CE input of the downstream device.  
The clock signal and the data outputs of all Platform Flash  
sequence. When using the XCFxxP Platform Flash PROM  
without design revisioning, if the CF pin is not connected to  
the FPGA PROG_B (or PROGRAM) pin, then the XCFxxP  
CF pin must be tied High.  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
Configuration PROM to FPGA Device Interface Connection Diagrams  
(2)  
V
CCO  
(1)  
V
CCJ  
V
V
CCO CCINT  
(1)  
V
V
V
D0  
DIN  
MODE PINS  
CCINT  
(2)  
CCO  
(2)  
CCJ  
DIN  
CCLK  
...OPTIONAL  
Slave FPGAs  
with identical  
configurations  
Xilinx FPGA  
Master Serial  
Platform Flash  
PROM  
DONE  
INIT_B  
PROG_B  
CLK  
CE  
CCLK  
DONE  
...OPTIONAL  
Daisy-chained  
Slave FPGAs  
with different  
configurations  
CEO  
DOUT  
DIN  
CCLK  
OE/RESET  
INIT_B  
(3)  
TDI  
TDI  
CF  
PROG_B  
DONE  
TMS  
TCK  
TDO  
TMS  
TCK  
INIT_B  
PROG_B  
TDO  
TDI  
GND  
TMS  
TCK  
TDO  
GND  
Notes:  
1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet.  
2 For compatible voltages, refer to the appropriate data sheet.  
3 For the XCFxxS the CF pin is an output pin. For the XCFxxP the CF pin is a bidirectional pin. For the  
XCFxxP, if CF is not connected to PROGB, then it must be tied to V  
via a 4.7 kΩ pull-up resistor.  
CCO  
ds123_11_122105  
Figure 6: Configuring in Master Serial Mode  
DS123 (v2.9) May 09, 2006  
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14  
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Platform Flash In-System Programmable Configuration PROMS  
(2)  
CCO  
V
(3)  
External  
Oscillator  
(1)  
V
V
V
CCJ CCO CCINT  
(1)  
V
V
V
D0  
DIN  
MODE PINS  
CCINT  
(2)  
CCO  
(2)  
CCJ  
DIN  
CCLK  
...OPTIONAL  
Slave FPGAs  
with identical  
configurations  
Xilinx FPGA  
Slave Serial  
Platform Flash  
PROM  
DONE  
INIT_B  
PROG_B  
(3)  
CLK  
CCLK  
DONE  
CE  
CEO  
...OPTIONAL  
Daisy-chained  
Slave FPGAs  
with different  
configurations  
DOUT  
DIN  
CCLK  
OE/RESET  
INIT_B  
(4)  
TDI  
TDI  
CF  
PROG_B  
DONE  
TMS  
TCK  
TDO  
TMS  
TCK  
INIT_B  
PROG_B  
TDO  
TDI  
GND  
TMS  
TCK  
TDO  
GND  
Notes:  
1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet.  
2 For compatible voltages, refer to the appropriate data sheet.  
3 In Slave Serial mode, the configuration interface can be clocked by an external oscillator, or  
optionally—for the XCFxxP Platform Flash PROM only—the CLKOUT signal can be used to drive the  
FPGA's configuration clock (CCLK). If the XCFxxP PROM's CLKOUT signal is used, then CLKOUT must  
be tied to a 4.7KΩ resistor pulled up to V  
.
CCO  
4 For the XCFxxS the CF pin is an output pin. For the XCFxxP the CF pin is a bidirectional pin. For the  
XCFxxP, if CF is not connected to PROGB, then it must be tied to V via a 4.7 kΩ pull-up resistor.  
ds123_12_122105  
CCO  
Figure 7: Configuring in Slave Serial Mode  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
(2)  
V
CCJ  
V
V
V
CCJ  
V
V
V
CCO  
CCO  
CCINT  
CCO  
CCINT  
(1)  
(1)  
MODE PINS  
(1)  
V
V
V
D0  
DIN  
MODE PINS  
V
V
V
D0  
CCINT  
(2)  
CCO  
(2)  
CCJ  
CCINT  
(2)  
CCO  
DOUT  
DIN  
(2)  
CCJ  
Platform Flash  
PROM  
Xilinx FPGA  
Master Serial  
Xilinx FPGA  
Slave Serial  
Platform Flash  
PROM  
First  
PROM  
(PROM 0)  
Cascaded  
PROM  
(PROM 1)  
CLK  
CE  
CCLK  
DONE  
CCLK  
DONE  
CLK  
CE  
CEO  
CEO  
OE/RESET  
INIT_B  
INIT_B  
OE/RESET  
(3)  
(3)  
TDI  
TMS  
TCK  
TDO  
CF  
PROG_B  
PROG_B  
TDI  
CF  
TMS  
TCK  
TDI  
TDO  
TMS  
TCK  
TDO  
TDI  
TDO  
TDI  
TMS  
TCK  
TMS  
TCK  
GND  
GND  
TDO  
GND  
GND  
Notes:  
1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet.  
2 For compatible voltages, refer to the appropriate data sheet.  
3 For the XCFxxS the CF pin is an output pin. For the XCFxxP the CF pin is a bidirectional pin. For the  
XCFxxP, if CF is not connected to PROGB, then it must be tied to V  
via a 4.7 kΩ pull-up resistor.  
CCO  
ds123_13_122105  
Figure 8: Configuring Multiple Devices in Master/Slave Serial Mode  
DS123 (v2.9) May 09, 2006  
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16  
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Platform Flash In-System Programmable Configuration PROMS  
(2)  
CCO  
V
(1)  
V
V
V
CCO CCINT  
CCJ  
(3)  
I/O  
(1)  
V
V
V
D[0:7]  
D[0:7]  
MODE PINS  
RDWR_B  
CS_B  
CCINT  
(2)  
CCO  
(2)  
CCJ  
(3)  
I/O  
1KΩ  
1KΩ  
XCFxxP  
Xilinx FPGA  
Platform Flash  
PROM  
Master SelectMAP  
CLK  
CCLK  
DONE  
CE  
CEO  
D[0:7]  
CCLK  
...OPTIONAL  
Slave FPGAs  
with identical  
configurations  
OE/RESET  
INIT_B  
DONE  
(5)  
TDI  
TDI  
CF  
PROG_B  
INIT_B  
(4)  
(4)  
TMS  
TCK  
TDO  
TMS  
TCK  
BUSY  
BUSY  
PROG_B  
(4)  
BUSY  
TDO  
TDI  
GND  
TMS  
TCK  
TDO  
GND  
Notes:  
1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet.  
2 For compatible voltages, refer to the appropriate data sheet.  
3 CS_B (or CS) and RDWR_B (or WRITE) must be either driven Low or pulled down exernally. One option is shown.  
4 The BUSY pin is only available with the XCFxxP Platform Flash PROM, and the connection is only required for high-  
frequency SelectMAP mode configuration. For BUSY pin requirements, refer to the appropriate FPGA data sheet.  
5 For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROGB, then it must be  
tied to V  
via a 4.7 kΩ pull-up resistor.  
CCO  
ds123_14_122105  
Figure 9: Configuring in Master SelectMAP Mode  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
(2)  
CCO  
V
(5)  
External  
Oscillator  
(1)  
V
V
V
CCO CCINT  
CCJ  
(3)  
I/O  
(1)  
V
V
V
D[0:7]  
D[0:7]  
MODE PINS  
RDWR_B  
CS_B  
CCINT  
(2)  
CCO  
(2)  
CCJ  
(3)  
I/O  
1KΩ  
1KΩ  
XCFxxP  
Xilinx FPGA  
Platform Flash  
PROM  
Slave SelectMAP  
(5)  
CLK  
CCLK  
DONE  
CE  
CEO  
D[0:7]  
CCLK  
...OPTIONAL  
Slave FPGAs  
with identical  
configurations  
OE/RESET  
INIT_B  
DONE  
(6)  
TDI  
TDI  
CF  
PROG_B  
INIT_B  
PROG_B  
(4)  
(4)  
TMS  
TCK  
TDO  
TMS  
TCK  
BUSY  
BUSY  
(4)  
BUSY  
TDO  
TDI  
GND  
TMS  
TCK  
TDO  
GND  
Notes:  
1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet.  
2 For compatible voltages, refer to the appropriate data sheet.  
3 CS_B (or CS) and RDWR_B (or WRITE) must be either driven Low or pulled down externally. One option is shown.  
4 The BUSY pin is only available with the XCFxxP Platform Flash PROM, and the connection is only required for high-  
frequency SelectMAP mode configuration. For BUSY pin requirements, refer to the appropriate FPGA data sheet.  
5 In Slave SelectMAP mode, the configuration interface can be clocked by an external oscillator, or, optionally, the  
CLKOUT signal can be used to drive the FPGA's configuration clock (CCLK). If the XCFxxP PROM's CLKOUT signal  
is used, then CLKOUT must be tied to a 4.7 KΩ resistor pulled up to V  
.
CCO  
6 For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROGB, then it must be  
tied to V via a 4.7 kΩ pull-up resistor.  
CCO  
ds123_15_122105  
Figure 10: Configuring in Slave SelectMAP Mode  
DS123 (v2.9) May 09, 2006  
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18  
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Platform Flash In-System Programmable Configuration PROMS  
(2)  
V
CCJ  
V
CCO  
V
CCINT  
V
CCJ  
V
CCO  
V
CCINT  
V
CCO  
(1)  
(1)  
(1)  
V
V
V
D[0:7]  
D[0:7]  
MODE PINS  
D[0:7]  
MODE PINS  
V
V
V
D[0:7]  
CCINT  
(2)  
CCINT  
(2)  
(3)  
(3)  
(3)  
(3)  
I/O  
I/O  
I/O  
I/O  
CCO  
CCO  
(2)  
(2)  
RDWR_B  
CS_B  
RDWR_B  
CS_B  
CCJ  
CCJ  
XCFxxP  
XCFxxP  
Platform Flash  
PROM  
Platform Flash  
PROM  
Xilinx FPGA  
Master SelectMAP  
Xilinx FPGA  
Slave SelectMAP  
First  
PROM  
(PROM 0)  
CLK  
CCLK  
DONE  
CCLK  
DONE  
CLK  
Cascaded  
PROM  
(PROM 1)  
CE  
CE  
CEO  
CEO  
OE/RESET  
INIT_B  
INIT_B  
OE/RESET  
(5)  
(5)  
TDI  
TMS  
TCK  
TDO  
CF  
PROG_B  
PROG_B  
TDI  
CF  
(4)  
(4)  
(4)  
(4)  
BUSY  
BUSY  
BUSY  
TMS  
TCK  
BUSY  
TDI  
TDO  
TMS  
TCK  
GND  
TDO  
TDO  
TDI  
TDI  
TMS  
TCK  
TMS  
GND  
TCK  
TDO  
GND  
GND  
Notes:  
1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet.  
2 For compatible voltages, refer to the appropriate data sheet.  
3 CS_B (or CS) and RDWR_B (or WRITE) must be either driven Low or pulled down exernally. One option is shown.  
4 The BUSY pin is only available with the XCFxxP Platform Flash PROM, and the connection is only required for high-  
frequency SelectMAP mode configuration. For BUSY pin requirements, refer to the appropriate FPGA data sheet.  
5 For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROGB, then it must be tied to  
V
via a 4.7 kΩ pull-up resistor.  
CCO  
ds123_16_122105  
Figure 11: Configuring Multiple Devices with Identical Patterns in Master/Slave SelectMAP Mode  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
(2)  
V
CCJ  
V
V
CCINT  
V
V
V
V
CCO  
CCO  
CCJ  
CCO  
CCINT  
(3)  
External  
Oscillator  
(1)  
(1)  
MODE PINS  
(1)  
D0  
V
V
V
D0  
DIN  
MODE PINS  
V
V
V
CCINT  
(2)  
CCINT  
(2)  
DOUT  
DIN  
CCO  
(2)  
CCO  
(2)  
CCJ  
CCJ  
XCFxxP  
XCFxxP  
Platform Flash  
PROM  
Platform Flash  
PROM  
Xilinx FPGA  
Slave Serial  
Xilinx FPGA  
Slave Serial  
(3)  
CLK  
(3)  
CLK  
CCLK  
DONE  
CCLK  
DONE  
First  
PROM  
(PROM 0)  
Cascaded  
PROM  
(PROM 1)  
CE  
CE  
CEO  
CEO  
OE/RESET  
OE/RESET  
INIT_B  
INIT_B  
(4)  
(4)  
TDI  
TMS  
TCK  
TDO  
CF  
CF  
PROG_B  
PROG_B  
TDI  
TMS  
TCK  
TDO  
TDI  
TMS  
TCK  
TDO  
TDI  
TDI  
TMS  
TCK  
TMS  
TCK  
EN_EXT_SEL  
REV_SEL[1:0]  
TDO  
EN_EXT_SEL  
REV_SEL[1:0]  
GND  
GND  
GND  
GND  
EN_EXT_SEL  
REV_SEL[1:0]  
DONE  
Design  
Revision  
Control  
Logic  
CF / PROG_B  
Notes  
1. For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet.  
2. For compatible voltages, refer to the appropriate data sheet.  
3. In Slave Serial mode, the configuration interface can be clocked by an external oscillator, or optionally the CLKOUT  
signal can be used to drive the FPGA's configuration clock (CCLK). If the XCFxxP PROM's CLKOUT signal is used,  
then CLKOUT must be tied to a 4.7 KΩ resistor pulled up to V  
.
CCO  
4. For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROGB, then it  
must be tied to V via a 4.7 kΩ pull-up resistor.  
ds123_17_122105  
CCO  
Figure 12: Configuring Multiple Devices with Design Revisioning in Slave Serial Mode  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
(2)  
V
CCJ  
V
V
V
V
V
V
CCO  
CCO CCINT  
CCJ  
CCO CCINT  
(5)  
External  
Oscillator  
(1)  
(1)  
(1)  
VCCINT  
(2)  
V
D[0:7]  
D[0:7]  
D[0:7]  
MODE PINS  
D[0:7]  
MODE PINS  
CCINT  
(2)  
V
V
V
RDWR_B  
CS_B  
RDWR_B  
CS_B  
CCO  
CCO  
(3)  
(3)  
(2)  
(2)  
I/O  
I/O  
V
CCJ  
CCJ  
XCFxxP  
Platform Flash  
PROM  
XCFxxP  
Platform Flash  
PROM  
Xilinx FPGA  
Slave SelectMAP  
Xilinx FPGA  
Slave SelectMAP  
(5)  
(5)  
First  
PROM  
(PROM 0)  
Cascaded  
PROM  
(PROM 1)  
CLK  
CE  
CEO  
CLK  
CCLK  
DONE  
CCLK  
DONE  
CE  
CEO  
OE/RESET  
OE/RESET  
INIT_B  
INIT_B  
(6)  
(6)  
TDI  
TDI  
CF  
CF  
PROG_B  
PROG_B  
(4)  
(4)  
(4)  
(4)  
TMS  
TCK  
TDO  
TMS  
TCK  
BUSY  
BUSY  
BUSY  
BUSY  
TDI  
TDO  
TMS  
TCK  
TDO  
TDI  
TDO  
TDI  
TMS  
TCK  
TMS  
EN_EXT_SEL  
REV_SEL[1:0]  
EN_EXT_SEL  
REV_SEL[1:0]  
TCK  
TDO  
GND  
GND  
GND  
GND  
EN_EXT_SEL  
REV_SEL[1:0]  
CF  
Design  
Revision  
Control  
Logic  
DONE  
PROG_B  
CS_B[1:0]  
Notes:  
1. For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet.  
2. For compatible voltages, refer to the appropriate data sheet.  
3. RDWR_B (or WRITE) must be either driven Low or pulled down exernally. One option is shown.  
4. The BUSY pin is only available with the XCFxxP Platform Flash PROM, and the connection is only required for high  
frequency SelectMAP mode configuration. For BUSY pin requirements, refer to the appropriate FPGA data sheet.  
5. In Slave SelectMAP mode, the configuration interface can be clocked by an external oscillator, or optionally the  
CLKOUT signal can be used to drive the FPGA's configuration clock (CCLK). If the XCFxxP PROM's CLKOUT signal is  
used, then it must be tied to a 4.7KΩ resistor pulled up to V  
.
CCO  
6 For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROGB, then it must be  
tied to V via a 4.7 kΩ pull-up resistor  
CCO  
ds123_18_122105  
Figure 13: Configuring Multiple Devices with Design Revisioning in Slave SelectMAP Mode  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
Reset and Power-On Reset Activation  
At power up, the device requires the V  
power supply to  
and OE/RESET is again held Low until the after the POR  
threshold is reached. OE/RESET polarity is not  
programmable. These power-up requirements are shown  
graphically in Figure 14, page 22.  
CCINT  
monotonically rise to the nominal operating voltage within  
the specified V rise time. If the power supply cannot  
CCINT  
meet this requirement, then the device might not perform  
power-on reset properly. During the power-up sequence,  
OE/RESET is held Low by the PROM. Once the required  
supplies have reached their respective POR (Power On  
For a fully powered Platform Flash PROM, a reset occurs  
whenever OE/RESET is asserted (Low) or CE is  
deasserted (High). The address counter is reset, CEO is  
driven High, and the remaining outputs are placed in a  
high-impedance state.  
Reset) thresholds, the OE/RESET release is delayed (T  
OER  
minimum) to allow more margin for the power supplies to  
stabilize before initiating configuration. The OE/RESET pin  
is connected to an external 4.7kΩ pull-up resistor and also  
to the target FPGA's INIT pin. For systems utilizing  
slow-rising power supplies, an additional power monitoring  
circuit can be used to delay the target configuration until the  
system power reaches minimum operating voltages by  
holding the OE/RESET pin Low. When OE/RESET is  
released, the FPGA’s INIT pin is pulled High allowing the  
FPGA's configuration sequence to begin. If the power drops  
Notes:  
1. The XCFxxS PROM only requires V  
to rise above  
CCINT  
its POR threshold before releasing OE/RESET.  
2. The XCFxxP PROM requires both V to rise above  
CCINT  
its POR threshold and for V  
to reach the  
CCO  
recommended operating voltage level before releasing  
OE/RESET.  
below the power-down threshold (V  
), the PROM resets  
CCPD  
VCCINT  
Recommended Operating Range  
Delay or Restart  
Configuration  
50 ms ramp  
200 µs ramp  
VCCPOR  
VCCPD  
A slow-ramping V  
supply may still  
CCINT  
be below the minimum operating  
voltage when OE/RESET is released.  
In this case, the configuration  
sequence must be delayed until both  
V
and V  
have reached their  
CCINT  
CCO  
TIME (ms)  
recommended operating conditions.  
TOER  
TOER  
TRST  
ds123_21_103103  
Figure 14: Platform Flash PROM Power-Up Requirements  
I/O Input Voltage Tolerance and Power Sequencing  
The I/Os on each re-programmable Platform Flash PROM  
are fully 3.3V-tolerant. This allows 3V CMOS signals to  
connect directly to the inputs without damage. The core  
Standby Mode  
The PROM enters a low-power standby mode whenever CE  
is deasserted (High). In standby mode, the address counter  
is reset, CEO is driven High, and the remaining outputs are  
placed in a high-impedance state regardless of the state of  
the OE/RESET input. For the device to remain in the  
low-power standby mode, the JTAG pins TMS, TDI, and  
TDO must not be pulled Low, and TCK must be stopped  
(High or Low).  
power supply (V  
), JTAG pin power supply (V  
),  
CCINT  
CCJ  
output power supply (V  
), and external 3V CMOS I/O  
CCO  
signals can be applied in any order.  
Additionally, for the XCFxxS PROM only, when V  
is  
CCO  
supplied at 2.5V or 3.3V and V  
is supplied at 3.3V, the  
CCINT  
I/Os are 5V-tolerant. This allows 5V CMOS signals to connect  
directly to the inputs on a powered XCFxxS PROM without  
damage. Failure to power the PROM correctly while supplying  
a 5V input signal may result in damage to the XCFxxS device.  
When using the FPGA DONE signal to drive the PROM CE  
pin High to reduce standby power after configuration, an  
external pull-up resistor should be used. Typically a 330Ω  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
pull-up resistor is used, but refer to the appropriate FPGA  
data sheet for the recommended DONE pin pull-up value. If  
the DONE circuit is connected to an LED to indicate FPGA  
configuration is complete, and is also connected to the  
PROM CE pin to enable low-power standby mode, then an  
external buffer should be used to drive the LED circuit to  
ensure valid transitions on the PROM’s CE pin. If low-power  
standby mode is not required for the PROM, then the CE pin  
should be connected to ground.  
Table 11: Truth Table for XCFxxS PROM Control Inputs  
Control Inputs  
Outputs  
Internal Address  
OE/RESET  
CE  
DATA  
Active  
High-Z  
High-Z  
High-Z  
CEO  
High  
Low  
ICC  
If address < TC(2) : increment  
If address = TC(2) : don't change  
Held reset  
Active  
High  
Low  
Reduced  
Active  
Low  
X(1)  
Low  
High  
High  
High  
Held reset  
Standby  
Notes:  
1. X = don’t care.  
2. TC = Terminal Count = highest address value.  
Table 12: Truth Table for XCFxxP PROM Control Inputs  
Control Inputs  
Outputs  
Internal Address  
OE/RESET  
CE  
CF  
BUSY(5)  
DATA  
CEO  
CLKOUT  
ICC  
If address < TC(2) and  
Active  
High-Z  
High-Z  
High  
High  
Low  
High  
Active  
Active  
address < EA(3) : increment  
If address < TC(2) and  
High  
Low  
High  
Low  
High-Z  
High-Z  
Active  
Reduced  
Reduced  
Active  
address = EA(3) : don't change  
Else  
If address = TC(2) : don't change  
Unchanged  
Active and  
Unchanged  
High  
Low  
High  
High  
High  
Low  
X
Low  
Low  
High  
X
X
X(1)  
X
Reset(4)  
Active  
High-Z  
High-Z  
High  
High  
High  
Active  
High-Z  
High-Z  
Active  
Active  
Held reset(4)  
Held reset(4)  
X
Standby  
Notes:  
1. X = don’t care.  
2. TC = Terminal Count = highest address value.  
3. For the XCFxxP with Design Revisioning enabled, EA = end address (last address in the selected design revision).  
4. For the XCFxxP with Design Revisioning enabled, Reset = address reset to the beginning address of the selected bank. If Design  
Revisioning is not enabled, then Reset = address reset to address 0.  
5. The BUSY input is only enabled when the XCFxxP is programmed for parallel data output and decompression is not enabled.  
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Platform Flash In-System Programmable Configuration PROMS  
DC Electrical Characteristics  
Absolute Maximum Ratings  
XCF01S, XCF02S,  
XCF04S  
XCF08P, XCF16P,  
XCF32P  
Symbol  
Description  
Units  
VCCINT  
VCCO  
VCCJ  
VIN  
Internal supply voltage relative to GND  
I/O supply voltage relative to GND  
JTAG I/O supply voltage relative to GND  
Input voltage with respect to GND  
–0.5 to +4.0  
–0.5 to +4.0  
–0.5 to +4.0  
–0.5 to +3.6  
–0.5 to +5.5  
–0.5 to +3.6  
–0.5 to +5.5  
–65 to +150  
+125  
–0.5 to +2.7  
–0.5 to +4.0  
–0.5 to +4.0  
–0.5 to +3.6  
–0.5 to +3.6  
–0.5 to +3.6  
–0.5 to +3.6  
–65 to +150  
+125  
V
V
V
VCCO < 2.5V  
VCCO 2.5V  
VCCO < 2.5V  
VCCO 2.5V  
V
V
VTS  
Voltage applied to High-Z output  
V
V
TSTG  
TJ  
Storage temperature (ambient)  
Junction temperature  
°C  
°C  
Notes:  
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device  
pins can undershoot to –2.0V or overshoot to +7.0V, provided this over- or undershoot lasts less then 10 ns and with the forcing current being  
limited to 200 mA.  
2. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.  
Exposure to Absolute Maximum Ratings conditions for extended periods of time adversely affects device reliability.  
3. For soldering guidelines, see the information on "Packaging and Thermal Characteristics" at www.xilinx.com.  
Supply Voltage Requirements for Power-On Reset and Power-Down  
XCF01S, XCF02S,  
XCF04S  
XCF08P, XCF16P,  
XCF32P  
Symbol  
Description  
Units  
Min  
0.2  
1
Max  
50  
Min  
0.2  
0.5  
0.5  
Max  
50  
TVCC  
VCCPOR  
TOER  
VCCPD  
TRST  
VCCINT rise time from 0V to nominal voltage(2)  
POR threshold for the VCCINT supply  
ms  
V
OE/RESET release delay following POR(3)  
0.5  
3
30  
ms  
V
Power-down threshold for VCCINT supply  
1
0.5  
Time required to trigger a device reset when the VCCINT  
supply drops below the maximum VCCPD threshold  
10  
10  
ms  
Notes:  
1.  
V
, V  
, and V  
supplies may be applied in any order.  
CCINT CCO  
CCJ  
2. At power up, the device requires the V  
power supply to monotonically rise to the nominal operating voltage within the specified T  
CCINT  
VCC  
rise time. If the power supply cannot meet this requirement, then the device might not perform power-on-reset properly. See Figure 14,  
page 22.  
3. If the V  
and V  
supplies do not reach their respective recommended operating conditions before the OE/RESET pin is released,  
CCINT  
CCO  
then the configuration data from the PROM will not be available at the recommended threshold levels. The configuration sequence must be  
delayed until both V and V have reached their recommended operating conditions.  
CCINT  
CCO  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
Recommended Operating Conditions  
XCF01S, XCF02S, XCF04S  
XCF08P, XCF16P, XCF32P  
Symbol  
Description  
Units  
Min  
3.0  
3.0  
2.3  
1.7  
Typ  
3.3  
3.3  
2.5  
1.8  
Max  
3.6  
3.6  
2.7  
1.9  
Min  
1.65  
3.0  
Typ  
1.8  
3.3  
2.5  
1.8  
1.5  
3.3  
Max  
2.0  
VCCINT  
VCCO  
Internal voltage supply  
V
V
V
V
V
V
3.3V Operation  
3.6  
Supply voltage  
for output  
drivers  
2.5V Operation  
1.8V Operation  
1.5V Operation  
3.3V Operation  
2.3  
2.7  
1.7  
1.9  
TBD  
3.0  
TBD  
3.6  
VCCJ  
Supply voltage  
for JTAG output  
drivers  
3.0  
3.3  
3.6  
2.5V Operation  
2.3  
0
2.5  
2.7  
0.8  
2.3  
2.5  
2.7  
0.8  
V
V
VIL  
3.3V Operation  
2.5V Operation  
1.8V Operation  
1.5V Operation  
3.3V Operation  
2.5V Operation  
0
0
0.7  
0
0.7  
V
Low-level input  
voltage  
20% VCCO  
20% VCCO  
TBD  
3.6  
V
0
V
VIH  
2.0  
1.7  
5.5  
2.0  
V
5.5  
1.7  
3.6  
V
High-level input  
voltage  
1.8V Operation 70% VCCO  
3.6  
70% VCCO  
3.6  
V
1.5V Operation  
TBD  
3.6  
V
TIN  
VO  
TA  
Input signal transition time(1)  
Output voltage  
500  
VCCO  
85  
500  
ns  
V
0
0
VCCO  
85  
Operating ambient temperature  
–40  
–40  
°C  
Notes:  
1. Input signal transition time measured between 10% V  
and 90% V  
.
CCO  
CCO  
Quality and Reliability Characteristics  
Symbol  
TDR  
Description  
Min  
Max  
Units  
Years  
Cycles  
Volts  
Data retention  
20  
NPE  
Program/erase cycles (Endurance)  
Electrostatic discharge (ESD)  
20,000  
2,000  
VESD  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
DC Characteristics Over Operating Conditions  
XCF01S, XCF02S,  
XCF04S  
XCF08P, XCF16P,  
XCF32P  
Symbol  
Description  
Units  
Test  
Test  
Min Max  
Min Max  
Conditions  
Conditions  
High-level output voltage for 3.3V outputs  
High-level output voltage for 2.5V outputs  
IOH = –4 mA  
2.4  
IOH = –4 mA  
2.4  
V
V
VCCO  
– 0.4  
VCCO  
– 0.4  
I
OH = –500 µA  
I
OH = –500 µA  
VOH  
VCCO  
– 0.4  
VCCO  
– 0.4  
High-level output voltage for 1.8V outputs  
I
OH = –50 µA  
IOH = –50 µA  
V
High-level output voltage for 1.5V outputs  
Low-level output voltage for 3.3V outputs  
Low-level output voltage for 2.5V outputs  
Low-level output voltage for 1.8V outputs  
Low-level output voltage for 1.5V outputs  
Internal voltage supply current, active mode  
Output driver supply current, active serial mode  
Output driver supply current, active parallel mode  
JTAG supply current, active mode  
0.4  
0.4  
0.4  
IOH = TBD  
IOL = 4 mA  
IOL = 500 µA  
IOL = 50 µA  
IOL = TBD  
33 MHz  
TBD  
0.4  
0.4  
0.4  
TBD  
10  
10  
40  
5
V
V
IOL = 4 mA  
IOL = 500 µA  
IOL = 50 µA  
V
VOL  
V
V
ICCINT  
33 MHz  
33 MHz  
10  
10  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
µA  
33 MHz  
(1)  
ICCO  
33 MHz  
ICCJ  
Note (2)  
Note (3)  
Note (3)  
Note (3)  
5
Note (2)  
ICCINTS  
ICCOS  
ICCJS  
Internal voltage supply current, standby mode  
Output driver supply current, standby mode  
JTAG supply current, standby mode  
5
Note (3)  
1
1
Note (3)  
1
1
Note (3)  
1
VCCJ = max  
VIN = GND  
VCCJ = max  
VIN = GND  
IILJ  
JTAG pins TMS, TDI, and TDO pull-up current  
100  
100  
VCCINT = max  
VCCINT = max  
V
CCO = max  
VCCO = max  
IIL  
Input leakage current  
–10  
10  
–10  
10  
µA  
µA  
µA  
µA  
V
IN = GND or  
VCCO  
V
IN = GND or  
VCCO  
VCCINT = max  
CCO = max  
VCCINT = max  
CCO = max  
V
V
IIH  
Input and output High-Z leakage current  
–10  
10  
–10  
10  
100  
V
IN = GND or  
VCCO  
V
IN = GND or  
VCCO  
VCCINT = max  
CCO = max  
Source current through internal pull-ups on  
EN_EXT_SEL, REV_SEL0, REV_SEL1  
V
IILP  
V
IN = GND or  
VCCO  
VCCINT = max  
CCO = max  
V
IIHP  
Sink current through internal pull-down on BUSY  
-100  
V
IN = GND or  
VCCO  
VIN = GND  
f = 1.0 MHz  
VIN = GND  
f = 1.0 MHz  
CIN  
Input capacitance  
Output capacitance  
8
8
pF  
pF  
VIN = GND  
f = 1.0 MHz  
VIN = GND  
f = 1.0 MHz  
COUT  
14  
14  
Notes:  
1. Output driver supply current specification based on no load conditions.  
2. TDI/TMS/TCK non-static (active).  
3. CE High, OE Low, and TMS/TDI/TCK static.  
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Platform Flash In-System Programmable Configuration PROMS  
AC Electrical Characteristics  
AC Characteristics Over Operating Conditions  
XCFxxS and XCFxxP PROM as Configuration Slave with CLK Input Pin as Clock Source  
T
SCE  
CE  
T
HCE  
T
HOE  
T
CYC  
OE/RESET  
CLK  
T
T
HC  
LC  
T
T
HB  
SB  
T
T
DF  
OH  
BUSY  
T
OE  
T
CAC  
(optional)  
T
CE  
DATA  
T
T
OH  
CF  
THCF  
CF  
EN_EXT_SEL  
REV_SEL[1:0]  
T
T
T
T
HXT  
SXT  
HXT  
SXT  
T
T
T
T
HRV  
SRV  
HRV  
SRV  
ds123_22_122905  
XCF01S, XCF02S,  
XCF04S  
XCF08P, XCF16P,  
XCF32P  
Symbol  
Description  
Units  
Min  
Max  
Min  
Max  
CF hold time to guarantee design revision selection is  
sampled when VCCO = 3.3V or 2.5V(9)  
300  
300  
ns  
ns  
THCF  
CF hold time to guarantee design revision selection is  
sampled when VCCO = 1.8V(9)  
300  
300  
CF to data delay when VCCO = 3.3V or 2.5V(8)  
CF to data delay when VCCO = 1.8V(8)  
0
5
25  
25  
25  
25  
25  
25  
25  
25  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
TCF  
OE/RESET to data delay(6) when VCCO = 3.3V or 2.5V  
OE/RESET to data delay(6) when VCCO = 1.8V  
CE to data delay(5) when VCCO = 3.3V or 2.5V  
CE to data delay(5) when VCCO = 1.8V  
10  
30  
15  
30  
15  
30  
TOE  
TCE  
TCAC  
CLK to data delay(7) when VCCO = 3.3V or 2.5V  
CLK to data delay(7) when VCCO = 1.8V  
Data hold from CE, OE/RESET, CLK, or CF  
when VCCO = 3.3V or 2.5V(8)  
TOH  
Data hold from CE, OE/RESET, CLK, or CF  
when VCCO = 1.8V(8)  
0
5
ns  
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Platform Flash In-System Programmable Configuration PROMS  
XCF01S, XCF02S,  
XCF04S  
XCF08P, XCF16P,  
XCF32P  
Symbol  
Description  
Units  
Min  
Max  
Min  
Max  
CE or OE/RESET to data float delay(2)  
when VCCO = 3.3V or 2.5V  
25  
45  
ns  
ns  
TDF  
CE or OE/RESET to data float delay(2)  
when VCCO = 1.8V  
30  
45  
Clock period(6) (serial mode) when VCCO = 3.3V or 2.5V  
Clock period(6) (serial mode) when VCCO = 1.8V  
Clock period(6) (parallel mode) when VCCO = 3.3V or 2.5V  
Clock period(6) (parallel mode) when VCCO = 1.8V  
CLK Low time(3) when VCCO = 3.3V or 2.5V  
CLK Low time(3) when VCCO = 1.8V  
30  
67  
25  
25  
30  
30  
12  
12  
12  
12  
30  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
TCYC  
10  
15  
10  
15  
20  
TLC  
CLK High time(3) when VCCO = 3.3V or 2.5V  
CLK High time(3) when VCCO = 1.8V  
THC  
CE setup time to CLK (guarantees proper counting)(3)  
when VCCO = 3.3V or 2.5V  
TSCE  
THCE  
THOE  
CE setup time to CLK (guarantees proper counting)(3)  
when VCCO = 1.8V  
30  
30  
ns  
ns  
ns  
ns  
ns  
CE hold time (guarantees counters are reset)(5)  
when VCCO = 3.3V or 2.5V  
250  
250  
250  
250  
2000  
2000  
2000  
2000  
CE hold time (guarantees counters are reset)(5)  
when VCCO = 1.8V  
OE/RESET hold time (guarantees counters are reset)(6)  
when VCCO = 3.3V or 2.5V  
OE/RESET hold time (guarantees counters are reset)(6)  
when VCCO = 1.8V  
BUSY setup time to CLK when VCCO = 3.3V or 2.5V(8)  
BUSY setup time to CLK when VCCO = 1.8V(8)  
BUSY hold time to CLK when VCCO = 3.3V or 2.5V(8)  
BUSY hold time to CLK when VCCO = 1.8V(8)  
12  
12  
8
ns  
ns  
ns  
ns  
ns  
TSB  
THB  
8
EN_EXT_SEL setup time to CF, CE or OE/RESET  
when VCCO = 3.3V or 2.5V(8)  
300  
TSXT  
THXT  
TSRV  
EN_EXT_SEL setup time to CF, CE or OE/RESET  
when VCCO = 1.8V(8)  
300  
300  
300  
300  
300  
ns  
ns  
ns  
ns  
ns  
EN_EXT_SEL hold time from CF, CE or OE/RESET  
when VCCO = 3.3V or 2.5V(8)  
EN_EXT_SEL hold time from CF, CE or OE/RESET  
when VCCO = 1.8V(8)  
REV_SEL setup time to CF, CE or OE/RESET  
when VCCO = 3.3V or 2.5V(8)  
REV_SEL setup time to CF, CE or OE/RESET  
when VCCO = 1.8V(8)  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
XCF01S, XCF02S,  
XCF04S  
XCF08P, XCF16P,  
XCF32P  
Symbol  
Description  
Units  
Min  
Max  
Min  
Max  
REV_SEL hold time from CF, CE or OE/RESET  
when VCCO = 3.3V or 2.5V(8)  
300  
ns  
ns  
THRV  
REV_SEL hold time from CF, CE or OE/RESET  
when VCCO = 1.8V(8)  
300  
Notes:  
1. AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P.  
2. Float delays are measured with 5 pF AC loads. Transition is measured at 200 mV from steady-state active levels.  
3. All AC parameters are measured with V = 0.0V and V = 3.0V.  
IL  
IH  
4. If T  
5. If T  
High < 2 µs, T = 2 µs.  
CE  
HCE  
Low < 2 µs, T = 2 µs.  
HOE  
OE  
6. This is the minimum possible T  
. Actual T  
= T  
+ FPGA Data setup time. Example: With the XCF32P in serial mode with V  
CCO  
at  
CYC  
CYC  
CAC  
3.3V, if FPGA data setup time = 15 ns, then the actual T  
= 25 ns +15 ns = 40 ns.  
CYC  
7. Guaranteed by design; not tested.  
8. CF, EN_EXT_SEL, REV_SEL[1:0], and BUSY are inputs for the XCFxxP PROM only.  
9. When JTAG CONFIG command is issued, PROM will drive CF Low for at least the T  
minimum.  
HCF  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
XCFxxP PROM as Configuration Master with CLK Input Pin as Clock Source  
CE  
T
HCE  
T
HOE  
OE/RESET  
CLK  
T
LC  
CYCO  
T
T
HC  
T
CLKO  
CLKOUT  
T
CECC  
T
T
HB  
SB  
T
T
T
CCDD  
DDC  
OECC  
T
CECF  
T
COH  
BUSY  
T
OE  
T
OECF  
(optional)  
T
CE  
DATA  
T
CF  
T
EOH  
T
CFCC  
T
DF  
THCF  
CF  
EN_EXT_SEL  
REV_SEL[1:0]  
T
T
T
T
HXT  
SXT  
HXT  
SXT  
T
T
T
T
HRV  
SRV  
HRV  
SRV  
Note: 8 CLKOUT cycles are output after CE rising edge, before CLKOUT  
tristates, if OE/RESET remains high, and terminal count has not been reached.  
ds123_25_122905  
XCF08P, XCF16P,  
XCF32P  
Symbol  
Description  
Units  
Min  
Max  
CF hold time to guarantee design revision selection is sampled  
when VCCO = 3.3V or 2.5V(11)  
300  
300  
300  
THCF  
CF hold time to guarantee design revision selection is sampled  
when VCCO = 1.8V(11)  
300  
CF to data delay when VCCO = 3.3V or 2.5V  
CF to data delay when VCCO = 1.8V  
5
5
TBD  
TBD  
25  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
TCF  
OE/RESET to data delay(6) when VCCO = 3.3V or 2.5V  
OE/RESET to data delay(6) when VCCO = 1.8V  
CE to data delay(5) when VCCO = 3.3V or 2.5V  
CE to data delay(5) when VCCO = 1.8V  
TOE  
25  
25  
TCE  
25  
Data hold from CE, OE/RESET, or CF when VCCO = 3.3V or 2.5V  
Data hold from CE, OE/RESET, or CF when VCCO = 1.8V  
TEOH  
CE or OE/RESET to data float delay(2) when VCCO = 3.3V or 2.5V  
CE or OE/RESET to data float delay(2) when VCCO = 1.8V  
OE/RESET to CLKOUT float delay(2) when VCCO = 3.3V or 2.5V  
OE/RESET to CLKOUT float delay(2) when VCCO = 1.8V  
CE to CLKOUT float delay(2) when VCCO = 3.3V or 2.5V  
CE to CLKOUT float delay(2) when VCCO = 1.8V  
45  
TDF  
45  
TBD  
TBD  
TBD  
TBD  
TOECF  
TCECF  
DS123 (v2.9) May 09, 2006  
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Platform Flash In-System Programmable Configuration PROMS  
XCF08P, XCF16P,  
XCF32P  
Symbol  
Description  
Units  
Min  
30  
Max  
Clock period(7) (serial mode) when VCCO = 3.3V or 2.5V  
Clock period(7) (serial mode) when VCCO = 1.8V  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
30  
TCYCO  
Clock period(7) (parallel mode) when VCCO = 3.3V or 2.5V  
Clock period(7) (parallel mode) when VCCO = 1.8V  
35  
35  
CLK Low time(3) when VCCO = 3.3V or 2.5V  
12  
TLC  
CLK Low time(3) when VCCO = 1.8V  
12  
CLK High time(3) when VCCO = 3.3V or 2.5V  
12  
THC  
THCE  
THOE  
TSB  
CLK High time(3) when VCCO = 1.8V  
12  
CE hold time (guarantees counters are reset)(5) when VCCO = 3.3V or 2.5V  
CE hold time (guarantees counters are reset)(5) when VCCO = 1.8V  
OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 3.3V or 2.5V  
OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 1.8V  
BUSY setup time to CLKOUT when VCCO = 3.3V or 2.5V  
BUSY setup time to CLKOUT when VCCO = 1.8V  
2000  
2000  
2000  
2000  
12  
12  
BUSY hold time to CLKOUT when VCCO = 3.3V or 2.5V  
BUSY hold time to CLKOUT when VCCO = 1.8V  
8
THB  
8
CLK input to CLKOUT output delay when VCCO = 3.3V or 2.5V  
CLK input to CLKOUT output delay when VCCO = 1.8V  
35  
35  
35  
CLK input to CLKOUT output delay when VCCO = 3.3V or 2.5V  
with decompression(12)  
TCLKO  
CLK input to CLKOUT output delay when VCCO = 1.8V  
with decompression(12)  
0
0
0
0
35  
ns  
CE to CLKOUT delay(8) when VCCO = 3.3V or 2.5V  
2 CLK  
cycles  
TCECC  
CE to CLKOUT delay(8) when VCCO = 1.8V  
2 CLK  
cycles  
2 CLK  
cycles  
OE/RESET to CLKOUT delay(8) when VCCO = 3.3V or 2.5V  
OE/RESET to CLKOUT delay(8) when VCCO = 1.8V  
TOECC  
2 CLK  
cycles  
CF to CLKOUT delay(8) when VCCO = 3.3V or 2.5V  
0
0
TBD  
TBD  
30  
TCFCC  
TCCDD  
TDDC  
CF to CLKOUT delay(8) when VCCO = 1.8V  
CLKOUT to data delay when VCCO = 3.3V or 2.5V(9)  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CLKOUT to data delay when VCCO = 1.8V(9)  
30  
Data setup time to CLKOUT when VCCO = 3.3V or 2.5V with decompression(9)(12)  
Data setup time to CLKOUT when VCCO = 1.8V with decompression(9)(12)  
Data hold from CLKOUT when VCCO = 3.3V or 2.5V  
5
5
3
Data hold from CLKOUT when VCCO = 1.8V  
3
TCOH  
Data hold from CLKOUT when VCCO = 3.3V or 2.5V with decompression(12)  
Data hold from CLKOUT when VCCO = 1.8V with decompression(12)  
EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V  
EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 1.8V  
3
3
300  
300  
TSXT  
DS123 (v2.9) May 09, 2006  
www.xilinx.com  
31  
R
Platform Flash In-System Programmable Configuration PROMS  
XCF08P, XCF16P,  
XCF32P  
Symbol  
Description  
Units  
Min  
300  
300  
300  
300  
300  
300  
Max  
EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V  
EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 1.8V  
REV_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V  
REV_SEL setup time to CF, CE, or OE/RESET when VCCO = 1.8V  
REV_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V  
REV_SEL hold time from CF, CE, or OE/RESET when VCCO = 1.8V  
ns  
ns  
ns  
ns  
ns  
ns  
THXT  
TSRV  
THRV  
Notes:  
1. AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P.  
2. Float delays are measured with 5 pF AC loads.Transition is measured at 200 mV from steady-state active levels.  
3. Guaranteed by design, not tested.  
4. All AC parameters are measured with V = 0.0V and V = 3.0V.  
IL  
IH  
5. If T  
6. If T  
High < 2 µs, T = 2 µs.  
CE  
HCE  
Low < 2 µs, T = 2 µs.  
HOE  
OE  
7. This is the minimum possible T  
. Actual T  
= T  
+ FPGA Data setup time. Example: With the XCF32P in serial mode with V  
CYCO  
CYCO  
CCDD CCO  
at 3.3V, if FPGA Data setup time = 15 ns, then the actual T  
= 25 ns +15 ns = 40 ns.  
CYCO  
8. The delay before the enabled CLKOUT signal begins clocking data out of the device is dependent on the clocking configuration. The delay  
before CLKOUT is enabled will increase if decompression is enabled.  
9. Slower CLK frequency option may be required to meet the FPGA data sheet setup time.  
10. When decompression is enabled, the CLKOUT signal becomes a controlled clock output. When decompressed data is available, CLKOUT  
will toggle at ½ the source clock frequency (either ½ the selected internal clock frequency or ½ the external CLK input frequency). When  
decompressed data is not available, the CLKOUT pin is parked High. If CLKOUT is used, then it must be pulled High externally using a 4.7kΩ  
pull-up to V  
.
CCO  
11. When JTAG CONFIG command is issued, PROM will drive CF Low for at least the T  
minimum.  
HCF  
DS123 (v2.9) May 09, 2006  
www.xilinx.com  
32  
R
Platform Flash In-System Programmable Configuration PROMS  
XCFxxP PROM as Configuration Master with Internal Oscillator as Clock Source  
CE  
T
HCE  
T
HOE  
OE/RESET  
CLKOUT  
T
CEC  
T
T
HB  
SB  
T
T
T
DDC  
T
CDD  
COH  
OEC  
T
T
CECF  
OECF  
BUSY  
T
OE  
(optional)  
T