Revision 1.16 – July 19, 2006
440GR – PPC440GR Embedded Processor
Preliminary Data Sheet
Table 14. Package Thermal Specifications
Thermal resistance values for the E-PBGA package are as follows:
Airflow
ft/min (m/sec)
Parameter
Symbol
Package
Unit
Notes
0 (0)
20.0
15.6
15.3
13.9
100 (0.51)
200 (1.02)
17.9
E-PBGA
TE-PBGA
E-PBGA
18.7
°C/W
°C/W
°C/W
°C/W
Junction-to-ambient thermal resistance
without heat sink
θJA
θJA
13.6
12.8
11.9
10.5
Junction-to-ambient thermal resistance
with heat sink
TE-PBGA
10.4
9.0
Resistance Value
E-PBGA
TE-PBGA
E-PBGA
8.3
6.3
°C/W
°C/W
°C/W
°C/W
Junction-to-case thermal resistance
θJC
θJB
14.3
9.3
Junction-to-board thermal resistance
TE-PBGA
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
2. TA = TC - P×θCA, where TA is ambient temperature and P is power consumption.
3. TCMax = TJMax - P×θJC, where TJMax is maximum junction temperature (+125°C) and P is power consumption.
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved with a JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
0.1mm thickness of adhesive having a thermal conductivity of 1.3 W/mK.
Thermal Management
The following heat sinks were used in the above thermal analysis:
ALPHA W35-15W (35mm x 35mm x15mm)
ALPHA LPD35-15B (35mm x 35mm x15mm)
The heat sinks are manufactured by:
Alpha Novatech, Inc. (www.alphanovatech.com)
473 Sapena Court, #12
Santa Clara, CA 95054
Phone: 408-567-8082
62
AMCC Proprietary
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
